Готові списки джерел за темами / Metallic films

Добірка наукової літератури з теми "Metallic films"

Автор: Grafiati
Опубліковано: 4 червня 2021
Оновлено: 31 липня 2024

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Статті в журналах з теми "Metallic films"

1

Česnek, J., J. Dobiáš, J. Houšová, and J. Sedláček. "Properties of thin metallic films for microwave susceptors." Czech Journal of Food Sciences 21, No. 1 (November 18, 2011): 34–40. http://dx.doi.org/10.17221/3475-cjfs.

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Thin Al films of varying thickness, i.e. 3 to 30 nm, were deposited onto polyethylene-terephthalate film by evaporation in the vacuum of 3 &times; 10<sup>&ndash;3</sup> Pa. The dependence of DC (direct current) surface resistance on thickness was measured using a four-point method. The surface resistance exhibits the size effect in accordance with the Fuchs-Sondheimer theory. The microwave absorption properties of the prepared films of various metallization thickness were measured in a microwave field at the microwave power of 1.8 mW. The maximum microwave absorption at 2.45 GHz was found to occur in a layer of optical density of about 0.22. &nbsp;
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2

Sysoiev, Yu A. "Metallic films for triggering vacuum-arc plasma sources." Functional materials 21, no. 1 (March 30, 2014): 47–51. http://dx.doi.org/10.15407/fm21.01.047.

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3

Cheng, Jin, Xiao Ping Zou, Xiang Min Meng, Gang Qiang Yang, Xue Ming Lü, Cui Liu Wei, Zhe Sun, Hong Ying Feng, and Yuan Yang. "Electrochemical Deposition of Metallic Lead Particle Film." Advanced Materials Research 123-125 (August 2010): 423–26. http://dx.doi.org/10.4028/www.scientific.net/amr.123-125.423.

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The preparation of metallic lead films by electrochemical deposition was reported. Although primary deposits at fresh state (also referred to as fresh deposits) were indeed metallic lead films, the fresh lead films could be rapidly oxidized to lead oxide in air. To obtain long stable metallic lead films, the key process is how to prevent the oxidization of fresh lead films. Our studies indicate that the washing of fresh metallic lead films in absolute alcohol is a simple but effective method to protect the lead films from the oxidization for an extended period of more than 20 days.
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4

Pardoen, Thomas, Michael Coulombier, Alexandre Boe, A. Safi, Charles Brugger, Sophie Ryelandt, Pierre Carbonnelle, Sébastien Gravier, and Jean Pierre Raskin. "Ductility of Thin Metallic Films." Materials Science Forum 633-634 (November 2009): 615–35. http://dx.doi.org/10.4028/www.scientific.net/msf.633-634.615.

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Depending on the loading conditions, geometry and material characteristics, the ductility of thin metallic films is controlled either by the resistance to plastic localization or by the resistance to internal damage. New on-chip tensile tests performed on submicron aluminium films show significant strain hardening capacity leading to relatively good resistance to necking, while damage occurs through void nucleation at grain boundaries followed by their growth and coalescence. These results are discussed in the light of several other studies presented in the recent literature in order to unravel the origins of the frequently reported poor ductility of thin metallic films, and the various means existing to improve it.
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5

Zhang, Kaiqi, Congmian Zhen, Wengang Wei, Wenzhe Guo, Guide Tang, Li Ma, Denglu Hou, and Xiancheng Wu. "Insight into metallic behavior in epitaxial half-metallic NiCo2O4 films." RSC Advances 7, no. 57 (2017): 36026–33. http://dx.doi.org/10.1039/c7ra03136j.

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Understanding the cation distribution and electronic transport properties of half-metallic NiCo2O4 (NCO) films is crucial to advancing their practical applications in optoelectronic materials.
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6

Ossi, P. M., and R. Pastorelli. "Structural stability of irradiated metallic and non-metallic films." Surface and Coatings Technology 125, no. 1-3 (March 2000): 61–65. http://dx.doi.org/10.1016/s0257-8972(99)00548-4.

