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Статті в журналах з теми "Electroless plating"
SAITO, Mamoru. "Electroless Plating. Recent Trend of Electroless Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 375–79. http://dx.doi.org/10.4139/sfj.48.375.
Повний текст джерелаSun, Hua, Xiao Fei Guo, Ke Gao Liu, Hong Fang Ma, and Li Ming Feng. "Influence of Ultrasonic on the Microstructure and Properties of Electroless Plating Ni-Co-P Coating at Low Temperature." Advanced Materials Research 314-316 (August 2011): 259–62. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.259.
Повний текст джерелаHARADA, Hisashi. "Electroless Plating." Journal of the Japan Society of Colour Material 69, no. 1 (1996): 60–70. http://dx.doi.org/10.4011/shikizai1937.69.60.
Повний текст джерелаUCHIDA, Ei. "Electroless Plating. Electroless Palladium Plating and Its Applications." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 400–404. http://dx.doi.org/10.4139/sfj.48.400.
Повний текст джерелаSAKATA, Takahiro, and Hideo HONMA. "Electroless copper plating by applying electrolysis." Journal of the Surface Finishing Society of Japan 40, no. 3 (1989): 488–89. http://dx.doi.org/10.4139/sfj.40.488.
Повний текст джерелаUraz, Canan, and Tuğba Gürmen Özçelik. "ELECTROLESS METAL PLATING OVER ABS PLASTIC." E-journal of New World Sciences Academy 14, no. 2 (April 29, 2019): 63–70. http://dx.doi.org/10.12739/nwsa.2019.14.2.1a0432.
Повний текст джерелаSHIBATA, Mitsuo. "Electroless Plating. Direct Electroless Nickel Plating on Magnesium Alloys." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 413–16. http://dx.doi.org/10.4139/sfj.48.413.
Повний текст джерелаKAMIYAMA, Hiroharu. "Electroless copper plating." Circuit Technology 4, no. 6 (1989): 318–26. http://dx.doi.org/10.5104/jiep1986.4.318.
Повний текст джерелаHONMA, Hideo, Yasunori KOUCHI, and Masaaki OYAMADA. "Electroless Solder Plating." Circuit Technology 6, no. 6 (1991): 299–305. http://dx.doi.org/10.5104/jiep1986.6.6_299.
Повний текст джерелаBrown, L. D. "Electroless nickel plating." International Materials Reviews 37, no. 1 (January 1992): 196. http://dx.doi.org/10.1179/imr.1992.37.1.196.
Повний текст джерелаДисертації з теми "Electroless plating"
Garcia, Alexandre. "Ligand Induced Electroless Plating of Polymers." Palaiseau, Ecole polytechnique, 2011. https://pastel.hal.science/docs/00/64/69/62/PDF/ThA_seAGARCIA.pdf.
Повний текст джерелаThe main goal of this research project was to answer to an industrial issue: To develop a "green" process for the electroless plating of polymers without chromic acid (CrVI) etching. During this work, an alternative process based on an innovative surface coating technology (Graftfast® technology) has been developed. This technique which is working in aqueous solution and at room temperature allows to chemically graft vinylic polymers on various types of substrates. Based on this method, a poly(acrylic acid) (PAA) layer has been covalently grafted onto various polymer substrates (ABS, ABS-PC, PA, PET, PVC, PVDF. . . ). Ion exchange properties introduced in these polymer thin films were used to entrap metal salts. Once reduced into this interphase, copper particles act as catalysts of the metal layer growth by immersion into an electroless plating bath. The resulting metal layer owns mechanical and electrical properties competitive with the current industrial processes. Combined with cost-effective and innovative lithographic processes, metal patterns were obtained onto flexible and transparent substrates (PET, PVDF) at the micrometer scale. In order to answer more appropriately to the current environmental and economic constraints, this "wet" Graftfast® surface functionalization process has been replaced by an inkjet-printed and photo-assisted process. This new process also enables to produce metal patterns onto flexible substrates such as glossy papers (PVC) or transparent sheets (PET) with a micrometric resolution. These devices similarly own excellent electrical and mechanical properties and allow considering its use for applications in the microelectronic field
Noren, Martin. "Electroless Copper Plating to Achieve Solderless Connections." Thesis, Luleå tekniska universitet, Institutionen för system- och rymdteknik, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-86533.
Повний текст джерелаSullivan, Anne M. "Autocatalytic electroless gold deposition at low pH." Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/10079.
Повний текст джерелаKrishnan, Vidya. "Electroless deposition of copper for microelectronic applications." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/11752.
Повний текст джерелаShi, Zhongliang 1965. "Electroless deposited palladium membranes and nanowires." Thesis, McGill University, 2007. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=111872.
