Добірка наукової літератури з теми "Copper"
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Статті в журналах з теми "Copper"
Honkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (May 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.
Повний текст джерелаXu, Xiaowei, Jing Hua, Houhu Zhang, Zehua Zhao, Yi Wang, Dapeng Zhang, Jun Zhang, and Xiaoxi Chen. "Environmental Risk Assessment of Recycled Products of Spent Coppery Etchant in Jiangsu Province, China." International Journal of Environmental Research and Public Health 18, no. 15 (July 26, 2021): 7881. http://dx.doi.org/10.3390/ijerph18157881.
Повний текст джерелаLalancette, N., and K. A. McFarland. "Phytotoxicity of Copper-Based Bactericides to Peach and Nectarine." Plant Disease 91, no. 9 (September 2007): 1122–30. http://dx.doi.org/10.1094/pdis-91-9-1122.
Повний текст джерелаCarrillo, F., J. Martínez, R. Barrios, and A. Roselló. "Kinetics of the conversion of copper sulfide to blister copper." Revista de Metalurgia 38, no. 5 (October 30, 2002): 334–38. http://dx.doi.org/10.3989/revmetalm.2002.v38.i5.416.
Повний текст джерелаThiele, D. J., and D. H. Hamer. "Tandemly duplicated upstream control sequences mediate copper-induced transcription of the Saccharomyces cerevisiae copper-metallothionein gene." Molecular and Cellular Biology 6, no. 4 (April 1986): 1158–63. http://dx.doi.org/10.1128/mcb.6.4.1158-1163.1986.
Повний текст джерелаThiele, D. J., and D. H. Hamer. "Tandemly duplicated upstream control sequences mediate copper-induced transcription of the Saccharomyces cerevisiae copper-metallothionein gene." Molecular and Cellular Biology 6, no. 4 (April 1986): 1158–63. http://dx.doi.org/10.1128/mcb.6.4.1158.
Повний текст джерелаCooper, H. Kory, Garett Hunt, Nicholas Waber, and Carey Gray. "Precontact Native Copper Innovation in British Columbia." Canadian Journal of Archaeology 44, no. 2 (2020): 185–22. http://dx.doi.org/10.51270/44.2.185.
Повний текст джерелаCusick, Kathleen, Ane Iturbide, Pratima Gautam, Amelia Price, Shawn Polson, Madolyn MacDonald, and Ivan Erill. "Enhanced copper-resistance gene repertoire in Alteromonas macleodii strains isolated from copper-treated marine coatings." PLOS ONE 16, no. 9 (September 28, 2021): e0257800. http://dx.doi.org/10.1371/journal.pone.0257800.
Повний текст джерелаZhang, Jing, Jie Wang, Yong Gao, Yaocheng Hu, Yupeng Xie, Zhiming You, and Sheng Wang. "Influence of Film Coating Thickness on Secondary Electron Emission Characteristics of Non-Evaporable Getter Ti-Hf-V-Zr Coated Open-Cell Copper Foam Substrates." Materials 15, no. 6 (March 16, 2022): 2185. http://dx.doi.org/10.3390/ma15062185.
Повний текст джерелаChang, Chao Cheng, and Teng Chiao Wang. "Effects of Grain Size on Micro Backward Extrusion of Copper." Advanced Materials Research 83-86 (December 2009): 1092–98. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.1092.
Повний текст джерелаДисертації з теми "Copper"
Clark, Susan Ferguson. "Copper status in multiple trauma patients : measurement of copper balance, serum copper and ceruloplasmin /." This resource online, 1990. http://scholar.lib.vt.edu/theses/available/etd-09162005-115033/.
Повний текст джерелаGraca, D. S. "Effects of copper depletion on subcellular hepatic copper and biliary copper excretion in cattle." Thesis, University of Aberdeen, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.370105.
Повний текст джерелаClark, Susan F. "Copper status in multiple trauma patients: measurement of copper balance, serum copper and ceruloplasmin." Diss., Virginia Tech, 1990. http://hdl.handle.net/10919/39376.
