Готові списки джерел за темами / Electromigration in liquid metals

Добірка наукової літератури з теми "Electromigration in liquid metals"

Автор: Grafiati
Опубліковано: 6 вересня 2023

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Статті в журналах з теми "Electromigration in liquid metals"

1

Belashchenko, David K. "The Relationship between Electrical Conductivity and Electromigration in Liquid Metals." Dynamics 3, no. 3 (July 28, 2023): 405–24. http://dx.doi.org/10.3390/dynamics3030022.

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The phenomena of electrical conductivity and electromigration in metallic systems are related, since in both cases the basic physical process is the scattering of conduction electrons by metal ions. Numerous searches have been made for equations connecting the conductivity with electromigration. In the case of a liquid metal, when using the Drude–Sommerfeld (DS) conductivity equation, it was not possible to obtain a quantitative relationship between these phenomena, which would be correct. Attempts to find such a relationship when taking into account the N. Mott correction (g-factor) in the DS equation were unsuccessful. This article proposes a different correction (b-factor) to the DS equation, which takes into account the possibility of varying the momentum transferred by the conduction electron to a metal ion during the scattering. This correction allows to establish a quantitative relationship between conductivity and electromigration as well as between electromigration in various binary systems with common components, in agreement with the experiment. The proposed theory describes well, in particular, two- and multi-component metal systems of any concentration (the consistency rule for triangles A–B, B–C, C–A). The value of the b-factor smoothly changes depending on the heat of vaporization of the metal, per unit volume.
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2

Kumar, Sumit, Praveen Kumar, and Rudra Pratap. "A model for electromigration induced flow in liquid metals." Journal of Physics D: Applied Physics 50, no. 39 (September 1, 2017): 39LT02. http://dx.doi.org/10.1088/1361-6463/aa84a2.

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3

Mao, Xin, Ruhua Zhang, and Xiaowu Hu. "Influence of Ni foam/Sn composite solder foil on IMC growth and mechanical properties of solder joints bonded with solid-liquid electromigration." Intermetallics 131 (April 2021): 107107. http://dx.doi.org/10.1016/j.intermet.2021.107107.

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4

Ho, P. S., and T. Kwok. "Electromigration in metals." Reports on Progress in Physics 52, no. 3 (March 1, 1989): 301–48. http://dx.doi.org/10.1088/0034-4885/52/3/002.

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5

Rous, P. J., T. L. Einstein, and Ellen D. Williams. "Theory of surface electromigration on metals: application to self-electromigration on Cu(111)." Surface Science 315, no. 1-2 (August 1994): L995—L1002. http://dx.doi.org/10.1016/0039-6028(94)90532-0.

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6

Ek, J. van, and A. Lodder. "Electromigration in transition metals. I. Computational method." Journal of Physics: Condensed Matter 3, no. 38 (September 23, 1991): 7307–30. http://dx.doi.org/10.1088/0953-8984/3/38/007.

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Michaud, Hadrien O., and Stéphanie P. Lacour. "Liquid electromigration in gallium-based biphasic thin films." APL Materials 7, no. 3 (March 2019): 031504. http://dx.doi.org/10.1063/1.5059380.

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Li, C. H., Y. C. Chuang, and C. Y. Liu. "Fabrication of Mg-Based Intermetallic Compounds by Liquid Electromigration." Journal of Electronic Materials 36, no. 11 (September 13, 2007): 1489–94. http://dx.doi.org/10.1007/s11664-007-0231-4.

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van Ek, J., and A. Lodder. "Electromigration of Interstitial and Substitutional Impurities in Transition Metals." Defect and Diffusion Forum 95-98 (January 1993): 265–70. http://dx.doi.org/10.4028/www.scientific.net/ddf.95-98.265.

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Kuge, Toshihiro, Masataka Yahagi, and Junichi Koike. "Electromigration characteristics of CuAl2." Journal of Alloys and Compounds 918 (October 2022): 165615. http://dx.doi.org/10.1016/j.jallcom.2022.165615.

