Добірка наукової літератури з теми "Delamination mechanism"
Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями
Ознайомтеся зі списками актуальних статей, книг, дисертацій, тез та інших наукових джерел на тему "Delamination mechanism".
Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.
Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.
Статті в журналах з теми "Delamination mechanism"
Hosseini-Toudeshky, Hossein, M. Saeed Goodarzi, and Bijan Mohammadi. "Multiple Delaminations Growth in Composite Laminates under Compressive Cyclic Loading in Post-Buckling." Applied Mechanics and Materials 225 (November 2012): 195–200. http://dx.doi.org/10.4028/www.scientific.net/amm.225.195.
Повний текст джерелаDong, Hui Ru, Wanlin Guo, and Zheng Yang. "Mechanism of Delamination and Its Effects on Fracture of Surface Crack Bodies in Ductile Pipeline Steel." Key Engineering Materials 297-300 (November 2005): 1235–40. http://dx.doi.org/10.4028/www.scientific.net/kem.297-300.1235.
Повний текст джерелаBrenneman, Jacob, Derya Z. Tansel, Gary K. Fedder, and Rahul Panat. "Interfacial delamination and delamination mechanism maps for 3D printed flexible electrical interconnects." Extreme Mechanics Letters 43 (February 2021): 101199. http://dx.doi.org/10.1016/j.eml.2021.101199.
Повний текст джерелаWei, Z., L. H. Yam, and L. Cheng. "Delamination Assessment of Multilayer Composite Plates Using Model-based Neural Networks." Journal of Vibration and Control 11, no. 5 (May 2005): 607–25. http://dx.doi.org/10.1177/1077546305052317.
Повний текст джерелаJeevan Kumar, N. "Analysis of Mode-I crack growth arresting mechanism in curved laminated joint." International Journal of Computational Materials Science and Engineering 08, no. 01 (March 2019): 1950001. http://dx.doi.org/10.1142/s2047684119500015.
Повний текст джерелаRiccio, Aniello, Angela Russo, Andrea Sellitto, Cinzia Toscano, Davide Alfano, and Mauro Zarrelli. "Experimental and Numerical Assessment of Fibre Bridging Toughening Effects on the Compressive Behaviour of Delaminated Composite Plates." Polymers 12, no. 3 (March 3, 2020): 554. http://dx.doi.org/10.3390/polym12030554.
Повний текст джерелаDjamaluddin, Rudy, Hijriah, Rita Irmawati, Faharuddin, and Rossy T. Wahyuningsih. "Delamination mechanism of GFRP sheet bonded on the reinforced concrete beams." MATEC Web of Conferences 258 (2019): 03009. http://dx.doi.org/10.1051/matecconf/201925803009.
Повний текст джерелаWang, Ligang, and Dan G. Zollinger. "Mechanistic Design Framework for Spalling Distress." Transportation Research Record: Journal of the Transportation Research Board 1730, no. 1 (January 2000): 18–24. http://dx.doi.org/10.3141/1730-03.
Повний текст джерелаLiu, Chang, and Yaolin Shi. "Initiation of Triangle Zones by Delamination, Shear, and Compaction at the Front of Fold-and-Thrust Belts." Journal of Earthquakes 2016 (March 16, 2016): 1–21. http://dx.doi.org/10.1155/2016/6302546.
Повний текст джерелаWakamoto, Keisuke, Takukazu Otsuka, Ken Nakahara, and Takahiro Namazu. "Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test." Energies 14, no. 17 (September 4, 2021): 5532. http://dx.doi.org/10.3390/en14175532.
Повний текст джерелаДисертації з теми "Delamination mechanism"
Blandon, Omar Ali. "Mechanism of Delamination of Electrospun Adhesive Nanofibers." University of Akron / OhioLINK, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=akron1446477512.
Повний текст джерелаYamanaka, Tadayoshi. "Delamination modelling and toughening mechanism of a woven fabric composite." Thesis, McGill University, 2011. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=104701.
