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Статті в журналах з теми "Molding materials Thermal properties"
Hentati, Nesrine, Mohamed Kchaou, Anne-Lise Cristol, Riadh Elleuch, and Yannick Desplanques. "Impact of hot molding temperature and duration on braking behavior of friction material." Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology 234, no. 9 (September 9, 2019): 1416–24. http://dx.doi.org/10.1177/1350650119873789.
Повний текст джерелаDobránsky, Jozef, and Zigmund Doboš. "Effect of thermal degradation on rheological properties of polymeric materials." MATEC Web of Conferences 299 (2019): 06001. http://dx.doi.org/10.1051/matecconf/201929906001.
Повний текст джерелаSrebrenkoska, Vineta, Gordana Bogoeva-Gaceva, and Dimko Dimeski. "Composite material based on an ablative phenolic resin and carbon fibers." Journal of the Serbian Chemical Society 74, no. 4 (2009): 441–53. http://dx.doi.org/10.2298/jsc0904441s.
Повний текст джерелаSakurai, Junpei, Mitsuhiro Abe, Masayuki Ando, and Seiichi Hata. "Combinatorial Searching for Ni-Nb-Zr Amorphous Alloys as Glass Lens Molding Die Materials." Key Engineering Materials 447-448 (September 2010): 661–65. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.661.
Повний текст джерелаXi, Yong Guang, Tong Jiang Peng, Hai Feng Liu, and Ji Ming Chen. "Preparation and Properties of Expanded Vermiculite/Gypsum Thermal Insulation Boards." Advanced Materials Research 178 (December 2010): 220–25. http://dx.doi.org/10.4028/www.scientific.net/amr.178.220.
Повний текст джерелаB Vaggar, Gurushanth, S. C Kamate, and Pramod V Badyankal. "Thermal Properties Characterization of Glass Fiber Hybrid Polymer Composite Materials." International Journal of Engineering & Technology 7, no. 3.34 (September 1, 2018): 455. http://dx.doi.org/10.14419/ijet.v7i3.34.19359.
Повний текст джерелаXue, Mao Quan. "Study and Application of Plastic Construction Materials." Applied Mechanics and Materials 99-100 (September 2011): 1117–20. http://dx.doi.org/10.4028/www.scientific.net/amm.99-100.1117.
Повний текст джерелаLee, Wen-Jau, I.-Min Tseng, Yu-Pin Kao, Yun-Yun Lee, and Ming-Shan Hu. "Synthesis of alcohol-soluble phenol-formaldehyde resins from pyrolysis oil of Cunninghamia lanceolata wood and properties of molding plates made of resin-impregnated materials." Holzforschung 68, no. 2 (February 1, 2014): 217–22. http://dx.doi.org/10.1515/hf-2013-0068.
Повний текст джерелаBillah, Md Maruf, Md Sanaul Rabbi, and Afnan Hasan. "A Review on Developments in Manufacturing Process and Mechanical Properties of Natural Fiber Composites." Journal of Engineering Advancements 2, no. 01 (February 3, 2021): 13–23. http://dx.doi.org/10.38032/jea.2021.01.003.
Повний текст джерелаKim, Young Shin, Jae Kyung Kim, and Euy Sik Jeon. "Effect of the Compounding Conditions of Polyamide 6, Carbon Fiber, and Al2O3 on the Mechanical and Thermal Properties of the Composite Polymer." Materials 12, no. 18 (September 19, 2019): 3047. http://dx.doi.org/10.3390/ma12183047.
Повний текст джерелаДисертації з теми "Molding materials Thermal properties"
Šupa, Jan. "Ověření funkčnosti počítačové simulace v oblasti tepelných vlastností forem." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2013. http://www.nusl.cz/ntk/nusl-230852.
Повний текст джерелаCockcroft, Steven Lee. "Thermal stress analysis of fused-cast Monofrax-S refractories." Thesis, University of British Columbia, 1990. http://hdl.handle.net/2429/30991.
Повний текст джерелаApplied Science, Faculty of
Materials Engineering, Department of
Graduate
Park, Sang-il. "Thermal conductivity of bentonite-bonded molding sands at high temperatures." Diss., Georgia Institute of Technology, 1987. http://hdl.handle.net/1853/18386.
Повний текст джерелаHellman, Olle. "Thermal properties of materials from first principles." Doctoral thesis, Linköpings universitet, Teoretisk Fysik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-78755.