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Дисертації з теми "Electromigration in liquid metals"

1

Hibbs, Andrew Dennis. "Electromigration in metals and critical currents in high Tc superconductors." Thesis, University of Cambridge, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.603993.

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This thesis contains experimental and theoretical work on two highly important aspects of electric current flow in solids. In Part 1 electromigration in metals is discussed and observations of the nucleation and growth of voids in aluminium microcircuits reported. The importance of stress driven diffusional backflow is highlighted and shown to play an analogous role to work hardening during plastic flow. In the second half of Part 1, a new expression for the force exerted on the lattice ions by the electrons of a current carrying metal is derived. The analysis is shown to be applicable to the similar problem of electrical resistivity and the predicted values for both electromigration mass transport and resistivity compare favourably with other expressions in the literature, and with experiment. Part 2 contains results of magnetisation measurements on the high temperature superconductor YBa2Cu3O7. Many of the essential parameters have been measured including perhaps the first data for the pinning penetration depth and the interaction distance. The results are shown to imply that YBa2Cu3O7 contains weak links approximately 1μm apart.
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2

Razmislevičienė, Ina. "Dispersive liquid-liquid microextraction for the determination of metals." Doctoral thesis, Lithuanian Academic Libraries Network (LABT), 2013. http://vddb.laba.lt/obj/LT-eLABa-0001:E.02~2013~D_20130625_092031-65110.

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The aim of this work was to investigate and apply new DLLME systems coupled with LA-ICP-MS and ultra-performance liquid chromatography (UPLC) techniques for the preconcentration and determination of Cr(VI), Co(II), Cu(II) ir Ni(II) ions.
Šioje daktaro disertacijoje apibendrintų mokslinių tyrimų tikslas – ištirti ir pritaikyti naujus Cr(VI), Co(II), Cu(II) ir Ni(II) koncentravimo ir nustatymo metodus apjungiant dispersinę skystafazę mikroekstrakciją (DSME) su lazerinio išgarinimo induktyviai sužadintos plazmos masių spektrometrijos (LA-ICP-MS) bei ultraefektyviosios skysčių chromatografijos (UESCh) metodais.
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3

Pivovarov, Eugene Preskill John P. "Aspects of non-Fermi-liquid metals /." Diss., Pasadena, Calif. : California Institute of Technology, 2002. http://resolver.caltech.edu/CaltechETD:etd-05302002-130637.

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4

Patty, Mark R. Montfrooij Wouter T. "Single particle dynamics in liquid metals." Diss., Columbia, Mo. : University of Missouri--Columbia, 2009. http://hdl.handle.net/10355/6166.

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Title from PDF of title page (University of Missouri--Columbia, viewed on Feb 17, 2010). The entire thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file; a non-technical public abstract appears in the public.pdf file. Dissertation advisor: Wouter Montfrooij. Vita. Includes bibliographical references.
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5

Nakajima, Hidemasa. "Modelling of inclusion behavior in liquid metals." Thesis, McGill University, 1985. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=65995.

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6

Adisa, Akintayo Oluwole. "Deposition on nanoparticulate metals at the liquid/liquid and templated interface." Thesis, University of Manchester, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.498795.

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This thesis considers the deposition of nanoparticulate metals at the liquid/liquid and templated interfaces. It comprises an introduction to the relevant literature. The literature reviewed serves as an introduction to the preparation of nanoparticles in the solution phase, particle growth mechanisms and deposition at the liquid / liquid interface and within porous structures.
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7

Vaughan, James. "Ionic liquid electrochemical processing of reactive metals." Thesis, University of British Columbia, 2007. http://hdl.handle.net/2429/445.

