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Статті в журналах з теми "Electronic manufacturing processes"
Michaelides, Roula, Dennis Kehoe, and Matthew Tickle. "Using electronic Customer Relationship Management to improve manufacturing processes." International Journal of Agile Systems and Management 2, no. 3 (2007): 321. http://dx.doi.org/10.1504/ijasm.2007.015796.
Повний текст джерелаSeyedin, Shayan, Tian Carey, Adrees Arbab, Ladan Eskandarian, Sivasambu Bohm, Jong Min Kim, and Felice Torrisi. "Fibre electronics: towards scaled-up manufacturing of integrated e-textile systems." Nanoscale 13, no. 30 (2021): 12818–47. http://dx.doi.org/10.1039/d1nr02061g.
Повний текст джерелаPalajova, Silvia, and Milan Gregor. "Simulation Metamodelling of Manufacturing Processes." Communications - Scientific letters of the University of Zilina 13, no. 4 (December 31, 2011): 51–54. http://dx.doi.org/10.26552/com.c.2011.4.51-54.
Повний текст джерелаBecker, K. F., S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, et al. "Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000021–25. http://dx.doi.org/10.4071/1085-8024-2021.1.
Повний текст джерелаLeckie, F. A., and R. M. McMeeking. "Processing and Manufacturing." Applied Mechanics Reviews 38, no. 10 (October 1, 1985): 1297–300. http://dx.doi.org/10.1115/1.3143697.
Повний текст джерелаCobley, A. J. "Alternative surface modification processes in metal finishing and electronic manufacturing industries." Transactions of the IMF 85, no. 6 (November 2007): 293–97. http://dx.doi.org/10.1179/174591907x246528.
Повний текст джерелаLiang, R. C., Jack Hou, HongMei Zang, Jerry Chung, and Scott Tseng. "Microcup® displays: Electronic paper by roll-to-roll manufacturing processes." Journal of the Society for Information Display 11, no. 4 (2003): 621. http://dx.doi.org/10.1889/1.1825690.
Повний текст джерелаLi, Ji, Thomas Wasley, Duong Ta, John Shephard, Jonathan Stringer, Patrick J. Smith, Emre Esenturk, Colm Connaughton, Russell Harris, and Robert Kay. "Micro electronic systems via multifunctional additive manufacturing." Rapid Prototyping Journal 24, no. 4 (May 14, 2018): 752–63. http://dx.doi.org/10.1108/rpj-02-2017-0033.
Повний текст джерелаUshijima, Hirobumi, Ken-ichi Nomura, Yasuyuki Kusaka, Shusuke Kanazawa, Yoshinori Horii, Mariko Fujita, and Noritaka Yamamoto. "Development of Manufacturing Processes for Novel Electronics by Print Technology." Journal of The Japan Institute of Electronics Packaging 21, no. 6 (September 1, 2018): 567–72. http://dx.doi.org/10.5104/jiep.21.567.
Повний текст джерелаMANDUTIANU, DAN, and SERBAN VOINEA. "Knowledge based processes in flexible manufacturing." International Journal of Computer Integrated Manufacturing 1, no. 3 (July 1988): 197–205. http://dx.doi.org/10.1080/09511928808944361.
Повний текст джерелаДисертації з теми "Electronic manufacturing processes"
George, Gikku J. "A simulation model to analyze post reflow processes at an electronics manufacturing facility." Diss., Online access via UMI:, 2006.
Знайти повний текст джерелаMa, Hongtao Johnson R. Wayne Suhling J. C. "Characterization of lead-free solders for electronic packaging." Auburn, Ala., 2007. http://repo.lib.auburn.edu/2006%20Fall/Dissertations/MA_HONGTAO_31.pdf.
Повний текст джерелаKrauss, Alan. "Control of run-by-run processes with applications to large-area material deposition." Diss., Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/14685.
Повний текст джерелаLi, Jing. "Evaluation and improvement of the robustness of a PCB pad in a lead-free environment." Diss., Online access via UMI:, 2007.
