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Добірка наукової літератури з теми "MICROSTRIP LIVES"

Автор: Grafiati

Опубліковано: 11 вересня 2023

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Статті в журналах з теми "MICROSTRIP LIVES"

Sai Geethika, Sunkavalli, Etyala Kethan, Pilli Rishika, and Machunoori Mounica. "Design of Microstrip Rectangular 8x1 Patch Array Antenna for WiMAX Application." E3S Web of Conferences 391 (2023): 01100. http://dx.doi.org/10.1051/e3sconf/202339101100.

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In our daily lives, wireless communications are becoming increasingly significant. The antennas needed for these applications should be light weight, conveniently mountable, and have a broad bandwidth due to the rise in data rates and a tendency of tiny electronic devices for wireless digital applications. These requirements can be met by Microstrip Array Antennas. In this paper, the rectangular microstrip patch array antenna of frequency 2.5-3.5Ghz for WIMAX applications is designed in computer stimulation tool (CST). The antenna is fabricated using FR-4 Substrate material. The designed antenna’s performance is analysed in terms of voltage VSWR, s-parameters, radiation pattern, gain, directivity.

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Christina, G. "A Review on Novel Microstrip Patch Antenna Designs and Feeding Techniques." IRO Journal on Sustainable Wireless Systems 4, no. 2 (July 25, 2022): 110–20. http://dx.doi.org/10.36548/jsws.2022.2.005.

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Mobile technology is rapidly advancing nowadays due to its high impact in our day-to-day lives. As a result, there is an increasing need to study the advancement of antenna systems, which are regarded as fundamental equipment for wireless connectivity. Compared to the traditional large size antennas, microstrip patch antennas are now widely used in different applications such as smart phones, military, smart wearable devices etc. due to its unique characteristics such as lighter weight, reconfigurable structure, foldability, ease of fabrication, multi-frequency operations, and compactness. This research study presents a review on various microstrip patch antenna designs and the different antenna feed mechanisms available for 5G applications.

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Chen, Ja-Hao, Chen-Yang Cheng, Chuan-Min Chien, Chumpol Yuangyai, Ting-Hua Chen, and Shuo-Tsung Chen. "Multiple Performance Optimization for Microstrip Patch Antenna Improvement." Sensors 23, no. 9 (April 26, 2023): 4278. http://dx.doi.org/10.3390/s23094278.

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As the Internet of Things (IOT) becomes more widely used in our everyday lives, an increasing number of wireless communication devices are required, meaning that an increasing number of signals are transmitted and received through antennas. Thus, the performance of antennas plays an important role in IOT applications, and increasing the efficiency of antenna design has become a crucial topic. Antenna designers have often optimized antennas by using an EM simulation tool. Although this method is feasible, a great deal of time is often spent on designing the antenna. To improve the efficiency of antenna optimization, this paper proposes a design of experiments (DOE) method for antenna optimization. The antenna length and area in each direction were the experimental parameters, and the response variables were antenna gain and return loss. Response surface methodology was used to obtain optimal parameters for the layout of the antenna. Finally, we utilized antenna simulation software to verify the optimal parameters for antenna optimization, showing how the DOE method can increase the efficiency of antenna optimization. The antenna optimized by DOE was implemented, and its measured results show that the antenna gain and return loss were 2.65 dBi and 11.2 dB, respectively.

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Singh, Arun Kumar, Arun Kumar, Samarendra Nath Sur, Rabindranath Bera, and Bansibadan Maji. "Design and implementation of microstrip array antenna for intelligent transportation systems application." Frequenz 75, no. 7-8 (June 1, 2021): 267–73. http://dx.doi.org/10.1515/freq-2020-0162.