Повний текст джерелаLes méthodes de simulation numériques efficaces et exactes pour l'analyse de l'endommagement et la prédiction de vie en fatigue des matériaux composites sont essentielles pour l'industrie. Les problèmes surviennent dans le développement d'une telle méthode de simulation en raison des restrictions des méthodes numériques, c'est-à-dire, modélisation de la délamination et compréhension des mécanismes de rupture de composites à base de fibres tissées.Pour developer un modèle de délamination efficace et précis, une nouvelle méthode est proposée dans cette étude en utilisant la method des éléments finis. La méthode proposée n'exige pas de degrés-de-liberté supplémentaires pour créer de nouvelles sufaces de fissures/ délaminations. Le résultat de simulation de délamination par la méthode proposée est comparé avec un logiciel d'éléments finis commercial, et les résultats se comparent bien.Les mécanismes d'endommagement d'un composite tissé typique "five-harness satin" sont le sujet d'une étude. Ceci est fait en créant un modèle d'éléments finis "méso-échelle" en utilisant l'exemple d'un spécimen d'essais Mode 1 (spécimen DCB). Le tissu est modélisé avec les trajectoires exactes des fibres dans les deux directions, et les espaces entre les fibres sont remplis de la matrice. Des éléments cohésifs sont insérés entre la matrice et les interfaces des fibres. Les composants méso-échelles sont joints avec des parties homogènes qui sont utilisées pour modéliser des régions où aucun endommagement n'est prévu. La combinaison des ces parties constitue un modèle multiéchelle d'un spécimen DCB. Les résultats de simulation d'un essai sont en accord avec les résultats expérimentaux, du côté conservateur. Le mécanisme renforçant des ultant du type de tissage a été démontré.Cette étude contribue à la science en présentant de nouvelles méthodes pour modéliser les fissures et pour comprendre les mécanismes d'endommagement des composites tissés pendant la croissance des délaminations.
Tran, Tony D. "An Investigation of Initially Delaminated Composite Sandwich with Delamination Arrest Mechanism under Buckling Loading." DigitalCommons@CalPoly, 2010. https://digitalcommons.calpoly.edu/theses/428.
Повний текст джерелаWhitcomb, J. D. "Instability-related delamination growth of embedded and edge delaminations." Diss., Virginia Polytechnic Institute and State University, 1988. http://hdl.handle.net/10919/77755.
Повний текст джерелаPh. D.
Xia, Qingxi 1973. "Mechanics of inelastic deformation and delamination in paperboard." Thesis, Massachusetts Institute of Technology, 2002. http://hdl.handle.net/1721.1/8334.
Повний текст джерелаIncludes bibliographical references (p. 233-236).
Paperboard is one of the most widely used materials. The inelastic deformation of paperboard plays a crucial role during many manufacturing processes (e.g., the converting process whereby paperboard is converted into a product such as a milk carton by punching and subsequent folding) and during in-service applications. There is a scarcity of constitutive models describing inelastic behavior of paperboard under complex loading, despite the paper industry's great need of analytical tools to aid the design and manufacturing of better paperboard products. In this thesis, two constitutive models are developed to model the highly anisotropic, elastic-plastic behavior of paperboard/paper: (1) A three-dimensional elastic-plastic interface constitutive model is developed to model the out-of-plane delamination behavior of paperboard. The onset of interface separation is controlled by a limit surface in the normal-shear traction space. The limit surface is taken to shrink with a monotonically-increasing scalar internal variable reflecting damage associated with the history of inelastic relative interface displacement. (2) A three-dimensional, anisotropic continuum constitutive model is developed to model the in-plane elastic-plastic deformation of paper and paperboard. The proposed initial yield surface is directly constructed from the yield strengths measured in various loading directions and the corresponding ratios of plastic strain components. An associated flow rule is used to model the plastic flow of the material. Anisotropic strain-hardening of yield strengths is introduced to model the evolution of the yield surface with inelastic strain.
