Готові списки джерел за темами / Epoxy compounds

Добірка наукової літератури з теми "Epoxy compounds"

Автор: Grafiati
Опубліковано: 4 червня 2021
Оновлено: 1 серпня 2024

Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями

Оберіть тип джерела:

Зміст

Ознайомтеся зі списками актуальних статей, книг, дисертацій, тез та інших наукових джерел на тему "Epoxy compounds".

Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.

Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.

Статті в журналах з теми "Epoxy compounds"

1

Rudawska, Anna. "Experimental Study of Mechanical Properties of Epoxy Compounds Modified with Calcium Carbonate and Carbon after Hygrothermal Exposure." Materials 13, no. 23 (November 29, 2020): 5439. http://dx.doi.org/10.3390/ma13235439.

Повний текст джерела
Анотація:
The objective of this paper is to analyze the effects of hygrothermal exposure on the mechanical properties of epoxy compounds modified with calcium carbonate or carbon fillers. In addition, comparative tests were carried out with the same parameters as hygrothermal exposure, but the epoxy compounds were additionally exposed to thermal shocks. The analysis used cylindrical specimens produced from two different epoxy compounds. The specimens were fabricated from compounds of epoxy resins, based on Bisphenol A (one mixture modified, one unmodified) and a polyamide curing agent. Some of the epoxy compounds were modified with calcium carbonate (CaCO3). The remainder were modified with activated carbon (C). Each modifying agent, or filler, was added at a rate of 1 g, 2 g, or 3 g per 100 g of epoxy resin. The effect of the hygrothermal exposure (82 °C temperature and 95% RH humidity) was examined. The effects of thermal shocks, achieved by cycling between 82 °C and −40 °C, on selected mechanical properties of the filler-modified epoxy compounds were investigated. Strength tests were carried out on the cured epoxy compound specimens to determine the shear strength, compression modulus, and compressive strain. The analysis of the results led to the conclusion that the type of tested epoxy compounds and the quantity and type of filler determine the effects of climate chamber aging and thermal shock chamber processing on the compressive strength for the tested epoxy compounds. The different filler quantities, 1–3 g of calcium carbonate (CaCO3) or activated carbon (C), determined the strength parameters, with results varying from the reference compounds and the compounds exposure in the climate chamber and thermal shock chamber. The epoxy compounds which contained unmodified epoxy resin achieved a higher strength performance than the epoxy compounds made with modified epoxy resin. In most instances, the epoxy compounds modified with CaCO3 had a higher compressive strength than the epoxy compounds modified with C (activated carbon).
Стилі APA, Harvard, Vancouver, ISO та ін.
2

Mikroyannidis, John A. "Self-curing epoxy compounds." Journal of Applied Polymer Science 41, no. 1112 (1990): 2613–24. http://dx.doi.org/10.1002/app.1990.070411109.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
3

Rudawska, Anna. "Mechanical Properties of Epoxy Compounds Based on Unmodified Epoxy Resin Modified with Boric Acid as an Antiseptic." Materials 17, no. 1 (January 3, 2024): 259. http://dx.doi.org/10.3390/ma17010259.

Повний текст джерела
Анотація:
The objective of this study was to compare the selected mechanical properties of epoxy compounds based on an unmodified epoxy resin with those containing an antiseptic as a modifying agent. Experiments were carried out on twelve epoxy compounds made of an epoxy resin based on bisphenol A (BPA) with a basic epoxide amount of 0.48–0.51 mol/100 g. Three curing agents were used: one polyamide (a polyaminoamide curing agent) and two amines (one was an adduct of aliphatic amine and aromatic glycidyl ether, and the other was an adduct of cycloaliphatic amine). The epoxy compounds were modified by adding an antiseptic in the form of powdered boric acid (H3BO3) in three amounts: 0.5 g, 1.0 g, and 1.5 g. The cured modified and unmodified epoxy compounds were subjected to compressive strength testing and microscopic examination. The experimental results showed that the epoxy compounds containing adduct of aliphatic amine (triethylenetetramine) and aromatic glycidyl ether as the amine curing agent, i.e., E5/ET/100:18, had the highest compressive strength out of all the tested epoxy compounds, with the highest value of 119 MPa obtained for the epoxy compound modified by the addition of 1.0 g boric acid. The epoxy compounds modified with boric acid acquired antiseptic properties and, for most cases, exhibited a higher compressive strength than the unmodified epoxy compounds (not lower than that specified by the manufacturer for unmodified epoxy compounds).
Стилі APA, Harvard, Vancouver, ISO та ін.
4

Saiki, Hiroyuki, Yasuo Marumo, Hiroshi Nishitake, Masahiro Hazama, and Fuminori Sakata. "Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits." Advanced Materials Research 15-17 (February 2006): 599–603. http://dx.doi.org/10.4028/www.scientific.net/amr.15-17.599.

