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Добірка наукової літератури з теми "Electrical boards"

Автор: Grafiati

Опубліковано: 30 травня 2022

Оновлено: 31 травня 2022

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Статті в журналах з теми "Electrical boards"

Moosavi, S. M. R., and A. Sadeghi-Niaraki. "A SURVEY OF SMART ELECTRICAL BOARDS IN UBIQUITOUS SENSOR NETWORKS FOR GEOMATICS APPLICATIONS." ISPRS - International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences XL-1-W5 (December 11, 2015): 503–7. http://dx.doi.org/10.5194/isprsarchives-xl-1-w5-503-2015.

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Nowadays more advanced sensor networks in various fields are developed. There are lots of online sensors spreading around the world. Sensor networks have been used in Geospatial Information Systems (GIS) since sensor networks have expanded. Health monitoring, environmental monitoring, traffic monitoring, etc, are the examples of its applications in Geomatics. Sensor network is an infrastructure comprised of sensing (measuring), computing, and communication elements that gives an administrator the ability to instrument, observe, and react to events and phenomena in a specified environment. This paper describes about development boards which can be used in sensor networks and their applications in Geomatics and their role in wireless sensor networks and also a comparison between various types of boards. Boards that are discussed in this paper are Arduino, Raspberry Pi, Beagle board, Cubieboard. The Boards because of their great potential are also known as single board computers. This paper is organized in four phases: First, Reviewing on ubiquitous computing and sensor networks. Second, introducing of some electrical boards. Then, defining some criterions for comparison. Finally, comparing the Ubiquitous boards.

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Preston, I. M. H. "Availability of electrical power." Proceedings of the Royal Society of Edinburgh. Section B. Biological Sciences 92, no. 1-2 (1987): 91–106. http://dx.doi.org/10.1017/s0269727000009556.

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SynopsisThe organisation of the generation and supply of electricity in Scotland by the South of Scotland Electricity Board and the North of Scotland Hydro Electric Board is detailed and differences from the other nationalised energy industries in Scotland and from the arrangements for the supply of electricity in England and Wales noted. The present plant position is described and the flexibility in the fuels used underlined. The experiences of the last thirty years are analysed and an account given of the response of the Boards to the crises of dramatic oil price increases and the 1984/85 dispute in the coal industry. Attention is given to the forward planning problems arising from the long construction time of a new station and the delays that may be involved with public inquiries. The opportunities for exporting power to England after the modest anticipated rises in Scottish demands are met are cited as a factor in the budgetting. The difficulties the Combined Heat and Power projects, being studied for a number of major cities including Edinburgh, present to the Boards are listed. Finally the implications for suppliers and contractors of the necessary replacement before the end of the century of equipment associated with the distribution system are noted.

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Traut, G. R. "Electrical performance of microwave boards." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B 18, no. 1 (1995): 106–11. http://dx.doi.org/10.1109/96.365496.

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Dils, Werft, Walter, Zwanzig, von Krshiwoblozki, and Schneider-Ramelow. "Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads." Materials 12, no. 21 (November 1, 2019): 3599. http://dx.doi.org/10.3390/ma12213599.

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In the last decade, interest in stretchable electronic systems that can be bent or shaped three-dimensionally has increased. The application of these systems is that they differentiate between two states and derive there from the requirements for the materials used: once formed, but static or permanently flexible. For this purpose, new materials that exceed the limited mechanical properties of thin metal layers as the typical printed circuit board conductor materials have recently gained the interest of research. In this work, novel electrically conductive textiles were used as conductor materials for stretchable circuit boards. Three different fabrics (woven, knitted and nonwoven) made of silver-plated polyamide fibers were investigated for their mechanical and electrical behavior under quasi-static and cyclic mechanical loads with simultaneous monitoring of the electrical resistance. Thereto, the electrically conductive textiles were embedded into a thermoplastic polyurethane dielectric matrix and structured by laser cutting into stretchable conductors. Based on the characterization of the mechanical and electrical material behavior, a life expectancy was derived. The results are compared with previously investigated stretchable circuit boards based on thermoplastic elastomer and meander-shaped conductor tracks made of copper foils. The microstructural changes in the material caused by the applied mechanical loads were analyzed and are discussed in detail to provide a deep understanding of failure mechanisms.

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Okude, Satoshi, M. Okamoto, Y. Sano, N. Ueta, and O. Nakao. "Ultrathin WLP Die Embedded Polyimide Multi-Layer Wiring Board." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (January 1, 2011): 001071–104. http://dx.doi.org/10.4071/2011dpc-tp34.