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Ionic liquids (ILs) were studied as solvents for electrochemical reactions with the intent to devise metallurgical processes for Al, Mg and Ti that are less energy intensive and operate at lower temperatures than current industrial practice. Tetra-alkyl phosphonium ILs are on the low end of the IL cost spectrum and are regarded as understudied compared with imidazolium and pyridinium ILs. They are also known to be more thermally stable. The density, viscosity and conductivity of the phosphonium ILs and metal salt-IL mixtures were measured. The conductivity of the phosphonium ILs tested were found to be roughly an order of magnitude lower than imidazolium ILs; this is attributed to the relatively large cation size and localized charge. Linear density-temperature functions are presented. The viscosity and conductivity temperature relationship was modeled using the Vogel-Tamman-Fulcher (VTF) equation. The electrochemical window of A10341'14,6,6,610 was studied on a Pt substrate over a wide range of A1C13 concentrations using cyclic voltammetry (CV). It was found that the tetra-alkyl phosphonium cation is on the order of 800 mV more electrochemically stable than the 1-ethyl-3-methyl imidazolium (EMI+). Cathodic and anodic polarization of Al in A1C13-[P14,6,6,6]C1 (Xmc13 = 0.67) was studied at temperatures ranging from 347 to 423 K. The Butler-Volmer equation was fitted to the plots by varying the kinetic parameters. The cathodic reaction was found to be diffusion limited and the anodic reaction is limited by passivation at lower temperatures. The overpotential required for electrodissolution of Al was found to be higher than for electrodeposition. Aluminium was electrodeposited using both an electrowinning setup (chlorine evolution anode reaction) and electrorefining setup (Al dissolution anode reaction). The deposits were characterized in terms of morphology, current efficiency and power consumption. A variety of deposit morphologies were observed ranging from smooth, to spherical to dendritic, and in some cases, the IL was occluded in the deposit. The current efficiency and power consumption were negatively impacted by the presence of H2O and HCl present in the as-received ILs and by C12(g) generated by the anode reaction in the case of the electrowinning setup. HC1 was removed by cyclic polarization or corrosion of pure Al, resulting in current efficiencies above 90%. Aluminium was electrodeposited using the electrorefining setup with anode-cathode spacing of 2 mm at power consumption as low as 0.6 kWhr/kg-Al. This is very low compared with industrial Al electrorefining and Al electroplating using the National Bureau of Standards bath, which require 15-18 kWhr/kg-Al and 18 kWhr/kg-Al, respectively. However, due to low solution conductivity the power consumption increases significantly with increased anode-cathode spacing. Titanium tetrachloride was found to be soluble in [P14,6,6,6]Cl and increases the conductivity of the solution. Attempts to reduce the Ti(IV) included corrosion of titanium metal, corrosion of magnesium metal powder and cathodic polarization. Despite a few attempts, the electro-deposition of Ti was not observed. At this point, titanium electrodeposition from phosphonium based ILs does not appear feasible.
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8

Leclerc, Stephane Alfred Andre. "Direct liquid crystal templating of mesoporous metals." Thesis, University of Southampton, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.340513.

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Clegg, Richard Edward. "Liquid-metal embrittlement of metals and alloys." Thesis, University of Cambridge, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.260608.

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Bozack, Michael J. "Surface phenomena in liquid metal alloys with application to development of a liquid metal ion source of B and As /." Full text open access at:, 1985. http://content.ohsu.edu/u?/etd,76.

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Книги з теми "Electromigration in liquid metals"

1

1938-, Warren William W., ed. Fluid metals: The liquid-vapor transition of metals. Princeton, N.J: Princeton University Press, 1999.

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2

March, Norman H. Liquid metals: Concepts and theory. Cambridge [England]: Cambridge University Press, 1990.

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3

Ultrasound in liquid and solid metals. Boca Raton, Fla: CRC Press, 1993.

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4

L, Guthrie Roderick I., ed. The physical properties of liquid metals. Oxford: Clarendon Press, 1988.

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5

J, Lielpeteris, Moreau René J, International Union of Theoretical and Applied Mechanics., and Symposium on "Liquid Metal MHD" (1989? : Rīga, Latvia), eds. Liquid metal magnetohydrodynamics. Dordrecht: Kluwer Academic, 1989.