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7

Varchenya, S. A., A. Simanovskis, and S. V. Stolyarova. "Adhesion of thin metallic films to non-metallic substrates." Thin Solid Films 164 (October 1988): 147–52. http://dx.doi.org/10.1016/0040-6090(88)90125-3.

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8

Mochizuki, Chihiro, Takashi Senga, and Masami Shibata. "Pd-Based Metallic Glass Films Formed by Electrodeposition Process." Solid State Phenomena 194 (November 2012): 183–86. http://dx.doi.org/10.4028/www.scientific.net/ssp.194.183.

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The formation of Pd-Ni-P and Pd-Ni-Cu-P metallic glass films using the electrodeposition method was examined. In this study, the structure and composition of these metallic alloys were investigated at various condition of electrodeposition. The X-ray diffraction pattern on the electrodeposited Pd-Ni-P films in the range of 18-69 at% Pd, 12-62 at% Ni and 9-21 at% P showed a broad diffraction peak, which indicates metallic amorphous structure. A result of DSC showed that the electrodeposited Pd-Ni-P films in the range of 36-57 at% Pd, 24-47 at% Ni and 16-21 at% P were metallic glasses. In addition, it was proven that the electrodeposited Pd54Cu8Ni22P16 film was metallic glass.
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9

Nittono, Osamu. "Thin Films and Metallic Multilayers." Materia Japan 36, no. 9 (1997): 847–50. http://dx.doi.org/10.2320/materia.36.847.

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10

Gupta, D. "Diffusion in Metallic Thin Films." Defect and Diffusion Forum 59 (January 1991): 137–50. http://dx.doi.org/10.4028/www.scientific.net/ddf.59.137.

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Дисертації з теми "Metallic films"

1

Sun, Tianyi. "Nano-optics of Perforated Metallic Films." Thesis, Boston College, 2014. http://hdl.handle.net/2345/bc-ir:103561.

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Thesis advisor: Krzysztof Kempa
Thesis advisor: Zhifeng Ren
In the past few decades, accompanied by the fascinating development of micro- and nano-fabrication techniques, the successful integration of subwavelength optics and multilayer structures has led to a number of remarkable discoveries. In this work, I present both experimental and theoretical investigations of the optics of thin metallic films with micro-/nano-scale perforations in the UV-VIS-IR ranges. Different fabrication techniques are employed, including nanosphere lithography, grain boundary lithography, crack templates, and sintered nanoparticles. The optical properties these films are studied, revealing important relation between optical response and the film geometry. This includes the evolution of plasmonic resonances in a series of periodic arrays of holes in a metallic film, with hole sizes increasing gradually until an array of islands is achieved. This evolution is an analog of the percolation problem, and critical phenomena are observed at the percolation threshold. Multilayer broad-band electromagnetic absorbers are also designed and fabricated based on the study of these perforated films. Parallel with these observations, an analytical coherence model is proposed to bridge the subwavelength and superwavelength limits. Such a model also provides an alternative way to handle thin random structures, avoiding large quantity of numerical computation. These studies can find applications in the design of sensors, ultrathin solar cells and transparent electrodes, as well as in applications where random structures are widely used
Thesis (PhD) — Boston College, 2014
Submitted to: Boston College. Graduate School of Arts and Sciences
Discipline: Physics
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2

Yang, Fu-Liang. "Interdiffusion in metallic multilayers." Thesis, University of Cambridge, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.360566.

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3

Steinsiek, Christoph. "Molecular Beam Scattering from Ultrathin Metallic Films." Doctoral thesis, Niedersächsische Staats- und Universitätsbibliothek Göttingen, 2017. http://hdl.handle.net/11858/00-1735-0000-0023-3EB8-2.

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4

Hoekstra, John. "The structural and mechanical properties of metallic multilayers /." Thesis, Connect to this title online; UW restricted, 1995. http://hdl.handle.net/1773/10582.

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5

Wu, Fan. "Microscopic and mesoscopic characteristics of granular metal films." Diss., Online access via UMI:, 2004.