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Abstract This article proposes a design and implementation of array Microstrip Patch antenna of configuration 2 × 2 at an operating frequency of 3.5 GHz. The proposed design takes a dimension of 80 mm × 92 mm × 1.6 mm with four radiating elements arranged in rectangular form with an optimized separation between the patches. All the radiating elements were connected through a corporate series network with an inset feed to have better impedance matching. The model gives an efficiency of 90.99% with a bandwidth of 510 MHz and with fractal configuration, the bandwidth further enhances to 1.12 GHz. The maximum gain measured was found as 11.01 dBi at θ = 10° and ɸ = 360° and 10.45 dBi with fractal configuration. The designed antenna is proposed to be used in RADAR which will be used in the intelligent transportation system for the detection of nearby (short-range) vehicles in the blind zone. This kind of Radar also finds its application in collision avoidance and activating airbags/break boosting and thus helping mankind by saving lives. The article gives an idea of the use of an array antenna in intelligent transportation system for better gain and efficient results.

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Ghazali, Abu Nasar, Mohd Sazid, and Srikanta Pal. "A dual notched band UWB-BPF based on microstrip-to-short circuited CPW transition." International Journal of Microwave and Wireless Technologies 10, no. 7 (May 21, 2018): 794–800. http://dx.doi.org/10.1017/s1759078718000594.

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AbstractThis paper proposes a dual notched band ultra-wideband (UWB) bandpass filter (BPF) based on hybrid transition of microstrip and coplanar waveguide (CPW). The CPW in ground plane houses a stepped impedance resonator shorted at ends, and is designed to place its resonant modes within the UWB passband. The microstrips on the top plane are placed some distance apart in a back-to-back manner. The transition of microstrip on top and shorted CPW in the ground is coupled through the dielectric in a broadside manner. The optimized design of the transition develops the basic UWB spectrum with good return/insertion loss and extended stopband. Later, defected ground structure, embedded in CPW, and split ring resonators, coupled to feeding lines are utilized to develop dual sharp passband notches. The simulated data are verified against the experimentally developed prototype. The proposed dual notched UWB-BPF structure measures only 14.6 × 7.3 mm2, thereby justifying its compactness.

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La, Dong-Sheng, Xin Guan, Shuai-Ming Chen, Yu-Ying Li, and Jing-Wei Guo. "Wideband Band-Pass Filter Design Using Coupled Line Cross-Shaped Resonator." Electronics 9, no. 12 (December 17, 2020): 2173. http://dx.doi.org/10.3390/electronics9122173.

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In this paper, a wideband bandpass filter with a coupled line cross-shaped resonator (CLCSR) is proposed. The proposed bandpass filter is composed of two open-end parallel coupled lines, one short-end parallel coupled line, one branch microstrip line, and the parallel coupled line feed structure. With the use of the even and odd mode approach, the transmission zeros and transmission poles of the proposed bandpass filter are analyzed. The coupling coefficient of the parallel coupled line feed structure is big, so the distance between the parallel coupled line is too small to be processed. A three microstirp lines coupled structure is used to realize strong coupling and cross coupling. This structure also can reduce the return loss in passband and increase the out-of-band rejection. The transmission zeros can be adjusted easily by varying the lengths of the open-end parallel coupled line or the short-end parallel coupled line. The proposed bandpass filter is fabricated and measured. The simulated results agree well with the measured ones, which shows that the design method is valid.

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Lin, Shu-Dong, Shi Pu, Chen Wang, and Hai-Yang Ren. "Compact Design of Annular-Microstrip-Fed mmW Antenna Arrays." Sensors 21, no. 11 (May 26, 2021): 3695. http://dx.doi.org/10.3390/s21113695.