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6

Anatolʹevich, Vatolin Nikolaĭ, Pastukhov Ė A, and Akademii͡a︡ nauk SSSR. Uralʹskiĭ nauchnyĭ t͡s︡entr., eds. Struktura i fiziko-khimicheskie svoĭstva metallicheskikh i oksidnykh rasplavov: Sbornik nauchnykh trudov. Sverdlovsk: Akademii͡a︡ nauk SSSR, Uralʹskiĭ nauch. t͡s︡entr, 1986.

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7

Nikiforovich, Eremenko Valentin, and Instytut problem materialoznavstva (Akademii͡a︡ nauk Ukraïnsʹkoï RSR), eds. Fizicheskai͡a︡ khimii͡a︡ vzaimodeĭstvii͡a︡ zhidkikh metallov s materialami. Kiev: Nauk. dumka, 1988.

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8

V, Naĭdich I͡U︡, and Instytut problem materialoznavstva (Akademii͡a︡ nauk Ukraïnsʹkoï RSR), eds. Kapilli͡a︡rnye i adgezionnye svoĭstva rasplavov. Kiev: Nauk. dumka, 1987.

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9

Edgar, Lüscher, Fritsch Gerhard, Jacucci Gianni, North Atlantic Treaty Organization. Scientific Affairs Division., and NATO Advanced Study Institute on "Amorphous and Liquid Materials" (1985 : Mendola, Italy), eds. Amorphous and liquid materials. Dordrecht: Nijhoff, 1987.

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10

1930-, Borgstedt H. U., Frees Gunter, and International Seminar on Liquid Metal Systems: Material Behavior and Physical Chemistry in Liquid Metal Systems (2nd : 1993 : Karlsruhe, Germany), eds. Liquid metal systems: Material behavior and physical chemistry in liquid metal systems 2. New York: Plenum Press, 1995.

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Частини книг з теми "Electromigration in liquid metals"

1

Jizhi, Chen, Xia Mingxu, and Xu Kuangdi. "Structure of Liquid Metals." In The ECPH Encyclopedia of Mining and Metallurgy, 1–6. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-19-0740-1_933-1.

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2

Rogers, S., L. Katgerman, P. G. Enright, and N. A. Darby. "Modelling of liquid-liquid metal mixing." In Modelling the Flow and Solidification of Metals, 175–95. Dordrecht: Springer Netherlands, 1987. http://dx.doi.org/10.1007/978-94-009-3617-1_11.

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3

Bennemann, K. H. "Disorder in Metals—Selected Problems." In Amorphous and Liquid Materials, 200–217. Dordrecht: Springer Netherlands, 1987. http://dx.doi.org/10.1007/978-94-009-3505-1_16.

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4

Hensel, F. "Fluid Metals at High Temperatures." In Amorphous and Liquid Materials, 345–67. Dordrecht: Springer Netherlands, 1987. http://dx.doi.org/10.1007/978-94-009-3505-1_28.

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5

Lüscher, E., and G. Fritsch. "Amorphous Metals at High Pressure." In Amorphous and Liquid Materials, 391–404. Dordrecht: Springer Netherlands, 1987. http://dx.doi.org/10.1007/978-94-009-3505-1_30.

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6

Borgstedt, Hans Ulrich, and Cezary Guminski. "Solubility of Metals in the Liquid Alkali Metals; The Solubility Data Programme of the IUPAC." In Liquid Metal Systems, 297–303. Boston, MA: Springer US, 1995. http://dx.doi.org/10.1007/978-1-4615-1977-5_32.

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de Teresa, Carmen, and Jaime Keller. "High Magnetic Susceptibility Liquid Metals." In Condensed Matter Theories, 237–52. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4613-0605-4_26.

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Zimbovskaya, Nataliya A. "The Electronic Liquid of Metals." In Local Geometry of the Fermi Surface, 1–30. New York, NY: Springer New York, 2001. http://dx.doi.org/10.1007/978-1-4613-0193-6_1.

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9

Beck, H. "Electric Transport in Liquid Metals." In Amorphous Solids and the Liquid State, 281–309. Boston, MA: Springer US, 1985. http://dx.doi.org/10.1007/978-1-4757-9156-3_9.

