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Статті в журналах з теми "Sintering of silver powder"
Li, Wei, Chunxiu Yu, Yunkai Wang, Yuan Yao, Xianglei Yu, Chuan Zuo, and Yang Yu. "Experimental Investigation of Effect of Flake Silver Powder Content on Sintering Structure and Properties of Front Silver Paste of Silicon Solar Cell." Materials 15, no. 20 (October 13, 2022): 7142. http://dx.doi.org/10.3390/ma15207142.
Повний текст джерелаFan, Mao Yan, Guo You Gan, Jian Hong Yi, Ji Kang Yan, Jing Hong Du, Jia Min Zhang, Yi Chun Liu, and Xin Xin He. "Effects of Na-Ca System Glass Powder on Properties of Silver Paste." Advanced Materials Research 833 (November 2013): 295–300. http://dx.doi.org/10.4028/www.scientific.net/amr.833.295.
Повний текст джерелаPathak, L. C., S. K. Mishra (Pathak), and S. Srikanth. "Sintering characteristics of Y–Ba–Cu oxide–Agx superconductors under argon atmosphere." Journal of Materials Research 17, no. 4 (April 2002): 895–900. http://dx.doi.org/10.1557/jmr.2002.0130.
Повний текст джерелаDurairaj, Rajkumar, M. Das, E. Morris, and Satesh Namasivayam. "Investigation on the Morphology of Sintered Silver Nanomaterial for Electronic Packaging Application." Advanced Materials Research 832 (November 2013): 21–26. http://dx.doi.org/10.4028/www.scientific.net/amr.832.21.
Повний текст джерелаBiguereau, E., D. Bouvard, J. M. Chaix, and S. Roure. "On the swelling of silver powder during sintering." Powder Metallurgy 59, no. 5 (October 19, 2016): 394–400. http://dx.doi.org/10.1080/00325899.2016.1250037.
Повний текст джерелаHutsch, Thomas, Thomas Schubert, Thomas Weißgärber, and Bernd Kieback. "Silver/Diamond Composite Material - Powder Metallurgical Route and Thermo-Physical Properties." Key Engineering Materials 742 (July 2017): 151–57. http://dx.doi.org/10.4028/www.scientific.net/kem.742.151.
Повний текст джерелаJiao, Ruo Bing, Tao Wu, Bo Ping Zhang, and Liang Liang Li. "Firing and Contact Resistivity of Ag2O-Aided Pb-Free Silver Paste for Crystalline Silicon Solar Cells." Materials Science Forum 847 (March 2016): 123–30. http://dx.doi.org/10.4028/www.scientific.net/msf.847.123.
Повний текст джерелаDubnika, Arita, Dagnija Loca, Aigars Reinis, Maris Kodols, and Liga Berzina-Cimdina. "Impact of sintering temperature on the phase composition and antibacterial properties of silver-doped hydroxyapatite." Pure and Applied Chemistry 85, no. 2 (January 12, 2013): 453–62. http://dx.doi.org/10.1351/pac-con-12-08-12.
Повний текст джерелаOkada, Atsuyuki, and Takashi Ogihara. "Sintering Behavior of Silver Particles in Electrode for Multilayer Ceramic Substrate." Key Engineering Materials 421-422 (December 2009): 289–92. http://dx.doi.org/10.4028/www.scientific.net/kem.421-422.289.
Повний текст джерелаYan, Fang Chun, Yuan Teng, Ji Kang Yan, Jing Hong Du, Jian Hong Yi, Jian Yang, and Guo You Gan. "Effects of Paste Composition and Sintering Process on Performance of Silver Paste for Silicon Solar Cells." Materials Science Forum 849 (March 2016): 852–59. http://dx.doi.org/10.4028/www.scientific.net/msf.849.852.
Повний текст джерелаДисертації з теми "Sintering of silver powder"
Zhang, Zhiye. "Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment." Diss., Virginia Tech, 2005. http://hdl.handle.net/10919/28902.
Повний текст джерелаPh. D.
Riva, Raphaël. "Solution d'interconnexions pour la haute température." Thesis, Lyon, INSA, 2014. http://www.theses.fr/2014ISAL0064/document.