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6

Boufelfel, Ahmed 1958. "STRUCTURAL CHARACTERIZATION OF SPUTTERED B.C.C.-B.C.C. METALLIC SUPERLATTICES." Thesis, The University of Arizona, 1987. http://hdl.handle.net/10150/276389.

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7

Rodekohr, Chad L. Bozack Michael J. Flowers George T. "Material factors influencing metallic whisker growth." Auburn, Ala, 2008. http://repo.lib.auburn.edu/EtdRoot/2008/FALL/Mechanical_Engineering/Dissertation/Rodekohr_Chad_16.pdf.

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8

Xu, Wenjin. "Anomalous hall effect in ferromagnetic metallic thin films /." View abstract or full-text, 2010. http://library.ust.hk/cgi/db/thesis.pl?NSNT%202010%20XU.

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9

Warren, Andrew. "X-ray Scattering Investigations of Metallic Thin Films." Doctoral diss., University of Central Florida, 2013. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/5721.

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Nanometric thin films are used widely throughout various industries and for various applications. Metallic thin films, specifically, are relied upon extensively in the microelectronics industry, among others. For example, alloy thin films are being investigated for CMOS applications, tungsten films find uses as contacts and diffusion barriers, and copper is used often as interconnect material. Appropriate metrology methods must therefore be used to characterize the physical properties of these films. X-ray scattering experiments are well suited for the investigation of nano-scaled systems, and are the focus of this doctoral dissertation. Emphasis is placed on (1) phase identification of polycrystalline thin films, (2) the evaluation of the grain size and microstrain of metallic thin films by line profile analysis, and (3) the study of morphological evolution in solid/solid interfaces. To illustrate the continued relevance of x-ray diffraction for phase identification of simple binary alloy systems, Pt-Ru thin films, spanning the compositional range from pure Pt to pure Ru were investigated. In these experiments, a meta-stable extension of the HCP phase is observed in which the steepest change in the electronic work function coincides with a rapid change in the c/a ratio of the HCP phase. For grain size and microstrain analysis, established line profile methods are discussed in terms of Cu and W thin film analysis. Grain sizes obtained by x-ray diffraction are compared to transmission electron microscopy based analyses. Significant discrepancies between x-ray and electron microscopy are attributed to sub-grain misorientations arising from dislocation core spreading at the film/substrate interface. A novel "residual" full width half max parameter is introduced for examining the contribution of strain to x-ray peak broadening. The residual width is subsequently used to propose an empirical method of line profile analysis for thin films on substrates. X-ray reflectivity was used to study the evolution of interface roughness with annealing for a series of Cu thin films that were encapsulated in both SiO2 and Ta/SiO2. While all samples follow similar growth dynamics, notable differences in the roughness evolution with high temperature ex-situ annealing were observed. The annealing resulted in a smoothing of only one interface for the SiO2 encapsulated films, while neither interface of the Ta/SiO2 encapsulated films evolved significantly. The fact that only the upper Cu/SiO2 interface evolves is attributed to mechanical pinning of the lower interface to the rigid substrate. The lack of evolution of the Cu/Ta/SiO2 interface is consistent with the lower diffusivity expected of Cu in a Cu/Ta interface as compared to that in a Cu/SiO2 interface. The smoothing of the upper Cu/SiO2 interface qualitatively follows that expected for capillarity driven surface diffusion but with notable quantitative deviation.
Ph.D.
Doctorate
Materials Science Engineering
Engineering and Computer Science
Materials Science and Engineering
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10

Peterson, Sarah M. "Influence of scale, geometry, and microstructure on the electrical properties of chemically deposited thin silver films /." Connect to title online (ProQuest), 2007. http://proquest.umi.com/pqdweb?did=1453183211&sid=2&Fmt=2&clientId=11238&RQT=309&VName=PQD.