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We have developed an ultrathin IC-embedded polyimide multi-layer wiring board utilizing a wafer level packaging (WLP) technology. The IC die is wafer level packaged with no solder bump (i.e. just copper land), thinned less than 100 micron and then sandwiched between multi-layer printed wiring boards composed of thin polyimide films with the thickness of several tens of microns used in standard flex boards. Therefore, the realized embedded board has a very thin structure, e.g. the thickness of a 4 layers board with 1 die embedded is 220 micron. For the electrical connection between circuit layers including redistribution layer of the embedded die, the means employed in our standard wiring board process is applied. The electrical connection is made by the conductive paste, which consists of several kinds of metal filler and resin adhesive and makes alloy between copper of circuit layer thorough pressing and heating processes. The alloying feature of the paste assures the robustness of the connection. The reliability of the board under several environmental test conditions has been confirmed so far, however, the board performance under bending stress was unclear. The realized board is still flexible and bendable to some extent, although the board has higher stiffness than standard flex board owing to its multi-layer structure. To confirm whether this feature affect on the board's performance or not, we have investigated the performance of the embedded board under the condition that the bending stress is applied to the die embedded die. The experimental results show no significant change due to the bending stress and the high durability against bending is confirmed.

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Jayaprasad, G., P. P. Dhanlakshmi, and S. Hemachandran. "Analysis of electrical discontinuity problem in MLB using Ishikawa model." Circuit World 42, no. 4 (November 7, 2016): 201–6. http://dx.doi.org/10.1108/cw-08-2016-0036.

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Purpose The purpose of this study/paper is regarding analysis of electrical discontinuity in penultimate layer of a few batches of Multilayer Boards (MLB) fabricated and supplied by a vendor. The ever-increasing demand of miniaturization in launch vehicle and spacecraft electronics systems has led to the usage of multilayer printed circuit boards (PCBs) for realizing high-performance electronics circuitry. Multilayer boards (MLBs) fabricated by qualified agencies based on the customer requirement are being used in the critical launch vehicle/spacecraft systems after evaluating the preliminary test results supplied by the vendor. However, a few batches of MLBs fabricated and supplied by a particular vendor (“A”) showed a discontinuity problem in a few PCB tracks connected by soldering pads. As these MLBs are part of Flight critical systems of both launch vehicle and spacecraft, a malfunction in the board may lead to fatal errors during fight or on-orbit, thereby jeopardizing the mission. Design/methodology/approach A systematic approach was followed to have a thorough understanding of the problem, and major tests such as inspection, continuity measurement, microsection of the plated through hole (PTH) and Scanning Electron Microscopy–Energy Dispersive X-ray Analysis tests were conducted on identified test boards based on Ishikawa model. Emphasis was given for horizontal microsection, as it has got a clear edge in detecting defects at any point of PTH barrel to inner-layer copper interface. Findings Systematic testing and evaluation on specimen revealed the presence of unwanted material at the bonding area of inner-layer copper and PTH copper due to inadequate fabrication process. The un-cleaned epoxy materials present at the bonding area creates a weak bond between barrel and inner-layer copper. Electrical strength of the MLB is the strength of this link. This weaker interconnection leads to electrical discontinuity of inner-layer tracks. Originality/value MLBs are part of Flight critical systems of both Launch Vehicle and Spacecraft; a malfunction in the board may lead to fatal errors during fight or on-orbit, thereby jeopardizing the mission. Case study of an original failure observed in MLBs helped to achieve normal functioning of systems and avoided failures at later stage of mission.

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KOBAYASHI, Tadashi. "Electrical Inspection of Printed Wiring Boards." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11, no. 4 (1996): 251–56. http://dx.doi.org/10.5104/jiep1995.11.251.

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Sung, Taehyun, Sue A. Bidstrup Allen, and Paul A. Kohl. "Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave Processing." Journal of Microelectronics and Electronic Packaging 2, no. 2 (April 1, 2005): 142–54. http://dx.doi.org/10.4071/1551-4897-2.2.142.

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The curing of polymer dielectrics on organic laminates by variable frequency microwave (VFM) processing was studied. Polymer dielectrics, such as polyimides, normally require long cure times at elevated temperatures resulting in processing incompatibility with epoxy-based laminates due to the low thermal stability of the organic laminates. In this study, VFM processing was investigated as an alternative, low temperature technique for curing polyimide and benzycyclobutene (BCB) on metallized bismaleimide triazine/epoxy (BT) board. The VFM heating characteristics of the metallized (BT) boards were studied. The VFM heating rates of the BT boards strongly depended on the configuration, size, and shape of the copper patterns on the boards. The VFM curing of polyimide and BCB on the metallized BT boards was also performed. The curing condition was optimized to minimize board degradation. At the same board degradation level, the chemical, thermo-mechanical and electrical properties of the VFM cured film were compared with a film thermally cured using a conventional convection furnace. A higher degree of curing and lower dielectric constant was achieved for benzocyclobutene (BCB) films on BT boards processed using VFM curing than was obtained using conventional curing. VFM cured polyimide (PI 2611) showed a similar degree of curing and Young's modulus to conventionally cured PI 2611. However, the VFM cured PI 2611 showed a higher residual content solvent and a higher dielectric constant than conventionally cured PI 2611.

