Добірка наукової літератури з теми "Epoxy compounds"
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Статті в журналах з теми "Epoxy compounds"
Rudawska, Anna. "Experimental Study of Mechanical Properties of Epoxy Compounds Modified with Calcium Carbonate and Carbon after Hygrothermal Exposure." Materials 13, no. 23 (November 29, 2020): 5439. http://dx.doi.org/10.3390/ma13235439.
Повний текст джерелаMikroyannidis, John A. "Self-curing epoxy compounds." Journal of Applied Polymer Science 41, no. 1112 (1990): 2613–24. http://dx.doi.org/10.1002/app.1990.070411109.
Повний текст джерелаRudawska, Anna. "Mechanical Properties of Epoxy Compounds Based on Unmodified Epoxy Resin Modified with Boric Acid as an Antiseptic." Materials 17, no. 1 (January 3, 2024): 259. http://dx.doi.org/10.3390/ma17010259.
Повний текст джерелаSaiki, Hiroyuki, Yasuo Marumo, Hiroshi Nishitake, Masahiro Hazama, and Fuminori Sakata. "Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits." Advanced Materials Research 15-17 (February 2006): 599–603. http://dx.doi.org/10.4028/www.scientific.net/amr.15-17.599.
Повний текст джерелаChen, Li, and Ying Huang. "Modification of Epoxy Molding Compounds with Epoxy-terminated Polydimethylsiloxane." Chinese Journal of Applied Chemistry 12, no. 5 (October 1, 1995): 67–72. http://dx.doi.org/10.3724/j.issn.1000-0518.1995.5.6772.
Повний текст джерелаSuojalehto, Hille, Joaquin Sastre, Emilia Merimaa, Irmeli Lindström, and Katri Suuronen. "Occupational Asthma From Epoxy Compounds." Journal of Allergy and Clinical Immunology: In Practice 7, no. 1 (January 2019): 191–98. http://dx.doi.org/10.1016/j.jaip.2018.07.023.
Повний текст джерелаKarandashov, Oleg, and Viacheslav Avramenko. "Studies of Thermal Stability of Epoxy Compounds for Glass-Fiber Pipes." Chemistry & Chemical Technology 11, no. 1 (March 15, 2017): 61–64. http://dx.doi.org/10.23939/chcht11.01.061.
Повний текст джерелаRudawska, Anna, and Mariaenrica Frigione. "Effect of Diluents on Mechanical Characteristics of Epoxy Compounds." Polymers 14, no. 11 (June 3, 2022): 2277. http://dx.doi.org/10.3390/polym14112277.
Повний текст джерелаGemuev, Sh I., and A. I. Gemuev. "Advanced technology of epoxy molding compounds production and strength characteristics of developed epoxy molding compounds." Polymer materials and technologies 2, no. 3 (2016): 73–75. http://dx.doi.org/10.32864/polymmattech-2016-2-3-73-75.
Повний текст джерелаWaechter, John M., and Gauke E. Veenstra. "ChemInform Abstract: Epoxy Compounds: Aromatic Diglycidyl Ethers, Polyglycidyl Ethers, Glycidyl Esters, and Miscellaneous Epoxy Compounds." ChemInform 33, no. 42 (May 19, 2010): no. http://dx.doi.org/10.1002/chin.200242272.
Повний текст джерелаДисертації з теми "Epoxy compounds"
Woo, Shui Cheung. "Degradation of epoxy-clay nanocomposites after UV exposure and moisture attack /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20WOO.
Повний текст джерелаHu, Chugang. "Epoxy-clay nanocomposites : morphology, moisture absorption behavior and thermo-mechanical properties /." View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?MECH%202004%20HU.
Повний текст джерелаPunchaipetch, Prakaipetch. "Epoxy + Liquid Crystalline Epoxy Coreacted Networks." Thesis, University of North Texas, 2000. https://digital.library.unt.edu/ark:/67531/metadc2705/.
Повний текст джерелаSgriccia, Nikki. "Microwave and thermally cured natural fiber epoxy composites." Diss., Connect to online resource - MSU authorized users, 2008.
