Добірка наукової літератури з теми "Copper free"
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Статті в журналах з теми "Copper free"
ARNAUD, CELIA. "COPPER-FREE CLICK CHEMISTRY." Chemical & Engineering News 85, no. 43 (October 22, 2007): 15. http://dx.doi.org/10.1021/cen-v085n043.p015.
Повний текст джерелаCanalle, Luiz A., Sander S. van Berkel, Laurens T. de Haan, and Jan C. M. van Hest. "Copper-Free Clickable Coatings." Advanced Functional Materials 19, no. 21 (November 9, 2009): 3464–70. http://dx.doi.org/10.1002/adfm.200900743.
Повний текст джерелаMacchiarulo Jorge, Rosane, and Acácio Antonio Mesquita Furtado Filho. "Characterization of New Lead-free Ballistic Modifiers and Phthalate-free Plasticizers in Propellants." Journal of Aerospace Technology and Management, no. 1 (January 21, 2020): 15–18. http://dx.doi.org/10.5028/jatm.etmq.54.
Повний текст джерелаRice, T. M. "Clues from copper-free samples." Nature 332, no. 6167 (April 1988): 780. http://dx.doi.org/10.1038/332780a0.
Повний текст джерелаMartínez, Ana, and Miguel Reina. "Copper or free radical scavenger?" Computational and Theoretical Chemistry 1104 (March 2017): 1–11. http://dx.doi.org/10.1016/j.comptc.2017.01.033.
Повний текст джерелаLei, H. "Melting of free copper clusters." Journal of Physics: Condensed Matter 13, no. 13 (March 15, 2001): 3023–30. http://dx.doi.org/10.1088/0953-8984/13/13/315.
Повний текст джерелаHonkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (May 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.
Повний текст джерелаChen, Longrui, Betsegaw E. Lemma, Jenna S. Rich, and James Mack. "Freedom: a copper-free, oxidant-free and solvent-free palladium catalysed homocoupling reaction." Green Chem. 16, no. 3 (2014): 1101–3. http://dx.doi.org/10.1039/c3gc41847b.
Повний текст джерелаYang, Chia-Anne, Yung-Han Chen, Shyue-Chu Ke, Yi-Ru Chen, Hsien-Bin Huang, Ta-Hsien Lin та Yi-Cheng Chen. "Correlation of Copper Interaction, Copper-Driven Aggregation, and Copper-Driven H2O2Formation with Aβ40 Conformation". International Journal of Alzheimer's Disease 2011 (2011): 1–7. http://dx.doi.org/10.4061/2011/607861.
Повний текст джерелаMadl, Jan, and Vaclav Koutny. "Machinability of Lead Free Copper Alloys." Manufacturing Technology 15, no. 5 (November 1, 2015): 870–75. http://dx.doi.org/10.21062/ujep/x.2015/a/1213-2489/mt/15/5/870.
Повний текст джерелаДисертації з теми "Copper free"
Mahale, Vishal Tulshiram. "Development of copper-free NAO brake-pads." Thesis, IIT Delhi, 2019. http://eprint.iitd.ac.in:80//handle/2074/8058.
Повний текст джерелаGeorge, Faith Olajumoke. "Chromium-free conversion coating of aluminium-copper alloys." Thesis, University of Manchester, 2011. https://www.research.manchester.ac.uk/portal/en/theses/chromiumfree-conversion-coating-of-aluminiumcopper-alloys(5176c8af-02af-44a8-a47f-44b5a0c2585c).html.
Повний текст джерелаLee, Lin. "Contribution to Development of Copper Free Automotive Brake Pad." OpenSIUC, 2013. https://opensiuc.lib.siu.edu/theses/1244.
Повний текст джерелаSaysell, Colin G. "Reactivity of the copper containing enzyme galactose oxidase." Thesis, University of Newcastle Upon Tyne, 1996. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.307890.
Повний текст джерелаLandeen, Lee Kevin 1965. "Inactivation of Legionella pneumophila by copper-silver ions and free chlorine." Thesis, The University of Arizona, 1989. http://hdl.handle.net/10150/276997.
Повний текст джерелаChiou, Ipeng 1957. "Inactivation of Listeria monocytogenes by copper, silver ions and free chlorine." Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/277992.
Повний текст джерелаStarnes, Hazel Louise. "The role of copper in the free radical depolymerisation of hyaluronic acid." Thesis, University of Salford, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.308285.
Повний текст джерелаBaga, Ayad Naji Omar. "Reactions of some copper complexes with hydrogen peroxide and radiation-produced free radicals." Thesis, University of Newcastle Upon Tyne, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.328136.
Повний текст джерелаAnson, Scott J. "Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions." Diss., Online access via UMI:, 2007.