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Thesis (Ph. D.)--University of Oregon, 2007.
Typescript. Includes vita and abstract. Includes bibliographical references (leaves 95-101). Also available online in ProQuest, free to University of Oregon users.
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Книги з теми "Metallic films"

1

Sedláček, Vladimír. Metallic surfaces, films, and coatings. Amsterdam: Elsevier, 1992.

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2

Klaus, Wetzig, and Schneider Claus M, eds. Metal based thin films for electronics. 2nd ed. Weinheim: Wiley-VCH, 2006.

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3

Symposium on Surface Oxide Films (1996 San Antonio, Tex.). Proceedings of the Symposium on Surface Oxide Films. Edited by Bardwell Jennifer A, Electrochemical Society Corrosion Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 1996.

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4

1936-, Wissmann P., ed. Thin metal films and gas chemisorption. Amsterdam: Elsevier, 1987.

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5

Aleshin, Anatoliĭ. Diffuzionnye prot͡sessy v tonkoplenochnykh metallicheskikh sistemakh. Chernogolovka: IKhFCh RAN, 1992.

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6

Symposium on Oxide Films on Metals and Alloys (1992 Toronto, Ont.). Proceedings of the Symposium on Oxide Films on Metals and Alloys. Pennington, NJ: Electrochemical Society, 1992.

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7

Ilʹinskiĭ, A. I. Struktura i prochnostʹ sloistykh i dispersnouprochnennykh plenok. Moskva: "Metallurgii͡a︡", 1986.

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8

Colloque de métallurgie (40th 1997 Saclay, France). Comportement méchanique et effets d'échelle: 40e Colloque de métallurgie de l'INSTN : CE Saclay/INSTN, 24-26 juin 1998. Les Ulis: Les Éditions de physique, 1998.

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9

International Symposium on Oxide Films on Metals and Alloys (7th 1994 Miami Beach, Fla.). Proceedings of the Seventh International Symposium on Oxide Films on Metals and Alloys. Pennington, NJ: Electrochemical Society, 1994.

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10

Orlov, V. M. (Veniamin Moiseevich) and Konorov P. P, eds. Anodnye oksidnye plenki. Leningrad: "Nauka," Leningradskoe otd-nie, 1990.

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Частини книг з теми "Metallic films"

1

Wu, D., and X. F. Jin. "Metallic Magnetic Thin Films." In Handbook of Magnetism and Magnetic Materials, 809–46. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-63210-6_19.

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2

Wu, D., and X. F. Jin. "Metallic Magnetic Thin Films." In Handbook of Magnetism and Magnetic Materials, 1–38. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-63101-7_19-1.

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3

Scragg, Jonathan J. "Electrodeposition of Metallic Precursors." In Copper Zinc Tin Sulfide Thin Films for Photovoltaics, 9–57. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-22919-0_2.

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4

Gavigan, James P. "Laser Ablation Deposition of Metallic Thin Films." In NATO ASI Series, 81–89. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-2590-9_11.

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5

Zhu, H. X., and B. L. Karihaloo. "Size-Dependent Bending of Thin Metallic Films." In IUTAM Symposium on Scaling in Solid Mechanics, 299–309. Dordrecht: Springer Netherlands, 2009. http://dx.doi.org/10.1007/978-1-4020-9033-2_28.

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6

Kalantari, Katayoon, Bahram Saleh, and Thomas J. Webster. "Applications of Thin Films in Metallic Implants." In Materials for Devices, 271–304. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003141358-10.

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7

Kulkarni, S. K., Mahesh Vedpathak, A. S. Nigavekar, Shubha Gokhale, R. Krishnan, H. Lassri, and M. Tessier. "Synthesis and Characterization of Metallic Multilayer Films." In Advances in Physical Metallurgy, 143–49. London: CRC Press, 2023. http://dx.doi.org/10.1201/9781003424000-20.

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8

Farrow, R. F. C., D. Weller, G. R. Harp, R. F. Marks, T. A. Rabedeau, M. Toney, and A. Cebollada. "Magnetic Alloy Films: New Developments in Structure-Property Relations." In Metallic Alloys: Experimental and Theoretical Perspectives, 379–88. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1092-1_41.