Повний текст джерела
Анотація:
Tensile tests of epoxy molding compounds were carried out using specimens composed of epoxy molding compounds which are transfer molded and post cured. The mechanical characteristics of the epoxy molding compounds change significantly due to changes in temperature and strain rate. In addition, the effect of nonlinear viscosity is large in both elastic and plastic regions. The characteristics of the visco-elastic-plastic behaviors of the epoxy molding compounds were examined. The behavior characteristics of the epoxy molding compounds during loading and unloading were shown in detail.
Стилі APA, Harvard, Vancouver, ISO та ін.
5

Chen, Li, and Ying Huang. "Modification of Epoxy Molding Compounds with Epoxy-terminated Polydimethylsiloxane." Chinese Journal of Applied Chemistry 12, no. 5 (October 1, 1995): 67–72. http://dx.doi.org/10.3724/j.issn.1000-0518.1995.5.6772.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
6

Suojalehto, Hille, Joaquin Sastre, Emilia Merimaa, Irmeli Lindström, and Katri Suuronen. "Occupational Asthma From Epoxy Compounds." Journal of Allergy and Clinical Immunology: In Practice 7, no. 1 (January 2019): 191–98. http://dx.doi.org/10.1016/j.jaip.2018.07.023.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
7

Karandashov, Oleg, and Viacheslav Avramenko. "Studies of Thermal Stability of Epoxy Compounds for Glass-Fiber Pipes." Chemistry & Chemical Technology 11, no. 1 (March 15, 2017): 61–64. http://dx.doi.org/10.23939/chcht11.01.061.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
8

Rudawska, Anna, and Mariaenrica Frigione. "Effect of Diluents on Mechanical Characteristics of Epoxy Compounds." Polymers 14, no. 11 (June 3, 2022): 2277. http://dx.doi.org/10.3390/polym14112277.

Повний текст джерела
Анотація:
The aim of this work is to assess the influence of different commercial diluents on some mechanical properties of two bisphenolic epoxy compounds, cold-cured by a polyamide curing agent, to be employed as epoxy structural adhesives for building and industrial applications. The diluents under analysis were epoxy, bituminous, nitro, acrylic and extraction. The choice of these products was made on the basis of their wide commercial availability as diluents for epoxies used as adhesives and in different industrial and construction applications. The diluents were all added in small proportions, i.e., from 1 to 10 g per 100 g of epoxy resin. The cold-cured epoxy compounds were subjected to compressive (according to ISO 604) and static tensile (according to ISO 527-1) tests. The same mechanical tests were performed on both unmodified epoxy resins, for comparison purposes. On the basis of the obtained results, it was concluded that the influence of the presence of a diluent, and of its amount, on the mechanical properties of epoxy compounds depends on the type of resin and of diluent, as well as on the mechanical characteristics analyzed.
Стилі APA, Harvard, Vancouver, ISO та ін.
9

Gemuev, Sh I., and A. I. Gemuev. "Advanced technology of epoxy molding compounds production and strength characteristics of developed epoxy molding compounds." Polymer materials and technologies 2, no. 3 (2016): 73–75. http://dx.doi.org/10.32864/polymmattech-2016-2-3-73-75.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
10

Waechter, John M., and Gauke E. Veenstra. "ChemInform Abstract: Epoxy Compounds: Aromatic Diglycidyl Ethers, Polyglycidyl Ethers, Glycidyl Esters, and Miscellaneous Epoxy Compounds." ChemInform 33, no. 42 (May 19, 2010): no. http://dx.doi.org/10.1002/chin.200242272.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Більше джерел

Дисертації з теми "Epoxy compounds"

1

Woo, Shui Cheung. "Degradation of epoxy-clay nanocomposites after UV exposure and moisture attack /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20WOO.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
2

Hu, Chugang. "Epoxy-clay nanocomposites : morphology, moisture absorption behavior and thermo-mechanical properties /." View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?MECH%202004%20HU.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
3

Punchaipetch, Prakaipetch. "Epoxy + Liquid Crystalline Epoxy Coreacted Networks." Thesis, University of North Texas, 2000. https://digital.library.unt.edu/ark:/67531/metadc2705/.