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Mills, K. C., B. J. Monaghan, and B. J. Keene. "Thermal Conductivities of Liquid Metals." In Thermal Conductivity 23, 519–29. Boca Raton: CRC Press, 2021. http://dx.doi.org/10.1201/9781003210719-54.

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Тези доповідей конференцій з теми "Electromigration in liquid metals"

1

Pierce, James V., and Lawrence F. Shuniak. "Reduced Device Life Caused by Flux Entrapment During the Construction Process." In ISTFA 1998. ASM International, 1998. http://dx.doi.org/10.31399/asm.cp.istfa1998p0347.

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Abstract Devices that are sealed with a process using flux (all solder seals, some brazed seals some weld seals, etc.) will have residual flux entrapped. Devices with an internal construction such that areas exist where solvents can not completely clean surfaces exposed to flux vapor will also have residual flux entrapped. This entrapped flux will cause these devices to be susceptible to electromigration induced failure prior to the normal end-of-life of the device. If solder flux is trapped within a device, elevated temperature operation will shorten the life of the device. At elevated temperature, the activators in the flux will become a vapor and act as a catalyst for electromigration. Metal will be distributed across the surface between the "anode" and the "cathode" of the applied potential. The metal will be pulled from the "anode" to the "cathode". The electromigration can be stopped (or slowed) by reducing the maximum temperature the device will be exposed to when a potential is applied. If the amount of entrapped flux is not sufficient to bridge the gap between the "anode" and the "cathode" of the potential when in a non-vapor state (liquid or solid), the electromigration will be stopped when the temperature is below that needed for the flux activators to be in a vapor state. This paper contains details of this failure mode in hermetically sealed EMI filters and includes life test data (insulation resistance at elevated temperature), life reduction calculations, and photographs of the electromigration.
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2

Liu, Qingquan, and Norman C. Tien. "Design and Modeling of Liquid Gallium Contact RF MEMS Switch." In ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASMEDC, 2009. http://dx.doi.org/10.1115/mnhmt2009-18257.

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Due to the high power density and local temperature increase on nanoscopic asperities of solid metal contacts, traditional MEMS contact switches suffer from contact welding, pitting, electromigration and oxidation. Particularly, when MEMS switches are used to handle high power, solid metal contacts pose serious limitation on the contact reliability. A self-healing RF MEMS switch, which utilizes liquid gallium contacts to take the place of the traditional solid metal-to-metal contacts, is proposed in this paper. Electrostatic actuation is used to drive a silicon nitride bridge with upper electrodes. When the bridge is pulled down, liquid gallium droplets work as an interface between the upper and lower contact electrodes. The loss of the gallium droplets can be avoided due to the unwettability of the material surrounding the contact electrodes. The switch is fabricated using a surface micromachining process. A coupled-field finite element analysis (FEA) is used to model the electric current, heating and thermal conduction of the contacts. The model includes deformable gallium droplets with 4 μm base diameter. The two sides of the droplets are connected to the upper and lower solid metal contact electrodes, respectively. By using the FEA models, the electric and thermal characteristics of the gallium droplets featuring a variety of geometric parameters have been studied. 1 A current handling capability of the liquid gallium contact is verified by the FEA models.
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3

Hosokawa, S., S. Munejiri, M. Inui, Y. Kajihara, W. C. Pilgrim, A. Q. R. Baron, F. Shimojo, and K. Hoshino. "Transverse excitations in liquid metals." In 4TH INTERNATIONAL SYMPOSIUM ON SLOW DYNAMICS IN COMPLEX SYSTEMS: Keep Going Tohoku. American Institute of Physics, 2013. http://dx.doi.org/10.1063/1.4794661.

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4

Rohsenow, Warren M. "FILM CONDENSATION OF LIQUID METALS." In Archives of Heat Transfer. Washington: Hemisphere, 1988. http://dx.doi.org/10.1615/ichmt.1988.20thaht.80.

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Rohsenow, Warren M. "FILM CONDENSATION OF LIQUID METALS." In Archives of Heat Transfer. Connecticut: Begellhouse, 1988. http://dx.doi.org/10.1615/ichmt.1988.aht.80.

