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Статті в журналах з теми "Thermal management of electronics"
FAULKNER, DAN, MEHDY KHOTAN, and REZA SHEKARRIZ. "Managing Electronics Thermal Management." Heat Transfer Engineering 25, no. 2 (March 2004): 1–4. http://dx.doi.org/10.1080/01457630490275944.
Повний текст джерелаXing, Wenkui, Yue Xu, Chengyi Song, and Tao Deng. "Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics." Nanomaterials 12, no. 19 (September 27, 2022): 3365. http://dx.doi.org/10.3390/nano12193365.
Повний текст джерелаLi, Yuhang, Jiayun Chen, Shuang Zhao, and Jizhou Song. "Recent Advances on Thermal Management of Flexible Inorganic Electronics." Micromachines 11, no. 4 (April 9, 2020): 390. http://dx.doi.org/10.3390/mi11040390.
Повний текст джерелаSong, Jizhou, Xue Feng, and Yonggang Huang. "Mechanics and thermal management of stretchable inorganic electronics." National Science Review 3, no. 1 (November 26, 2015): 128–43. http://dx.doi.org/10.1093/nsr/nwv078.
Повний текст джерелаPang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (April 16, 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.
Повний текст джерелаEgan, Eric, and Cristina H. Amon. "Thermal Management Strategies for Embedded Electronic Components of Wearable Computers." Journal of Electronic Packaging 122, no. 2 (September 15, 1999): 98–106. http://dx.doi.org/10.1115/1.483140.
Повний текст джерелаShi, Yingli, Junyun Ji, Yafei Yin, Yuhang Li, and Yufeng Xing. "Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate." Applied Mathematics and Mechanics 41, no. 11 (October 19, 2020): 1599–610. http://dx.doi.org/10.1007/s10483-020-2671-7.
Повний текст джерелаKosoy, Boris. "Micro channels in macro thermal management solutions." Thermal Science 10, no. 1 (2006): 81–98. http://dx.doi.org/10.2298/tsci0601081k.
Повний текст джерелаYeh, L. T. "Review of Heat Transfer Technologies in Electronic Equipment." Journal of Electronic Packaging 117, no. 4 (December 1, 1995): 333–39. http://dx.doi.org/10.1115/1.2792113.
Повний текст джерелаAnandan, Sundaram, and Velraj Ramalingam. "Thermal management of electronics: A review of literature." Thermal Science 12, no. 2 (2008): 5–26. http://dx.doi.org/10.2298/tsci0802005a.
Повний текст джерелаДисертації з теми "Thermal management of electronics"
Mital, Manu. "Integrated Thermal Management Strategies for Embedded Power Electronic Modules." Diss., Virginia Tech, 2006. http://hdl.handle.net/10919/30269.
Повний текст джерелаPh. D.
Wu, Yupeng. "Thermal management of concentrator photovoltaics." Thesis, University of Warwick, 2009. http://wrap.warwick.ac.uk/3218/.
Повний текст джерелаTighe, Christopher James Frederick. "Thermal management of solid state power switches." Thesis, University of Nottingham, 2011. http://eprints.nottingham.ac.uk/12714/.
Повний текст джерелаStinnett, William A. "Thermal Management of Power Electronic Building Blocks." Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/31389.
Повний текст джерелаMaster of Science
McGlen, Ryan James. "Advanced thermal management techniques for high power electronics devices." Thesis, University of Newcastle Upon Tyne, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.533697.
Повний текст джерелаJakaboski, Juan-Carlos. "Innovative Thermal Management of Electronics Used in Oil Well Logging." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/7255.
Повний текст джерелаMahanta, Nayandeep Kumar. "Characterization and Analysis of Graphite Nanocomposites for Thermal Management of Electronics." Case Western Reserve University School of Graduate Studies / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=case1246546934.
Повний текст джерелаRaut, Rahul. "Thermal management of heat sensitive components in Pb-free assembly." Diss., Online access via UMI:, 2005.
Знайти повний текст джерелаPang, Ying-Feng. "Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules." Diss., Virginia Tech, 2005. http://hdl.handle.net/10919/26035.
Повний текст джерелаPh. D.
Green, Craig Elkton. "Composite thermal capacitors for transient thermal management of multicore microprocessors." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44772.