Повний текст джерелаArrighi, Aloïs. "Thermal and thermoelectric properties of two-dimensional materials." Doctoral thesis, TDX (Tesis Doctorals en Xarxa), 2020. http://hdl.handle.net/10803/670380.
Повний текст джерелаLa gestión térmica es un problema crítico en el diseño de dispositivos nanoelectrónicos. Las soluciones de enfriamiento avanzadas y la recolección eficiente de energía son clave para mantener la tendencia de productos electrónicos cada vez más pequeños y rápidos. Esta tesis se centra en la gestión térmica y el uso de calor disipado en materiales emergentes para la electrónica. En particular, los materiales bidimensionales (2DM) y las heteroestructuras basadas en ellos son candidatos muy interesantes para el futuro de la electrónica y se están investigando intensamente. La tesis trata dos temas principales: (i) el transporte térmico de 2DMs suspendidos, incluido el grafeno CVD, dicalcogenuros de metales de transición (TMDC) y heteroestructuras de TMDC con nitruro de boro hexagonal (hBN); y (ii) las propiedades térmicas y de termoelectricidad de películas delgadas de (Bi1-xSbx)2Te3(BST). Estos materiales están siendo considerados para interconexiones y transistores hasta THz (grafeno), electrónica digital (TMDCs) y aislamiento eléctrico (hBN) y son bien conocidos como generadores termoeléctricos, como también lo son materiales recientemente identificados como aislantes topológicos (BST). En primer lugar, el objetivo fue medir la conductividad térmica de 2DMs utilizando el método de espectroscopia Raman de dos láser, recientemente desarrollado. El desafío fue el uso de membranas relativamente pequeñas obtenidas y su alta conductividad térmica. Demostramos que la conductividad térmica del grafeno CVD es de aproximadamente 300 W/(m·K). Aunque menor que en el grafeno exfoliado, esto podría deberse a los bordes de grano y al desorden en grafeno CVD. Demostramos también que las conductividades térmicas de MoS2 y MoSe2 exfoliados (dos TMDC) son 12 a 24 W/(m·K) y 60 W/(m·K), respectivamente. Y que para membranas delgadas (pocas monocapas) la conductividad incrementa con su grosor. Agregando una membrana de hBN exfoliada sobre una muestra de MoS2 previamente caracterizada nos permitió demostrar un notable aumento de la conductividad térmica en la heteroestructura de hBN/MoS2, cuando se introduce calor en MoS2. Esta presenta una conductividad térmica de 185 W/(m·K), casi un orden de magnitud mayor que para MoS2. En segundo lugar, se estudiaron películas delgadas de BST crecidas mediante epitaxia de haz molecular con el objetivo de correlacionar sus propiedades termoeléctricas con su nivel de Fermi, que sintonizaría el peso relativo del transporte de volumen y de los estados topológicos de superficie (TSS). Primero demostramos que es posible diseñar la estructura de la banda y ajustar el nivel de Fermi desde la valencia hasta la banda de conducción simplemente controlando la concentración de Sb. Para ello se utilizó espectroscopia de fotoemisión con resolución angular en combinación con conductividad eléctrica y mediciones de Hall en películas relativamente delgadas (10 nm). También se identificó la concentración de Sb a la que los TSSs dominan el transporte y se llevaron a cabo experimentos termoeléctricos en las mismas películas. No se encontró una correlación clara entre la energía termoeléctrica y la naturaleza de los portadores de carga cuando los TSSs eran dominantes, indicando que el transporte de los TSSs tiene una influencia limitada en las propiedades termoeléctricas de este material y que para observar los efectos de superficie se necesitarían películas más delgadas. Finalmente, una caracterización de las películas delgadas de BST usando espectroscopia Raman demostró variaciones específicas en el comportamiento asociado a la concentración de Sb. En particular, el aumento de la potencia del láser dio lugar a la aparición de picos Raman no activos de origen indeterminado. Estos picos pueden indicar la ruptura de simetrías estructurales, modos de fonón de superficie u otros efectos tales como resonancias plasmónicas que son de alto interés, una respuesta que debería motivar investigaciones adicionales.
