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Статті в журналах з теми "TEM ANALYSIS"
Du, Z. W., A. S. Liu, B. L. Shao, Z. Y. Zhang, X. S. Zhang, and Z. M. Sun. "TEM analysis of Gd5Si1.85Ge2.15 alloy." Materials Characterization 59, no. 9 (September 2008): 1241–44. http://dx.doi.org/10.1016/j.matchar.2007.10.005.
Повний текст джерелаRajan, Krishna, and Peter Sewell. "Surface Analysis in the TEM." JOM 38, no. 10 (October 1986): 34–35. http://dx.doi.org/10.1007/bf03258578.
Повний текст джерелаMizunaga, Hideki, and Toshiaki Tanaka. "Development of Temtool for TEM analysis." BUTSURI-TANSA(Geophysical Exploration) 67, no. 2 (2014): 135–42. http://dx.doi.org/10.3124/segj.67.135.
Повний текст джерелаOkamoto, Tatsuki, Masaki Kanegami, and Naohiro Hozumi. "TEM Analysis of Polyethylene with EELS." IEEJ Transactions on Fundamentals and Materials 118, no. 7-8 (1998): 767–72. http://dx.doi.org/10.1541/ieejfms1990.118.7-8_767.
Повний текст джерелаHIROSE, Yukinori, and Koji FUKUMOTO. "Evaluation and Analysis Technique Using TEM." Journal of the Surface Finishing Society of Japan 54, no. 1 (2003): 21–25. http://dx.doi.org/10.4139/sfj.54.21.
Повний текст джерелаStöger-Pollach, M., A. Steiger-Thirsfeld, and S. Schwarz. "Low voltage TEM for semiconductor analysis." Journal of Physics: Conference Series 326 (November 9, 2011): 012027. http://dx.doi.org/10.1088/1742-6596/326/1/012027.
Повний текст джерелаRowlands, Neil, and Simon Burgess. "Energy dispersive analysis in the TEM." Materials Today 12 (2010): 46–48. http://dx.doi.org/10.1016/s1369-7021(10)70145-0.
Повний текст джерелаDahmen, U., N. Thangaraj, and R. Kilaas. "Quantitative TEM analysis of microstructural anisotropy." Proceedings, annual meeting, Electron Microscopy Society of America 52 (1994): 682–83. http://dx.doi.org/10.1017/s0424820100171146.
Повний текст джерелаBauer, Natalie, Jyoti Rai, Hairu Chen, Lillianne Harris, Lalita Shevde, Tim Moore, and Judy King. "Microparticles/Exosomes: Isolation and TEM Analysis." Microscopy Today 17, no. 2 (March 2009): 42–45. http://dx.doi.org/10.1017/s1551929500054493.
Повний текст джерелаNeumann, Wolfgang, Holm Kirmse, Ines Häusler, Reinhard Otto, and Irmela Hähnert. "Quantitative TEM analysis of quantum structures." Journal of Alloys and Compounds 382, no. 1-2 (November 2004): 2–9. http://dx.doi.org/10.1016/j.jallcom.2004.05.066.
Повний текст джерелаДисертації з теми "TEM ANALYSIS"
Foo, Seng-Lee. "Analysis of electromagnetic fields in loaded TEM cells." Thesis, University of Ottawa (Canada), 1988. http://hdl.handle.net/10393/5170.
Повний текст джерелаKylberg, Gustaf. "Automatic Virus Identification using TEM : Image Segmentation and Texture Analysis." Doctoral thesis, Uppsala universitet, Avdelningen för visuell information och interaktion, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-217328.
Повний текст джерелаHajduček, Jan. "Zobrazování metamagnetických tenkých vrstev pomocí TEM." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2021. http://www.nusl.cz/ntk/nusl-443233.
Повний текст джерелаNord, Magnus Kristofer. "Quantitative (S)TEM analysis of intermediate band solar cell materials." Thesis, Norges teknisk-naturvitenskapelige universitet, Institutt for fysikk, 2011. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-13655.
Повний текст джерелаElFallagh, Fathi Ali. "3D Analysis of Indentation Damage by FIB tomography and TEM." Thesis, University of Sheffield, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.500111.