(cont.) The two constitutive models are implemented into finite element software to enable the simulation of paperboard mechanical behavior under complex, finite deformation. The models are shown to be capable of accurately capturing both the out-of-plane delamination (via the interface model) and the anisotropic in-plane elastic-plastic (via the continuum in-plane model) behavior of paperboard under complex loading. The two models are combined to simulate the mechanics of a converting process (creasing and subsequent folding) of paperboard. The simulations agree well with corresponding experimental observations. In particular, the underlying mechanisms of damage and delamination development during creasing and subsequent folding are predicted well; the macroscopic response of the bending moment vs. bending angle also agrees with experimental data. This research provides physically based three-dimensional material models of the anisotropic, elastic-plastic deformation of paperboard that enable the computational design of paperboard process and product design.
by Qingxi Steve Xia.
Ph.D.
Johansson-Näslund, Markus. "Numerical analysis of paperboard delamination using cohesive elements." Thesis, KTH, Hållfasthetslära, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-277779.
Повний текст джерелаEn ny testmetod för att mäta skjuvstyrkan för modus III delaminering av kartong studeras i syftet att reducera testutrustningens storlek. Testmetoden, som använder sig av en delad konsolbalk (SCB), mäter skjuvstyrkan indirekt genom brottresistansen. Metodiken är baserad på det standardiserad konsolbalks testet DCB, var två balkar är sammankopplade och som används för att mäta delaminering styrkan i kartongens normala riktning. Studien baseras på analyser med finita element, var kohesiva element implementeras för att prediktera brottbeteendet. En experimentell utvärdering av testmetoden genomfördes i en förstudie mellan Karlstads, Skövdes och Lunds universitet tillsammans med Tetra Pak. Experimenten gjordes både för DCB- och SCB-testet, och för att utvärdera brottbeteendet användes de kohesiva lagarna som presenterats av Tryding & Ristinmaa (2017). De experimentella resultaten används som bas vid utvärdering av analyserna. För att modellera spricktillväxten implementeras de kohesiva lagarna i det kommersiella FEM programmet Abaqus genom ett användar specificerat element (UEL). Från analyserna av DCB-testet visas det att det är möjligt att simulera modus I sprickbildning i kartong genom implementering av en specifik kohesive lag. Simuleringarna av DCB-testet stämmer väl överens med de experimentella resultaten. Resultaten från SCB-analyserna visar däremot på ett avvikande beteende från experimenten genom att underskatta skjuvstyrkan. Det noteras i analyserna av SCB-testet att märkbara deformationer i både den första skjuvriktningen och normal riktningen uppkommer, vilket förhindrar att ren skjuvbelastning i modus III erhålls. Baserat på analysernas resultat indikeras det att den nuvarande konfiguration för SCB-testet inte ger ren skjuvbelastning i modus III och underskattar därför kartongens faktiska skjuvstyrka. Det visas också att en 400 mm reducering av SCB-geometrins längd inte har någon märkbar påverkan på de kohesiva egenskaperna. Genom att ändra den initiala spricklängden är det möjligt att ytterligare reducera SCBgeometrins längd. För att försäkra sig om att sprickas tillväxt förblir stabil bör däremot längden på kartongen överstiga 300 mm. Att minska den initiala spricklängden och bredden på kartongen verkar generellt bidra till lägre deformationer i normal riktningen och ett resultat som ligger närmare de experimentella. Tryding, J. & Ristinmaa, M. (2017). Normalization of cohesive laws for quasi-brittle materials. Engineering Fracture Mechanics, 178, 333-345. doi:10.1016/j.engfracmech.2017.03.020
Dávila, Carlos G. "Delamination initiation in postbuckled dropped-ply laminates /." This resource online, 1991. http://scholar.lib.vt.edu/theses/available/etd-07282008-134842/.
Повний текст джерелаWang, Bin. "Local delamination failure of thin material layers." Thesis, Loughborough University, 2017. https://dspace.lboro.ac.uk/2134/25128.