Повний текст джерелаThe investigation of deposition progress of a palladium membrane on porous stainless steel substrate illustrates that palladium deposits will form a network structure on pore areas of the substrate surface in the initial stages. A bridge model is presented to describe the formation of a membrane. This model is confirmed from the cross-section of the deposited membranes. Based on the bridge model and the experimental measurements of palladium membranes deposited on the pore area of the substrates, the thickness of a palladium membrane deposited on 0.2 mum grade porous stainless steel substrate can be effectively controlled around 1.5∼2 mum, and the thickness of a palladium membrane deposited on 2 mum grade porous Inconel substrate can be effectively controlled around 7.5∼8 mum. Comparing the thickness and quality of palladium membranes deposited on the same substrates with the data in the literature, the thicknesses of the membranes prepared in this program are lower. The obtained result will be beneficial in the design and manufacture of suitable membranes using the electroless deposition process.
In the initial deposition stages, palladium nanoparticles cannot be deposited at the surface of the SiO2 inclusions that appear at the substrate surface. With the extension of deposition time, however, palladium nanoparticles gradually cover the SiO2 inclusions layer by layer due to the advance deposited palladium nanoparticles on the steel substrate surrounding them. The effect of the SiO2 inclusions on palladium deposits cannot be neglected when an ultra-thin membrane having the thickness similar to the size of inclusions is to be built.
The chemical reaction between phosphorus (or phosphate) and palladium at high temperature can take place. This reaction causes surface damage of the membranes. If palladium membranes are built on the porous substrates that contain phosphorus or phosphate used in the inorganic binders, they cannot be used over 550°C. This result also implies that palladium membranes cannot be employed on the work environment of phosphorus or phosphates.
Palladium nanowires are well arranged by nanoparticles at the rough stainless steel surface. The formation procedures consist of 3 stages. In the initial stage, palladium nanoparticles are aligned in ore direction, then the nanowire is assembled continuously using follow-up palladium deposits, and finally the nanowire is built smoothly and homogeneously. It is also found that palladium nanoparticles generated from the autocatalytic reaction are not wetting with the steel substrate and they are not solid and easily deformed due to the interfacial tension when they connect to each other.
Various palladium nanowire arrays possessing the morphologies of single wires, parallel and curved wires, intersections and network structures are illustrated. The results demonstrate that palladium nanowires can be built in a self-assembled manner by palladium nanoparticles in the initial deposition stages. Such self-assembled nanowires may attract engineering applications because electroless deposition process and preparation of a substrate are simple and inexpensive.
The diameter of palladium nanowires can be effectively controlled by the concentration of PdCl2 in the plating solution and deposition time. The size of palladium nanoparticles generated from the autocatalytic reaction is directly dependent on the concentration of PdCl2 in the plating solution. The higher the concentration of PdCl2 in the plating solution is, the smaller the deposited palladium nanoparticles are. The experimental results provide a controllable method for the fabrication of palladium nanowire arrays with potential engineering applications.
Shemesh, Ely 1962. "TERNARY COMPLEXES OF COPPER(I), CYANIDE, AND 2,9-DIMETHYL-1,10-PHENANTHROLINE." Thesis, The University of Arizona, 1986. http://hdl.handle.net/10150/291268.
Повний текст джерелаOwen, S. A. "Corrosion resistance of electroless nickel deposits from aged and synthetic solutions." Thesis, University of Nottingham, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.311914.
Повний текст джерелаSutch, Peter John F. "Consumption and loss of formaldehyde in electroless copper plating." Master's thesis, University of Central Florida, 1993. http://digital.library.ucf.edu/cdm/ref/collection/RTD/id/21775.
Повний текст джерелаThe objectives of this research were to quantify formaldehyde consumption due to plating and parasitic reactions and determine the magnitude and distribution of formaldehyde losses from the electroless copper plating process. Plating and rinse bath samples obtained from three electroless copper plating operations were analyzed for formaldehyde and copper in order to develop a mass balance analysis about the plating bath for periods of active production and no production. Fugitive air and stack releases of formaldehyde were estimated using emission factors developed from air sampling at the three facilities. It was determined that approximately 90% of the formaldehyde added to the plating process was sonsumed by some type of chemical reaction. The remaining 10% of formaldehyde represents losses from the plating operation. For the facilities with a waste plating solution stream, atmospheric losses accounted for approximately 25% of the total losses. The mass of fugitive air formaldehyde measured approximately 2.8 times that escaping through the stack. Dragout accounted for approximately 2.3% of the losses with the remaining going to the waste stream. For the facility without a plating solution waste stream, formaldehyde losses were distributed 59% to atmospheric relases and 41% to the rinse tank. Fugitive and stack releases were approximately the same at 29% of the formaldehyde losses. Formaldehyde consumption due to parasitic reactions for periods of active plating and no plating were determined for two facilities. The rate of parasitic consumption during periods of production was found to be approximately 3 times greater than that for no production. The rate of parasitic consumption was observed to increase with increasing bath temperature.