Знайти повний текст джерелаIncludes bibliographical references.
Hinshaw, Robert Bruce Lall Pradeep. "Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environments." Auburn, Ala, 2009. http://hdl.handle.net/10415/1907.
Повний текст джерелаWang, Qing Johnson R. Wayne Gale W. F. "Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/WANG_QING_29.pdf.
Повний текст джерелаWoo, Belemy Hok Chung. "Solderability & microstructure of lead-free solder in leadframe packaging." access abstract and table of contents access full-text, 2005. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21175214a.pdf.
Повний текст джерелаAt head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.
Shantaram, Sandeep Lall Pradeep. "Explicit finite element modeling in conjunction with digital image correlation based life prediction of lead-free electronics under shock-impact." Auburn, Ala, 2009. http://hdl.handle.net/10415/1894.
Повний текст джерелаMee, Christine. "Spectrophotometric studies of individual components of a cupric chloride etchant used in printed wiring board manufacturing processes /." Online version of thesis, 1986. http://hdl.handle.net/1850/8841.
Повний текст джерелаIyengar, Deepti Raju Lall Pradeep. "Initialization and progression of damage in lead free electronics under drop impact." Auburn, Ala, 2008. http://repo.lib.auburn.edu/EtdRoot/2008/FALL/Mechanical_Engineering/Thesis/Iyengar_Deepti_35.pdf.
Повний текст джерелаКниги з теми "Electronic manufacturing processes"
Yung-Cheng, Lee, and Chen William T, eds. Manufacturing challenges in electronic packaging. London: Chapman & Hall, 1998.
Знайти повний текст джерелаLee, Y. C. Manufacturing Challenges in Electronic Packaging. Boston, MA: Springer US, 1998.
Знайти повний текст джерелаIEEE/CHMT International Electronic Manufacturing Technology Symposium. (2nd 1986 San Francisco, Calif.). IEEE International Electronic Manufacturing Technology Symposium. New York: Institute of Electrical and Electronics Engineers, 1986.
Знайти повний текст джерелаDonald, Brettner, ed. Process improvement in the electronics industry. New York: Wiley, 1992.
Знайти повний текст джерелаIEEE/CHMT, International Electronic Manufacturing Technology Symposium (2nd 1986 San Francisco Calif ). Proceedings 1986. [New York, NY, U.S.A: IEEE, 1986.
Знайти повний текст джерелаLead-free implementation and production: A manufacturing guide. New York: McGraw-Hill, 2005.
Знайти повний текст джерелаMatisoff, Bernard S. Handbook of electronics manufacturing engineering. 2nd ed. New York: Van Nostrand Reinhold, 1986.
Знайти повний текст джерелаMatisoff, Bernard S. Handbook of electronics manufacturing engineering. 3rd ed. New York: Chapman & Hall, 1997.
Знайти повний текст джерелаMatisoff, Bernard S. Handbook of electronics manufacturing engineering. 2nd ed. New York: Van Nostrand Reinhold, 1986.
Знайти повний текст джерелаHandbook of electronics manufacturing engineering. 2nd ed. New York: Van Nostrand Reinhold, 1986.
Знайти повний текст джерелаЧастини книг з теми "Electronic manufacturing processes"
Poudelet, Louison, Anna Castellví, and Laura Calvo. "An Innovative (DIW-Based) Additive Manufacturing Process." In New Business Models for the Reuse of Secondary Resources from WEEEs, 65–80. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-74886-9_6.
Повний текст джерелаMatisoff, Bernard. "Standard Manufacturing Processes." In Handbook of Electronics Manufacturing Engineering, 121–254. Boston, MA: Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-6047-0_6.
Повний текст джерелаMatisoff, Bernard S. "Standard Manufacturing Processes." In Handbook of Electronics Manufacturing Engineering, 118–252. Dordrecht: Springer Netherlands, 1986. http://dx.doi.org/10.1007/978-94-011-7038-3_6.