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9

Veziroglu, Salih, Moritz Paulsen, Jan Schardt, Blessing Adejube, Cenk Aktas, Alexander Vahl, and Martina Gerken. "Photocatalytic Deposition for Metal Line Formation." In Springer Series on Bio- and Neurosystems, 241–63. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-36705-2_10.

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AbstractIn neural systems, plasticity can be found throughout a variety of scales, ranging from local synaptic plasticity between two neurons towards long-range connections and global plasticity within larger neuron assemblies. While memristive devices have attracted a lot of attention as a potential neuromorphic analog to represent local synapses and are regarded as promising building blocks for neuromorphic engineering, long-range connections and globally mediated aspects like homeoplasticity are not yet widely considered for neuromorphic systems. In this chapter, photocatalytic deposition is discussed as an approach to form metallic structures from a global liquid reservoir. In this context, the photocatalytic properties of TiO2 thin films are employed to reduce metallic species from the surrounding solution. This chapter will elucidate the fundamental process of photocatalytic deposition with photocatalytic TiO2 thin films and will showcase the applicability towards the formation of metallic structures at the example of arrangements of locally grown metallic Au structures.
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10

Fert, A. "Transport Properties of Thin Metallic Films and Multilayers." In NATO ASI Series, 221–37. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-2590-9_29.

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Тези доповідей конференцій з теми "Metallic films"

1

Ng, F. L., and J. Wei. "X-Ray Microanalysis of Metallic Thin Films." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-79319.

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Nickel and gold films are widely used for microsystems fabrication and packaging, as well as under bump metallization. In this paper, x-ray microanalysis was used to measure the thickness of Ni and Au films. Au and Ni films with varied thicknesses were deposited on silicon (Si) substrate by magnetron sputtering method. Incremental electron beam energy ranging from 4 keV to 30 keV was applied while other parameters were kept constant to determine the electron beam energy required to penetrate the metallic films. The effects of probe current at a fixed electron beam energy on the penetration depth were investigated too. With higher energy applied, the electron beam can penetrate deeper and more Si signal can be detected. The Ni and Au film thicknesses almost have linear relationship with the required penetration electron beam energy. The probe current has minimal effect on the specimen once it has reached the critical excitation probe current. For Ni and Au films with same thickness, higher energy or probe current is needed to penetrate the Au film to reach Si substrate due to the higher Au atomic weight.
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2

Lemarquis, Frederic, Michel Cathelinaud, and Claude Amra. "Index determination for metallic thin films." In Optical Interference Coatings. Washington, D.C.: OSA, 2001. http://dx.doi.org/10.1364/oic.2001.tuf1.

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3

Papez, V., and S. Papezova. "Contactless measurement of thin metallic films." In 2010 27th International Conference on Microelectronics (MIEL 2010). IEEE, 2010. http://dx.doi.org/10.1109/miel.2010.5490522.

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4

Kumar, M. Senthil. "Magnetic and magnetotransport properties of metallic multilayers." In INDIAN VACUUM SOCIETY SYMPOSIUM ON THIN FILMS: SCIENCE AND TECHNOLOGY. AIP, 2012. http://dx.doi.org/10.1063/1.4732365.

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5

Oshikane, Yasushi, Motohiro Nakano, and Hirotsugu Ogi. "Asymmetric MIM structure formation by PLD technique with metallic nitrides and its SPP excitation and waveguiding characteristics." In Nanostructured Thin Films XI, edited by Tom G. Mackay and Akhlesh Lakhtakia. SPIE, 2018. http://dx.doi.org/10.1117/12.2322091.

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6

Ahmad, Faiz, Thomas H. Anderson, Benjamin J. Civiletti, Peter B. Monk, and Akhlesh Lakhtakia. "On optical-absorption peaks in a nonhomogeneous dielectric material over a two-dimensional metallic surface-relief grating." In Nanostructured Thin Films X, edited by Tom G. Mackay, Akhlesh Lakhtakia, and Yi-Jun Jen. SPIE, 2017. http://dx.doi.org/10.1117/12.2274142.