Thermal management is becoming a critical issue in the packaging and design of nanoelectronics. Advanced cooling solutions and efficient energy harvesting are key aspects to help keep the trend for ever smaller and faster electronics. This thesis is focused on thermal management and the use of heat waste in emerging materials for electronics. In particular, two-dimensional materials (2DM), and related heterostructures, are amongst the most intriguing prospects for future electronics and are being intensively investigated. Here, two main subjects were explored. First, the thermal transport of suspended 2DMs, including CVD graphene, transition metal dichalcogenides (TMDCs) and heterostructures of TMDCs with hexagonal boron nitride (hBN) and, second, the thermal properties and thermoelectricity of (Bi1-xSbx)2Te3 (BST) thin films. These materials are being considered for interconnects and THz transistors (graphene), digital electronics (TMDCs) and electrical insulation (hBN) and are well known as thermoelectric generators, as are also materials that have recently been identified as topological insulators (BST). In the first part, the objective was to demonstrate the measurement of the thermal conductivity of 2DMs using the recently developed two-laser Raman spectroscopy method. Its implementation was rendered difficult by the relatively small exfoliated flakes of the materials investigated and their high thermal conductivity. The thermal conductivity of CVD graphene was found to be about 300 W/(m·K). Although smaller than exfoliated graphene, it is argued that this could be due to grain boundaries and disorder. Exfoliated MoS2 and MoSe2 (two well-known TMDCs) presented thermal conductivities of 12 to 24 W/(m·K) and 60 W/(m·K). Measurements on different membranes of MoS2 further showed that the conductivity increases with the thickness in thin membranes (few monolayers). Furthermore, stacking an exfoliated hBN membrane on top of a previously characterized MoS2 sample allowed us to demonstrate a notorious increase of the thermal conductivity in the hBN/MoS2 heterostructure, when heat is introduced on MoS2. Indeed, when compared with MoS2 alone the thermal conductivity is found to be almost one order of magnitude larger, 185 W/(m·K). For the second part, BST thin films were grown by molecular beam epitaxy. The main objective was to investigate the correlation of the thermoelectric properties of these materials with the Fermi level, which would tune the relative weight of bulk and topological surface state (TSS) transport. It was first demonstrated that controlling the concentration of Sb we could engineer the band structure and tune the Fermi level from the valence to the conduction band. Such demonstration was achieved by using angle-resolved photoemission spectroscopy in combination with conductivity and Hall measurements in relatively thin (10 nm) films. The Sb concentration at which TSS dominated the transport was also identified. Thermoelectric experiments on the same films were then carried out but no clear correlation between the thermopower and the carrier nature was found when the TSSs were dominant. These results indicate that TSS transport has limited influence on the thermoelectric properties. Further studies should be carried our using even thinner films. Finally, a side characterization of the BST thin films using Raman spectroscopy demonstrated specific variations in the behaviour associated to Sb concentration. An increase of the laser power showed the emergence of non-active Raman peaks of undetermined origin. However, they can indicate the presence of broken structural symmetries, surface phonon modes or other effects such as plasmonic resonances. This interesting response is worthy of for further investigation.
Universitat Autònoma de Barelona. Programa de Doctorat en Física
Modica, S. P. "The thermal properties of homogeneous and composite materials." Thesis, Loughborough University, 1992. https://dspace.lboro.ac.uk/2134/35579.
Повний текст джерелаFarhoudi, Yalda. "Measurement and computation of thermal stresses in injection molding of amorphous and crystalline polymers." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape11/PQDD_0018/NQ44426.pdf.
Повний текст джерелаLeBaut, Yann P. "Thermal aspect of stereolithography molds." Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/15991.
Повний текст джерелаLind, Cora. "Negative thermal expansion materials related to cubic zirconium tungstate." Diss., Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/30861.
Повний текст джерелаLiao, Hao-Hsiang. "Thermal and thermoelectric properties of nanostructured materials and interfaces." Diss., Virginia Tech, 2012. http://hdl.handle.net/10919/19198.
Повний текст джерелаPh. D.
Книги з теми "Molding materials Thermal properties"
Ignaszak, Zenon. Właściwości termofizyczne materiałów formy w aspekcie sterowania procesem krzepnięcia odlewów. Poznań: Politechnika Poznańska, 1989.
Знайти повний текст джерелаGrimvall, Göran. Thermophysical properties of materials. Amsterdam: Elsevier, 1999.
Знайти повний текст джерелаJannot, Yves, and Alain Degiovanni. Thermal Properties Measurement of Materials. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2018. http://dx.doi.org/10.1002/9781119475057.
Повний текст джерелаThermophysical properties of materials. Amsterdam: North-Holland, 1986.
Знайти повний текст джерелаS, Yungman V., ed. Thermal constants of substances. New York: Wiley, 1999.
Знайти повний текст джерелаThermal analysis of materials. New York: Marcel Dekker, 1994.