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In this paper, a series of four novel microstrip antenna array designs based on different annular-microstrip feeding lines at 60-GHz millimeter wave (mmW) band are proposed, aiming at the potential usage of the mmW coverage antenna with multi-directional property. As the feeding network, the annular contour microstrip lines are employed to connect the patch units so as to form a more compact array. Our first design is to use an outer contour annular microstrip line to connect four-direction linear arrays composed of 1 × 3 rectangular patches, thus the gain of 8.4 dBi and bandwidth of over 300 MHz are obtained. Our second design is to apply the two-direction pitchfork-shaped array each made up of two same linear arrays as the above, therefore the gain of 9.65 dBi and bandwidth of around 250 MHz are achieved. Our third design is to employ dual (inner and outer contour) annular-microstrip feeding lines to interconnect the above four-direction linear arrays, while our fourth design is to bring bridged annular-microstrip feeding lines, both of which can realize the goal of multi-directional radiation characteristic and higher gain of over 10 dBi.

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Yang, Hong, Zhe Yu Chen, and Kun Yi Lv. "Analysis of Dispersion Characteristic of Microstrip Lines on Ferrite and Silicon Structures with Spectral-Domain Method." Applied Mechanics and Materials 130-134 (October 2011): 1244–49. http://dx.doi.org/10.4028/www.scientific.net/amm.130-134.1244.

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In this paper, we presented two types of ferrite&si double layer substrate microstrip lines structures and derived waveguide admittance through coordinate rotation and Fourier transformation of Maxwell equations, then we analyzed its characteristics. We performed dispersion characteristic calculations on microstrip lines, discussed influence of various parameters of microstrip lines on dispersion characteristics and compared their characteristics, then we discovered parameters influence on one specific type of structure dispersion is minimum, especially on technique dimension of dielectric. It can make applications for IC fabrication.

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Knyazev N. S., Malkin A. I., and Chechetkin V. A. "Losses measurement method for transmission lines at mmWave." Technical Physics Letters 48, no. 3 (2022): 34. http://dx.doi.org/10.21883/tpl.2022.03.52880.18981.

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An experimental method was developed to determine losses in microstrip and coplanar transmission lines for devices operating in the frequency range of 77-81 GHz. The parameters of the scattering matrices are obtained using a vector network analyzer and frequency upconverters. The calculation of losses in waveguide-coplanar and coplanar-microstrip adapters is made. Keywords: losses, attenuation, microstrip line, coplanar waveguide, electrodynamic parameters.

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Vo, Hung T., and Frank G. Shi. "New Analytical Model for the Dielectric Loss of Microstrip Lines on Multilayer Dielectric Substrates: Effect of Conductor-Dielectric Interphase." Journal of Microelectronics and Electronic Packaging 3, no. 2 (April 1, 2006): 61–66. http://dx.doi.org/10.4071/1551-4897-3.2.61.

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The existing CAD formulae for dielectric loss of microstrip lines on substrate are complicated and inaccurate at high frequencies. In particular, no closed-form expression has been obtained for the dielectric loss of microstrip lines on multi-layer dielectric substrate by including the conductor-substrate interphase effect, although attempts have been made to study the finite thickness effect of the conductor and dielectric substrate. The present work represents the first attempt to obtain a closed-form CAD formula for the dielectric loss of microstrip lines on dielectric substrates by considering the effect of conductor-substrate interphase. Our simple and accurate model systematically considers the effect of the interphase between the microstrip line and substrate by using a quasi-TEM approach and is shown to be supported by the available experimental data.

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Дисертації з теми "MICROSTRIP LIVES"

Jones, Mark Loyd. "Spatial sampling of microwave frequency electrical signals using photoconductive switches on a microstrip transmission line." Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/15619.

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Simpson, John P. "Radiation from microstrip transmission lines." Thesis, University of Ottawa (Canada), 1988. http://hdl.handle.net/10393/5435.

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Dumbell, Keith David. "Theoretical and experimental investigation of shield effects in microstrip." Thesis, University of Bath, 1989. https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.257187.

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Tang, Guanghua. "High temperature thin film superconductors and microstrip spiral delay lines." Thesis, This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-01242009-063221/.

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Apaydin, Nil. "Novel Implementations of Coupled Microstrip Lines on Magnetic Substrates." The Ohio State University, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=osu1373897365.