Повний текст джерелаDimant, Ron A. "Damage mechanics of composite laminates." Thesis, University of Cambridge, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.338020.
Повний текст джерелаHuang, Haiying. "Single and multiple delamination behavior in composite plates." Diss., Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/12541.
Повний текст джерелаКниги з теми "Delamination mechanism"
Center, Langley Research, ed. Instability-related delamination growth of embedded and edge delaminations. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1988.
Знайти повний текст джерелаCenter, Langley Research, ed. Instability-related delamination growth of embedded and edge delaminations. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1988.
Знайти повний текст джерелаCenter, Langley Research, ed. Instability-related delamination growth of embedded and edge delaminations. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1988.
Знайти повний текст джерелаAdams, Donald Frederick. Delamination micromechanics analysis. Laramie, Wyo: University of Wyoming, 1985.
Знайти повний текст джерелаCenter, Langley Research, ed. Mechanics of instability-related delamination growth. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1988.
Знайти повний текст джерелаCenter, Langley Research, ed. Mechanics of instability-related delamination growth. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1988.
Знайти повний текст джерелаMurthy, Pappu L. N. Finite element substructuring methods for composite mechanics. [Washington, DC]: National Aeronautics and Space Administration, 1988.
Знайти повний текст джерелаUnited States. National Aeronautics and Space Administration., ed. Analysis of delamination related fracture processes in composites. [Washington, DC: National Aeronautics and Space Administration, 1992.
Знайти повний текст джерелаUnited States. National Aeronautics and Space Administration., ed. Analysis of delamination related fracture processes in composites: Preliminary final report. [Washington, DC: National Aeronautics and Space Administration, 1988.
Знайти повний текст джерелаUnited States. National Aeronautics and Space Administration, ed. Analysis of delamination related fracture processes in composites: Preliminary final report. [Washington, DC: National Aeronautics and Space Administration, 1988.
Знайти повний текст джерелаЧастини книг з теми "Delamination mechanism"
Bi, Xue, Peng Zou, and Xiangming Chen. "Study on Bearing Mechanism of Composite Stiffened Panel with Delamination Under Shear Load." In Mechanical Engineering and Materials, 155–72. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-68303-0_13.
Повний текст джерелаLiechti, Kenneth M. "Delamination Mechanics." In Springer Handbook of Experimental Solid Mechanics, 961–84. Boston, MA: Springer US, 2008. http://dx.doi.org/10.1007/978-0-387-30877-7_34.
Повний текст джерелаDong, Hui Ru, Wanlin Guo, and Zheng Yang. "Mechanism of Delamination and Its Effects on Fracture of Surface Crack Bodies in Ductile Pipeline Steel." In Key Engineering Materials, 1235–40. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-978-4.1235.
Повний текст джерелаKachanov, L. M. "Delamination Buckling." In Mechanics of Elastic Stability, 19–56. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-2819-0_2.
Повний текст джерелаKachanov, L. M. "Delamination Growth." In Mechanics of Elastic Stability, 57–87. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-2819-0_3.
Повний текст джерелаBaylakoglu, I., and E. Hedin. "PCB Delamination." In The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, 275–82. London: Springer London, 2011. http://dx.doi.org/10.1007/978-0-85729-236-0_12.
Повний текст джерелаMegonigal, Luke, Foad Nazari, Amirhassan Abbasi, T. Haj Mohamad, and C. Nataraj. "Delamination Fault Compensation in Composite Structures." In Mechanisms and Machine Science, 141–50. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-60694-7_8.
Повний текст джерелаPoint, Nelly, and Elio Sacco. "A Delamination Model. Mathematical Properties." In Solid Mechanics and Its Applications, 151–62. Dordrecht: Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-011-4738-5_18.
Повний текст джерелаAllix, O., L. Gornet, P. Ladevèze, and D. LéVêque. "Delamination Prediction by Continuum Damage Mechanics." In Solid Mechanics and Its Applications, 163–71. Dordrecht: Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-011-4738-5_19.