Повний текст джерелаMcLaughlin, Kirsten Kathleen. "TEM diffraction analysis of the deformation underneath low load indentations." Thesis, University of Cambridge, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.613392.
Повний текст джерелаSears, Jasmine, Ricky Gibson, Michael Gehl, Sander Zandbergen, Patrick Keiffer, Nima Nader, Joshua Hendrickson, Alexandre Arnoult, and Galina Khitrova. "TEM EDS analysis of epitaxially-grown self-assembled indium islands." AMER INST PHYSICS, 2017. http://hdl.handle.net/10150/624718.
Повний текст джерелаIssa, Inas. "In situ TEM nanocompression and mechanical analysis of ceramic nanoparticles." Thesis, Lyon, 2016. http://www.theses.fr/2016LYSEI008/document.
Повний текст джерелаIn this study, we propose an innovative mechanical observation protocol of ceramics nanoparticles in the 100nm size range. This Protocol consists of in situ TEM nanocompression tests of isolated nanoparticles. Load–real displacements curves, obtained by Digital Image Correlation, are analyzed and these analyses are correlated with Molecular Dynamics simulations. By this protocol a constitutive law with its mechanical parameters (Young modulus, Yield stress...) of the studied material at the nano-scale can be obtained. In situ TEM nano-compression tests on magnesium oxide nanocubes are performed. Magnesium oxide is a model material and its plasticity is very well known at bulk. The MgO nanocubes show large plastic deformation, more than 50% of plastic strain without any fracture. The TEM results are correlated to MD simulations and the deformation mechanism can be identified.The size effect and the electron beam effect on the yield strength are investigated. In a second part of the dissertation, we present a study on transition alumina nanoparticles compacted in a Diamond Anvil Cell at different uniaxial pressures. Thin Foils of these compacted nanoparticles are prepared by FIB for HRTEM Observations. Their analysis reveals the plastic deformation of the nanoparticles. The crystallographic texture observed inthese compacted nanoparticles in DAC shows a preferred orientation of the {110} lattice planes, orientated perpendicular to the compression direction. This is compatible with the slip system. This argument was reinforced with a preferred orientation of slip bands observed during in situ TEM nano-compression tests. Moreover, electron diffraction patterns (Debye Scherrer) analysis on these compacted transition alumina nanoparticles reveals the decrease of the presence of gamma-alumina and the increase of delta-alumina with increasing pressure. This reveals the phase transformation with increasing pressure from gamma to delta* alumina
King, Jason Peters King. "An investigation of spin-valves and related films by TEM." Thesis, University of Glasgow, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.301949.
Повний текст джерелаWoonbumroong, Apinya. "Fresnel contrast analysis and analytical TEM study of grain boundaries in electroceramics." Thesis, University of Cambridge, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.624490.
Повний текст джерелаКниги з теми "TEM ANALYSIS"
Henning, K. H. Electron micrographs (TEM, SEM) of clays and clay minerals. Berlin: Akademie-Verlag, 1986.
Знайти повний текст джерелаHaron, Sharifah Zabidah. Aspects of tea analysis. Salford: University of Salford, 1991.
Знайти повний текст джерелаClemente, Filipe Manuel, Fernando Manuel Lourenço Martins, and Rui Sousa Mendes. Social Network Analysis Applied to Team Sports Analysis. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-25855-3.
Повний текст джерелаPassos, Pedro. Performance Analysis in Team Sports. Abingdon, Oxon ; New York, NY : Routledge is an imprint of the: Routledge, 2016. http://dx.doi.org/10.4324/9781315739687.
Повний текст джерела1973-, Coliva Annalisa, ed. Filosofia analitica: Temi e problemi. Roma: Carocci, 2007.
Знайти повний текст джерелаChen, Yen-Sen. Lox manifold tee analysis: Final report. Huntsville, Ala: SECA, Inc., 1990.
Знайти повний текст джерелаCommerce, Ceylon Chamber of. Tea sector statistical analysis, 2012-2013. Colombo: The Ceylon Chamber of Commerce, 2014.
Знайти повний текст джерелаGuzʹ, Aleksandr Nikolaevich. Trekhmernai͡a︡ teorii͡a︡ ustoĭchivosti deformiruemykh tel. Kiev: Nauk. dumka, 1985.