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Ozkal, Piroglu Sefika. "Analysis Of Coupled Lines In Microwave Printed Circuit Elements." Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/2/12609047/index.pdf.

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Full wave analysis of microstrip lines at microwave frequencies is performed by using method of moments in conjunction with closed-form spatial domain Green&rsquo
s functions. The Green&rsquo
s functions are in general Sommerfeld-type integrals which are computationally expensive. To improve the efficiency of the technique, Green&rsquo
s functions are approximated by their closed-forms. Microstrip lines are excited by arbitrarily located current sources and are terminated by complex loads at both ends. Current distributions over microstrip lines are represented by rooftop basis functions. At first step, the current distribution over a single microstrip line is calculated. Next, the calculation of the current distributions over coupled microstrip lines is performed. The technique is then, applied to directional couplers. Using the current distributions obtained by the analysis, the scattering parameters of the structures are evaluated by using Prony&rsquo
s method. The results are compared with the ones gathered by using simulation software tools, CNL/2&trade
and Agilent Advanced Design System&trade
(ADS).

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Tan, Song. "Design of compact and dual-band microwave microstrip balun /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?ECED%202008%20TAN.

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Sotomayor, Polar Manuel Gustavo. "Analysis of Microstrip Lines on Substrates Composed of Several Dielectric Layers under the Application of the Discrete Mode Matching." Thesis, University of Gävle, University of Gävle, University of Gävle, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-3106.

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Microstrip structures became very attractive with the development of cost-effective dielectric materials. Among several techniques suitable to the analysis of such structures, the discrete mode matching method (DMM) is a full-wave approach that allows a fast solution to Helmholz equation. Combined with a full-wave equivalent circuit, the DMM allows fast and accurate analysis of microstrips lines on multilayered substrates.

The knowledge of properties like dispersion and electromagnetic fields is essential in the implementation of such transmission lines. For this objective a MATLAB computer code was developed based on the discrete mode matching method (DMM) to perform this analysis.

The principal parameter for the analysis is the utilization of different dielectric profiles with the aim of a reduction in the dispersion in comparison with one-layer cylindrical microstrip line, showing a reduction of almost 50%. The analysis also includes current density distribution and electromagnetic fields representation. Finally, the data is compared with Ansoft HFSS to validate the results.

The German Aerospace Center has rights over the thesis work

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Jin, Won Tae. "Circuit models for a millimeter-wave suspended-microstrip line discontinuity." Thesis, Monterey, California : Naval Postgraduate School, 1990. http://handle.dtic.mil/100.2/ADA240906.

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Thesis (M.S. in Systems Engineering (Electronic Warfare))--Naval Postgraduate School, September 1990.
Thesis Advisor(s): Atwater, Harry A. Second Reader: Janaswamy, Rama. "September 1990." Description based on title screen as viewed on December 29, 2009. DTIC Identifier(s): Suspended striplines, microstrip lines, equivalent circuits, program listings, theses. Author(s) subject terms: Suspended-microstrip line, step discontinuity, equivalent circuit model, step-change. Includes bibliographical references (p. 60). Also available in print.

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Wong, Man Fai. "A novel compact microstrip type composite right/left handed transmission line (CRLH TL) and its applications /." access full-text access abstract and table of contents, 2009. http://libweb.cityu.edu.hk/cgi-bin/ezdb/thesis.pl?mphil-ee-b23750467f.pdf.

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Thesis (M.Phil.)--City University of Hong Kong, 2009.
"Submitted to Department of Electronic Engineering in partial fulfillment of the requirements for the degree of Master of Philosophy." Includes bibliographical references.

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Книги з теми "MICROSTRIP LIVES"

Gardiol, Fred E. Microstrip circuits. New York: Wiley, 1994.

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Garg, Ramesh. Microstrip lines and slotlines. 3rd ed. Boston: Artech House, 2013.