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BLAKE, T., and L. PARNELL. "Confined reacting jets in liquid metals." In 29th Joint Propulsion Conference and Exhibit. Reston, Virigina: American Institute of Aeronautics and Astronautics, 1993. http://dx.doi.org/10.2514/6.1993-2206.

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Levashov, Pavel R. "Equation of state for liquid metals." In Shock compression of condensed matter. AIP, 2000. http://dx.doi.org/10.1063/1.1303428.

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Reichel, Kimberly S., Ishan Joshipura, Nicolas Lozada-Smith, Rajind Mendis, Michael D. Dickey, and Daniel M. Mittleman. "Liquid metals for active terahertz waveguides." In 2017 42nd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). IEEE, 2017. http://dx.doi.org/10.1109/irmmw-thz.2017.8066889.

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Talukder, Santanu, Praveen Kumar, and Rudra Pratap. "Nanoscale patterning in ambient conditions using liquid electromigration." In SPIE Advanced Lithography, edited by Christopher Bencher and Joy Y. Cheng. SPIE, 2016. http://dx.doi.org/10.1117/12.2219024.

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10

Timsit, R. S. "Electromigration in a Liquid Bridge before Contact Break." In 2010 IEEE Holm Conference on Electrical Contacts (Holm 2010). IEEE, 2010. http://dx.doi.org/10.1109/holm.2010.5619474.

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Звіти організацій з теми "Electromigration in liquid metals"

1

Ross, M., D. Errandonea, and R. Boehler. Evidence for Liquid-Liquid Phase Transitions in the Transition Metals. Office of Scientific and Technical Information (OSTI), February 2008. http://dx.doi.org/10.2172/926433.

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2

McClelland, M., and P. Meyer. Time-dependent free convection in liquid metals. Office of Scientific and Technical Information (OSTI), September 1989. http://dx.doi.org/10.2172/5648234.

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3

Kent, E., and C. Grandy. Mutual Inductance Level Sensor for Use in Liquid Metals. Office of Scientific and Technical Information (OSTI), April 2021. http://dx.doi.org/10.2172/1886309.

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4

Rice, Stuart A. Experimental and Theoretical Studies of Liquid-Solid and Liquid-Vapor Interfaces of Metals and Alloys. Office of Scientific and Technical Information (OSTI), September 2012. http://dx.doi.org/10.2172/1052401.

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5

Natesan, K., D. L. Rink, R. Haglund, and R. W. Clark. Subtask 12E1: Compatibility of structural materials in liquid alkali metals. Office of Scientific and Technical Information (OSTI), March 1995. http://dx.doi.org/10.2172/415183.

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6

Wendt, Jost O. L. Isolation of Metals from Liquid Wastes: Reactive in Turbulent Thermal Reactors. Office of Scientific and Technical Information (OSTI), September 2001. http://dx.doi.org/10.2172/829931.

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7

Luo, Jian, and Jimmy Shi. Young Investigator Program: Quasi-Liquid Grain Boundary Films in Refractory Metals. Fort Belvoir, VA: Defense Technical Information Center, January 2010. http://dx.doi.org/10.21236/ada523019.

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8

Natesan, K., and D. L. Rink. Fabrication of aluminum nitride and its stability in liquid alkali metals. Office of Scientific and Technical Information (OSTI), April 1995. http://dx.doi.org/10.2172/115712.

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9

William Linak. Isolation of Metals from Liquid Wastes: Reactive Scavenging in Turbulent Thermal Reactors. Office of Scientific and Technical Information (OSTI), December 2004. http://dx.doi.org/10.2172/835123.

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10

Wendt, Jost O. L., William P. Linak, Alan R. Kerstein, Arne J. Pearlstein, and Alexander Scheeline. Isolation of Metals from Liquid Wastes: Reactive Scavenging in Turbulent Thermal Reactors. Office of Scientific and Technical Information (OSTI), June 1999. http://dx.doi.org/10.2172/829928.

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