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Abdelmalik, Abdelghaffar, M. I. Muhammed, A. B. Muhammad, A. Ismaila, and A. Aliyu. "INFRARED THERMOGRAPHIC INSPECTION OF ELECTRICAL JUNCTIONS IN SOME ELECTRICITY DISTRIBUTION FACILITIES IN AHMADU BELLO UNIVERSITY." FUDMA JOURNAL OF SCIENCES 4, no. 2 (July 1, 2020): 46–52. http://dx.doi.org/10.33003/fjs-2020-0402-149.

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Electrical or insulation failure is usually accompanied by two major events among others; production of acoustic pulses (sound) and an increase in temperature owing to heating. These lead to costly energy dissipation. Distribution boards are elementary necessities in any electrical wiring but overheating at the junctions can result in serious energy loss and eventual fire outbreak. There are several methods and techniques used in monitoring and assessing the state of power equipment and components in the electricity network. One of such techniques is Infrared thermography (IRT). An average temperature of 92.4°C and 33.7°C were recorded on the three-phase distribution board for the building during the peak and off-peak periods respectively. The inspection of the distribution boards in the Physics Department building of Ahmadu Bello University, Zaria, using thermal imaging camera, revealed excessive heating at the three-phase distribution board during peak hours, leading to Ohmic loss. The dissipated energy during the peak period ranges from 665 W/m2 to 1.5 kW/m2. The heating resulted in an average energy loss of about 1 kW/m2. The energy loss at the junctions may have, among other factors, contributed to the high electricity billing at the university.

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Sedlář, Tomáš, and Tibor Bachorec. "Multiphysical Simulations Help to Ensure Assembled Printed Circuit Board and Power Components Reliability." TRANSACTIONS ON ELECTRICAL ENGINEERING 8, no. 1 (March 30, 2020): 1–3. http://dx.doi.org/10.14311/tee.2019.1.001.

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Higher integration and reduced dimensions of components and printed circuit boards lead to rise of demands in precise design of electrical system. Numerical simulation enables designer to spot and repair errors in the electrical system without expensive prototyping and measuring. The paper summarizes possibilities of multiphysical analysis focused on problems with printed circuit boards and electrical power components with software ANSYS.

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Дисертації з теми "Electrical boards"

Radojicic, Marko L. M. "Aspects of electromagnetic interference on printed circuit boards." Thesis, University of Ottawa (Canada), 1990. http://hdl.handle.net/10393/5873.

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General guidelines for the design of printed circuit boards have been developed for two important aspects of electromagnetic compatibility: cross-talk and radiated emissions. Numerical methods were used to study the cross-talk between tracks of several common printed circuit board technologies. Design recommendations are suggested that minimize the cross-talk on printed circuit boards. A simple model was developed to predict radiated emissions from complicated circuits on printed circuit boards. The concepts of ground impedance and common-mode currents were used to build a model which gives fast and accurate predictions. The technique was tested using a method of moments program.

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Mata, Milton E. "MIDS universal interface for the selection of link 16 messages." Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 2002. http://sirsi.nps.navy.mil/uhtbin/hyperion-image/02Mar%5FMata.pdf.

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Williams, Harel M. (Harel Michael). "DomeView : community-based digital bulliten boards and mobile phone interaction." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/42126.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007.
Includes bibliographical references (leaves 60-61).
Our thesis is that a networked public display/kiosk system, that provides information for a local community, functions best when it is decentralized and interactive. We deployed such a system at MIT that has two aspects, DomeView for distributed decentralized display and content distribution, and PhoneView for enhanced user consumption of that content. PhoneView is an implementation that we propose to solve a number of issues with current interactive public kiosk deployments, as well as enables scenarios of enhanced interactions. By using the Hands-Free Bluetooth profile as the basis for the communication between a mobile phone and a kiosk, we provide an enhanced personalized interaction for all passersby with Bluetooth-enabled mobile phones, without requiring the installation of custom software. Some examples include the ability to remotely control a kiosk, exchange calendar and contact data with the kiosk, and play games on a kiosk with other users via one's mobile phone. By removing the software installation barrier and providing new mechanisms of public interaction, this implementation is ripe for wide-spread and immediate adoption across multiple public kiosk platforms.
by Harel M. Williams.
M.Eng.

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Ghazizadeh, Ali. "Optimum mounting of electronic circuit boards for components and circuits survivability." Thesis, University of Ottawa (Canada), 1994. http://hdl.handle.net/10393/6936.