M.S.;
Civil and Environmental Engineering;
Engineering;
Environmental Engineering;
206 p.
xii, 206 leaves, bound : ill. ; 28 cm.
Zeszut, Ronald Anthony Jr. "Effects of Transport and Additives on Electroless Copper Plating." Case Western Reserve University School of Graduate Studies / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=case1497271315649528.
Повний текст джерелаHayden, Harley T. "Enhanced Adhesion Between Electroless Copper and Advanced Substrates." Diss., Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22615.
Повний текст джерелаКниги з теми "Electroless plating"
O, Mallory Glenn, Hajdu Juan B, and American Electroplaters and Surface Finishers Society., eds. Electroless plating: Fundamentals and applications. Orlando, Fla: The Society, 1990.
Знайти повний текст джерелаAmerican Electroplaters and Surface Finishers Society, ed. Electroless plating: Fundamentals and applications. Orlando, Fla: AESF, 1990.
Знайти повний текст джерелаMasao, Matsuoka, ed. Gendai mudenkai mekki. Tōkyō-to Chūō-ku: Nikkan Kōgyō Shinbunsha, 2014.
Знайти повний текст джерелаWybrane zagadnienia procesów hezprądowego osadzania warstw niklowo-fosforowych. Warszawa: Wydawnictwa Politechniki Warszawskiej, 1985.
Знайти повний текст джерелаParkinson, Ron. Properties and applications of electroless nickel. Toronto: Nickel Development Institute, 1997.
Знайти повний текст джерелаElectroless, Nickel '93 Conference (1993 Orlando Fla ). EN Conference 93, November 10-12, 1993, Orlando Airport Marriott, Orlando, Florida: Proceedings. Cincinnati, Ohio (6600 Clough Pike, Cincinnati 45244): Gardner Publications, 1993.
Знайти повний текст джерелаElectroless, Nickel '97 (1997 Cincinnati Ohio). EN Conference 97, Electroless Nickel '97, December 8-10, 1997, Hyatt Regency, Cincinnati, Ohio: Conference proceedings. Cincinnati, Ohio: Gardner Publications, 1997.
Знайти повний текст джерелаElectroless Nickel '91 Conference (1991 Orlando, Fla.). EN Conference 91, November 20-22, 1991, Buena Vista Palace Hotel, Orlando, Florida: Proceedings. Cincinnati, Ohio (6600 Clough Pike, Cincinnati 45244): Garden Publications, 1991.
Знайти повний текст джерелаKanani, Nasser. Chemische Vernicklung: Nickel-Phosphor-Sichten : Herstellung, Eigenschaften, Anwendungen. Bad Saulgau, Germany: E.G. Leuze, 2007.
Знайти повний текст джерелаSymposium on Electroless Deposition of Metals and Alloys (1987 Honolulu, Hawaii). Proceedings of the Symposium on Electroless Deposition of Metals and Alloys. Pennington, NJ (10 S. Main St., Pennington 08534-2896): Electrochemical Society, 1988.
Знайти повний текст джерелаЧастини книг з теми "Electroless plating"
Gooch, Jan W. "Electroless Plating." In Encyclopedic Dictionary of Polymers, 259–60. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4282.
Повний текст джерелаGooch, Jan W. "Electroless Plating Equipment." In Encyclopedic Dictionary of Polymers, 260. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4283.
Повний текст джерелаBroglia, M., P. Pinacci, and A. Basile. "Membranes Prepared via Electroless Plating." In Membranes for Membrane Reactors, 315–33. Chichester, UK: John Wiley & Sons, Ltd, 2011. http://dx.doi.org/10.1002/9780470977569.ch11.
Повний текст джерелаShacham-Diamand, Yosi, Yelena Sverdlov, Stav Friedberg, and Avi Yaverboim. "Electroless Plating and Printing Technologies." In Nanomaterials for 2D and 3D Printing, 51–67. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2017. http://dx.doi.org/10.1002/9783527685790.ch3.
Повний текст джерелаSenkevich, Jay J. "ALD Seed Layers for Plating and Electroless Plating." In Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, 169–79. New York, NY: Springer New York, 2009. http://dx.doi.org/10.1007/978-0-387-95868-2_12.
Повний текст джерелаViswanathan, B. "Metallization of Plastics by Electroless Plating." In Microwave Materials, 79–99. Berlin, Heidelberg: Springer Berlin Heidelberg, 1994. http://dx.doi.org/10.1007/978-3-662-08740-4_3.