Повний текст джерела
Анотація:
Molecular reinforcement through in-situ polymerization of liquid crystalline epoxies (LCEs) and a non-liquid crystalline epoxy has been investigated. Three LCEs: diglycidyl ether of 4,4'-dihydroxybiphenol (DGE-DHBP) and digylcidyl ether of 4-hydroxyphenyl-4"-hydroxybiphenyl-4'-carboxylate (DGE-HHC), were synthesized and blended with diglycidyl ether of bisphenol F (DGEBP-F) and subsequently cured with anhydride and amine curing agents. Curing kinetics were determined using differential scanning calorimetry (DSC). Parameters for autocatalytic curing kinetics of both pure monomers and blended systems were determined. The extent of cure for both monomers was monitored by using Fourier transform infrared spectroscopy (FT-IR). The glass transitions were evaluated as a function of composition using DSC and dynamic mechanical analysis (DMA). The results show that the LC constituent affects the curing kinetics of the epoxy resin and that the systems are highly miscible. The effects of molecular reinforcement of DGEBP-F by DGE-DHBP and DGE-HHC were investigated. The concentration of the liquid crystalline moiety affects mechanical properties. Tensile, impact and fracture toughness tests results are evaluated. Scanning electron microscopy of the fracture surfaces shows changes in failure mechanisms compared to the pure components. Results indicate that mechanical properties of the blended samples are improved already at low concentration by weight of the LCE added into epoxy resin. The improvement in mechanical properties was found to occur irrespective of the absence of liquid crystallinity in the blended networks. The mechanism of crack study indicates that crack deflection and crack bridging are the mechanisms in case of LC epoxy. In case of LC modified epoxy, the crack deflection is the main mechanism. Moreover, the effect of coreacting an epoxy with a reactive monomer liquid crystalline epoxy as a matrix for glass fiber composites was investigated. Mechanical properties of the modified matrix were determined by tensile, flexural and impact testing. The improvement in toughness of the bulk matrix by the addition of a LCEs is seen also in the composites. The improvement is related to the enhancement of adhesion between the glass fibers and the matrix.
Стилі APA, Harvard, Vancouver, ISO та ін.
4

Sgriccia, Nikki. "Microwave and thermally cured natural fiber epoxy composites." Diss., Connect to online resource - MSU authorized users, 2008.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
5

Kelly, Paul Thomas. "Preparation, characterization and properties of montmorillonite/epoxy compounds." Case Western Reserve University School of Graduate Studies / OhioLINK, 1994. http://rave.ohiolink.edu/etdc/view?acc_num=case1057604761.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
6

Bilyeu, Bryan. "Characterization of Cure Kinetics and Physical Properties of a High Performance, Glass Fiber-Reinforced Epoxy Prepreg and a Novel Fluorine-Modified, Amine-Cured Commercial Epoxy." Thesis, University of North Texas, 2003. https://digital.library.unt.edu/ark:/67531/metadc4437/.

Повний текст джерела
Анотація:
Kinetic equation parameters for the curing reaction of a commercial glass fiber reinforced high performance epoxy prepreg composed of the tetrafunctional epoxy tetraglycidyl 4,4-diaminodiphenyl methane (TGDDM), the tetrafunctional amine curing agent 4,4'-diaminodiphenylsulfone (DDS) and an ionic initiator/accelerator, are determined by various thermal analysis techniques and the results compared. The reaction is monitored by heat generated determined by differential scanning calorimetry (DSC) and by high speed DSC when the reaction rate is high. The changes in physical properties indicating increasing conversion are followed by shifts in glass transition temperature determined by DSC, temperature-modulated DSC (TMDSC), step scan DSC and high speed DSC, thermomechanical (TMA) and dynamic mechanical (DMA) analysis and thermally stimulated depolarization (TSD). Changes in viscosity, also indicative of degree of conversion, are monitored by DMA. Thermal stability as a function of degree of cure is monitored by thermogravimetric analysis (TGA). The parameters of the general kinetic equations, including activation energy and rate constant, are explained and used to compare results of various techniques. The utilities of the kinetic descriptions are demonstrated in the construction of a useful time-temperature-transformation (TTT) diagram and a continuous heating transformation (CHT) diagram for rapid determination of processing parameters in the processing of prepregs. Shrinkage due to both resin consolidation and fiber rearrangement is measured as the linear expansion of the piston on a quartz dilatometry cell using TMA. The shrinkage of prepregs was determined to depend on the curing temperature, pressure applied and the fiber orientation. Chemical modification of an epoxy was done by mixing a fluorinated aromatic amine (aniline) with a standard aliphatic amine as a curing agent for a commercial Diglycidylether of Bisphenol-A (DGEBA) epoxy. The resulting cured network was tested for wear resistance using tribological techniques. Of the six anilines, 3-fluoroaniline and 4-fluoroaniline were determined to have lower wear than the unmodified epoxy, while the others showed much higher wear rates.
Стилі APA, Harvard, Vancouver, ISO та ін.
7