Знайти повний текст джерелаKelly, Paul Thomas. "Preparation, characterization and properties of montmorillonite/epoxy compounds." Case Western Reserve University School of Graduate Studies / OhioLINK, 1994. http://rave.ohiolink.edu/etdc/view?acc_num=case1057604761.
Повний текст джерелаBilyeu, Bryan. "Characterization of Cure Kinetics and Physical Properties of a High Performance, Glass Fiber-Reinforced Epoxy Prepreg and a Novel Fluorine-Modified, Amine-Cured Commercial Epoxy." Thesis, University of North Texas, 2003. https://digital.library.unt.edu/ark:/67531/metadc4437/.
Повний текст джерелаChen, Rong-Sheng. "Hygrothermal response of graphite/epoxy composites /." The Ohio State University, 1987. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487326511715323.
Повний текст джерелаChonkaew, Wunpen Brostow Witold. "Modifications of epoxy resins for improved mechanical and tribological performances and their effects on curing kinetics." [Denton, Tex.] : University of North Texas, 2008. http://digital.library.unt.edu/permalink/meta-dc-6123.
Повний текст джерелаChan, Edward King-Long. "A study of moisture diffusion at the epoxy/copper interface for plastic IC packages /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20CHAN.
Повний текст джерелаCrow, Brian Shelton. "Epoxidation of alkenes by dimethyldioxirane kinetics, activation parameters and solvent studies /." restricted, 2005. http://etd.gsu.edu/theses/available/etd-11282005-140018/.
Повний текст джерелаTitle from title screen. Al Baumstark, committee chair; Paul Franklin, David Boykin, Markus Germann, committee members. Electronic text (136 p. : charts (some col.)) : digital, PDF file. Description based on contents viewed June 7, 2007. Includes bibliographical references (p. 130-136).
Книги з теми "Epoxy compounds"
Työterveyslaitos and Teknillinen Korkeakoulu. Faculty of Process Engineering and Material Science., eds. Occupational skin diseases from epoxy compounds: Epoxy resin compounds, epoxy acrylates, and 2,3-epoxypropyl trimethyl ammonium chloride. Helsinki: Institute of Occupational Health, 1991.
Знайти повний текст джерелаA, Sokolova I͡U. Modifit͡sirovannye ėpoksidnye klei i pokrytii͡a v stroitelʹstve. Moskva: Stroĭizdat, 1990.
Знайти повний текст джерелаSingh, Jag J. Investigation of the effects of cobalt ions on epoxy properties. Hampton, Va: Langley Research Center, 1986.
Знайти повний текст джерелаMilchert, Eugeniusz. Epoksydowanie olefin i chloroolefin wodoronadtlenkiem tert-butylu. Szczecin: Wydawn. Uczelniane Politechniki Szczecińskiej, 1991.
Знайти повний текст джерелаDryuk, V. G. Peroxide epoxidation of the alkenes: Mechanism, associative and stereochemical peculiarities. Moscow: Simferopol, 2001.
Знайти повний текст джерелаSingh, Jag J. Free-volume characteristics of epoxies. Hampton, Va: Langley Research Center, 1992.
Знайти повний текст джерелаJ, Singh Jag, and United States. National Aeronautics and Space Administration. Scientific and Technical Information Program., eds. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.
Знайти повний текст джерелаSingh, Jag J. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.
Знайти повний текст джерелаSingh, Jag J. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.
Знайти повний текст джерелаuniversitet, Lunds, ed. Synthetic studies towards taxol: An epoxy-olefin cyclization approach. Lund, Sweden: Organic Chemistry 2, Lund Institute of Technology, University of Lund, 1989.
Знайти повний текст джерелаЧастини книг з теми "Epoxy compounds"
Gooch, Jan W. "Epoxy Compounds." In Encyclopedic Dictionary of Polymers, 271. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4466.
Повний текст джерела"Epoxy Compounds." In A Comprehensive Guide to the Hazardous Properties of Chemical Substances, 348–69. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/9780470134955.ch16.
Повний текст джерела"6β-Acetoxy-1,10-epoxy-furanoeremophilane (6β-Acetoxy-1,10-epoxy-euryopsin)." In Natural Compounds, 554–55. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1106.