Повний текст джерелаNa, S. R., A. Hassan, K. M. Liechti, and M. J. Krische. "Delamination Between Functionalized Silicon Surfaces." In Experimental and Applied Mechanics, Volume 6, 89. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0222-0_12.
Повний текст джерелаТези доповідей конференцій з теми "Delamination mechanism"
Zhu, Z., B. S. Xu, Y. Liu, Y. X. Chen, S. Ma, and Z. X. Li. "The Delamination Wear Mechanism of Thermally Sprayed Coating." In ITSC2005, edited by E. Lugscheider. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2005. http://dx.doi.org/10.31399/asm.cp.itsc2005p1462.
Повний текст джерелаKumar, Rajesh S., and Matthew M. Mordasky. "Foreign Object Impact Damage in Ceramic Matrix Composites: Experiments and Computational Predictions." In ASME Turbo Expo 2019: Turbomachinery Technical Conference and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/gt2019-90368.
Повний текст джерелаMASSEY, JUSTIN, BARRETT ROMASKO, and HYONNY KIM. "NOVEL ENCLOSED DELAMINATION INJECTION REPAIR PROCESS FOR STRENGTH RESTORATION." In Proceedings for the American Society for Composites-Thirty Seventh Technical Conference. Destech Publications, Inc., 2022. http://dx.doi.org/10.12783/asc37/36491.
Повний текст джерелаKim, Ju Young, Hyoung-Ryeun Kim, Dong Woo Hahn, and Sung Min Hwang. "Study on Development Behavior and Mechanism of Delamination by NCF Material under uHAST Test Condition." In ISTFA 2017. ASM International, 2017. http://dx.doi.org/10.31399/asm.cp.istfa2017p0040.
Повний текст джерелаShen, Yanfeng, and Mingjing Cen. "Delamination Detection in Composite Plates Using Linear and Nonlinear Ultrasonic Guided Waves." In ASME 2019 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/imece2019-10928.
Повний текст джерелаPrack, Edward R., and Xuejun Fan. "Root Cause Mechanism for Delamination/Cracking in Stacked Die Chip Scale Packages." In 2006 International Symposium on Semiconductor Manufacturing (ISSM). IEEE, 2006. http://dx.doi.org/10.1109/issm.2006.4493066.
Повний текст джерелаKnaster, Mark B., and Jeffrey M. Parks. "Mechanism of Corrosion and Delamination of Painted Phosphated Steel During Accelerated Corrosion Testing." In SAE International Congress and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1986. http://dx.doi.org/10.4271/860110.
Повний текст джерелаKondo, S., T. Nasuno, S. Ogawa, S. Tokitou, B. U. Yoon, A. Namiki, Y. Sone, et al. "The Delamination Mechanism of Porous Low-k Film during the Cu-CMP Process." In 2003 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2003. http://dx.doi.org/10.7567/ssdm.2003.c-5-3.
Повний текст джерелаMatsumoto, Keiji, Keishi Okamoto, and Hiroyuki Mori. "The Mechanism of the Low-K Stress Reduction in Chip Assembly by Shorter Solder Bump Height." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74097.
Повний текст джерелаDe la Rama, Lito P., Dante G. Nuarin, and Marilin H. Nery. "Die Edge Thin Film Delamination on the Bottom Die of a Stacked Chip Scale Package (SCSP)." In ISTFA 2005. ASM International, 2005. http://dx.doi.org/10.31399/asm.cp.istfa2005p0037.
Повний текст джерелаЗвіти організацій з теми "Delamination mechanism"
Hodo, Wayne. Investigation of the mechanisms for the delamination resistance found in bio-engineered composites found in nature : bi-layered exoskeleton fish scales. Engineer Research and Development Center (U.S.), May 2019. http://dx.doi.org/10.21079/11681/32680.
Повний текст джерела