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Electronic circuit boards are employed in demanding environments (e.g. satellite, aerospace, marine, automobile, etc.) where the board and mounted components are exposed to vibration of varying amplitude and frequencies. Optimum mounting and component placement to reduce the effect of vibration on the equipment may prolong the service life of the system and reduce costly down time. Electronic boards are often mounted on four rigid support legs. Their vibration is a function of the location of the support legs, and board physical specifications such as length, width, weight, and placement of the components mounted on them. In this study, plate vibration analysis is employed to find the board's free vibration. With the help of nonlinear optimization methods, optimum mounting of circuit boards are investigated. Square board has a better performance than any other board shape. A table of suitable support points will be introduced outlining optimum support points for eight rectangular shapes. For each of these shapes a graph of unsuitable regions is provided to help the designer to avoid placing delicate components over those regions of the plate. Furthermore, the tabulated results can eliminate the need for optimization in non-critical circuit boards or determine a good starting point for optimization. (Abstract shortened by UMI.)

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Strusevich, Nadezhda. "Numerical modelling of electrodeposition process for printed circuit boards manufacturing." Thesis, University of Greenwich, 2013. http://gala.gre.ac.uk/10214/.

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Printed circuit boards (PCBs) are used extensively in electronic products to connect assembled components within a system. The so-called vertical interconnect access (via) is a vertical hole or cavity in the PCB filled with metal to facilitate conductivity. The current trend, particularly for high technology products (e.g., 3D packaging), is to manufacture PCBs with high aspect ratio (AR) vias. Typically, the size of such a via is at the micrometer scale (this is why they are termed micro-vias). The most widely used technique for manufacturing micro-vias is electrodeposition of metal (e.g., copper), where the PCB is immersed into a plating cell filled with an electrolyte solution. Using standard conditions, electrodeposition usually does not produce micro-vias with the required quality. This is due to a lack of copper ion transport into the via. This has lead to studies of various ways of enhancing the ion transport. This thesis documents the results from a modelling study into the electrodeposition processes for fabricating high aspect ratio micro-vias. This includes basic electrodeposition and techniques that enhance ion transport such as forced convection (using a pump) and acoustic streaming (using transducers). In this work, a novel numerical method for explicitly tracking the interface between the deposited metal and the electrolyte is implemented and validated under the conditions of basic electrodeposition using experimental data. Results from a parametric study have established a set of design rules for micro-vias fabrication. When ion transport is enhanced by forced convection (e.g., pumping) in the plating cell, we apply a multi-scale modelling methodology that provides interaction between models at the macro level (the plating cell) and the micro level (the interior of a via). Numerical simulations can then be used to verify how ion transport into the micro-via is improved. These results can then be used to identify process conditions for the plating cell which will result in the required flow behaviour at the micro-via. Megasonic agitation can also be used to enhance electrolyte convection in the plating cell. This is achieved by placing megasonic transducers into the plating cell. This leads to several phenomena, one of which is known as the acoustic streaming. Models have been developed for predicting megasonic agitation both at the macro and micro-scales, and a number of designs have been investigated for both open and blind micro-vias.

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Cho, Sang-Yeon. "High speed optical interconnection on electrical boards using embedded OE devices in polymer optical waveguides." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/14881.

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Khan, Raouf Lawrence. "Finite element method applied to modelling electromagnetic interference and compatibility problems on printed circuit boards." Thesis, University of Ottawa (Canada), 1990. http://hdl.handle.net/10393/5676.

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The finite element method is applied to compute the distributed capacitance and inductance matrices for multilayered dielectric, planar transmission media. The analysis involves the solution of the Laplace equation in two dimensions for multiconductor configurations in microstrip, triplate, or TEM Cell configurations of arbitrary cross section and utilizes a unique node allocation algorithm for automatic generation of the finite element mesh. The advantages, disadvantages, and difficulties encountered in application of the FEM for this problem are outlined and discussed. Several programs, based on multiconductor transmission line theory, are developed for application to Electromagnetic Interference and Compatibility (EMI/C) problems for crosstalk and radiated emission analysis. To verify the model experimentally, a simple printed circuit board consisting of five parallel conductors in microstrip configuration was constructed and measured in both time domain and frequency domains. Radiation model results are compared for a multiconductor configuration with numerical results obtained using the Numerical Electromagnetics Code (NEC) moment method program.

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Wei, Zishan. "Reliability quantification of printed circuit boards subjected to thermal and vibration loads." Diss., The University of Arizona, 2005. http://hdl.handle.net/10150/280758.