Повний текст джерела"6β-Acetoxy-1,10-epoxy-furanoeremophil-9-one (1,10-Epoxy-decompositin)." In Natural Compounds, 555. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1107.
Повний текст джерела"6β-(2′,3′-Epoxy-angeloyloxy)-1β,10β-epoxy-furanoeremophil-9-one." In Natural Compounds, 579. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1161.
Повний текст джерела"6-Angeloyloxy-1α,10-epoxy-furanoeremophilane (6-Angeloyloxy-1α,10-epoxy-euryopsin)." In Natural Compounds, 570. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1140.
Повний текст джерела"6β-Angeloyloxy-1,10-epoxy-furanoeremophil-9-one (6β-Angeloyloxy-1,10α-epoxy-euryopsin)." In Natural Compounds, 571–72. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1142.
Повний текст джерела"6β-(4′-Hydroxyangeloyloxy)-1,10β-epoxy-furanoeremophilane (1,10β-Epoxy-6β-(γ-hydroxyangeloyloxy)furanoeremophilan)." In Natural Compounds, 581. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1166.
Повний текст джерела"3β-Angeloyloxy-6,15-epoxy-furanoeremophilane." In Natural Compounds, 562. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1122.
Повний текст джерела"6β-Isobutyroyloxy-1,10-epoxy-furanoeremophilane." In Natural Compounds, 588. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1180.
Повний текст джерелаТези доповідей конференцій з теми "Epoxy compounds"
Uschitsky, M., and E. Suhir. "Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles." In ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0818.
Повний текст джерелаUschitsky, M., E. Suhir, and G. W. Kammlott. "Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach." In ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0819.
Повний текст джерелаWalter, H., O. Holck, H. Dobrinski, J. Stuermann, T. Braun, J. Bauer, O. Wittler, and K. D. Lang. "Moisture induced swelling in epoxy moulding compounds." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575803.
Повний текст джерелаLindahl, R., M. Rhen, and A. Hagenbjörk-Gustavsson. "78. Dermal Exposure Measurement of Epoxy Compounds." In AIHce 2005. AIHA, 2005. http://dx.doi.org/10.3320/1.2758669.
Повний текст джерелаLall, Pradeep, Kalyan Dornala, Jeff Suhling, and John Deep. "Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74322.
Повний текст джерелаLall, Pradeep, Kalyan Dornala, Jeff Suhling, John Deep, and Ryan Lowe. "Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading." In ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/ipack2019-6572.
Повний текст джерелаSousa, M. F., O. Holck, T. Braun, J. Bauer, H. Walter, O. Wittler, and K. D. Lang. "Mechanically relevant chemical shrinkage of epoxy molding compounds." In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2013. http://dx.doi.org/10.1109/eurosime.2013.6529962.
Повний текст джерелаvan Soestbergen, M., L. J. Ernst, G. Q. Zhang, and R. T. H. Rongen. "Transport of Corrosive Constituents in Epoxy Moulding Compounds." In 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007. IEEE, 2007. http://dx.doi.org/10.1109/esime.2007.360019.
Повний текст джерелаLiu, Xiang, Roger Lu, Guangchao Xie, and Haiyong Gu. "Improving Moldability by Regulating Thixotropy of Epoxy Molding Compounds." In 2023 24th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2023. http://dx.doi.org/10.1109/icept59018.2023.10491915.
Повний текст джерелаHuiqiang, Shen, Qin Fei, Xia Guofeng, and Bie Xiaorui. "Characterization of thermal and curing behaviors of epoxy molding compounds." In 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM). IEEE, 2014. http://dx.doi.org/10.1109/isaf.2014.6917884.
Повний текст джерелаЗвіти організацій з теми "Epoxy compounds"
Naim, Michael, Gary R. Takeoka, Haim D. Rabinowitch, and Ron G. Buttery. Identification of Impact Aroma Compounds in Tomato: Implications to New Hybrids with Improved Acceptance through Sensory, Chemical, Breeding and Agrotechnical Techniques. United States Department of Agriculture, October 2002. http://dx.doi.org/10.32747/2002.7585204.bard.
Повний текст джерела