Chen, Rong-Sheng. "Hygrothermal response of graphite/epoxy composites /." The Ohio State University, 1987. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487326511715323.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
8

Chonkaew, Wunpen Brostow Witold. "Modifications of epoxy resins for improved mechanical and tribological performances and their effects on curing kinetics." [Denton, Tex.] : University of North Texas, 2008. http://digital.library.unt.edu/permalink/meta-dc-6123.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
9

Chan, Edward King-Long. "A study of moisture diffusion at the epoxy/copper interface for plastic IC packages /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20CHAN.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
10

Crow, Brian Shelton. "Epoxidation of alkenes by dimethyldioxirane kinetics, activation parameters and solvent studies /." restricted, 2005. http://etd.gsu.edu/theses/available/etd-11282005-140018/.

Повний текст джерела
Анотація:
Thesis (Ph. D.)--Georgia State University, 2005.
Title from title screen. Al Baumstark, committee chair; Paul Franklin, David Boykin, Markus Germann, committee members. Electronic text (136 p. : charts (some col.)) : digital, PDF file. Description based on contents viewed June 7, 2007. Includes bibliographical references (p. 130-136).
Стилі APA, Harvard, Vancouver, ISO та ін.
Більше джерел

Книги з теми "Epoxy compounds"

1

Työterveyslaitos and Teknillinen Korkeakoulu. Faculty of Process Engineering and Material Science., eds. Occupational skin diseases from epoxy compounds: Epoxy resin compounds, epoxy acrylates, and 2,3-epoxypropyl trimethyl ammonium chloride. Helsinki: Institute of Occupational Health, 1991.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
2

A, Sokolova I͡U. Modifit͡sirovannye ėpoksidnye klei i pokrytii͡a v stroitelʹstve. Moskva: Stroĭizdat, 1990.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
3

Singh, Jag J. Investigation of the effects of cobalt ions on epoxy properties. Hampton, Va: Langley Research Center, 1986.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
4

Milchert, Eugeniusz. Epoksydowanie olefin i chloroolefin wodoronadtlenkiem tert-butylu. Szczecin: Wydawn. Uczelniane Politechniki Szczecińskiej, 1991.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
5

Dryuk, V. G. Peroxide epoxidation of the alkenes: Mechanism, associative and stereochemical peculiarities. Moscow: Simferopol, 2001.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
6

Singh, Jag J. Free-volume characteristics of epoxies. Hampton, Va: Langley Research Center, 1992.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
7

J, Singh Jag, and United States. National Aeronautics and Space Administration. Scientific and Technical Information Program., eds. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
8

Singh, Jag J. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
9

Singh, Jag J. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
10

universitet, Lunds, ed. Synthetic studies towards taxol: An epoxy-olefin cyclization approach. Lund, Sweden: Organic Chemistry 2, Lund Institute of Technology, University of Lund, 1989.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Більше джерел

Частини книг з теми "Epoxy compounds"

1

Gooch, Jan W. "Epoxy Compounds." In Encyclopedic Dictionary of Polymers, 271. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4466.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
2

"Epoxy Compounds." In A Comprehensive Guide to the Hazardous Properties of Chemical Substances, 348–69. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/9780470134955.ch16.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
3

"6β-Acetoxy-1,10-epoxy-furanoeremophilane (6β-Acetoxy-1,10-epoxy-euryopsin)." In Natural Compounds, 554–55. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1106.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
4