Повний текст джерелаSilicon has reached its usage limit in many areas such as aeronautics. One of the challenges is the design of power components operable in high temperature and/or high voltage. The use of wide bandgap materials such as silicon carbide (SiC) provides in part a solution to meet these requirements. The packaging must be adapted to these new types of components and new operating environnement. However, it appears that the planar integration (2D), consisting of wire-bonding and soldered components-attach, can not meet these expectations. This thesis aims to develop a three dimensional power module for the high temperature aeronautics applications. A new original 3D structure made of two silicon carbide dies, silver-sintered die-attaches and an encapsulation by parylene HT has been developed. Its various constituting elements, the reason for their choice, and the pratical realization of the structure are presented in this manuscript. Then, we focus on a failure mode specific to silver-sintered attaches : The silver migration. An experimental study allows to define the triggering conditions of this failure. It is extended and analyzed by numerical simulations
Blackmore, Katherine Ann 1969. "Sintering of heterogeneous glass powder compacts." Thesis, The University of Arizona, 1995. http://hdl.handle.net/10150/291349.
Повний текст джерелаHascoët, Stanislas. "Mise en oeuvre de nouveaux matériaux d’assemblage dans les modules multipuces de puissance (MCM)." Thesis, Lyon, INSA, 2013. http://www.theses.fr/2013ISAL0123/document.
Повний текст джерелаUse of wide band gap chip in the power electronic industry requires an optimization of the close environment (packaging). Indeed, the can often sustain lower temperature than the die, especially the solder that are used to bond the parts of the module. Consequently, new bonding methods are investigated to enhance the performance of the packages. Silver sintering bonding technique is one the most promising. This method allow to bond parts at moderate temperature and the formed joint to operate at very high temperature (until the melting point of silver). This work is focused on the development of this bonding technique in the case of bonding a dies on a substrate. A study of the influence of the different parameters on the strength of the formed bond has been done. It revealed a major influence of the finishes of the bonded parts. Bonding on silver finished substrate results in good mechanical strength of the bond even after ageing. Furthermore, no interface issues are observed. However, the most used finish for power electronic is not silver but nickel-gold. Regarding this type of finish, the bond quality depends on the gold thickness, sintering profile and also sintering atmosphere. A solid solution of silver and gold seems to develop on the surface of the substrate, decreasing the section of the silver grains in contact with the substrate. Thus the mechanical strength of the assembly is decreased. This effect should be limited by the gold available for the Au-Ag solid solution growth. When sintering under nitrogen, the diffusion of silver on the gold surface is much lower than under air. Good results have been obtained with these configurations and even after ageing. Adding pressure during the thermal treatment seems also to minimize the phenomenon, probably by increasing the number of silver grains in contact with the substrate surface and so reducing the free surface for Au-Ag layer formation. Those results have been used to build prototypes, one of whom has been electrically tested with success at temperatures up to 300°C
Marsh, P. "Sintering of mixed powders." Thesis, University of Nottingham, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.282832.
Повний текст джерелаDhavale, Tushar. "Low power laser sintering of iron powder." Thesis, University of the West of England, Bristol, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.522529.
Повний текст джерелаBooysen, Gerrie Jacobus. "Bridge tooling through layered sintering of powder." Thesis, Bloemfontein : Central University of Technology, Free State, 2007. http://hdl.handle.net/11462/72.
Повний текст джерелаFaster mould production methods will undeniably impact positively on the product development community. Rapid Tooling (RT) concepts, in context with the product development process and related product development theories, were analysed. Conventional tooling techniques used such as epoxy plastic tooling and machined injection moulding techniques were used as point of departure for the research work, which focused on Laser Sintering of powder materials. The new generation RT materials that are available at the Central University of Technology, Free State, are a vast improvement on the old materials. RT materials are constantly being developed and the project aims were to stay abreast with the latest developments. The thesis gives a complete overview of all related technologies, and also an in-depth discussion of both the Selective Laser Sintering (SLS) and Laser Sintering (LS) processes. Mould size limitations, as well as general tooling design issues, polishing and finishing techniques were all taken into account. Data has been collected to compare mould inserts grown with RP machines with that of conventionally machined tools. Aspects such as tool life, part quality, lead times and cost were used as parameters to determine the differences and make recommendations. Through analysis of several experiments and industrial case studies, RT through sintered materials was proven as a capable technology, giving the option of an intermediate (bridge tooling) or even a final step of tooling. Recommendations for future use were made in terms of insert size and geometry, accuracy, durability and shrinkages, to ensure the feasibility of the RT process in SA.
Eane, Radu Bogdan. "Metal powder effects on selective laser sintering." Thesis, University of Leeds, 2002. http://etheses.whiterose.ac.uk/4016/.