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Reliability quantification is one of the most important tasks in Reliability Engineering. During the design, development, and operational phase, this information can be very valuable to the product's designers, and users. The designers can use it to guide their design, find the design's weak points. Users can use it to setup maintenance plans and schedule. PCBs, as the major building block of electronic equipment, have been widely used in modern complex systems, such as aircraft, automotives, laptop computers, etc. Its reliability plays a vital role in the whole system's reliability. Thus, effective and accurate quantification of PCB's reliability becomes very essential to the whole electronic system's reliability quantification. Random vibration and thermal cycling are two common environments experienced by PCB's. As a result, quantifying the reliability of a PCB under these two environments becomes necessary. Currently, in industry, the commonly used methods to quantify the reliability of a PCB are the MIL-HDBK-217 and Bellcore type methods. However, the lack of accuracy and slow pace of updating the databases have limited the usage of these methods. In this dissertation, a Modified Stress-Strength Interference (MSSI) method is proposed to quantify the reliability of a PCB. In this method, not only the stress and the strength are assumed to be distributed, but also is the mean value of the strength, so that both the initial designed-in reliability and the reliability at any time can be quantified. Based on this method, a reliability quantification model for the PCB is developed. In this model, a PCB is divided into three parts: i.e., board, interconnects, and parts and modules mounted on the board. Seven (7) failure modes related to the board and the interconnects, and one (1) failure mode related to the module have been investigated. The dependence between these failure modes is studied and incorporated into the reliability quantification model. A three-step popcorn effect reliability quantification model is also proposed by means of considering the failure mechanism of the popcorn effect. Finally, a comprehensive example is given to demonstrate the usage of the methodology proposed in this dissertation.

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Aguirre, Gerardo 1960. "Methodologies for modeling radiated emissions from printed circuit boards and packaged electronic systems." Diss., The University of Arizona, 1996. http://hdl.handle.net/10150/282256.

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A two-step methodology for predicting the radiated fields from lines radiating in the presence of conductor-backed substrates is presented. The method employs the use of transmission line theory to find the current distributions on the lines forming the interconnects of a circuit. These currents are used to evaluate the far-fields of the circuit through the use of dipole theory and superposition. The method was tested and validated by comparison to full-wave models. Investigations established that radiation from common-mode currents, which are not accounted for by the circuit analysis, are found to be dominated by the radiation due to differential mode currents, and thus EMI prediction based on the two-step methodology is found to have good engineering accuracy. A full-wave method based on the Finite-Difference Time-Domain (FDTD) is presented for the evaluation of radiation from structures of such geometrical complexity that the transmission line model is not applicable. The Perfectly Matched Layer truncation scheme is implemented in the FDTD and investigated for radiating structures found in printed circuit boards (PCBs). Proximity effects of the PML dictate careful attention to the proper implementation of this absorbing boundary condition. Also, the FDTD subcell model for thin wires is investigated for modelling thin microstrip interconnect lines. To evaluate the far-fields from radiating structures found in multilayer electronic packages, a novel near-to-far field transform at a single frequency is developed and implemented for sources in stratified medium. This transform is validated and investigated with regard to PML and structure proximity. The near-to-far field transform is also implemented in a methodology for obtaining the radiated emissions from a radiating structure. This methodology is used to address important concerns regarding the grounding of heat sinks, "floating" conducting planes, and the electromagnetic behavior of split ground planes.

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Arkeholt, Simon. "Induction in Printed Circuit Boards using Magnetic Near-Field Transmissions." Thesis, Linköpings universitet, Teoretisk Fysik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-148788.

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In 1865 Maxwell outlined the theoretical framework for electromagnetic field propagation. Since then many important developments have been made in the field, with an emphasis on systems using high frequencies for long-range interactions. It was not until recent years that applications based on short-range inductive coupling demonstrated the advantages of using low frequency transmissions with magnetic fields to transfer power and information. This thesis investigates magnetic transmissions in the near-field and the possibility of producing induced voltages in printed circuit boards. A near-field magnetic induction system is designed to generate a magnetic flux in the very low frequency region, and used experimentally to evaluate circuit board induction in several interesting environments. The resulting voltages are measured with digital signal processing techniques, using Welch’s method to estimate the spectrum of the received voltage signal. The results show that the amount of induced voltage is proportional to the inverse cube of the transmission distance, and that the system is able to achieve a maximum induced voltage of 65 \micro V at a distance of 2.5 m and under line-of-sight conditions. It is also concluded that conductive obstructions, electromagnetic shielding and background noise all have a large impact on the obtained voltage, either cancelling the signal or causing it to fluctuate.

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Книги з теми "Electrical boards"

Ehrenstrom, William A. International space station Alpha remote manipulator system workstation control test report. [Washington, D.C.]: National Aeronautics and Space Administration, 1994.

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Ehrenstrom, William A. International space station Alpha remote manipulator system workstation control test report. [Washington, D.C.]: National Aeronautics and Space Administration, 1994.