Знайти повний текст джерелаUnited States. National Aeronautics and Space Administration., ed. Transient Ejector Analysis (TEA) code user's guide. [Washington, DC: National Aeronautics and Space Administration, 1993.
Знайти повний текст джерелаGeological Survey (U.S.), ed. Geologic hazards team. [Reston, Va.?]: U.S. Dept. of the Interior, U.S. Geological Survey, 1997.
Знайти повний текст джерелаЧастини книг з теми "TEM ANALYSIS"
McHendry, P., AJ Craven, and LJ Murphy. "TEM studies of organic pigments." In Electron Microscopy and Analysis 1997, 665–68. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-172.
Повний текст джерелаRambousky, R., and H. Garbe. "Analysis of Open TEM-Waveguide Structures." In Ultra-Wideband, Short-Pulse Electromagnetics 10, 49–58. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-9500-0_4.
Повний текст джерелаLi, Xiu, Guoqiang Xue, and Changchun Yin. "Velocity Analysis of TEM Pseudo Wave Field." In Migration Imaging of the Transient Electromagnetic Method, 105–23. Singapore: Springer Singapore, 2016. http://dx.doi.org/10.1007/978-981-10-2708-6_6.
Повний текст джерелаKirkland, A. I., W. O. Saxton, and R. Meyer. "Super resolved microscopy and aberration determination in the TEM." In Electron Microscopy and Analysis 1997, 105–8. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-26.
Повний текст джерелаVoelkl, E., L. F. Allard, J. Bruley, V. J. Keast, and D. B. Williams. "The teaching of TEM by telepresence microscopy over the internet." In Electron Microscopy and Analysis 1997, 45–48. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-10.
Повний текст джерелаKondo, Y., H. Ohnishi, Q. Ru, H. Kimata, and K. Takayanagi. "Newly developed UHV-FE-HR-TEM for particle surface studies." In Electron Microscopy and Analysis 1997, 241–44. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-62.
Повний текст джерелаBlank, V. D., B. A. Kulnitskiy, Ye V. Tatyanin, and O. M. Zhigalina. "TEM study of the crystalline and amorphous phases in C60." In Electron Microscopy and Analysis 1997, 593–96. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-154.
Повний текст джерелаKylberg, Gustaf, Ida-Maria Sintorn, and Gunilla Borgefors. "Towards Automated TEM for Virus Diagnostics: Segmentation of Grid Squares and Detection of Regions of Interest." In Image Analysis, 169–78. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-02230-2_18.
Повний текст джерелаGupta, Anindya, Amit Suveer, Joakim Lindblad, Anca Dragomir, Ida-Maria Sintorn, and Nataša Sladoje. "Convolutional Neural Networks for False Positive Reduction of Automatically Detected Cilia in Low Magnification TEM Images." In Image Analysis, 407–18. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-59126-1_34.
Повний текст джерелаMacLaren, I., and C. B. Ponton. "TEM investigation of hydrothermally synthesised Ba(Mg1/3Ta2/3)O3, powders." In Electron Microscopy and Analysis 1997, 531–34. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-137.
Повний текст джерелаТези доповідей конференцій з теми "TEM ANALYSIS"
Chong, H. B., Brandon Van Leer, V. Narang, and M. Y. Ho. "Sideways FIB TEM sample preparation for improved construction analysis in TEM." In 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012). IEEE, 2012. http://dx.doi.org/10.1109/ipfa.2012.6306257.
Повний текст джерелаChen, S. Y., W. Yang, G. F. Xu, and C. T. Liu. "TEM EELS analysis for DRAM failure analysis." In 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2021. http://dx.doi.org/10.1109/ipfa53173.2021.9617371.
Повний текст джерелаIanconescu, Reuven, and Vladimir Vulfin. "TEM transmission line radiation losses analysis." In 2016 46th European Microwave Conference (EuMC). IEEE, 2016. http://dx.doi.org/10.1109/eumc.2016.7824381.
Повний текст джерелаXiaoding Cai. "Analysis of longitudinal characteristics TEM cells." In International Symposium on Electromagnetic Compatibility. IEEE, 1989. http://dx.doi.org/10.1109/isemc.1989.240866.
Повний текст джерелаEsa, S. R., R. Yahya, A. Hassan, and G. Omar. "Copper oxidation study by TEM." In 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012). IEEE, 2012. http://dx.doi.org/10.1109/ipfa.2012.6306315.