Знайти повний текст джерелаFreiholtz, Oliver. "Corrosion behaviour of new lead-free brass alloys in aqueous copper (II) chloride." Thesis, KTH, Kemi, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-299780.
Повний текст джерелаDue to new regulations for the use of brass in contact with drinking water, new lead-free brass alloys have been developed. It is therefore of great interest to investigate their corrosion properties in terms of dezincification resistance. An accelerated standard test, SS-EN ISO 6509-1:2014 is used to determine the dezincification resistance of brass alloys. However, as this standard test was developed for leaded brass alloys, it has not yet been established whether this method also is suitable to assess the dezincification resistance of lead-free brass alloys. This master thesis study aimed to expand this knowledge gap by investigating how the dezincification properties of three different brass alloys, two newly developed lead-free alloys and one lead-containing alloy, were affected by changing the parameters of the standard test. The results were compared with their behaviour in tap water to determine the reliability of the ISO test. Most of the obtained results of the lead-free brass alloys were in accordance with the results obtained for the leaded brass alloy. It could therefore be concluded that the standard test can be used to assess the dezincification resistance of brass alloys and also reflect their ranking at tap water conditions.
Книги з теми "Copper free"
Starnes, Hazel Louise. The role of copper in the free radical depolymerisation of hyaluronic acid. Salford: University of Salford, 1995.
Знайти повний текст джерелаPowell, Pnina. Ṃeʻoravut matakhot ha-maʻavar bi-neziḳim biologiyim ha-musharim ʻal yede radiḳalim ḥofshiyim: Manganon reʻilut ha-paraḳṿaṭ. [Israel: ḥ. mo. l., 1990.
Знайти повний текст джерелаVarada, Raj Subramanium, Walker K. P, and United States. National Aeronautics and Space Administration., eds. Stress versus temperature dependent activation energies in creep. [Washington, D.C.]: NASA, 1990.
Знайти повний текст джерелаGittleman, Ann Louise. Why am I always so tired?: Discover how correcting your body's copper imbalance can: keep your body from giving out before your mind does, free you from those mid-day slumps, give you the energy breakthrough you've been looking for. San Francisco, Calif: HarperSanFrancisco, 1999.
Знайти повний текст джерелаTobar, Héctor. Deep down dark: The untold stories of 33 men buried in a Chilean mine, and the miracle that set them free. Toronto, Ontario, Canada: HarperCollinsPublishersLtd, 2014.
Знайти повний текст джерелаTobar, Héctor. Deep down dark: The untold stories of 33 men buried in a Chilean mine, and the miracle that set them free. London: Sceptre, 2015.
Знайти повний текст джерелаD, Reid Colin, ed. To the world: Mark the literary attainments of the Rev. Robert Irvine, D.D., minister of Knox's Church ("Free Presbyterian"), Hamilton, shewn in the following letter, copied from the Globe newspaper of 22nd instant, Sunday labour, synod debate ... [Hamilton, Ont.?: s.n., 1986.
Знайти повний текст джерелаOffice, Great Britain Colonial. Prince Edward Island: Return to an address of the Honourable the House of Commons, dated 5 July 1842 : copies of the petition and memorial of the Legislative Council and Assembly of Her Majesty's Island of Prince Edward, in February 1842, to Her Majesty, praying for the admission of corn and other produce of that colony into Great Britain free ... [London: HMSO, 2001.
Знайти повний текст джерелаGreat Britain. Colonial Office. Canada: Return to an address of the Honourable the House of Commons, dated 3 February 1852, for, a copy of address of the Legislative Council of Canada respecting a royal charter for a college in connection with the Church of England in Canada, and respecting a free convocation of the bishops, clergy and laity in communion with the said church, dated the 9th day of July 1851, and copies or extracts of any correspondence relating thereto. [London: HMSO, 2001.
Знайти повний текст джерелаTaylor, W. Thomas. The plot of Bartolomé Pagés: To free Santa Anna from the chains of his Texian captors in late 1836, the discovery of the plot and his subsequent arrest, his escape, capture, trial, and punishment, concluding with his doleful letter from prison to Sam Houston : with a further account of the modern forgery of the only known copy of the reward poster issued by Sheriff Calder in 1836, the twisting history of copies fake and real, their discovery and exposure, concluding with a few remarks on the staining & baking of paper. Dallas: DeGolyer Library, 1990.
Знайти повний текст джерелаЧастини книг з теми "Copper free"
Klein, Konrad. "Development of copper-free friction material." In Proceedings, 647–55. Wiesbaden: Springer Fachmedien Wiesbaden, 2014. http://dx.doi.org/10.1007/978-3-658-05978-1_45.