Повний текст джерелаChanges in copper metabolism have been reported in both thermal injury and skeletal trauma; data regarding copper status in multiple trauma patients (MTP) are nonexistent. Hypercatabolism following multiple trauma may increase copper utilization, deplete copper stores and compromise cuproenzyme synthesis and function. The purpose of this study was to provide information on copper status in MTP and determine whether age, injury severity, clinical outcome or nutritional intake influenced copper status. Twenty-four hour copper losses, serum copper and ceruloplasmin were measured in 11 MTP with Injury Severity Scores (ISS) >12 at 24-48 hours post admission. Collections of biological fluids (urine, nasogastric, chest tube, drains, stools) were analyzed for copper using atomic absorption spectrophotometry (AAS) and quantified over 5 days. Serial serum copper and ceruloplasmin were determined on days 1,3,5,10,15 and patient discharge by ASS and rate nephelometry inmunoprecipition, respectively. Eight patients received parenteral nutrition (PN). Three received intravenous glucose/electrolyte infusions (IV). urine (n=11) and nasogastric losses (n=8) were statistically greater than normal (p<.001). The mean ± SEM cumulative copper losses of urine, chest tube drainage, nasogastric secretions and other drains were 790 ± 116 (n=11), 833 ± 130 (n=7), 261 ± 46 (n+8), and 150 ± 58 μg/5 d (n=8), respectively. Urinary losses represented 10 to 12 times the normal copper excretion. Serum copper on day 1 and ceruloplasmin day 3 were significantly higher than normal (p<.025). Cumulative copper balance in the IV group was - 2266 μg and -440 μg in the PN group. No relationship was found between copper loss and ISS. Patients in their twenties demonstrated the greatest urinary copper loss. The physiological and biochemical effects of extensive copper loss in the MTP require further evaluation. These patients may have a predisposition to copper deficiency due to excessive copper losses and may require increased copper supplementation.
Ph. D.
Reed, Stewart T. "Copper adsorption/desorption characteristics on copper amended soils." Diss., This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-06062008-171512/.
Повний текст джерелаMao, Zhong. "Effects of copper-ligand and copper-copper interactions on excited state properties of luminescent copper (I) complexes : structural and photophysical studies /." View the Table of Contents & Abstract, 2003. http://sunzi.lib.hku.hk/hkuto/record/B26450859.
Повний текст джерелаMao, Zhong, and 毛中. "Effects of copper-ligand and copper-copper interactions on excited state properties of luminescent copper (I) complexes: structural and photophysical studies." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2003. http://hub.hku.hk/bib/B45015582.
Повний текст джерелаGremillion, Eric J. "Copper Kingdom." ScholarWorks@UNO, 2015. http://scholarworks.uno.edu/td/1973.
Повний текст джерелаTörndahl, Tobias. "Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates." Doctoral thesis, Uppsala University, Department of Materials Chemistry, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651.
Повний текст джерелаThin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. In this thesis growth of copper, copper(I) oxide and copper(I) nitride on two different substrates, amorphous SiO2 and single crystalline α-Al2O3 by the so called Atomic Layer Deposition (ALD) techniques has been studied. This technique allows precise control of the growth process at monolayer level on solid substrates. Other characteristic features of ALD are that it produces films with excellent step coverage and good uniformity even as extremely thin films on complicated shaped substrates.
Alternative deposition schemes were developed for the materials of interest. It was demonstrated that use of intermediate water pulses affected the deposition pathways considerably. By adding water, the films are thought to grow via formation of an oxide over-layer instead of through a direct reaction between the precursors as in the case without water.
For growth of copper(I) nitride from Cu(hfac)2 and ammonia no film growth occurred without adding water to the growth process. The Cu3N films could be transformed into conducting copper films by post annealing. In copper growth from CuCl and H2 the water affected film growth on the alumina substrates considerably more than on the fused silica substrates. The existence of surface -OH and/or -NHx groups was often found to play an important role, according to both theoretical calculations and experimental results.
Törndahl, Tobias. "Atomic layer deposition of copper, copper(I) oxide and copper(I) nitride on oxide substrates /." Uppsala : Acta Universitatis Upsaliensis : Univ.-bibl. [distributör], 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651.
Повний текст джерелаFitzsimons, Nuala Patricia. "Copper hydride as a precursor for supported copper catalysts." Thesis, University of Cambridge, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.281998.
Повний текст джерелаКниги з теми "Copper"
R, Davis J., and ASM International. Handbook Committee., eds. Copper and copper alloys. Materials Park, OH: ASM International, 2001.
