Добірка наукової літератури з теми "Tin-lead alloy"
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Статті в журналах з теми "Tin-lead alloy"
Jordan, Manfred. "Lead-free Tin Alloys as Substitutes for Tin-lead Alloy Plating." Transactions of the IMF 75, no. 4 (January 1997): 149–53. http://dx.doi.org/10.1080/00202967.1997.11871162.
Повний текст джерелаRoelandts, Iwan. "Lead and tin alloy reference materials." Spectrochimica Acta Part B: Atomic Spectroscopy 49, no. 11 (September 1994): 1103–9. http://dx.doi.org/10.1016/0584-8547(94)80095-2.
Повний текст джерелаWang, Frank Fan, William McKeague, and Christina Polwarth. "Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000596–601. http://dx.doi.org/10.4071/2380-4505-2018.1.000596.
Повний текст джерелаHo, C. T. "Carbon fiber-reinforced tin-lead alloy composites." Journal of Materials Research 9, no. 8 (August 1994): 2144–47. http://dx.doi.org/10.1557/jmr.1994.2144.
Повний текст джерелаBurashnikova, M. M., I. V. Zotova, and I. A. Kazarinov. "Anodic passivation mechanism of lead-tin alloys in sulfuric acid solution." Electrochemical Energetics 13, no. 4 (2013): 205–12. http://dx.doi.org/10.18500/1608-4039-2013-13-4-205-212.
Повний текст джерелаAamir, Muhammad, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, and Vadim V. Silberschmidt. "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics." Soldering & Surface Mount Technology 32, no. 2 (October 14, 2019): 115–26. http://dx.doi.org/10.1108/ssmt-11-2018-0046.
Повний текст джерелаTakateru, Umeda. "Development Of Lead Free Copper Alloy Casting; Mechanical Properties, Castability and Machinability." Metal Indonesia 26 (January 31, 2018): 34. http://dx.doi.org/10.32423/jmi.2004.v26.34-40.
Повний текст джерелаCzerwiński, Andrzej, Agata Skwarek, Mariusz Płuska, Jacek Ratajczak, and Krzysztof Witek. "Tin Pest and Tin Oxidation on Tin-Rich Lead-Free Alloys Investigated by Electron Microscopy Methods." Solid State Phenomena 186 (March 2012): 275–78. http://dx.doi.org/10.4028/www.scientific.net/ssp.186.275.
Повний текст джерелаSONODA, Tsukasa, Mamoru SUGIMOTO, Masayoshi NISHIRA, Hidemi NAWAFUNE, and Shozo MIZUMOTO. "Bright tin-lead alloy plating from pyrophosphate baths." Journal of the Surface Finishing Society of Japan 40, no. 6 (1989): 771–76. http://dx.doi.org/10.4139/sfj.40.771.
Повний текст джерелаSONODA, Tsukasa, Mamoru SUGIMOTO, Masayoshi NISHIRA, Hidemi NAWAFUNE, and Shozo MIZUMOTO. "Bright tin-lead alloy plating from gluconate baths." Journal of the Surface Finishing Society of Japan 41, no. 9 (1990): 922–26. http://dx.doi.org/10.4139/sfj.41.922.
Повний текст джерелаДисертації з теми "Tin-lead alloy"
Lee, Richard. "The Production, Use and Disposal of Romano-British Tin and Tin and Lead Alloy Tableware." Thesis, University of Reading, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.486350.
Повний текст джерелаJiang, Hongjin. "Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22636.
Повний текст джерелаCommittee Chair: Dr. C. P. Wong; Committee Member: Dr. Boris Mizaikoff; Committee Member: Dr. Rigoberto Hernandez; Committee Member: Dr. Z. John Zhang; Committee Member: Dr. Z.L. Wang.
Nibhanupudi, Syam S. "Affect of pressurised solidification on the secondary dentritic arm spacing in lead-tin alloy." abstract and full text PDF (free order & download UNR users only), 2008. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1453603.
Повний текст джерелаMabiala, Floyd Lionel. "Photo-physical properties of lead-tin binary Perovskite thin films." University of Western Cape, 2021. http://hdl.handle.net/11394/8002.
Повний текст джерелаOrganic-inorganic lead-based perovskite has exhibited great performance in the past few years. However, the lead (Pb) embedded in those compounds is a significant drawback to further progress, due to its environmental toxicity. As an alternative, tin (Sn) based-perovskites have demonstrated promising results in terms of electrical and optical properties for photovoltaic devices, but the oxidation of tin ion- from stannous ion (Sn2+) to stannic ion (Sn4+) presents a problem in terms of performance and stability when exposed to ambient conditions. A more feasible approach may be in a Pb-Sn binary metal perovskite in pursuit of efficient, stable perovskite solar cells (PSCs) with reduced Pb-content, as compared to pure Pb- or Sn-based PSCs. Here, we report on the deposition of a Pb-Sn binary perovskite by sequential chemical vapor deposition.