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Division, Nebraska State Electrical. State Electrical Act and State Electrical Board rules. Lincoln, Neb: State Electrical Division, 2005.

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S, Maloney Elbert, ed. Your boat's electrical system. 2nd ed. New York, N.Y: Hearst Marine Books, 1988.

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Payne, Peter L. A simple guide to certain civil, electrical and economic questions involved in hydro-electric developments. Aberdeen: Aberdeen University Press, 1988.

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Martin, Thomas Commerford. Electrical boats and navigation. 2nd ed. Portland, Or: Boat House, 2002.

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Colorado. Dept. of Regulatory Agencies. Office of Policy, Research, and Regulatory Reform. 2009 sunset review---State Electrical Board. Denver, CO: Dept. of Regulatory Agencies, 2009.

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Colorado. Dept. of Regulatory Agencies. Office of Policy and Research. Colorado Electrical Board: 2000 sunset review. [Denver, Colo.] (1560 Broadway, Suite 1550, Denver 80202): The Office, 2000.

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Colorado. Dept. of Regulatory Agencies. Office of Policy and Research. 1997 sunset review, State Electrical Board. [Denver, Colo.]: The Office, 1997.

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Alaska. Board of Electrical Examiners: Statutes and regulations. Juneau, Alaska: Alaska Dept. of Commerce and Economic Development, Division of Occupational Licensing, 1989.

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Частини книг з теми "Electrical boards"

Cincotti, Alessandro. "Synchronized Triomineering on Rectangular Boards." In Lecture Notes in Electrical Engineering, 81–89. Dordrecht: Springer Netherlands, 2012. http://dx.doi.org/10.1007/978-94-007-5651-9_6.

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Arrabito, Giuseppe, Christian Falconi, Vito Errico, and Weihua Han. "Zinc Oxide Nanowires on Printed Circuit Boards." In Lecture Notes in Electrical Engineering, 271–75. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-09617-9_48.

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Vidhyotma and Jaiteg Singh. "Comparative Analysis of Existing Latest Microcontroller Development Boards." In Lecture Notes in Electrical Engineering, 1011–25. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-5802-9_88.

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Griese, Elmar, Detlef Krabe, and Engelbert Strake. "Electrical-Optical Printed Circuit Boards: Technology - Design - Modeling." In Interconnects in VLSI Design, 221–36. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/978-1-4615-4349-7_18.

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Laxmi and Rajesh Mehra. "Thermal Imaging-Based Fault Diagnosis of Electronics Circuit Boards." In Lecture Notes in Electrical Engineering, 111–21. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-1476-7_11.

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Grasso, James. "Electrical Testing of Bare Fine Pitch Printed Circuit Boards." In Handbook of Fine Pitch Surface Mount Technology, 567–97. Boston, MA: Springer US, 1994. http://dx.doi.org/10.1007/978-1-4684-1437-0_20.

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Qiu, Yang, Zhijie Ai, Ye Lin, Zhezhuang Xu, and Xinxiang Liu. "Detecting Defects of Wooden Boards by Improved YOLOv4-tiny Algorithm." In Lecture Notes in Electrical Engineering, 519–27. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-6320-8_53.

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Liu, Chenyang, Lijiang Huo, Yu Zhao, and Yin Shang. "Experimental Study on Moisture-Proof Coating for Corrugated Boards and Boxes." In Lecture Notes in Electrical Engineering, 411–15. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-1864-5_57.

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Lin, Xueyan, Yongsheng Zhou, and Xin An. "Influence of Via Stubs on Signal Integrity of Multi-layer PCB Boards." In Lecture Notes in Electrical Engineering, 1340–52. Singapore: Springer Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-1528-4_136.

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Pranav, M., S. Nithin, and N. Guruprasad. "A Comparison of Warnsdorff’s Rule and Backtracking for Knight’s Tour on Square Boards." In Lecture Notes in Electrical Engineering, 171–85. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-5802-9_16.

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Тези доповідей конференцій з теми "Electrical boards"

Karagrigoriou, Fotini S., Panagiotis I. Mouzakitis, John D. Koustellis, Emmanuel I. Koufakis, and Constantinos G. Karagiannopoulos. "Consumed Electrical Power in Fuse Cases of Low Voltage Electrical Boards." In Power and Energy Systems. Calgary,AB,Canada: ACTAPRESS, 2011. http://dx.doi.org/10.2316/p.2011.714-109.

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Pan Wang and Qinfen Hao. "Silica-microfiber-based opto-electrical printed circuit boards for board-level optical interconnects." In 2014 IEEE Optical Interconnects Conference (OI). IEEE, 2014. http://dx.doi.org/10.1109/oic.2014.6886067.