Знайти повний текст джерелаAtkinson, R. L. Copper and copper mining. Princes Risborough: Shire, 1987.
Знайти повний текст джерелаJohanson, Paula. Copper. New York: The Rosen Pub. Group, 2007.
Знайти повний текст джерелаC, Dameron, Howe Paul, National Research Centre for Environmental Toxicology (Australia), WHO Task Group on Environmental Health Criteria for Copper., United Nations Environment Programme, International Labour Organisation, World Health Organization, Inter-Organization Programme for the Sound Management of Chemicals., and International Program on Chemical Safety., eds. Copper. Geneva: World Health Organization, 1998.
Знайти повний текст джерелаUnited States. Agency for Toxic Substances and Disease Registry. Division of Toxicology. Copper. Atlanta, GA: Dept. of Health and Human Services, Public Health Service, Agency for Toxic Substances and Disease Registry, Division of Toxicology, 2004.
Знайти повний текст джерелаButler, L. J. Copper Empire. London: Palgrave Macmillan UK, 2007. http://dx.doi.org/10.1057/9780230589766.
Повний текст джерелаHohl, Joan. California copper. London: Silhouette Books, 1987.
Знайти повний текст джерелаHohl, Joan. California copper. Don Mills, Ont: Mira Books, 1995.
Знайти повний текст джерелаDraper, Sharon M. Copper sun. New York, N.Y: Simon Pulse, 2008.
Знайти повний текст джерелаCopper & copper alloys. Potters Bar: Copper Development Association, 1991.
Знайти повний текст джерелаЧастини книг з теми "Copper"
Sequeira, C. A. C. "Copper and Copper Alloys." In Uhlig's Corrosion Handbook, 757–85. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470872864.ch56.
Повний текст джерелаFreudenberger, Jens, and Hans Warlimont. "Copper and Copper Alloys." In Springer Handbook of Materials Data, 297–305. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-69743-7_12.
Повний текст джерелаKundig, Konrad J. A., and John G. Cowie. "Copper and Copper Alloys." In Mechanical Engineers' Handbook, 117–220. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/0471777447.ch4.
Повний текст джерелаCastroviejo, Ricardo. "Copper(Cu/Native Copper)." In A Practical Guide to Ore Microscopy—Volume 1, 227–32. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-12654-3_37.
Повний текст джерелаBährle-Rapp, Marina. "copper." In Springer Lexikon Kosmetik und Körperpflege, 128. Berlin, Heidelberg: Springer Berlin Heidelberg, 2007. http://dx.doi.org/10.1007/978-3-540-71095-0_2406.
Повний текст джерелаKurtz, Wolfgang, and Hans Vanecek. "Copper." In W Tungsten, 200–234. Berlin, Heidelberg: Springer Berlin Heidelberg, 1987. http://dx.doi.org/10.1007/978-3-662-08690-2_26.
Повний текст джерелаCrowson, Philip. "Copper." In Mining in the Asia-Pacific, 217–36. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-61395-6_13.
Повний текст джерелаLiu, Xingcheng, and Xiaolin Xiong. "Copper." In Encyclopedia of Earth Sciences Series, 1–3. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-39193-9_216-1.
Повний текст джерелаLiu, Xingcheng, and Xiaolin Xiong. "Copper." In Encyclopedia of Earth Sciences Series, 303–5. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-39312-4_216.
Повний текст джерелаCrowson, Phillip. "Copper." In Minerals Handbook 1992–93, 76–83. London: Palgrave Macmillan UK, 1992. http://dx.doi.org/10.1007/978-1-349-12564-7_12.
Повний текст джерелаТези доповідей конференцій з теми "Copper"
Okamoto, S., K. Hashimoto, T. Sato, and K. Niwa. "Laser welding copper and copper alloys." In ICALEO® ‘89: Proceedings of the Materials Processing Conference. Laser Institute of America, 1989. http://dx.doi.org/10.2351/1.5058338.
Повний текст джерелаAng, X. F., A. T. Lin, J. Wei, Z. Chen, and C. C. Wong. "Low Temperature Copper-Copper Thermocompression Bonding." In 2008 10th Electronics Packaging Technology Conference (EPTC). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763467.
