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Дисертації з теми "Circuits imprimés – Simulation par ordinateur":
Atintoh, Ange. "Modélisation thermomécanique 3D de circuits imprimés." Electronic Thesis or Diss., Université de Lorraine, 2023. http://www.theses.fr/2023LORR0123.
The rapid changes in the industry and the increasing integration of electronics in new environments require the control of the reliability of electronic boards. The integration of electronics in severe environments within the MAPP platform (Mechatronics for the Improvement of Products and Processes) of CEA Tech Grand Est deal with this problem. In these environments, defects such as delamination and via cracking can occur in printed circuit boards (PCB). From this perspective, this thesis proposes a contribution to creating a numerical tool to prevent these defects. For a realistic modeling, the thermomechanical characterization of the different layers of the PCB has been performed through experimental tests. Nevertheless, this characterization was incomplete because of the thinness of the PCB, which motivated the implementation of a multi-scale method. An inverse method based on Mechanics of Structure Genome (MSG) was developed and implemented as a Python script. Microscopic observations were coupled to Gmsh software to create the microscopic model and then to TexGen modeling software for the mesoscopic model. The presence of inclusions inside the matrix between the yarns was confirmed by nanoindentation. The influence of yarns' geometrical parameters and phase properties was analyzed. Adapting a hybrid optimization method was implemented to minimize the discrepancies between the experimental and numerical properties. Obtained results were used to simulate the behavior of an electronic board in operation using ABAQUS/Standard finite element software. Thermomechanical tests at the board scale were implemented to validate the simulations. The comparison shows good agreement between results as predicted by both numerical and experimental approaches. The mechanical field analysis showed contrasts that could lead to thermomechanical fatigue. Nevertheless, delamination tests to feed cohesive zones at the interfaces between layers were not performed due to the small thickness
Bazzoli, Sébastien. "Caractérisation et simulation de la susceptibilité des circuits intégrés face aux risques d'inductions engendrées par des micro-ondes de forte puissance." Lille 1, 2005. https://pepite-depot.univ-lille.fr/LIBRE/Th_Num/2005/50376-2005-Bazzoli.pdf.
Egot, Stéphane. "Intégration des équipements électroniques dans la modélisation de l'architecture électrique des véhicules automobiles : application à la prédiction de compatibilité électromagnétique dans les phases amont de la conception." Lille 1, 2005. http://www.theses.fr/2005LIL10151.
This thesis deals with the elaboration and the evaluation of an integration methodology of electronic equipment in the EMC modeling of the electrical architecture in the early design phase of a vehicle. The proposed approach is based on dissociating the equipment modeling into two complementary parts involving the car manufacturer and the elctronic supplier. The feasibility of this modeling technique primarily required ton characterize the interaction between the equipment and the car body. Besides, the different factors having an influence on the validity of the model were examined as well as its needed level of precision. The latter issue was considered by taking into account the globality of the system, especially the variability brought by the random bundling of the cable harness. Finally the proposed method was evaluated by comparing statistical measurement and simulation results obtained on a realistic electronic sub-system
Linot, Fabrice. "Apport des Surfaces à Haute Impédance à la conception d'antennes réseaux compactes et d'antennes réseaux à très large bande passante." Phd thesis, Télécom ParisTech, 2011. http://pastel.archives-ouvertes.fr/pastel-00617270.
Bureau, Denis. "Conception de circuits imprimés : vers un compilateur cuivre." Compiègne, 1989. http://www.theses.fr/1989COMPD227.
We put forth a new concept : a « copper compiler ». This concept is to printed circuit boards what silicon compilers are to integrated circuits. A large part of current PCB design software is now approaching the limits of its capabilities, essentially in terms of efficiency, and printed circuits are becoming as complex as integrated circuits of a few years ago. The development of such a software tool requires an efficient router and an intelligent system to manage all the necessary modules. That’s why this thesis presents, firstly, an original gridless and internally hierarchical router along with a prototype which validates a theoretical model of a printed circuit ; and secondly, a novel software structure which permits the construction of modular expert systems which simultaneously use several types of knowledge representations. Each of these two parts is accompanied by a description of the current state of the art in the field, a comprehensive bibliography and a glossary
Benleulmi, Zoubir. "Contribution à l'inspection automatique des cartes de circuits imprimés par vision artificielle." Compiègne, 1986. http://www.theses.fr/1986COMPS143.
Zhang, Xiao Hui. "Simulation avancée des circuits micro-ondes." Paris 12, 1989. http://www.theses.fr/1989PA120040.
Legrand, Fabien. "Modélisation de circuits électrotechniques en vue de leur simulation : réalisation d'un simulateur." Bordeaux 1, 2004. http://www.theses.fr/2004BOR12790.
Dubois, Jean-Luc. "L'abstraction fonctionnelle des parties contrôles des circuits pour l'accélération de simulateurs générés : une contribution au développement d'outils de C.A.O. de l'architecture matérielle." Lille 1, 1991. http://www.theses.fr/1991LIL10037.
Crastes, de Paulet Michel Saucier Gabrièle. "Spécification et simulation fonctionnelles de circuits complexes le système CADOC /." S.l. : Université Grenoble 1, 2008. http://tel.archives-ouvertes.fr/tel-00318467.
Книги з теми "Circuits imprimés – Simulation par ordinateur":
Saeid, Moslehpour. Circuit simulation and analysis: An introduction to computer-aided circuit design using PSpice software. Newington, CT: American Radio Relay League, 2013.
Al-Hashimi, Bashir. The art of simulation using PSpice: Analog and digital. Boca Raton: CRC Press, 1995.
Rietman, Ed. Experiments in artificial neural networks. Blue Ridge Summit, PA: Tab Books, 1988.
Alary. Circuits imprimés en pratique. Dunod, 1999.
Ogrodzki, Jan. Circuit Simulation Methods and Algorithms. Taylor & Francis Group, 2018.
Ogrodzki, Jan. Circuit Simulation Methods and Algorithms. Taylor & Francis Group, 2018.
Ogrodzki, Jan. Circuit Simulation Methods and Algorithms. Taylor & Francis Group, 2018.
Ogrodzki, Jan. Circuit Simulation Methods and Algorithms. Taylor & Francis Group, 2018.
Mohindru, Pooja, and Pankaj Mohindru. Electronic Circuit Analysis Using LTSpice XVII Simulator: A Practical Guide for Beginners. Taylor & Francis Group, 2021.
Mohindru, Pooja, and Pankaj Mohindru. Electronic Circuit Analysis Using LTSpice XVII Simulator: A Practical Guide for Beginners. Taylor & Francis Group, 2021.
Тези доповідей конференцій з теми "Circuits imprimés – Simulation par ordinateur":
Elmoutawakkil, N., S. Bouzoubaa, S. Bellemkhannate, and I. Benyahya. "Flux de travail du guidage tridimensionnel en chirurgie orale." In 66ème Congrès de la SFCO. Les Ulis, France: EDP Sciences, 2020. http://dx.doi.org/10.1051/sfco/20206602005.