Знайти повний текст джерелаThermodynamics of materials. New York: Wiley, 1995.
Знайти повний текст джерелаBarry, Haworth, and Batchelor Jim, eds. Physics of plastics: Processing, properties and materials engineering. Munich: Hanser, 1992.
Знайти повний текст джерелаBarry, Haworth, and Batchelor Jim, eds. Physics of plastics: Processing, properties, and materials engineering. Munich: Hanser Publishers, 1992.
Знайти повний текст джерелаA, Schneider Gerold, Petzow G, North Atlantic Treaty Organization. Scientific Affairs Division., and NATO Advanced Research Workshop on the Thermal Shock and Thermal Fatigue Behavior of Advanced Ceramics (1992 : Munich, Germany), eds. Thermal shock and thermal fatigue behavior of advanced ceramics. Dordrecht: Kluwer Academic Publishers, 1993.
Знайти повний текст джерелаЧастини книг з теми "Molding materials Thermal properties"
Dasari, Aravind, Zhong-Zhen Yu, and Yiu-Wing Mai. "Thermal Properties." In Engineering Materials and Processes, 161–84. London: Springer London, 2016. http://dx.doi.org/10.1007/978-1-4471-6809-6_7.
Повний текст джерелаBuck, Wolfgang, and Steffen Rudtsch. "Thermal Properties." In Springer Handbook of Materials Measurement Methods, 399–429. Berlin, Heidelberg: Springer Berlin Heidelberg, 2006. http://dx.doi.org/10.1007/978-3-540-30300-8_8.
Повний текст джерелаDomone, Peter, and Marios Soutsos. "Electrical and thermal properties." In Construction Materials, 81–82. Fifth edition. | Boca Raton : CRC Press, [2017]: CRC Press, 2017. http://dx.doi.org/10.1201/9781315164595-8.
Повний текст джерелаHummel, Rolf E. "Thermal Conduction." In Electronic Properties of Materials, 285–90. Berlin, Heidelberg: Springer Berlin Heidelberg, 1985. http://dx.doi.org/10.1007/978-3-662-02424-9_21.
Повний текст джерелаHummel, Rolf E. "Thermal Expansion." In Electronic Properties of Materials, 291–93. Berlin, Heidelberg: Springer Berlin Heidelberg, 1985. http://dx.doi.org/10.1007/978-3-662-02424-9_22.
Повний текст джерелаHummel, Rolf E. "Thermal Conduction." In Electronic Properties of Materials, 351–57. Dordrecht: Springer Netherlands, 1993. http://dx.doi.org/10.1007/978-94-017-4914-5_21.
Повний текст джерелаHummel, Rolf E. "Thermal Expansion." In Electronic Properties of Materials, 358–60. Dordrecht: Springer Netherlands, 1993. http://dx.doi.org/10.1007/978-94-017-4914-5_22.
Повний текст джерелаHummel, Rolf E. "Thermal Conduction." In Electronic Properties of Materials, 390–96. Berlin, Heidelberg: Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-86538-1_21.
Повний текст джерелаHummel, Rolf E. "Thermal Expansion." In Electronic Properties of Materials, 397–99. Berlin, Heidelberg: Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-86538-1_22.
Повний текст джерелаWhite, Mary Anne. "Thermal Expansion." In Physical Properties of Materials, 173–93. Third edition. | Boca Raton : Taylor & Francis, CRC Press, 2019.: CRC Press, 2018. http://dx.doi.org/10.1201/9780429468261-10.
Повний текст джерелаТези доповідей конференцій з теми "Molding materials Thermal properties"
Johnson, John L., Lye King Tan, Pavan Suri, and Randall M. German. "Metal Injection Molding of Multi-Functional Materials." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-41151.
Повний текст джерелаKosnik, Sabrina, and Davide Piovesan. "Polymeric Reaction Molding of Biocompatible Materials: Lessons Learned." In ASME 2020 15th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/msec2020-8465.
Повний текст джерелаWilden, J., T. Schnick, and A. Wank. "Thermal Spray Moulding – Production of Microcomponents." In ITSC2002, edited by C. C. Berndt and E. Lugscheider. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2002. http://dx.doi.org/10.31399/asm.cp.itsc2002p0144.
Повний текст джерелаGhosh, Kalyanjit, and Srinivas Garimella. "Dynamic Modeling of Thermal Processes in Rotational Molding." In ASME 2004 Heat Transfer/Fluids Engineering Summer Conference. ASMEDC, 2004. http://dx.doi.org/10.1115/ht-fed2004-56801.