"6β-Acetoxy-1,10-epoxy-furanoeremophil-9-one (1,10-Epoxy-decompositin)." In Natural Compounds, 555. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1107.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
5

"6β-(2′,3′-Epoxy-angeloyloxy)-1β,10β-epoxy-furanoeremophil-9-one." In Natural Compounds, 579. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1161.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
6

"6-Angeloyloxy-1α,10-epoxy-furanoeremophilane (6-Angeloyloxy-1α,10-epoxy-euryopsin)." In Natural Compounds, 570. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1140.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
7

"6β-Angeloyloxy-1,10-epoxy-furanoeremophil-9-one (6β-Angeloyloxy-1,10α-epoxy-euryopsin)." In Natural Compounds, 571–72. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1142.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
8

"6β-(4′-Hydroxyangeloyloxy)-1,10β-epoxy-furanoeremophilane (1,10β-Epoxy-6β-(γ-hydroxyangeloyloxy)furanoeremophilan)." In Natural Compounds, 581. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1166.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
9

"3β-Angeloyloxy-6,15-epoxy-furanoeremophilane." In Natural Compounds, 562. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1122.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
10

"6β-Isobutyroyloxy-1,10-epoxy-furanoeremophilane." In Natural Compounds, 588. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1180.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.

Тези доповідей конференцій з теми "Epoxy compounds"

1

Uschitsky, M., and E. Suhir. "Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles." In ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0818.

Повний текст джерела
Анотація:
Abstract Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) devices is affected to a great extent by the materials ability to absorb moisture. Accordingly, the objective of the study is to evaluate the effect of moisture sorption on the mechanical properties of the compounds. The diffusion of water in compounds filled with silica and alumina nitride particles has been studied experimentally for systems with moderate and high concentration of fillers. The analysis of the weight gain profiles has shown that the process of moisture diffusion is non-Fickian and that the moisture weight gain depends on the specimen’s relative humidity and the concentration of fillers. As to the hygro-thermal (swelling) stress, caused by moisture diffusion, we found that this stress is very low (its average value does not exceed 662 psi). We showed also that moisture diffusion leads to an appreciable decrease in the compound’s strength and to a substantial increase in the material’s plasticity. The obtained results can be helpful in the analysis of the mechanical behavior of epoxy molding compounds used in electronic packaging.
Стилі APA, Harvard, Vancouver, ISO та ін.
2

Uschitsky, M., E. Suhir, and G. W. Kammlott. "Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach." In ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0819.

Повний текст джерела
Анотація:
Abstract Reliability of epoxy molding compounds used in plastic packages of integrated circuit (IC) devices depends on the level of thermal stresses caused by the thermal expansion (contraction) mismatch of the epoxy and the silicon materials. In this analysis we asses the effect of silica fillers on the thermal stresses. We conclude that thermal stresses in the epoxy molding compound (composite) can be indeed reduced by the application of appropriate fillers. We found, however, that the volume concentration of the fillers, does not have to be larger than 0.3 to keep the thermal stresses at a sufficiently low level. This number is close to the fillers volume concentration (c = 0.336–0.390) in actual commercially available molding compounds. The obtained results and recommendations can be helpful in the analysis of stresses and physical design of plastic packages of IC devices.
Стилі APA, Harvard, Vancouver, ISO та ін.
3

Walter, H., O. Holck, H. Dobrinski, J. Stuermann, T. Braun, J. Bauer, O. Wittler, and K. D. Lang. "Moisture induced swelling in epoxy moulding compounds." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575803.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
4

Lindahl, R., M. Rhen, and A. Hagenbjörk-Gustavsson. "78. Dermal Exposure Measurement of Epoxy Compounds." In AIHce 2005. AIHA, 2005. http://dx.doi.org/10.3320/1.2758669.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
5

Lall, Pradeep, Kalyan Dornala, Jeff Suhling, and John Deep. "Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74322.

