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Статті в журналах з теми "Chemical Process Modeling"
Byun, Ki Ryang, Jeong Won Kang, Ki Oh Song, and Ho Jung Hwang. "Atomic Scale Modeling of Chemical Mechanical Polishing Process." Journal of the Korean Institute of Electrical and Electronic Material Engineers 18, no. 5 (May 1, 2005): 414–22. http://dx.doi.org/10.4313/jkem.2005.18.5.414.
Повний текст джерелаTiong, Low Soon, and Arshad Ahmad. "A Hybrid Model for Chemical Process Modeling." IFAC Proceedings Volumes 30, no. 25 (September 1997): 163–68. http://dx.doi.org/10.1016/s1474-6670(17)41318-8.
Повний текст джерелаBhat, N. V., P. A. Minderman, T. McAvoy, and N. S. Wang. "Modeling chemical process systems via neural computation." IEEE Control Systems Magazine 10, no. 3 (April 1990): 24–30. http://dx.doi.org/10.1109/37.55120.
Повний текст джерелаBILIAIEV, М. М., V. V. BILIAIEVA, O. V. BERLOV, V. A. KOZACHYNA, and Z. M. YAKUBOVSKA. "MATHEMATICAL MODELING OF UNSTATIONARY AIR POLLUTION PROCESS." Ukrainian Journal of Civil Engineering and Architecture, no. 3 (015) (June 24, 2023): 13–19. http://dx.doi.org/10.30838/j.bpsacea.2312.140723.13.949.
Повний текст джерелаDong, Gao, Xu Xin, Zhang Beike, Ma Xin, and Wu Chongguang. "A Framework for Agent-based Chemical Process Modeling." Journal of Applied Sciences 13, no. 17 (August 15, 2013): 3490–96. http://dx.doi.org/10.3923/jas.2013.3490.3496.
Повний текст джерелаBogomolov, B. B., E. D. Bykov, V. V. Men’shikov, and A. M. Zubarev. "Organizational and technological modeling of chemical process systems." Theoretical Foundations of Chemical Engineering 51, no. 2 (March 2017): 238–46. http://dx.doi.org/10.1134/s0040579517010043.
Повний текст джерелаNie, Miaomiao, Jing Tan, Wen-Sheng Deng, and Yue-Feng Su. "Modeling Investigation of Concurrent-flow Chemical Extraction Process." Journal of Physics: Conference Series 1284 (August 2019): 012024. http://dx.doi.org/10.1088/1742-6596/1284/1/012024.
Повний текст джерелаGao, Li, and Norman W. Loney. "Evolutionary polymorphic neural network in chemical process modeling." Computers & Chemical Engineering 25, no. 11-12 (November 2001): 1403–10. http://dx.doi.org/10.1016/s0098-1354(01)00708-6.
Повний текст джерелаGau, Chao-Yang, and Mark A. Stadtherr. "New interval methodologies for reliable chemical process modeling." Computers & Chemical Engineering 26, no. 6 (June 2002): 827–40. http://dx.doi.org/10.1016/s0098-1354(02)00005-4.
Повний текст джерелаMcBride, Kevin, and Kai Sundmacher. "Overview of Surrogate Modeling in Chemical Process Engineering." Chemie Ingenieur Technik 91, no. 3 (January 3, 2019): 228–39. http://dx.doi.org/10.1002/cite.201800091.
Повний текст джерелаДисертації з теми "Chemical Process Modeling"
Shi, Ruijie. "Subspace identification methods for process dynamic modeling /." *McMaster only, 2001.
Знайти повний текст джерелаNarisaranukul, Narintr. "Modeling and analysis of the chemical milling process." Thesis, Massachusetts Institute of Technology, 1997. http://hdl.handle.net/1721.1/43425.
Повний текст джерелаSinangil, Mehmet Selcuk. "Modeling and control on an industrial polymerization process." Thesis, Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/10150.
Повний текст джерелаJohnston, Lloyd Patrick Murphy. "Probability based approaches to process data modeling and rectifictaion." Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/10913.
Повний текст джерелаKoulouris, Alexandros. "Multiresolution learning in nonlinear dynamic process modeling and control." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/11376.
Повний текст джерелаBohn, Douglas (Douglas Gorman) 1970. "Computer modeling of a continuous manufacturing process." Thesis, Massachusetts Institute of Technology, 1998. http://hdl.handle.net/1721.1/47557.