Повний текст джерелаКниги з теми "Thermal management of electronics"
Heat transfer: Thermal management of electronics. Boca Raton: Taylor & Francis, 2010.
Знайти повний текст джерелаJiang, Guosheng. Advanced Thermal Management Materials. New York, NY: Springer New York, 2013.
Знайти повний текст джерелаKrishnan, Ravi. The market for electronics thermal management technologies. Norwalk, CT: Business Communications Co., 2002.
Знайти повний текст джерелаFavreau, Marc. Hot markets: Thermal management technology for electronics. Norwalk, CT: Business Communications Co., 1996.
Знайти повний текст джерелаDace, Andrea. The market for electronics thermal management technologies. Norwalk, CT: Business Communications Co., 2000.
Знайти повний текст джерелаHienonen, Risto. Reliability of materials for the thermal management of electronics. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2006.
Знайти повний текст джерелаHoogendoorn, C. J., R. A. W. M. Henkes, and C. J. M. Lasance, eds. Thermal Management of Electronic Systems. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2.
Повний текст джерелаSergent, Jerry E. Thermal management handbook: For electronic assemblies. New York: McGraw-Hill, 1998.
Знайти повний текст джерелаBeyne, E., C. J. M. Lasance, and J. Berghmans, eds. Thermal Management of Electronic Systems II. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5506-9.
Повний текст джерелаChu, R. C. (Richard C.), 1933-, ed. Thermal management of telecommunications equipment. New York: ASME Press, 2013.
Знайти повний текст джерелаЧастини книг з теми "Thermal management of electronics"
Ginsberg, Gerald L. "Thermal Management." In Electronic Equipment Packaging Technology, 215–48. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3542-3_9.
Повний текст джерелаTye, R. P., and R. L. Gardner. "Recent innovations in thermal technology instrumentation applied to materials used in electronics applications." In Thermal Management of Electronic Systems, 191–200. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_17.
Повний текст джерелаLiu, Yong. "Thermal Management, Design, and Cooling for Power Electronics." In Power Electronic Packaging, 167–213. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-1053-9_6.
Повний текст джерелаCocks, Rachele, David Clendenen, and Ludovic Chretien. "Design Considerations for Thermal Management of Electronics Enclosures." In Springer Proceedings in Mathematics & Statistics, 141–47. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-12307-3_20.
Повний текст джерелаBhattacharya, Anandaroop, Je-young Chang, and Nicholas S. Haehn. "Thermal Management of Electronics Using Sprays and Droplets." In Energy, Environment, and Sustainability, 267–95. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-7233-8_10.
Повний текст джерелаLienig, Jens, and Hans Bruemmer. "Thermal Management and Cooling." In Fundamentals of Electronic Systems Design, 75–146. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-55840-0_5.
Повний текст джерелаJiang, Guosheng, Liyong Diao, and Ken Kuang. "Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications." In Advanced Thermal Management Materials, 89–98. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_6.
Повний текст джерелаLasance, C. J. M. "Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research." In Thermal Management of Electronic Systems, 3–24. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_1.
Повний текст джерелаManca, O., S. Nardini, and V. Naso. "Effect of radiation on natural convection in tilted channels." In Thermal Management of Electronic Systems, 117–26. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_10.
Повний текст джерелаOttavy, N., M. Bourhrara, J. P. Le Jannou, and P. Paris. "Thermal Study of a Laser Diode Using a Finite Element Method Associated with a Meshing Superimposition Method." In Thermal Management of Electronic Systems, 129–38. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_11.
Повний текст джерелаТези доповідей конференцій з теми "Thermal management of electronics"
Mahalingam, Raghav, Andrew Poynot, and Jeffrey Helsel. "Ultrathin synthetic jets for thermal management of consumer electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892225.
Повний текст джерелаChow, Louis C., Maninder S. Sehmbey, and Tom Mahefkey. "Thermal management of low temperature electronics." In Proceedings of the 12th symposium on space nuclear power and propulsion: Conference on alternative power from space; Conference on accelerator-driven transmutation technologies and applications. AIP, 1995. http://dx.doi.org/10.1063/1.47085.
Повний текст джерелаMoreno, Gilberto, Jana R. Jeffers, Sreekant Narumanchi, and Kevin Bennion. "Passive two-phase cooling for automotive power electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892216.