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Schrader, David H. Microstrip circuit analysis. Upper Saddle River, N.J: Prentice Hall PTR, 1995.

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Trinogga, L. A. Practical microstrip circuit design. New York: E. Horwood, 1991.

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Practical microstrip design and applications. Boston, MA: Artech House, 2005.

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A, Zakarevičius R., ed. Microwave engineering using microstrip circuits. New York: Prentice Hall, 1990.

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Edwards, T. C. Foundations for microstrip circuit design. 2nd ed. Chichester, West Sussex, England: Wiley, 1991.

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Bhartia, P. Millimeter-wave microstrip and printed circuit antennas. Boston: Artech House, 1991.

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Hong, Jia-Sheng. Microstrip filters for RF/microwave applications. 2nd ed. Hoboken, N.J: Wiley, 2011.

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B, Steer M., and Edwards T. C, eds. Foundations of interconnect and microstrip design. 3rd ed. Chichester: John Wiley, 2000.

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Частини книг з теми "MICROSTRIP LIVES"

Awang, Zaiki. "Microstrip and Related Transmission Lines." In Microwave Systems Design, 101–46. Singapore: Springer Singapore, 2013. http://dx.doi.org/10.1007/978-981-4451-24-6_3.

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Edwards, T. C., and M. B. Steer. "Parallel-Coupled Lines and Directional Couplers." In Foundations of Interconnect and Microstrip Design, 269–314. West Sussex, England: John Wiley & Sons, Ltd, 2013. http://dx.doi.org/10.1002/9781118894514.ch8.

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Carin, Lawrence. "Leaky-Waves on Multiconductor Microstrip Transmission Lines." In Directions in Electromagnetic Wave Modeling, 319–27. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-3677-6_30.

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Ohshima, Shigetoshi, Katsuro Okuyama, Kunio Sawaya, and Keisuke Noguchi. "Surface Resistance of the BSCCO Microstrip Lines." In Advances in Superconductivity IV, 965–68. Tokyo: Springer Japan, 1992. http://dx.doi.org/10.1007/978-4-431-68195-3_211.

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Culbertson, J. C., H. S. Newman, U. Strom, J. M. Pond, D. B. Chrisey, J. S. Horwitz, and S. A. Wolf. "Light Detection Using High-T c Microstrip Lines." In Superconducting Devices and Their Applications, 180–85. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-77457-7_30.

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Kiang, Jean-Fu, Hsiao-Lun Hsu, and Yuan-Shun Cheng. "Microstrip Lines with a Periodically Corrugated Ground Plane." In Novel Technologies for Microwave and Millimeter — Wave Applications, 231–55. Boston, MA: Springer US, 2004. http://dx.doi.org/10.1007/978-1-4757-4156-8_11.

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Kanade, Tarun Kumar, Alok Rastogi, Sunil Mishra, and Vijay D. Chaudhari. "Analysis of Rectangular Microstrip Array Antenna Fed Through Microstrip Lines with Change in Width." In Advances in Intelligent Systems and Computing, 487–96. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-2008-9_46.

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Hessel, A. "Broadbanding Guide Lines of Strip-Element Microstrip Phased Arrays." In Directions for the Next Generation of MMIC Devices and Systems, 131–44. Boston, MA: Springer US, 1997. http://dx.doi.org/10.1007/978-1-4899-1480-4_16.

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Pan, Guangwen, and Jilin Tan. "Full-Wave Analysis of Radiation Effect of Microstrip Transmission Lines." In Modeling and Simulation of High Speed VLSI Interconnects, 77–85. Boston, MA: Springer US, 1994. http://dx.doi.org/10.1007/978-1-4615-2718-3_8.

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Xiao, Zhen, Dan Zhang, and Weijie Xu. "Electromagnetic Line-Parameters Extracted from Microstrip Lines with Step Discontinuities." In Lecture Notes in Electrical Engineering, 25–33. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4110-4_4.