Повний текст джерелаIncludes bibliographical references.
by Douglas Bohn.
S.M.
Lai, Jiun-Yu. "Mechanics, mechanisms, and modeling of the chemical mechanical polishing process." Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/8860.
Повний текст джерелаIncludes bibliographical references.
The ever-increasing demand for high-performance microelectronic devices has motivated the semiconductor industry to design and manufacture Ultra-Large-Scale Integrated (ULSI) circuits with smaller feature size, higher resolution, denser packing, and multi-layer interconnects. The ULSI technology places stringent demands on global planarity of the Interlevel Dielectric (ILD) layers. Compared with other planarization techniques, the Chemical Mechanical Polishing (CMP) process produces excellent local and global planarization at low cost. It is thus widely adopted for planarizing inter-level dielectric (silicon dioxide) layers. Moreover, CMP is a critical process for fabricating the Cu damascene patterns, low-k dielectrics, and shallow isolated trenches. The wide range of materials to be polished concurrently or sequentially, however, increases the complexity of CMP and necessitates an understanding of the process fundamentals for optimal process design. This thesis establishes a theoretical framework to relate the process parameters to the different wafer/pad contact modes to study the behavior of wafer-scale polishing. Several models of polishing - microcutting, brittle fracture, surface melting and burnishing - are reviewed. Blanket wafers coated with a wide range of materials are polished to verify the models. Plastic deformation is identified as the dominant mechanism of material removal in fine abrasive polishing.
(cont.) Additionally, contact mechanics models, which relate the pressure distribution to the pattern geometry and pad elastic properties, explain the die-scale variation of material removal rate (MRR) on pattern geometry. The pad displacement into low features of submicron lines is less than 0.1 nm. Hence the applied load is only carried by the high features, and the pressure on high features increases with the area fraction of interconnects. Experiments study the effects of pattern geometry on the rates of pattern planarization, oxide overpolishing and Cu dishing. It was observed that Cu dishing of submicron features is less than 20 nm and contributes less to surface non-uniformity than does oxide overpolishing. Finally, a novel in situ detection technique, based on the change of the reflectance of the patterned surface at different polishing stages, is developed to detect the process endpoint and minimize overpolishing. Models that employ light scattering theory and statistical treatment correlate the sampled reflectance with the surface topography and Cu area fraction for detecting the process regime and endpoint. The experimental results agree well with the endpoint detection schemes predicted by the models.
by Jiun-Yu Lai.
Ph.D.
Bakshi, Bhavik Ramesh. "Multi-resolution methods for modeling, analysis and control of chemical process operations." Thesis, Massachusetts Institute of Technology, 1992. http://hdl.handle.net/1721.1/13203.
Повний текст джерелаBryden, Michelle D. (Michelle Denise). "Macrotransport process in branching networks : modeling convective-diffusive phenomena in the lung." Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/33514.
Повний текст джерелаJi, Qingjun. "Mathematical modeling of carbon black process from coal." Ohio : Ohio University, 2000. http://www.ohiolink.edu/etd/view.cgi?ohiou1172255200.
Повний текст джерелаКниги з теми "Chemical Process Modeling"
Denn, Morton M. Process modeling. New York: Longman, 1986.
Знайти повний текст джерелаProcess modeling. Harlow: Longman Scientific & Technical, 1987.
Знайти повний текст джерелаGeorgiadis, Michael C., Julio R. Banga, and Efstratios N. Pistikopoulos. Dynamic process modeling. Weinheim: Wiley-VCH, 2011.
Знайти повний текст джерелаProcess dynamics: Modeling, analysis, and simulation. Upper Saddle River, N.J: Prentice Hall PTR, 1998.
Знайти повний текст джерелаGeorgiadis, Michael C. Dynamic process modeling. Weinheim: Wiley-VCH, 2011.
Знайти повний текст джерела1940-, Ray W. Harmon, ed. Process dynamics, modeling, and control. New York: Oxford University Press, 1994.
Знайти повний текст джерелаProcess modeling, simulation, and control for chemical engineers. 2nd ed. New York: McGraw-Hill, 1990.
Знайти повний текст джерелаE, Schiesser W., ed. Dynamic modeling of transport process systems. San Diego: Academic Press, 1992.