Повний текст джерелаLin, Ching-Chun, Jay Wang, and Kim Hsu. "TEM applications for III-V material analysis." In 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2017. http://dx.doi.org/10.1109/ipfa.2017.8060204.
Повний текст джерелаDu, A. Y., J. Zhu, Y. K. Zhou, B. H. Liu, Eddie Er, Z. Q. Mo, S. P. Zhao, and Jeffrey Lam. "Advanced TEM applications in semiconductor devices." In 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2014. http://dx.doi.org/10.1109/ipfa.2014.6898193.
Повний текст джерелаZhu, Xiangqin, Weiqing Chen, Zaigao Chen, and Jianguo Wang. "Analysis of TEM Horn with Dielectric Loaded." In 2018 IEEE International Conference on Computational Electromagnetics (ICCEM). IEEE, 2018. http://dx.doi.org/10.1109/compem.2018.8496637.
Повний текст джерелаLee, Tan-Chen, Jui-Yen Huang, Li-Chien Chen, Ruey-Lian Hwang, and David Su. "Methodology for TEM Analysis of Barrier Profiles." In ISTFA 2002. ASM International, 2002. http://dx.doi.org/10.31399/asm.cp.istfa2002p0689.
Повний текст джерелаFuhrmann, T., J. Pletzer, and A. Uhl. "Computer assisted morphometric analysis of TEM images." In IET 3rd International Conference MEDSIP 2006. Advances in Medical, Signal and Information Processing. IEE, 2006. http://dx.doi.org/10.1049/cp:20060362.
Повний текст джерелаЗвіти організацій з теми "TEM ANALYSIS"
Kass, M. A., Yaoguo Li, Richard Krahenbuhl, Misac Nabighian, and Douglas Oldenburg. Enhancement of TEM Data and Noise Characterization by Principal Component Analysis. Fort Belvoir, VA: Defense Technical Information Center, May 2010. http://dx.doi.org/10.21236/ada571505.
Повний текст джерелаGerberich, W. W. Micromechanisms of brittle fracture: STM, TEM and electron channeling analysis. Final report. Office of Scientific and Technical Information (OSTI), January 1997. http://dx.doi.org/10.2172/463626.
Повний текст джерелаPercival, J. B., T. Jensen, K. Wasyliuk, G. Drever, J. Sader, M. Sarfi, P A Hunt, C. Bibby, S. Wong, and A. Enright. EXTECH IV mineralogical database: XRD, infrared and TEM analyses. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 2012. http://dx.doi.org/10.4095/292112.
Повний текст джерелаCalahorra-Jimenez, Maria. Contracting Strategies: A Different Approach to Address Long-term Performance. Mineta Transportation Institute, July 2022. http://dx.doi.org/10.31979/mti.2021.2130.
Повний текст джерелаCalahorra-Jimenez, Maria. Contracting Strategies: A Different Approach to Address Long-term Performance. Mineta Transportation Institute, July 2022. http://dx.doi.org/10.31979/mti.2022.2130.
Повний текст джерелаAponte, C. I. Supernate source term analysis: Revision 1. Office of Scientific and Technical Information (OSTI), October 1994. http://dx.doi.org/10.2172/10105057.
Повний текст джерелаAuthor, Not Given. Vehicle Systems Analysis Technical Team Roadmap. Office of Scientific and Technical Information (OSTI), June 2013. http://dx.doi.org/10.2172/1220129.
Повний текст джерелаAllison, Ralph E., and Jr. Analysis of First-Term Army Attrition. Fort Belvoir, VA: Defense Technical Information Center, April 1999. http://dx.doi.org/10.21236/ada362968.
Повний текст джерелаCanto, Patricia, ed. Lessons to be learnt for initiatives to promote cross-border collaboration: an experience in the New Aquitaine-Euskadi-Navarre euroregion. Universidad de Deusto, 2022. http://dx.doi.org/10.18543/xjrt7954.
Повний текст джерелаSawan, M. E., G. L. Kulcinski, and D. L. Henderson. Nuclear Analysis for Near Term Fusion Devices. Office of Scientific and Technical Information (OSTI), April 2007. http://dx.doi.org/10.2172/901591.
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