Повний текст джерелаKumar, Sanjay. "Electron Beam Powder Bed Fusion." In Additive Manufacturing Processes, 65–78. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-45089-2_4.
Повний текст джерелаMinkoff, Isaac. "Process Selection and Control/Computer Applications/Electronics Manufacturing Processes/Modelling of Processes." In Materials Processes, 109–25. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-95562-4_7.
Повний текст джерелаQuezada, Jonnathan, Lorena Siguenza-Guzman, and Juan Llivisaca. "Optimization of Motorcycle Assembly Processes Based on Lean Manufacturing Tools." In Advances and Applications in Computer Science, Electronics and Industrial Engineering, 247–59. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-33614-1_17.
Повний текст джерелаSolis-Quinteros, Maria Marcela, Luis Alfredo Avila-Lopez, Carolina Zayas-Márquez, Teresa Carrillo-Gutierrez, and Karina Cecilia Arredondo-Soto. "Analysis of the Technological Capability of Linking SMEs in the Electronic Sector to Integrate into the Maquiladora Industry Electronic Sector in Tijuana, Baja California, Mexico." In Advances in Manufacturing, Production Management and Process Control, 376–87. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-20494-5_35.
Повний текст джерелаPriarone, Paolo C., Matteo Robiglio, Giuseppe Ingarao, and Luca Settineri. "Assessment of Cost and Energy Requirements of Electron Beam Melting (EBM) and Machining Processes." In Sustainable Design and Manufacturing 2017, 723–35. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-57078-5_68.
Повний текст джерелаBotello-Lara, Berónica, Margarita Gil-Samaniego Ramos, Juan Ceballos-Corral, and Arturo Sinue Ontiveros-Zepeda. "Are Productivity and Quality in Electronics Manufacturing Industry Affected by Human Factors? A Quantitative Analysis Using Statistical Tools." In Trends in Industrial Engineering Applications to Manufacturing Process, 529–59. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-71579-3_22.
Повний текст джерелаFischer, Andreas, Malte Vollmer, Philipp Krooß, and Thomas Niendorf. "Microstructural and Mechanical Properties of AISI 4140 Steel Processed by Electron Beam Powder Bed Fusion Analyzed Using Miniature Samples." In Progress in additive manufacturing 2020, 296–311. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 2022. http://dx.doi.org/10.1520/stp163720200125.
Повний текст джерелаТези доповідей конференцій з теми "Electronic manufacturing processes"
Dishon, G. J., and S. M. Bobbio. "Dry (fluxless) thermal soldering processes." In Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle. IEEE, 1988. http://dx.doi.org/10.1109/emts.1988.16145.
Повний текст джерелаHorvath, Eszter, Andras Erenyi, Attila Geczy, and Gabor Harsanyi. "Optimization of breaking processes in LTCC manufacturing." In 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME). IEEE, 2011. http://dx.doi.org/10.1109/siitme.2011.6102708.
Повний текст джерелаBecker, K. F., A. Kurz, H. Reichl, M. Koch, J. Bauer, and T. Braun. "Precision material deposition for SiP manufacturing using jetting processes." In 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC). IEEE, 2010. http://dx.doi.org/10.1109/ectc.2010.5490667.
Повний текст джерелаVemal, R., Calvin Lo, Sherrill Ong, B. S. Lee, and C. C. Yong. "MEMS vs. IC manufacturing: Is integration between processes possible." In 2009 1st Asia Symposium on Quality Electronic Design (ASQED 2009). IEEE, 2009. http://dx.doi.org/10.1109/asqed.2009.5206300.
Повний текст джерелаFjelstad, Joseph. "Benefits of reversing the circuit manufacturing and assembly processes for electronic products." In 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011. IEEE, 2011. http://dx.doi.org/10.1109/isemc.2011.6038386.