Повний текст джерелаBasosi, Riccardo, Giovanni Della Lunga, and Rebecca Pogni. "Copper Biomolecules in Solution." In Biomedical EPR, Part A: Free Radicals, Metals, Medicine, and Physiology, 385–416. Boston, MA: Springer US, 2005. http://dx.doi.org/10.1007/0-387-26741-7_13.
Повний текст джерелаGoldstein, Sara, Gidon Czapski, Haim Cohen, and Dan Meyerstein. "Free Radical Induced Cleavage of Organic Molecules Catalyzed by Copper Ions — An Alternative Pathway for Biological Damage." In Bioinorganic Chemistry of Copper, 222–35. Dordrecht: Springer Netherlands, 1993. http://dx.doi.org/10.1007/978-94-011-6875-5_18.
Повний текст джерелаNedilko, S. A., and V. A. Drozd. "Problems of Searching for Copper-Free HTSC Compositions." In Physics and Materials Science of High Temperature Superconductors, IV, 205–11. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5732-2_15.
Повний текст джерелаGilbert, B. C., G. Harrington, G. Scrivens, and S. Silvester. "EPR Studies of Fenton-Type Reactions in Copper- Peroxide Systems." In Free Radicals in Biology and Environment, 49–62. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-017-1607-9_4.
Повний текст джерелаCal, Pedro M. S. D., Gonçalo J. L. Bernardes, and Omar Boutureira. "Fluoroglycoproteins by Copper-Free Strain-Promoted Azide–Alkyne Cycloaddition." In Springer Protocols Handbooks, 53–67. New York, NY: Springer US, 2020. http://dx.doi.org/10.1007/978-1-0716-0720-6_5.
Повний текст джерелаCeballos-Picot, Irène, Annie Nicole, and Pierre-Marie Sinet. "Cellular clones and transgenic mice overexpressing copper — zinc superoxide dismutase: Models for the study of free radical metabolism and aging." In Free Radicals and Aging, 89–98. Basel: Birkhäuser Basel, 1992. http://dx.doi.org/10.1007/978-3-0348-7460-1_10.
Повний текст джерелаGoto, Takayuki, Masatsugu Fukunaga, Kazuya Miyagawa, Tetsuo Hanaguri, and Tetsuo Fukase. "Synthesis of Electron Doped Copper Oxides Free from 4f Spins." In Advances in Superconductivity V, 267–70. Tokyo: Springer Japan, 1993. http://dx.doi.org/10.1007/978-4-431-68305-6_58.
Повний текст джерелаTam, Nora F. Y., Yuk-Shan Wong, and Craig G. Simpson. "Removal of Copper by Free and Immobilized Microalga, Chlorella vulgaris." In Wastewater Treatment with Algae, 17–36. Berlin, Heidelberg: Springer Berlin Heidelberg, 1998. http://dx.doi.org/10.1007/978-3-662-10863-5_2.
Повний текст джерелаJonas, John J., and Laszlo S. Toth. "Large Strain Effects during Free-End Torsion of Copper Bars." In Anisotropy and Localization of Plastic Deformation, 319–22. Dordrecht: Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3644-0_74.
Повний текст джерелаТези доповідей конференцій з теми "Copper free"
Miller, M. K., and K. F. Russell. "Clustering and precipitation in neutron irradiated low copper and copper-free steels and model alloys." In 2006 19th International Vacuum Nanoelectronics Conference and 50th International Field Emission Symposium. IEEE, 2006. http://dx.doi.org/10.1109/ivnc.2006.335299.
Повний текст джерелаSatyanarayan and K. N. Prabhu. "Wetting behavior of lead-free solders on copper substrates." In National Conference on Challenges in Research & Technology in the Coming Decades National Conference on Challenges in Research & Technology in the Coming Decades (CRT 2013). Institution of Engineering and Technology, 2013. http://dx.doi.org/10.1049/cp.2013.2550.
Повний текст джерелаBernhard, Tobias, Stefanie Manuela Bremmert, Sascha Dieter, Laurence John Gregoriades, and Edith Steinhauser. "Hydrogen Embrittlement Suppressors for Nickel-Free Electroless Copper Baths." In 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2022. http://dx.doi.org/10.1109/impact56280.2022.9966702.
Повний текст джерелаLiu, Chia Yu, June Che Lu, and Su Wen Hsu. "A Novel Halogen-Free, Phosphorous-free and Heat Resistant Material for Copper clad laminate." In Circuits Technology Conference (IMPACT). IEEE, 2008. http://dx.doi.org/10.1109/impact.2008.4783836.