Знайти повний текст джерелаUpreti, Simant Ranjan. Process Modeling and Simulation for Chemical Engineers. Chichester, UK: John Wiley & Sons, Ltd, 2017. http://dx.doi.org/10.1002/9781118914670.
Повний текст джерелаGhasem, Nayef. Modeling and Simulation of Chemical Process Systems. Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018.: CRC Press, 2018. http://dx.doi.org/10.1201/b22487.
Повний текст джерелаЧастини книг з теми "Chemical Process Modeling"
am Ende, Mary T., William Ketterhagen, Andrew Prpich, Pankaj Doshi, Salvador García-Muñoz, and Rahul Bharadwajh. "DRUG PRODUCT PROCESS MODELING." In Chemical Engineering in the Pharmaceutical Industry, 489–525. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2019. http://dx.doi.org/10.1002/9781119600800.ch70.
Повний текст джерелаSharma, Shivom, and G. P. Rangaiah. "Mathematical Modeling, Simulation and Optimization for Process Design." In Chemical Process Retrofitting and Revamping, 97–127. Chichester, UK: John Wiley & Sons, Ltd, 2016. http://dx.doi.org/10.1002/9781119016311.ch4.
Повний текст джерелаSimpson, Ricardo, and Sudhir K. Sastry. "Fundamentals of Mathematical Modeling, Simulation, and Process Control." In Chemical and Bioprocess Engineering, 245–60. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-9126-2_9.
Повний текст джерелаChen, Chau-Chyun. "Molecular Thermodynamics for Pharmaceutical Process Modeling and Simulation." In Chemical Engineering in the Pharmaceutical Industry, 505–19. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470882221.ch27.
Повний текст джерелаGhasem, Nayef. "Introduction." In Modeling and Simulation of Chemical Process Systems, 1–38. Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018.: CRC Press, 2018. http://dx.doi.org/10.1201/b22487-1.
Повний текст джерелаGhasem, Nayef. "Lumped Parameter Systems." In Modeling and Simulation of Chemical Process Systems, 39–105. Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018.: CRC Press, 2018. http://dx.doi.org/10.1201/b22487-2.
Повний текст джерелаGhasem, Nayef. "Theory and Applications of Distributed Systems." In Modeling and Simulation of Chemical Process Systems, 107–53. Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018.: CRC Press, 2018. http://dx.doi.org/10.1201/b22487-3.
Повний текст джерелаGhasem, Nayef. "Computational Fluid Dynamics." In Modeling and Simulation of Chemical Process Systems, 155–221. Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018.: CRC Press, 2018. http://dx.doi.org/10.1201/b22487-4.
Повний текст джерелаGhasem, Nayef. "Mass Transport of Distributed Systems." In Modeling and Simulation of Chemical Process Systems, 223–72. Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018.: CRC Press, 2018. http://dx.doi.org/10.1201/b22487-5.
Повний текст джерелаGhasem, Nayef. "Heat Transfer Distributed Parameter Systems." In Modeling and Simulation of Chemical Process Systems, 273–361. Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018.: CRC Press, 2018. http://dx.doi.org/10.1201/b22487-6.
Повний текст джерелаТези доповідей конференцій з теми "Chemical Process Modeling"
Baharev, Ali, and Arnold Neumaier. "Chemical Process Modeling in Modelica." In 9th International MODELICA Conference, Munich, Germany. Linköping University Electronic Press, 2012. http://dx.doi.org/10.3384/ecp12076955.
Повний текст джерелаR. Stoyanov, Stanislav, and Andriy Kovalenko. "Multiscale Computational Modeling: From Heavy Petroleum to Biomass Valorization." In Annual International Conference on Chemistry, Chemical Engineering and Chemical Process. Global Science & Technology Forum (GSTF), 2015. http://dx.doi.org/10.5176/2301-3761_ccecp15.48.
Повний текст джерелаYu, Wen, and Francisco J. Pineda. "Chemical process modeling with multiple neural networks." In 2001 European Control Conference (ECC). IEEE, 2001. http://dx.doi.org/10.23919/ecc.2001.7076515.
Повний текст джерелаKamchaddaskorn, Atthadej, Nalinee Mukdasanit, and Thongchai Srinophakun. "Process Modeling and Simulation of Cyclohexanone Production." In The 3rd World Congress on Mechanical, Chemical, and Material Engineering. Avestia Publishing, 2017. http://dx.doi.org/10.11159/iccpe17.118.