Koegel, David Eric. "SPECIFIC PERMEABILITIES OF METALLIC COLUMNAR STRUCTURES AT LOW LIQUID-VOLUME FRACTIONS (MACROSEGREGATION, LEAD-TIN ALLOY, DENDRITIC)." Thesis, The University of Arizona, 1985. http://hdl.handle.net/10150/275455.
Повний текст джерелаZhang, Yi. "The electrodeposition and characterisation of compositionally modulated tin-cobalt alloy coatings as lead-free plain bearing material." Thesis, Loughborough University, 2008. https://dspace.lboro.ac.uk/2134/15138.
Повний текст джерелаGao, Yang 1966. "Solderability Study of Tin/Lead Alloy Under Steam-Aging Treatment by Electrochemical Reduction Analysis and Wetting Balance Tests." Thesis, University of North Texas, 1993. https://digital.library.unt.edu/ark:/67531/metadc501051/.
Повний текст джерелаДячок, Дарія Романівна. "Оптимізація технологічного процесу відтворення художніх виробів у металі". Bachelor's thesis, КПІ ім. Ігоря Сікорського, 2021. https://ela.kpi.ua/handle/123456789/43657.
Повний текст джерелаBachelor’s dissertation: 86 pages, 20 figures, 30 tables, 16 references. The purpose of the work – optimize the technological processes of reproduction in metal copies, two works of art, according to the available non metallic originals. Research methodology – production of silicone and plaster molds with different variants of the foundry system; production of plaster-silica molds, their calcination and pouring at different temperatures; control of quality parameters of castings (surface roughness and the presence of casting defects). Results of the work and their novelty – theoretically and practically established the suitability of silicone molds for the manufacture of high-quality castings from low-melting (tin-lead) alloys; the parameters of technological processes of reproduction in metal copies of art products are investigated; made a series of high-quality art castings from tin-lead and copper alloy. The main indicators – as a result of work the optimum parameters of technological processes of manufacturing of art products are defined. A 0.099 kg Viking figure made of tin-lead alloy and 0.073 kg L63 brass was cast, as well as a 0.468 kg Celt statue made of L63 brass. The products do not have casting defects, the surface roughness does not exceed 12,5 microns and 6,3 microns, Areas of application – art and jewelry casting of unique products. Economic efficiency – UAH 214,137.4. Predictive assumptions about the development of the object of study – by analogy with the studied technological processes, the development of plans for the manufacture of similar size and complexity of cast art products in small scale production.
Mahapatra, Rama Ballav. "Columnar to equiaxed transition in tin-lead alloys." Thesis, University of British Columbia, 1985. http://hdl.handle.net/2429/26313.
Повний текст джерелаApplied Science, Faculty of
Materials Engineering, Department of
Graduate
Wang, Xiangjun. "Sliding behavior of lead and tin based alloys /." The Ohio State University, 1994. http://rave.ohiolink.edu/etdc/view?acc_num=osu148785607641229.
Повний текст джерелаКниги з теми "Tin-lead alloy"
Tan, A. C. Tin and solder plating in the semiconductor industry: A technical guide. London: Chapman & Hall, 1993.
Знайти повний текст джерелаZhang, Zaihui. Electrodeposition and X-ray structure of gold-nickel and lead-tin alloys and pulse deposition of gold-nickle alloys. Sudbury, Ont: Laurentian University of Sudbury, 1987.
Знайти повний текст джерелаBirte, Anspach, and Dobat Andres Siegfried, eds. Studien zu Haithabu und Füsing. Neumünster: Wachholtz, 2010.
Знайти повний текст джерелаParker, Philip M. The 2007-2012 World Outlook for Secondary Lead-And Tin-Base Alloy Solder. ICON Group International, Inc., 2006.
Знайти повний текст джерелаParker, Philip M. The 2007-2012 World Outlook for Secondary Lead-And Tin-Base Alloy Antimonial Lead and Babbitt Metal Refining. ICON Group International, Inc., 2006.
Знайти повний текст джерелаUnited States. National Aeronautics and Space Administration., ed. Macrosegregation in directionally solidified Pb-Sn alloys: Project closing report. [Washington, DC: National Aeronautics and Space Administration, 1998.
Знайти повний текст джерелаTin and Solder Plating in the Semiconductor Industry. Springer Netherlands, 1992.
Знайти повний текст джерелаSarathy, T. P. Characterization of superplastic deformation. 1992.
Знайти повний текст джерелаThe 2006-2011 World Outlook for Secondary Antimonial Lead-And Tin-Base Alloys. Icon Group International, Inc., 2005.
Знайти повний текст джерелаParker, Philip M. The 2007-2012 World Outlook for Secondary Antimonial Lead-And Tin-Base Alloys Refining. ICON Group International, Inc., 2006.
Знайти повний текст джерелаЧастини книг з теми "Tin-lead alloy"
Unertl, W. N., M. Grunze, and J. J. Weimer. "Surface Properites of a Lead-Tin Alloy." In Diffusion at Interfaces: Microscopic Concepts, 132–41. Berlin, Heidelberg: Springer Berlin Heidelberg, 1988. http://dx.doi.org/10.1007/978-3-642-73632-2_14.