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Kisiel, Ryszard. "Polymers for electrical connections in printed circuit boards." In SPIE Proceedings, edited by Ryszard S. Romaniuk. SPIE, 2006. http://dx.doi.org/10.1117/12.714551.

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DeMaria, L., and N. C. Pistoni. "Optical and Electrical Characterization of A Voltage Sensor Prototype for Electric Boards." In 2015 Fotonica AEIT Italian Conference on Photonics Technologies. Institution of Engineering and Technology, 2015. http://dx.doi.org/10.1049/cp.2015.0190.

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Lowndes, R., I. Cotton, C. Emersic, S. Rowland, and R. Freer. "Thermal stresses of conformal coatings on printed circuit boards." In 2015 IEEE Electrical Insulation Conference. IEEE, 2015. http://dx.doi.org/10.1109/icacact.2014.7223585.

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Juhana, Agus, Rahadian Yusuf, Ary Setijadi Prihatmanto, and Ade Gafar Abdullah. "Basic Electrical Installation Trainer Boards : Virtual Reality based Laboratory for Electrical Basic Education." In 2020 6th International Conference on Interactive Digital Media (ICIDM). IEEE, 2020. http://dx.doi.org/10.1109/icidm51048.2020.9339681.

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Zeynali, Ehsan, Ryan Bridges, and Behzad Kordi. "Investigation of Partial Discharge in Aircraft Conformally-Coated Printed Circuit Boards." In 2019 IEEE Electrical Insulation Conference (EIC). IEEE, 2019. http://dx.doi.org/10.1109/eic43217.2019.9046586.

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Cassiago, Cristina, Marco Sellone, and Luca Callegaro. "Characterization of ADC boards for application in ac electrical metrology setups." In 2014 Conference on Precision Electromagnetic Measurements (CPEM 2014). IEEE, 2014. http://dx.doi.org/10.1109/cpem.2014.6898475.

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Zundel, J., T. Krivec, Q. Tao, M. Frewein, and S. Stojanovic. "Panel Level Warpage Simulation of Printed Circuit Boards comprising electrical components." In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2020. http://dx.doi.org/10.1109/eurosime48426.2020.9152666.

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George-Andrei, Ursan, Plopa Olga, and Ursan Maria. "Simulation of Electrical Circuits Using Data Acquisition Boards for Online Education." In 2020 International Conference and Exposition on Electrical And Power Engineering (EPE). IEEE, 2020. http://dx.doi.org/10.1109/epe50722.2020.9305613.

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Звіти організацій з теми "Electrical boards"

Glass, Jim, Alexander M. Melin, Michael R. Starke, and Ben Ollis. Chattanooga Electric Power Board Case Study Distribution Automation. Office of Scientific and Technical Information (OSTI), October 2016. http://dx.doi.org/10.2172/1329733.

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Pratt, Joesph W., Leonard E. Klebanoff, Karina Munoz-Ramos, Abbas A. Akhil, Dita B. Curgus, and Benjamin L. Schenkman. Proton Exchange Membrane Fuel Cells for Electrical Power Generation On-Board Commercial Airplanes. Office of Scientific and Technical Information (OSTI), May 2011. http://dx.doi.org/10.2172/1219354.

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Curgus, Dita Brigitte, Karina Munoz-Ramos, Joseph William Pratt, Abbas Ali Akhil, Leonard E. Klebanoff, and Benjamin L. Schenkman. Proton exchange membrane fuel cells for electrical power generation on-board commercial airplanes. Office of Scientific and Technical Information (OSTI), May 2011. http://dx.doi.org/10.2172/1018476.

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Starke, Michael, Ben Ollis, Jim Glass, Alex Melin, Guodong Liu, and Isha Sharma. Analysis of Electric Power Board of Chattanooga Smart Grid Investment. Office of Scientific and Technical Information (OSTI), June 2017. http://dx.doi.org/10.2172/1376469.

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Nowak, D. A one-wire'' battery monitoring system with applications to on-board charging for electric vehicles. Office of Scientific and Technical Information (OSTI), October 1990. http://dx.doi.org/10.2172/6281988.

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Isakson, K., and A. L. Vessell. An assessment of alternatives for replacing Freon 113 in bench type electrical circuit board cleaning at Fermi National Accelerator Laboratory. Office of Scientific and Technical Information (OSTI), July 1994. http://dx.doi.org/10.2172/10170238.

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Weinschenk, Craig, Daniel Madrzykowski, and Paul Courtney. Impact of Flashover Fire Conditions on Exposed Energized Electrical Cords and Cables. UL Firefighter Safety Research Institute, October 2019. http://dx.doi.org/10.54206/102376/hdmn5904.