Повний текст джерелаKempen, Daniel. "Thermomechanical modelling of powder compaction and sintering." Doctoral thesis, Università degli studi di Trento, 2019. https://hdl.handle.net/11572/369024.
Повний текст джерелаSilver, Kathleen G. "Processing of nano-sized boron carbide powder." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/26476.
Повний текст джерелаCommittee Chair: Speyer, Robert; Committee Member: Judson, Elizabeth; Committee Member: Sanders, Thomas. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Книги з теми "Sintering of silver powder"
Ceramic processing and sintering. 2nd ed. New York: M. Dekker, 2003.
Знайти повний текст джерелаRahaman, M. N. Ceramic processing and sintering. New York: M. Dekker, 1995.
Знайти повний текст джерелаIvensen, V. A. Fenomenologii͡a︡ spekanii͡a︡ i nekotorye voprosy teorii. Moskva: "Metallurgii͡a︡", 1985.
Знайти повний текст джерелаBondarenko, B. I. Vosstanovitelʹno-obezuglerozhivai͡u︡shchiĭ otzhig metallicheskikh poroshkov. Kiev: Nauk. dumka, 1991.
Знайти повний текст джерелаV, Skorokhod V., Khermelʹ V, and Instytut problem materialoznavstva (Akademii͡a︡ nauk Ukraïnsʹkoï RSR), eds. Prot͡s︡essy massoperenosa pri spekanii. Kiev: Nauk. dumka, 1987.
Знайти повний текст джерелаSuxing, Wu. Sintering additives for Zirconia ceramics. Carnforth, Lancs: Parthenon Press, 1986.
Знайти повний текст джерелаGerman, Randall M. Powder metallurgy and particulate materals processing: The processes, materials, products, properties and applications. Princeton, NJ: Metal Powder Industries Federation, 2005.
Знайти повний текст джерелаOkoński, Stanisław. Podstawy plastycznego kształtowania materiałów spiekanych z proszków metali. Kraków: Politechnika Krakowska im. Tadeusza Kościuszki, 1993.
Знайти повний текст джерелаGerman, Randall M. Powder metallurgy and particulate materials processing: The processes, materials, products, properties and applications. Princeton, New Jersey: Metal Powder Industries Federation, 2005.
Знайти повний текст джерелаKubicki, Boguslaw. Sintered machine elements. New York: Ellis Horwood, 1995.
Знайти повний текст джерелаЧастини книг з теми "Sintering of silver powder"
Lei, Thomas G., Jesus Calata, Shu Fang Luo, Guo Quan Lu, and Xu Chen. "Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules." In Key Engineering Materials, 2948–53. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-456-1.2948.
Повний текст джерелаSeto, Takafumi, and Kikuo Okuyama. "Sintering." In Powder Technology Handbook, 151–54. Fourth edition. | Boca Raton, FL : Taylor & Francis Group, LLC, 2020.: CRC Press, 2019. http://dx.doi.org/10.1201/b22268-21.
Повний текст джерелаSyed-Khaja, Aarief, and Jörg Franke. "Silver Sintering." In CIRP Encyclopedia of Production Engineering, 1–5. Berlin, Heidelberg: Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-642-35950-7_16867-1.
Повний текст джерелаSyed-Khaja, Aarief, and Jörg Franke. "Silver Sintering." In CIRP Encyclopedia of Production Engineering, 1565–70. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-53120-4_16867.
Повний текст джерелаKelly, J. P., and O. A. Graeve. "Effect of Powder Characteristics on Nanosintering." In Sintering, 57–95. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-31009-6_4.
Повний текст джерелаSato, Yasuhisa, Seiki Matsui, Ryuzo Watanabe, and Atushi Satori. "Isodynamic Compaction of Titanium Powder." In Sintering ’87, 569–74. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_96.
Повний текст джерелаAbe, Osami, Syuzo Kanzaki, Masayoshi Ohashi, and Hideyo Tabata. "Characterization of CIP Formed Powder Compacts." In Sintering ’87, 237–42. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_40.
Повний текст джерелаEvans, James W., and Lutgard C. De Jonghe. "Sintering of Powder Compacts." In The Production and Processing of Inorganic Materials, 402–39. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-48163-0_13.
Повний текст джерелаTanno, Koichi, and Masaaki Yagi. "Rapidly Solidified Powder Produced by Counterrotating Process." In Sintering ’87, 182–87. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_31.
Повний текст джерелаOkimoto, Kunio, and Tomio Satoh. "Superplastic Forming of Zn-Al Pre-Alloy Powder." In Sintering ’87, 611–16. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_103.