Повний текст джерелаRyding, David G., Douglas Allen, and Richard H. Lee. "Brazing copper to dispersion-strengthened copper." In SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, edited by Ali M. Khounsary. SPIE, 1996. http://dx.doi.org/10.1117/12.259829.
Повний текст джерелаKishida, S., Y. Takada, Z. Yinan, J. M. Song, and K. Yasuda. "Copper-Copper Ultrasonic Bonding by Using Blue Laser-Sintered Copper Nanoparticles." In 2022 International Conference on Electronics Packaging (ICEP). IEEE, 2022. http://dx.doi.org/10.23919/icep55381.2022.9795481.
Повний текст джерелаKim, Wooyoung, Seung Ho Han, Yongin Lee, Donggap Shin, Wonyoung Choi, Jiwon Moon, Kyeongbin Lim, BumKi Moon, and Minwoo Daniel Rhee. "Copper contamination control in Hybrid Copper Bonding." In 2023 International Conference on Electronics Packaging (ICEP). IEEE, 2023. http://dx.doi.org/10.23919/icep58572.2023.10129740.
Повний текст джерелаZeng, Xian, Yu Zhang, Chengqiang Cui, Kai Zhang, Xun Chen, Xin Chen, Jian Gao, Yunbo He, and Hui Tang. "Synthesis of copper nanoparticles using copper hydroxide." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480621.
Повний текст джерелаHu, Liangxing, Simon Chun Kiat Goh, Shaoteng Wu, and Chuan Seng Tan. "Sputtered Copper Nitride-Copper Nitride Direct Bonding." In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2021. http://dx.doi.org/10.1109/ltb-3d53950.2021.9598450.
Повний текст джерелаDell'Erba, M., P. Sforza, G. Chita, and L. Cento. "New Problems Emerging From CO 2 Laser Material Processing: Copper To Copper And Copper To Non-Copper Welding." In 1986 Int'l European Conf on Optics, Optical Systems, and Applications, edited by Stefano Sottini and Silvana Trigari. SPIE, 1987. http://dx.doi.org/10.1117/12.937099.
Повний текст джерелаSakamoto, Hirokatsu, Tadashi Teranishi, Rumi Nagai, Ryo Itaya, and Akihiko Happoya. "Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C." In 2024 International Conference on Electronics Packaging (ICEP). IEEE, 2024. http://dx.doi.org/10.23919/icep61562.2024.10535679.
Повний текст джерелаGondcharton, P., B. Imbert, L. Benaissa, and M. Verdier. "Copper-copper direct bonding: Impact of grain size." In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM). IEEE, 2015. http://dx.doi.org/10.1109/iitc-mam.2015.7325657.
Повний текст джерелаЗвіти організацій з теми "Copper"
Kirkham, R. V., and W. D. Sinclair. Vein copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208010.
Повний текст джерелаDawson, K. M., and R. V. Kirkham. Skarn copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208018.
Повний текст джерелаSimon, N. J., E. S. Drexler, and R. P. Reed. Properties of copper and copper alloys at cryogenic temperatures. Gaithersburg, MD: National Institute of Standards and Technology, 1992. http://dx.doi.org/10.6028/nist.mono.177.
Повний текст джерелаKirkham, R. V. Volcanic redbed copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/207986.
Повний текст джерелаEckstrand, O. R. Nickel-copper sulphide. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208042.
Повний текст джерелаBlais, A. Copper Rand Mine. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132280.
Повний текст джерелаPalmer, D. A., J. M. Simonson, and D. B. Joyce. Volatility of copper. Office of Scientific and Technical Information (OSTI), August 1996. http://dx.doi.org/10.2172/285269.
Повний текст джерелаZhao, L., P. E. Phelan, R. C. Niemann, and B. R. Weber. Thermal resistance across a copper/Kapton/copper interface at cryogenic temperatures. Office of Scientific and Technical Information (OSTI), September 1997. http://dx.doi.org/10.2172/554889.
Повний текст джерелаDelaney, G. D. Investigations of sediment-hosted copper and copper-uranium mineralization, Wollaston Domain. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/205407.
Повний текст джерелаKidwell, David A. Measuring Copper in Seawater - An Automated Detection of Copper Binding Capacity. Fort Belvoir, VA: Defense Technical Information Center, December 2003. http://dx.doi.org/10.21236/ada419453.
Повний текст джерела