Повний текст джерелаChang, Ruxia, Desong Fan, and Qiang Li. "Research on Thermal Properties of Insulator-Metal Transition at Room Temperature in Sm1-xCaxMnO3." In ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/mnhmt2019-3963.
Повний текст джерелаSaad, Messiha, Darryl Baker, and Rhys Reaves. "Thermal Characterization of Carbon-Carbon Composites." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-64061.
Повний текст джерелаHamasaki, Norikazu, Shuhei Yamaguchi, Shohei Use, Tomohiro Kawashima, Hiroyuki Muto, Masayuki Nagao, Naohiro Hozumi, and Yoshinobu Murakami. "Influence of filler orientation and molding temperature on electrical and thermal properties of PMMA/h-BN composite material produced by electrostatic adsorption method." In 2017 International Symposium on Electrical Insulating Materials (ISEIM). IEEE, 2017. http://dx.doi.org/10.23919/iseim.2017.8166535.
Повний текст джерелаFalat, T., K. Friedel, K. Malecki, D. Uruska, and W. Gal. "The influence of process parameters and materials properties on stress distribution in MEMS - ASIC integrated systems after molding - numerical and experimental approach." In 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2009. http://dx.doi.org/10.1109/esime.2009.4938440.
Повний текст джерелаPatrick, Melanie, and Messiha Saad. "3D Examination of the Thermal Properties of Carbon-Carbon Composites." In ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-40146.
Повний текст джерелаTillmann, W., E. Vogli, K. Weidenmann, and K. Fleck. "Reinforced Lightweight Composite Materials." In ITSC2005, edited by E. Lugscheider. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2005. http://dx.doi.org/10.31399/asm.cp.itsc2005p1064.
Повний текст джерелаЗвіти організацій з теми "Molding materials Thermal properties"
Johra, Hicham. Thermal properties of common building materials. Department of the Built Environment, Aalborg University, January 2019. http://dx.doi.org/10.54337/aau294603722.
Повний текст джерелаHardy, Robert Douglas, David R. Bronowski, Moo Yul Lee, and John H. Hofer. Mechanical properties of thermal protection system materials. Office of Scientific and Technical Information (OSTI), June 2005. http://dx.doi.org/10.2172/923159.
Повний текст джерелаJohra, Hicham. Thermal properties of building materials - Review and database. Department of the Built Environment, Aalborg University, October 2021. http://dx.doi.org/10.54337/aau456230861.
Повний текст джерелаBennett, John G., and Erik S. Polsen. Analysis of the Thermal Shielding Properties of Camouflage Materials. Fort Belvoir, VA: Defense Technical Information Center, February 2007. http://dx.doi.org/10.21236/ada466873.
Повний текст джерелаChen, Youping. Prediction of Thermal Transport Properties of Materials with Microstructural Complexity. Office of Scientific and Technical Information (OSTI), October 2017. http://dx.doi.org/10.2172/1398768.
Повний текст джерелаLawson, J. Randall, William D. Walton, Nelson P. Bryner, and Francine K. Amon. Estimates of thermal properties for fire fighters' protective clothing materials. Gaithersburg, MD: National Institute of Standards and Technology, 2005. http://dx.doi.org/10.6028/nist.ir.7282.
Повний текст джерелаJ. E. Daw, J. L. Rempe, and D. L. Knudson. Thermal Properties of Structural Materials Found in Light Water Reactor Vessels. Office of Scientific and Technical Information (OSTI), November 2009. http://dx.doi.org/10.2172/974795.
Повний текст джерелаRoberts, Howard W. Thermal Properties of Contemporary and Conventional Gutta Percha Materials Used in Root Canal Treatment. Fort Belvoir, VA: Defense Technical Information Center, January 2015. http://dx.doi.org/10.21236/ada612962.
Повний текст джерелаMcQuaid, M. J., A. E. Kinkennon, R. A. Pesce-Rodriguez, and R. A. Beyer. Laser-Based Ignition for a Gunfire Simulator (GUFS): Thermal Transport Properties for Candidate Igniter Materials. Fort Belvoir, VA: Defense Technical Information Center, August 1999. http://dx.doi.org/10.21236/ada368648.
Повний текст джерелаMin, Kyung-Eun. A Study of Thermal Energy Storage of Phase Change Materials: Thermophysical Properties and Numerical Simulations. Portland State University Library, January 2000. http://dx.doi.org/10.15760/etd.6711.
Повний текст джерела