Повний текст джерелаТези доповідей конференцій з теми "Sintering of silver powder"
Pietrikova, Alena, Tomas Girasek, Juraj Durisin, and Karel Saksl. "Pressureless Silver Sintering in Power Application." In 2018 International Conference on Diagnostics in Electrical Engineering (Diagnostika). IEEE, 2018. http://dx.doi.org/10.1109/diagnostika.2018.8526084.
Повний текст джерелаButtay, Cyril, Bruno Allard, and Raphael Riva. "Silver sintering for power electronics integration." In 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC). IEEE, 2015. http://dx.doi.org/10.1109/icep-iaac.2015.7111076.
Повний текст джерелаBai, John G., Zach Z. Zhang, Jesus N. Calata, and Guo-Quan Lu. "Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-79187.
Повний текст джерелаDutt, Gyan, Mike Marczi, and Oscar Khaselev. "Silver Sintering Die Attach – Myths & Physics." In 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP). IEEE, 2019. http://dx.doi.org/10.1109/iwipp.2019.8799095.
Повний текст джерелаFujino, M., H. Narusawa, Y. Kuramochi, E. Higurashi, T. Suga, T. Shiratori, and M. Mizukoshi. "Transient Liquid-Phase Sintering using Tin and Silver Powder Mixture for Die Bonding." In 2015 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2015. http://dx.doi.org/10.7567/ssdm.2015.ps-2-7.
Повний текст джерелаLu, Guo-Quan, Yunhui Mei, Meiyu Wang, and Xin Li. "Low-temperature Silver Sintering for Bonding 3D Power Modules." In 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735123.
Повний текст джерелаGao, Lilan, Xinwei Tian, Chengjin Wu, Yulong Xing, Yansong Tan, Xu Chen, and Guoquan Lu. "Nano-Silver Pressureless Sintering Technology in Power Module Packaging." In 2022 IEEE International Conference on Mechatronics and Automation (ICMA). IEEE, 2022. http://dx.doi.org/10.1109/icma54519.2022.9856054.
Повний текст джерелаChi, Wei-Hao, Yu-Wen Huang, Hao-Chih Chen, Ping-Chun Chen, Chia-Hsiang Chang, and Hsueh-Kuo Liao. "Silver sintering die attachment for power chip in power module." In 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2017. http://dx.doi.org/10.1109/impact.2017.8255944.
Повний текст джерелаPribitny, P., A. Chvala, J. Marek, and D. Donoval. "Advanced TCAD Simulation of Silver Sintering for Power Modules Integration." In 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM). IEEE, 2018. http://dx.doi.org/10.1109/asdam.2018.8544562.
Повний текст джерелаZhao, Yimin, Paul Mumby-Croft, Steve Jones, Andy Dai, Zechun Dou, Yafei Wang, and Feng Qin. "Silver sintering die attach process for IGBT power module production." In 2017 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2017. http://dx.doi.org/10.1109/apec.2017.7931138.
Повний текст джерелаЗвіти організацій з теми "Sintering of silver powder"
Chu, May-Ying. Sintering stress and microstructure in ceramic powder compacts. Office of Scientific and Technical Information (OSTI), August 1990. http://dx.doi.org/10.2172/6388375.
Повний текст джерелаRios, Orlando, William G. Carter, and Stefan Ulrich. Additive Manufacturing Consolidation of Low-Cost Water Atomized Steel Powder Using Micro-Induction Sintering. Office of Scientific and Technical Information (OSTI), April 2018. http://dx.doi.org/10.2172/1439146.
Повний текст джерелаBraegelmann, Peter. Developing New Polymeric Powder Feedstocks for Selective Laser Sintering: Emphasizing Particle Size and Shape. Office of Scientific and Technical Information (OSTI), June 2022. http://dx.doi.org/10.2172/1871451.
Повний текст джерелаDubois, Diego, Amirali Eskandariyun, Suprabha Das, Andriy Durygin, and Zhe Cheng. Flash Sintering of Commercial Zirconium Nitride Powders. Florida International University, October 2021. http://dx.doi.org/10.25148/mmeurs.009777.
Повний текст джерелаMunir, Z. A. An investigation of the mechanisms of solid state powder reaction in the combustion synthesis and sintering of high temperature materials. Office of Scientific and Technical Information (OSTI), August 1989. http://dx.doi.org/10.2172/7258522.
Повний текст джерела