Повний текст джерелаHosoi, N., R. Kimizuka, M. Nagai, S. Okuyama, T. Kobayashi, N. Ito, K. Arita, and H. Miyamoto. "Two-step copper electroplating technique using seed enhancement step with alkali-metal-free copper pyrophosphate bath." In Proceedings of the IEEE 2001 International Interconnect Technology Conference. IEEE, 2001. http://dx.doi.org/10.1109/iitc.2001.930083.
Повний текст джерелаAraki, Noritoshi, Yasutomo Ichiyama, Ryo Oishi, and Takashi Yamada. "A study of free air ball formation in palladium-coated copper and bare copper bonding wire." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575779.
Повний текст джерелаJorne, J., and Anh Man Tran. "Additive-free electroplating of copper in high-aspect-ratio trenches." In Proceedings of the IEEE 2001 International Interconnect Technology Conference. IEEE, 2001. http://dx.doi.org/10.1109/iitc.2001.930006.
Повний текст джерелаReinhardt, Kathrin, Christel Kretzschmar, Lars Rebenklau, Jurgen Schul, Andreas Meyer, and Christian Marx. "Lead-oxide-free copper thick-film paste for alumina substrates." In 2010 33rd International Spring Seminar on Electronics Technology (ISSE). IEEE, 2010. http://dx.doi.org/10.1109/isse.2010.5547266.
Повний текст джерелаYuan, Shuaishuai, Yiquan Li, Jinkai Xu, and Changtai Zhai. "Study on Orthogonal Micro-cutting Deformation of Oxygen-free Copper." In 2019 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO). IEEE, 2019. http://dx.doi.org/10.1109/3m-nano46308.2019.8947407.
Повний текст джерелаCarlen, M., and M. Berrogain. "Oil-free pole-mount transformers: Avoiding oil and copper theft." In 2015 IEEE Thirty Fifth Central American and Panama Convention (CONCAPAN XXXV). IEEE, 2015. http://dx.doi.org/10.1109/concapan.2015.7428489.
Повний текст джерелаЗвіти організацій з теми "Copper free"
Rohatgi, P. K. Development of Lead-Free Copper Alloy-Graphite Castings. Office of Scientific and Technical Information (OSTI), October 1999. http://dx.doi.org/10.2172/14366.
Повний текст джерелаPritzkau, David P. Experimental Study of RF Pulsed Heating on Oxygen Free Electronic Copper. Office of Scientific and Technical Information (OSTI), February 2003. http://dx.doi.org/10.2172/812622.
Повний текст джерелаRohatgi, P. K. Development of lead-free copper alloy graphite castings. Annual report, January--December 1995. Office of Scientific and Technical Information (OSTI), October 1996. http://dx.doi.org/10.2172/435339.
Повний текст джерелаRohatgi, P. K. Development of lead-free copper alloy-graphite casting. Annual report, January--December 1994. Office of Scientific and Technical Information (OSTI), February 1996. http://dx.doi.org/10.2172/282040.
Повний текст джерелаRohatgi, P. K. Development of lead-free copper alloy-graphite castings. Technical report, January 1994--December 1994. Office of Scientific and Technical Information (OSTI), July 1995. http://dx.doi.org/10.2172/83843.
Повний текст джерелаJones, Thomas, Richard Strachan, David Mackie, Mervyn Cooper, Brian Frame, and Jan Vorstius. Phase Field & Monte Carlo Potts Simulation of Grain Growth and Morphology of Vertically Upwards Cast Oxygen Free Copper. University of Dundee, October 2021. http://dx.doi.org/10.20933/100001287.
Повний текст джерелаRohatgi, P. K. Development of lead-free copper alloy graphite castings. Annual report for the period January through December 1996. Office of Scientific and Technical Information (OSTI), March 1997. http://dx.doi.org/10.2172/542500.
Повний текст джерелаHutchinson, M. L., J. E. L. Corry, and R. H. Madden. A review of the impact of food processing on antimicrobial-resistant bacteria in secondary processed meats and meat products. Food Standards Agency, October 2020. http://dx.doi.org/10.46756/sci.fsa.bxn990.
Повний текст джерелаBano, Masooda. The Missing Link: Low-Fee Private Tuition and Education Options for the Poor – The Demand-Side Dynamics in Pakistan. Research on Improving Systems of Education (RISE), September 2022. http://dx.doi.org/10.35489/bsg-risewp_2022/113.
Повний текст джерелаJordan, Ramon L., Abed Gera, Hei-Ti Hsu, Andre Franck, and Gad Loebenstein. Detection and Diagnosis of Virus Diseases of Pelargonium. United States Department of Agriculture, July 1994. http://dx.doi.org/10.32747/1994.7568793.bard.
Повний текст джерела