Повний текст джерелаHyde, T. H., and H. Fessler. "Static strength testing of a plane frame using the tin-lead alloy technique." In Tubular Structures VI, 85–91. London: Routledge, 2021. http://dx.doi.org/10.1201/9780203735015-14.
Повний текст джерелаJordan, Manfred. "Electrodeposition of Tin-Lead Alloys." In Modern Electroplating, 265–84. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470602638.ch9.
Повний текст джерелаZhang, Yun. "Tin and Tin Alloys for Lead-Free Solder." In Modern Electroplating, 139–204. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470602638.ch6.
Повний текст джерелаPredel, F. "Phase diagram of Pb-Sn (lead-tin) system." In Phase Equilibria, Crystallographic and Thermodynamic Data of Binary Alloys, 156. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-642-24977-8_92.
Повний текст джерелаJones, W. Kinzy, Y. Q. Liu, Marc A. Zampino, and Gerardo L. Gonzalez. "The At-Temperature Mechanical Properties of Lead-Tin Based Alloys." In Microelectronic Interconnections and Assembly, 53–58. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5135-1_7.
Повний текст джерелаSchroer, Carsten. "Fundamental Interactions of Steels and Nickel‐based Alloys with Lead‐based Liquid Alloys or Liquid Tin." In TMS 2021 150th Annual Meeting & Exhibition Supplemental Proceedings, 642–56. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-65261-6_58.
Повний текст джерелаVaynman, Semyon, and Moris E. Fine. "Effects of Strain Range, Ramp Time, Hold Time, and Temperature on Isothermal Fatigue Life of Tin-Lead Solder Alloys." In Solder Joint Reliability, 333–60. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3910-0_11.
Повний текст джерелаSauer, Günther. "Extruded Products." In Extrusion, 9–58. 2nd ed. ASM International, 2006. http://dx.doi.org/10.31399/asm.tb.ex2.t69980009.
Повний текст джерелаBiborski, Marcin, and Mateusz Biborski. "Badania składu chemicznego oraz technologia wykonania wybranych zabytków ze stopu miedzi." In Ocalone Dziedzictwo Archeologiczne, 121–34. Wydawnictwo Profil-Archeo; Muzeum im. Jacka Malczewskiego w Radomiu, 2020. http://dx.doi.org/10.33547/oda-sah.10.zn.11.
Повний текст джерелаТези доповідей конференцій з теми "Tin-lead alloy"
Hongjin Jiang, Kyoung-sik Moon, Fay Hua, and C. P. Wong. "Tin/silver alloy nanoparticles for low temperature lead-free interconnect applications." In 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. IEEE, 2007. http://dx.doi.org/10.1109/isapm.2007.4419947.
Повний текст джерелаSTRACHOTOVÁ, Kristýna Charlotte, Milan KOUŘIL, and Šárka MSALLAMOVÁ. "LONG-TERM STABILITY OF PROTECTIVE COATINGS ON LEAD AND LEAD-TIN ALLOY UNDER STORAGE CONDITIONS." In METAL 2022. TANGER Ltd., 2022. http://dx.doi.org/10.37904/metal.2022.4490.
Повний текст джерелаBruno, Felix, Purushothaman Damodaran, Krishnaswami Srihari, and Guhan Subbarayan. "An Experimental Study on Voids in Mixed Alloy Assemblies." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-13556.
Повний текст джерелаLiu, Ting, Dongyan Ding, Yiqing Wang, Yu Hu, Yihua Gong, and Klaus-Peter Galuschki. "Tin whisker growth on bright Sn films supported by lead-frame alloy substrates." In 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2012. http://dx.doi.org/10.1109/icept-hdp.2012.6474810.
Повний текст джерелаEzaham, N. A., N. R. A. Razak, and M. A. A. M. Salleh. "Influence of bismuth on the solidification of tin copper lead-free solder alloy." In 4TH ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2018 (EGM 2018). Author(s), 2018. http://dx.doi.org/10.1063/1.5080917.
Повний текст джерелаHongjin Jiang, Kyoung-sik Moon, and C. P. Wong. "Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications." In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550160.
Повний текст джерелаSosiati, H., N. Kuwano, S. Hata, Y. Iwane, Y. Morizono, and Y. Ohno. "Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy." In 2006 8th Electronics Packaging Technology Conference. IEEE, 2006. http://dx.doi.org/10.1109/eptc.2006.342749.
Повний текст джерелаJiang, Hongjin, Kyoung-sik Moon, Fay Hua, and C. P. Wong. "Thermal Properties of Tin/Silver Alloy Nanoparticles for Low Temperature Lead-free Interconnect Technology." In 2007 Proceedings 57th Electronic Components and Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/ectc.2007.373776.
Повний текст джерелаShen, Y. L., K. C. R. Abell, and S. E. Garrett. "Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-32885.
Повний текст джерелаYiqing Wang, Dongyan Ding, Ting Liu, Klaus-Peter Galuschki, Yu Hu, Angela Gong, Ming Shen, et al. "Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582636.
Повний текст джерела