Повний текст джерелаJiang, Feng, Qibin Wang, Kai Xue, Xiangmeng Jing, Daquan Yu, and Dongkai Shangguan. "Wafer level warpage characterization for backside manufacturing processes of TSV interposers." In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, 2014. http://dx.doi.org/10.1109/ectc.2014.6897532.
Повний текст джерелаPanhalkar, Neeraj, Ratnadeep Paul, and Sam Anand. "A Novel Additive Manufacturing File Format for Printed Electronics." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-64678.
Повний текст джерелаHuang, P. S., M. Y. Tsai, C. Y. Huang, P. C. Lin, Lawrence Huang, Michael Chang, Steven Shih, and J. P. Lin. "Warpage, stresses and KOZ of 3D TSV DRAM package during manufacturing processes." In 2012 14th International Conference on Electronic Materials and Packaging (EMAP). IEEE, 2012. http://dx.doi.org/10.1109/emap.2012.6507849.
Повний текст джерелаXiaogan Liang, Hongsuk Nam, Sungjin Wi, and Mikai Chen. "Plasma-assisted printing and doping processes for manufacturing few-layer MoS2-based electronic and optoelectronic devices." In 2014 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2014. http://dx.doi.org/10.1109/asmc.2014.6846956.
Повний текст джерелаWhite, Andrew Scott, David Saltzman, and Stephen Lynch. "Performance Analysis of Heat Sinks Designed for Additive Manufacturing." In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/ipack2020-2532.
Повний текст джерелаЗвіти організацій з теми "Electronic manufacturing processes"
Medina, Enrique A., Kaitlin Schneider, Arthur Temmesfeld, Jill Csavina-Raison, Douglas Hutchens, Robert Drerup, Roberto Acosta, et al. Manufacturing Technology (MATES) II. Task Order 0006: Air Force Technology and Industrial Base Research Sub-Task 07: Future Advances in Electronic Materials and Processes-Flexible Hybrid Electronics. Fort Belvoir, VA: Defense Technical Information Center, February 2016. http://dx.doi.org/10.21236/ad1011193.
Повний текст джерелаCrepeau, P., P. Glaser, J. Murray, and G. Swiech. Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies. Fort Belvoir, VA: Defense Technical Information Center, April 1992. http://dx.doi.org/10.21236/ada259589.
Повний текст джерелаWada, Yasutaka. Working Paper PUEAA No. 3. Parallel Processing and Parallelizing Compilation Techniques for "Green Computing". Universidad Nacional Autónoma de México, Programa Universitario de Estudios sobre Asia y África, 2022. http://dx.doi.org/10.22201/pueaa.001r.2022.
Повний текст джерелаRead, M. Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies; Program Task 1 Baseline Report. Fort Belvoir, VA: Defense Technical Information Center, April 1992. http://dx.doi.org/10.21236/ada256507.
Повний текст джерелаJagannathan, Shanti, and Dorothy Geronimo. Reaping the Benefits of Industry 4.0 through Skills Development in the Philippines. Asian Development Bank, January 2021. http://dx.doi.org/10.22617/spr200326.
Повний текст джерелаDryepondt, Sebastien N., Bruce A. Pint, and Daniel Ryan. Comparison of electron beam and laser beam powder bed fusion additive manufacturing process for high temperature turbine component materials. Office of Scientific and Technical Information (OSTI), April 2016. http://dx.doi.org/10.2172/1248786.
Повний текст джерелаDryepondt, Sebastien, Michael Kirka, and Daniel Ryan. Comparison of Electron Beam and Laser Beam Powder Bed Fusion Additive Manufacturing Process for High Temperature Turbine Component Materials, Phase II. Office of Scientific and Technical Information (OSTI), June 2019. http://dx.doi.org/10.2172/1658007.
Повний текст джерелаRouseff, Russell L., and Michael Naim. Characterization of Unidentified Potent Flavor Changes during Processing and Storage of Orange and Grapefruit Juices. United States Department of Agriculture, September 2002. http://dx.doi.org/10.32747/2002.7585191.bard.
Повний текст джерела