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Тези доповідей конференцій з теми "MICROSTRIP LIVES"

Roskos, Hartmut, Martin C. Nuss, Keith W. Goossen, David W. Kisker, Ben Tell, Alice E. White, Ken T. Short, Dale C. Jacobson, and John M. Poate. "Propagation of 100 GHz bandwidth electrical pulses on a microstrip line with buried silicide groundplane." In Picosecond Electronics and Optoelectronics. Washington, D.C.: Optica Publishing Group, 1991. http://dx.doi.org/10.1364/peo.1991.wb4.

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Microstrip transmission lines consisting of a narrow center line and an extended groundplane are the most commonly used device interconnections in millimeter-wave integrated circuits. Typically, the ground plane of a microstrip line is located on the backside of the roughly 500 µm thick semiconductor wafer that carries the circuit elements. For frequencies above 10 GHz, this simple scheme can lead to a limitation of the useful bandwidth of ultra-high-speed electronic circuits because dispersion can significantly distort the electrical pulses propagating on the microstrip interconnect [Goossen, 1989]. Recently, it has been proposed to use buried silicide layers as groundplanes for microstrip lines in silicon based circuits [Goossen, 1990]; the resulting reduction in the separation of the center conductor and the ground plane should push the onset of the dispersion to frequencies above the range of interest. For a separation of 10 pm the dispersion should be negligible for frequencies up to 500 GHz. Here, we test this concept by studying the propagation of 100 GHz bandwidth electrical pulses on microstrip lines that have been fabricated on silicon wafers with buried and with conventionally formed groundplanes.

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Lu, H. J., Y. X. Guo, K. Faeyz, C. K. Cheng, and J. Wei. "Liquid Crystal Polymer (LCP) for Characterization of Millimer-Wave Transmission Lines and Bandpass Filters." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-10573.

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In this paper, a multi-layer LCP substrate fabrication process was described and millimeter wave transmission lines and filters were designed and fabricated on the LCP substrate. Various transitions from a CPW to a microstrip line with their characteristic impedance being 50 ohms were investigated. The characteristics of the wirebonding assembly for connecting two transmission lines was also examined. The measurement results show that an insertion loss of 1.3 dB at 60 GHz can be achieved for the two-wire bonding trasmisssion line including two transitions from a CPW to a microstrip line.

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Lyons, W. Gregory. "High-Frequency Analog Signal Processing With High-Temperature Superconductors*." In Picosecond Electronics and Optoelectronics. Washington, D.C.: Optica Publishing Group, 1991. http://dx.doi.org/10.1364/peo.1991.fa2.

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The low conductor loss of superconducting materials makes it possible to build passive microwave devices that cannot be built with normal metal conductors. For example, compact transversal filters in the form of tapped delay lines can be fabricated from superconducting niobium to operate with multi-gigahetz signal processing bandwidths [1,2]. Recent advances in the growth of thin films of the high-temperature superconductor (HTS) Y-Ba-Cu-O [3,4] have made possible the demonstration of a variety of passive microwave devices. This includes long delay lines [5], tapped delay line filters [6], and narrow-band microstrip bandpass filters using edge-coupled resonators [5]. The most notable of these demonstations has been the operation of a 2.6-GHz bandwidth stripline chirp filter with 12 ns of total delay and a Y-Ba-Cu-O patterned line length of 0.7 m. The HTS microwave components crucial to this development were long delay lines with more than 10 ns of delay, impedance transformers, and backward-wave couplers. Microstrip, coplanar, and stripline geometries were all examined during the course of this development. The stripline configuration selected for the chirp filter was developed using microwave CAD routines and superconducting niobium prototypes.

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Wu, Xin, Omar M. Ramahi, Gary A. Brist, and Donald P. Cullen. "Surface Finish Effects on High-Speed Interconnects." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35332.