Повний текст джерелаShioga, Takeshi, and Yoshihiro Mizuno. "Micro loop heat pipe for mobile electronics applications." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100139.
Повний текст джерелаDede, Ercan M. "Single-phase microchannel cold plate for hybrid vehicle electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892227.
Повний текст джерелаHu, Xiao, Sivasubramani Krishnaswamy, Saeed Asgari, and Scott Stanton. "An efficient transient thermal model for electronics thermal management based on singular value decomposition." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100173.
Повний текст джерелаBoswell, Joe, Corey Wilson, Daniel Pounds, and Bruce Drolen. "Recent advances in oscillating heat pipes for passive electronics thermal management." In 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2018. http://dx.doi.org/10.1109/semi-therm.2018.8357350.
Повний текст джерелаSzel, Attila, Zoltan Sarkany, Marton Bein, Robin Bornoff, Andras Vass-Varnai, and Marta Rencz. "Lifetime estimation of power electronics modules considering the target application." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100183.
Повний текст джерелаBloschock, Kristen P., and Avram Bar-Cohen. "Advanced thermal management technologies for defense electronics." In SPIE Defense, Security, and Sensing, edited by Raja Suresh. SPIE, 2012. http://dx.doi.org/10.1117/12.924349.
Повний текст джерелаSahoo, Pranati. "A Review on Immersion Cooling for Power Electronics." In SAENIS TTTMS Thermal Management Systems Conference-2022. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2022. http://dx.doi.org/10.4271/2022-28-0446.
Повний текст джерелаЗвіти організацій з теми "Thermal management of electronics"
Moreno, Gilberto. Power Electronics Thermal Management Research: Annual Progress Report. Office of Scientific and Technical Information (OSTI), October 2017. http://dx.doi.org/10.2172/1404874.
Повний текст джерелаMiljkovic, Nenad, Thomas Foulkes, Junho Oh, Patrick Birbarah, Robert Pilawa-Podgurski, and Jason C. Neely. Advanced Thermal Management for High Power Density Electronics. Office of Scientific and Technical Information (OSTI), October 2017. http://dx.doi.org/10.2172/1510616.
Повний текст джерелаMoreno, Gilbert. Power Electronics Thermal Management R&D: Annual Report. Office of Scientific and Technical Information (OSTI), April 2016. http://dx.doi.org/10.2172/1247463.
Повний текст джерелаThomas, Scott K., and Andrew J. Fleming. Thermal Management of Next-Generation Power Electronics for the More-Electric Aircraft Initiative. Fort Belvoir, VA: Defense Technical Information Center, July 2005. http://dx.doi.org/10.21236/ada452622.
Повний текст джерелаLin, Lanchao. Thermal Management Research for Power Generation. Delivery Order 0002 - Volume 1: Plain Fin Array Cooler for Electronics Cooling. Fort Belvoir, VA: Defense Technical Information Center, December 2002. http://dx.doi.org/10.21236/ada413410.
Повний текст джерелаAvis, William. Drivers, Barriers and Opportunities of E-waste Management in Africa. Institute of Development Studies (IDS), December 2021. http://dx.doi.org/10.19088/k4d.2022.016.
Повний текст джерелаSpahr, Sydney, Ephraim Maltz, and Nelson Buck. Automation and Electronics for Dairy Herd Management. United States Department of Agriculture, January 1987. http://dx.doi.org/10.32747/1987.7695595.bard.
Повний текст джерелаBayba, Andrew J., and Derwin F. Washington. Initial Experiments on Thermal Interface Materials for Electronics Packaging. Fort Belvoir, VA: Defense Technical Information Center, December 2012. http://dx.doi.org/10.21236/ada571796.
Повний текст джерелаSavrun, E., C. Toy, and M. Sarikaya. High Thermal Conductivity AlN Packages for High-Temperature Electronics. Fort Belvoir, VA: Defense Technical Information Center, September 1998. http://dx.doi.org/10.21236/ada359647.
Повний текст джерелаDEFENSE ELECTRONICS SUPPLY CENTER DAYTON OH. DESC (Defense Electronics Supply Center) Total Quality Management Plan. Fort Belvoir, VA: Defense Technical Information Center, April 1989. http://dx.doi.org/10.21236/ada212900.
Повний текст джерела