Повний текст джерелаWen, G., Z. X. Guo, and C. K. L. Davies. "Direct Electroless Plating of ZrO2 Powder." In Ceramics - Processing, Reliability, Tribology and Wear, 318–23. Weinheim, FRG: Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527607293.ch54.
Повний текст джерелаMatsumura, Sowjun, and Ju Sheng Ma. "Properties of Electroless Nickel Composite Plating Film." In Materials Science Forum, 1877–80. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.1877.
Повний текст джерелаOlberding, W. "An Introduction to Electrodeposition and Electroless Plating Processes." In Modern Surface Technology, 101–18. Weinheim, FRG: Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527608818.ch7.
Повний текст джерелаMahmoudi, Hacene. "Water Recycling in Electroless Plating by Membrane Operations." In Encyclopedia of Membranes, 1999–2000. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-662-44324-8_1971.
Повний текст джерелаТези доповідей конференцій з теми "Electroless plating"
Ebdon, Paul R. "Electroless Nickel/IPTFE Composites." In Annual Aerospace/Airline Plating and Metal Finishing Forum and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1988. http://dx.doi.org/10.4271/880875.
Повний текст джерелаRains, Aaron E., and Ronald A. Kline. "Real time monitoring of electroless nickel plating." In REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: VOLUME 32. AIP, 2013. http://dx.doi.org/10.1063/1.4789211.
Повний текст джерелаNanzi Fan, Mingliang Huang, and Lai Wang. "Electroless nickel-boron plating on magnesium alloy." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582328.
Повний текст джерелаYukun, Ren, Ao Hongrui, Jiang Hongyuan, Tao Ye, and Li Shanshan. "Dielectrophoresis of Electroless Gold Plating Polystyrene Microspheres." In 2011 International Conference on Measuring Technology and Mechatronics Automation (ICMTMA). IEEE, 2011. http://dx.doi.org/10.1109/icmtma.2011.269.
Повний текст джерелаWang, Xu, Cheng Zhang, and Hongqiang Zhou. "Effect of additives on electroless silver plating." In 2016 6th International Conference on Machinery, Materials, Environment, Biotechnology and Computer. Paris, France: Atlantis Press, 2016. http://dx.doi.org/10.2991/mmebc-16.2016.232.
Повний текст джерелаYang, Ching-Yun, Han-Tang Hung, and C. Robert Kao. "Effects of plating conditions on electroless Ni-P plating in the microchannel." In 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). IEEE, 2018. http://dx.doi.org/10.23919/icep.2018.8374673.
Повний текст джерелаWestby, Philip, Kevin Mattson, Fred Haring, Jacob Baer, Matt Steele, Syed Sajid Ahmad, and Aaron Reinholz. "Electroless Nickel Plating Process Optimization for Aluminum Terminals." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89131.
Повний текст джерелаLitchfield, R. E., J. Graves, M. Sugden, D. A. Hutt, and A. Cobley. "Functionalised copper nanoparticles as catalysts for electroless plating." In 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). IEEE, 2014. http://dx.doi.org/10.1109/eptc.2014.7028381.
Повний текст джерелаFolkman, Steven L., and Michael Stevens. "Characterization of electroless nickel plating on aluminum mirrors." In International Symposium on Optical Science and Technology, edited by Alson E. Hatheway. SPIE, 2002. http://dx.doi.org/10.1117/12.482167.
Повний текст джерелаSu, Xingsong, Lifei Lai, Chang Li, Wenjun Liu, Xian-Zhu Fu, Rong Sun, and C. P. Wong. "Electroless plating alloy thin-film embedded resistor materials." In 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2015. http://dx.doi.org/10.1109/icept.2015.7236584.
Повний текст джерелаЗвіти організацій з теми "Electroless plating"
Stencel, Nick, and Joyce O'Donnell. Electrolytic Regeneration of Contaminated Electroless Nickel Plating Baths. Fort Belvoir, VA: Defense Technical Information Center, August 1995. http://dx.doi.org/10.21236/ada350616.
Повний текст джерелаDavis, J. S. Waste Reduction for Electroless Nickel Plating Solutions at U.S. Army Depots. Fort Belvoir, VA: Defense Technical Information Center, June 1992. http://dx.doi.org/10.21236/ada253404.
Повний текст джерелаIlias, Shamsuddin, and Dhananjay Kumar. Fabrication of Pd/Pd-Alloy Films by Surfactant Induced Electroless Plating for Hydrogen Separation from Advanced Coal Gasification Processes. Office of Scientific and Technical Information (OSTI), July 2012. http://dx.doi.org/10.2172/1080430.
Повний текст джерела