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In printed circuit boards (PCB), the selection of surface finish is a balance of cost, performance and material compatibility consideration. When the operating frequency is in gigahertz range, the signal loss in interconnects has stronger dependence on the material composition of traces, surface finishes, substrates, and geometry of the traces. Skin effects, frequency dependent dielectric properties and the electrical functioning mechanism are important factors that affect signal integrity. In this work, both measurements and finite element method (FEM) based full wave simulation are used to investigate the effects of hot air solder leveling (HASL) and its alternatives on signal degradation of high-speed interconnect structures. For the microstrip line structure, the loss due to surface finishes is negligible. For the differential mode coupled microstrip lines, the loss increment resulted from surface finish can be up to 50%∼200% at 10 GHz. Surface finish caused signal loss must be carefully considered for differential mode interconnects.

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Dmitry Zelenchuk, Aleksey P. Shitvov, Alex G. Schuchinsky, and Torbjorn Olsson. "Passive intermodulation on microstrip lines." In 2007 European Microwave Conference. IEEE, 2007. http://dx.doi.org/10.1109/eumc.2007.4405210.

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Sergienko, Pavlo, Irina Golubeva, and Yuriy Prokopenko. "Loss in tunable microstrip lines." In 2014 IEEE 34th International Conference on Electronics and Nanotechnology (ELNANO). IEEE, 2014. http://dx.doi.org/10.1109/elnano.2014.6873972.

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Aksun, M. I., and H. Morkoc. "Characteristics of Shielded Microstrip Lines on GaAs-Si at Millimeter-Wave Frequencies." In Picosecond Electronics and Optoelectronics. Washington, D.C.: Optica Publishing Group, 1987. http://dx.doi.org/10.1364/peo.1987.we7.

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The advantages of GaAs on Si technology have stimulated a great deal of interest [1], [2]. Although Si was studied extensively as the substrate material for microwave monolithic integration because of its high thermal conductivity, well-established technology, mechanical strength, and availability in larger diameter [3]-[5], it lacks millimeter-wave three terminal devices which is now afforded with GaAs on Si [6]. Dielectric losses in GaAs on Si, however, must be small in order for this composite technology to be practical. We have thus undertaken a theoretical study of the shielded microstrip lines on GaAs on Si up to 100 GHz for various parameters in Si and GaAs.

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Meng-Yu Hsiao, Yu-Wei Chang, and Ching-Wen Hsue. "Chirped signal generation using microstrip lines." In 2015 International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM). IEEE, 2015. http://dx.doi.org/10.1109/iwem.2015.7365070.

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Azar, C. M., and R. F. Harrington. "Dispersion characteristics of open microstrip lines." In IEEE Antennas and Propagation Society International Symposium 1992 Digest. IEEE, 1992. http://dx.doi.org/10.1109/aps.1992.221861.

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Khalaj-Amirhosseini, Mohammad, and Gholamali Rezai-rad. "Circular Symmetric Coupled Microstrip Transmission Lines." In 2008 IEEE International RF and Microwave Conference (RFM). IEEE, 2008. http://dx.doi.org/10.1109/rfm.2008.4897362.

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Звіти організацій з теми "MICROSTRIP LIVES"

Johnk, Robert T. Crosstalk between microstrip transmission lines. Gaithersburg, MD: National Institute of Standards and Technology, 1993. http://dx.doi.org/10.6028/nist.ir.5015.

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Hill, D. A. Radiated emissions and immunity of microstrip transmission lines :. Gaithersburg, MD: National Bureau of Standards, 1995. http://dx.doi.org/10.6028/nist.tn.1377.

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Elsherbeni, Atef Z., Vicente Rodriguez-Pereyra, and Charles E. Smith. The Effect of an Air Gap on the Coupling Between Two Planar Microstrip Lines. Fort Belvoir, VA: Defense Technical Information Center, September 1995. http://dx.doi.org/10.21236/ada300530.

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