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Raikar, Ganesh, John Gregory, Penny Pettigrew, Robert Connatser, and Palmer Peters. "Space environmental effects on thin metallic films." In Space Programs and Technologies Conference. Reston, Virigina: American Institute of Aeronautics and Astronautics, 1995. http://dx.doi.org/10.2514/6.1995-3566.

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8

Sikula, J., P. Schauer, P. Vasina, M. Sikulova, B. Koktavy, Z. Chobola, H. Navarova, and L. Pazdera. "1/f noise in metallic thin films." In The sixth Van der Zielsymposium on quantum 1/f noise and other low frequency fluctuations in electronic devices. AIP, 1996. http://dx.doi.org/10.1063/1.50886.

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9

Trivino, Galo C., Kenneth J. Klabunde, and Brock Dale. "Thin Metallic Films From Solvated Metal Atoms." In 31st Annual Technical Symposium, edited by Michael R. Jacobson. SPIE, 1988. http://dx.doi.org/10.1117/12.941859.

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Joshi, Pushkaraj, and Venugopal Santhanam. "Nanostructured metallic thin films for sensing applications." In Proceedings of the International Conference on Nanotechnology for Better Living. Singapore: Research Publishing Services, 2016. http://dx.doi.org/10.3850/978-981-09-7519-7nbl16-rps-77.

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Звіти організацій з теми "Metallic films"

1

Gunnarsson, Carey, and Eric Wetzel. Quasistatic Tensile Response of Polymer Films and Metallic Foils. DEVCOM Army Research Laboratory, September 2023. http://dx.doi.org/10.21236/ad1210689.

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Abdeljawad, Fadi F. Microstructural evolution of thin polycrystalline metallic films under extreme conditions. Office of Scientific and Technical Information (OSTI), October 2016. http://dx.doi.org/10.2172/1562840.

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Boettger, J. C. Thickness dependencies in the calculated properties of metallic ultra-thin films. Office of Scientific and Technical Information (OSTI), December 1997. http://dx.doi.org/10.2172/642814.

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4

Smith, Randall. Investigations of the Air-Water Interface: A Structural Analysis of Metallic Surface Films and Aquatic Surface Films by Comparative Microscopy. Portland State University Library, January 2000. http://dx.doi.org/10.15760/etd.2303.

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Sugar, Joshua D. Mechanisms of microstructure development at metallic-interlayer/ceramic interfaces during liquid-film-assisted bonding. Office of Scientific and Technical Information (OSTI), December 2003. http://dx.doi.org/10.2172/825347.

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Jing, Dapeng. Metal thin film growth on multimetallic surfaces: From quaternary metallic glass to binary crystal. Office of Scientific and Technical Information (OSTI), January 2010. http://dx.doi.org/10.2172/1037881.

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Utah Mineral Occurrence System (UMOS) Database, 2023 Update. Utah Geological Survey, October 2023. http://dx.doi.org/10.34191/ofr-757.

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Анотація:
The Utah Mineral Occurrence System (UMOS) is a database that includes known mineral mines, quarries, prospects, and deposits in Utah. The database focuses on metallic and industrial minerals, but also includes information on energy minerals (particularly uranium). The database includes extensive information for each record including location, related mineral commodities, geology, mineralogy, production data, resource size, important references, and other relevant information. Over recent decades, UMOS has been a useful tool for mineral explorers, mining companies, land managers, and the general public. We are releasing the current version of UMOS as an Open-File Report (OFR) in order to preserve versioning of the database. Over the years, UMOS or parts thereof have been released in UGS publications and a few of those references are cataloged below. We consider it worth noting that the current digital database consists solely of point data for each record, but many of the paper files and maps from the initial UMOS records provide additional information on the aerial extent of an occurrence or deposit. Some records also include substantial details or other reports that are not captured in the digital database. These paper files remain available at the UGS office in Salt Lake City.
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