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Анотація:

A set of experiments was conducted to expose different types of energized electrical cords for lamps, office equipment, and appliances to a developing room fire exposure. All of the cords were positioned on the floor and arranged in a manner to receive a similar thermal exposure. Six types of cords commonly used as power supply cords, extension cords, and as part of residential electrical wiring systems were chosen for the experiments. The non-metallic sheathed cables (NMB) typically found in residential electrical branch wiring were included to provide a link to previous research. The basic test design was to expose the six different types of cords, on the floor of a compartment to a growing fire to determine the conditions under which the cord would trip the circuit breaker and/or undergo an arc fault. All of the cords would be energized and installed on a non-combustible surface. Six cord types (18-2 SPT1, 16-3 SJTW, 12-2 NM-B, 12-3 NM-B, 18-3 SVT, 18-2 NISPT-2) and three types of circuit protection (Molded case circuit breaker (MCCB), combination Arc-fault circuit interrupter (AFCI), Ground-fault circuit interrupter (GFCI)) were exposed to six room-scale fires. The circuit protection was remote from the thermal exposure. The six room fires consisted of three replicate fires with two sofas as the main fuel source, two replicate fires with one sofa as the main fuel source and one fire with two sofas and MDF paneling on three walls in the room. Each fuel package was sufficient to support flashover conditions in the room and as a result, the impact on the cords and circuit protection was not significantly different. The average peak heat release rate of the sofa fueled compartment fires with gypsum board ceiling and walls was 6.8 MW. The addition of vinyl covered MDF wall paneling on three of the compartment walls increased the peak heat release rate to 12 MW, although most of the increased energy release occurred outside of the compartment opening. In each experiment during post flashover exposure, the insulation on the cords ignited and burned through, exposing bare conductor. During this period the circuits faulted. The circuit protection devices are not designed to provide thermal protection, and, thus, were installed remote from the fire. The devices operated as designed in all experiments. All of the circuit faults resulted in either a magnetic trip of the conventional circuit breaker or a ground-fault trip in the GFCI or AFCI capable circuit protection devices. Though not required by UL 1699, Standard for Safety for Arc-Fault Circuit-Interrupters as the solution for detection methodology, the AFCIs used had differential current detection. Examination of signal data showed that the only cord types that tripped with a fault to ground were the insulated conductors in non-metallic sheathed cables (12-2 NM-B and 12-3 NM-B). This was expected due to the bare grounding conductor present. Assessments of both the thermal exposure and physical damage to the cords did not reveal any correlation between the thermal exposure, cord damage, and trip type.

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Comparative Analysis on Fuel Consumption Between Two Online Strategies for P2 Hybrid Electric Vehicles: Adaptive-RuleBased (A-RB) vs Adaptive-Equivalent Consumption Minimization Strategy (A-ECMS). SAE International, March 2022. http://dx.doi.org/10.4271/2022-01-0740.

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Hybrid electric vehicles (HEVs) represent one of the main technological options for reducing vehicle CO2 emissions, helping car manufacturers (OEMs) to meet the stricter targets which are set by the European Green Deal for new passenger cars at 80 g CO2/km by 2025. The optimal power-split between the internal combustion engine (ICE) and the electric motor is a challenge since it depends on many unpredictable variables. In fact, HEV improvements in fuel economy and emissions strongly depend on the energy management strategy (EMS) on-board of the vehicle. Dynamic Programming approach (DP), direct methods and Pontryagin’s minimum principle (PMP) are some of the most used methodologies to optimize the HEV power-split. In this paper two online strategies are evaluated: an Adaptive-RuleBased (A-RB) and an Adaptive-Equivalent Consumption Minimization Strategy (A-ECMS). At first, a description of the P2 HEV model is made. Second, the two sub-optimal strategies are described in detail and then implemented on the HEV model to derive the fuel-optimal control strategy managing the power split between the thermal and electric engine to satisfy the driver's power request, including the engine on/off operating mode and the best gear selection. Finally, the two proposed strategies are tested on different driving cycles and then compared to other commercial strategies available in literature, such as the Equivalent Consumption Minimization Strategy (ECMS) and a RuleBased (RB) strategy. The results show that the A-ECMS is more conservative in terms of state of charge (SoC) compared to the A-RB. In fact, in the A-ECMS the SoC is always within the admissible range with considerable margin from the upper and lower limits for tested cycles, while in the A-RB a deep discharge of the battery is allowed. This behavior leads to a better fuel consumption of the A-RB compared to the A-ECMS, both in the WLTC and in the FTP-75 cycle.

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Type A Accident Investigation Board report on the January 17, 1996, electrical accident with injury in Technical Area 21 Tritium Science and Fabrication Facility Los Alamos National Laboratory. Final report. Office of Scientific and Technical Information (OSTI), April 1996. http://dx.doi.org/10.2172/244591.

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