Повний текст джерела
Анотація:
Electronics components operating under extreme thermo-mechanical stresses are often protected with conformal coating and potting encapsulation to isolate the thermal and vibration shock loads. Development of predictive models for high-g shock survivability of electronics requires the measurement of the interface properties of the potting compounds with the printed circuit board materials. There is scarcity of interface fracture properties of porting compounds with printed circuit board materials. Potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. The cured potting materials are prone to interfacial delamination under dynamic shock loading which in turn potentially cause failures in the package interconnects. The study of interfacial fracture resistance in PCB/epoxy potting systems under dynamic shock loading is important in mitigating the risk of system failure in mission critical applications. In this paper three types of epoxy potting compounds were used as an encapsulation on PCB samples. The potting compounds were selected on the basis of their ultimate elongation under quasi-static loading. Potting compound, A is stiffer material with 5% of ultimate elongation before failure. Potting compound, B is a moderately stiff material with 12% ultimate elongation. Finally potting compound C is a softer material with 90% ultimate elongation before failure. The fracture properties and interfacial crack delamination of the PCB/epoxy interface was determined using three-point bend loading with a pre-crack in the epoxy near the interface. The fracture toughness and crack initiation of the three epoxy systems was compared with the cure schedule and temperature. Fracture modeling was performed with crack tip elements in ABAQUS finite element models to determine the crack initiation and interfacial stresses. A comparison of the fracture properties and the performance of epoxy system resistance to delamination was shown through the three-point bend tests. The finite element model results were correlated with the experimental findings.
Стилі APA, Harvard, Vancouver, ISO та ін.
6

Lall, Pradeep, Kalyan Dornala, Jeff Suhling, John Deep, and Ryan Lowe. "Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading." In ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/ipack2019-6572.

Повний текст джерела
Анотація:
Abstract Electronics components operating under extreme thermo-mechanical stresses are often protected with underfills and potting encapsulation to isolate the severe stresses. By encapsulating the entire PCB, the resin provides complete insulation for the unit thereby combining good electrical properties with excellent mechanical protection. In military and defense applications these components are often subjected to mechanical shock loads of 50,000g and are expected to perform with reliability. Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully-cured material, with no by-products. The cured potting materials are prone to interfacial delamination under dynamic shock loading which in turn potentially cause failures in the package interconnects. The study of interfacial fracture resistance in PCB/epoxy potting systems under dynamic shock loading is important in mitigating the risk of system failure in mission critical applications. In this paper, three types of epoxy potting compounds were used as an encapsulation on PCB samples. The potting compounds were selected based on their ultimate elongation under quasi-static loading. Potting compound, A is a stiffer material with 5% of ultimate elongation before failure. Potting compound, B is a moderately stiff material with 12% ultimate elongation. Finally, potting compound C is a softer material with 90% ultimate elongation before failure. The fracture properties and interfacial crack delamination of the PCB/epoxy interface were determined using three-point bend loading with a pre-crack at the interface. The fatigue crack growth of the interfacial delamination was characterized for the three epoxy systems. A prediction of number of cycles to failure and the performance of different epoxy system resistance under cyclic bending loading was assessed.
Стилі APA, Harvard, Vancouver, ISO та ін.
7

Sousa, M. F., O. Holck, T. Braun, J. Bauer, H. Walter, O. Wittler, and K. D. Lang. "Mechanically relevant chemical shrinkage of epoxy molding compounds." In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2013. http://dx.doi.org/10.1109/eurosime.2013.6529962.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
8

van Soestbergen, M., L. J. Ernst, G. Q. Zhang, and R. T. H. Rongen. "Transport of Corrosive Constituents in Epoxy Moulding Compounds." In 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007. IEEE, 2007. http://dx.doi.org/10.1109/esime.2007.360019.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
9

Liu, Xiang, Roger Lu, Guangchao Xie, and Haiyong Gu. "Improving Moldability by Regulating Thixotropy of Epoxy Molding Compounds." In 2023 24th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2023. http://dx.doi.org/10.1109/icept59018.2023.10491915.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
10

Huiqiang, Shen, Qin Fei, Xia Guofeng, and Bie Xiaorui. "Characterization of thermal and curing behaviors of epoxy molding compounds." In 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM). IEEE, 2014. http://dx.doi.org/10.1109/isaf.2014.6917884.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.

Звіти організацій з теми "Epoxy compounds"

1

Naim, Michael, Gary R. Takeoka, Haim D. Rabinowitch, and Ron G. Buttery. Identification of Impact Aroma Compounds in Tomato: Implications to New Hybrids with Improved Acceptance through Sensory, Chemical, Breeding and Agrotechnical Techniques. United States Department of Agriculture, October 2002. http://dx.doi.org/10.32747/2002.7585204.bard.

Повний текст джерела
Анотація:
The tomato, a profitable vegetable crop in both the USA and Israel, has benefited significantly from intensive breeding efforts in both countries, and elsewhere (esp. Holland). : Modem hybrids are highly prolific and resistant to a variety of major pests. They produce attractive, firm fruit for both processing and fresh-marketing. In all cases, however, reduction in flavor and aroma have occurred concomitantly with the increase in yield. Sugars-acids ratio dominate fruit taste, whereas aroma volatiles (potent at minute ppb and ppt levels) contribute to the total characteristic tomato flavor. An increase in sugars (1-2%) contributes significantly to tomato fruit taste. However, because of energy reasons, an increase in fruit sugars is immediately compensated for by a decrease in yield. Our main objectives were to: (a) pinpoint and identify the major impact aroma components of fresh tomato; (b) study the genetic and environmental effects on fruit aroma; (c) determine precursors of appealing (flavors) and repelling (off-flavors) aroma compounds in tomato. Addition of saturated salts blocked all enzymatic activities prior to isolation of volatiles by dynamic and static headspace, using solvent assisted flavor evaporation (SAFE) and solid phase micro-extraction (SPME) from highly favored (FA-612 and FA-624) and less preferred (R 144 and R 175) tomato genotypes. Impact aroma components were determined by gas chromatography-olfactometry (GC-O), gas chromatography-mass spectrometry (GC- MS) and aroma extract dilution analysis (AEDA). The potent odorant (Z)-1,5-octadien-3-one, was identified for the first time in fresh tomato. From the ca. 400 volatile compounds in the headspace of fresh tomato, the following compounds are proposed to be impact aroma compounds: (Z)-3-hexenal, hexanal, 1-penten-3-one, 2-phenylethanol, (E)-2-hexenal, phenyl acetaldehyde, b-ionone, b-damascenone, 4-hydroxy-2,5-dimethyl-3-(2H)-furanone (FuraneolR), (Z)-l,5-octadien-3-one, methional, 1-octen-3-one, guaiacol, (E,E)- and (E,Z)- 2,4-decadienal and trans- and cis-4,5-EPOXY -(E)-2-decenal. This confirms the initial hypothesis that only a small number of volatiles actually contribute to the sensation of fruit aroma. Tomato matrix significantly affected the volatility of certain impact aroma components and thus led to the conclusion that direct analysis of molecules in the headspace . may best represent access of tomato volatiles to the olfactory receptors. Significant differences in certain odorants were found between preferred and less-preferred cultivars. Higher consumer preference was correlated with higher concentrations of the following odorants: l-penten-3-one, (Z)-3-hexenal, (E,E)- and (E,Z)-2,4-decadienal and especially Furaneol, whereas lower consumer preference was associated with higher concentrations of methional, 3-methylbutyric acid, phenylacetaldehyde, 2-phenylethanol, and 2-isobutylthiazole. Among environmental factors (salinity, N source, growth temperature), temperature had significant effects on the content of selected aroma compounds (e.g., 3-methylbutanal, 1- penten-3-one, hexanal, (Z)-3-hexenal, (E)-2-hexenal, 2-isobutylthiazole, 6-methyl-5-hepten- 2-one, 1-octen-3-one, methional, 2-phenylethanal, phenyl acetaldehyde, and eugenol) in fresh tomatoes. Salt stress (20 mM NaCl) increased the content of odorants such as (Z)-3-hexenal, 2-phenylethanol and 3-methylbutanal in the R-144 cultivar whereas salinity had minor effects on 1-pentene-3-one, 2-isobutylthiazole and b-ionone. This fundamental knowledge obtained by comprehensive investigation, using modem chemical, sensory and agrotechnical methodology will assist future attempts to genetically modify the concentrations of key odorants in fresh tomatoes, and thus keep the tomato production of Israel and the USA competitive on the world market.
Стилі APA, Harvard, Vancouver, ISO та ін.
Також вас можуть зацікавити розширені добірки на тему "Epoxy compounds" для конкретних типів джерел:
Статті в журналах Дисертації Книги
Ми пропонуємо знижки на всі преміум-плани для авторів, чиї праці увійшли до тематичних добірок літератури. Зв'яжіться з нами, щоб отримати унікальний промокод!

До бібліографії