Повний текст джерелаLin, Po Ting, Yogesh Jaluria, and Hae Chang Gea. "Parametric Modeling and Optimization of Chemical Vapor Deposition Process." In ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2008. http://dx.doi.org/10.1115/detc2008-50054.
Повний текст джерелаZographos, Nikolas, Christoph Zechner, Pedro Castrillo, and Ignacio Martin-Bragado. "Process modeling of chemical and stress effects in SiGe." In ION IMPLANTATION TECHNOLOGY 2012: Proceedings of the 19th International Conference on Ion Implantation Technology. AIP, 2012. http://dx.doi.org/10.1063/1.4766526.
Повний текст джерелаChojnowski, Krystian, Piotr Wasilewski, and Rafał Grądzki. "Movement modeling of mobile robot in MegaSumo category." In 2ND INTERNATIONAL CONFERENCE ON CHEMISTRY, CHEMICAL PROCESS AND ENGINEERING (IC3PE). Author(s), 2018. http://dx.doi.org/10.1063/1.5066472.
Повний текст джерелаShao, Hua, Panpan Lai, Junjie Li, Guobin Bai, Qi Yan, Junfeng Li, Tao Yang, Rui Chen, and Yayi Wei. "Modeling of SiNx growth by chemical vapor deposition in nanosheet indentation." In Advanced Etch Technology and Process Integration for Nanopatterning XII, edited by Efrain Altamirano-Sánchez and Nihar Mohanty. SPIE, 2023. http://dx.doi.org/10.1117/12.2658152.
Повний текст джерела"Computational Fluid Dynamics Modeling of Mixing Process for Two-Components Mixture in the Large Scale Reactor." In Chemical technology and engineering. Lviv Polytechnic National University, 2021. http://dx.doi.org/10.23939/cte2021.01.038.
Повний текст джерелаRao, S. Rama, C. R. M. Sravan, V. Pandu Ranga, and G. Padmanabhan. "Fuzzy logic-based forward modeling of Electro Chemical Machining process." In 2009 World Congress on Nature & Biologically Inspired Computing (NaBIC). IEEE, 2009. http://dx.doi.org/10.1109/nabic.2009.5393708.
Повний текст джерелаЗвіти організацій з теми "Chemical Process Modeling"
Martino, C., D. Herman, J. Pike, and T. Peters. ACTINIDE REMOVAL PROCESS SAMPLE ANALYSIS, CHEMICAL MODELING, AND FILTRATION EVALUATION. Office of Scientific and Technical Information (OSTI), June 2014. http://dx.doi.org/10.2172/1134065.
Повний текст джерелаXu, Dikai, Yu-Yen Chen, Jianhua Pan, Yitao Zhang, Dawei Wang, Yaswanth Pottimurthy, Thomas J. Flynn, et al. Heat Integration Optimization and Dynamic Modeling Investigation for Advancing the Coal-Direct Chemical Looping Process. Office of Scientific and Technical Information (OSTI), April 2020. http://dx.doi.org/10.2172/1608820.
Повний текст джерелаNechypurenko, Pavlo, Tetiana Selivanova, and Maryna Chernova. Using the Cloud-Oriented Virtual Chemical Laboratory VLab in Teaching the Solution of Experimental Problems in Chemistry of 9th Grade Students. [б. в.], June 2019. http://dx.doi.org/10.31812/123456789/3175.
Повний текст джерелаMorkun, Volodymyr, Natalia Morkun, Andrii Pikilnyak, Serhii Semerikov, Oleksandra Serdiuk, and Irina Gaponenko. The Cyber-Physical System for Increasing the Efficiency of the Iron Ore Desliming Process. CEUR Workshop Proceedings, April 2021. http://dx.doi.org/10.31812/123456789/4373.
Повний текст джерелаSeale, Maria, R. Salter, Natàlia Garcia-Reyero,, and Alicia Ruvinsky. A fuzzy epigenetic model for representing degradation in engineered systems. Engineer Research and Development Center (U.S.), September 2022. http://dx.doi.org/10.21079/11681/45582.
Повний текст джерелаBanks, H. T. Modeling Validation and Control of Advanced Chemical Vapor Deposition Processes. Fort Belvoir, VA: Defense Technical Information Center, November 2000. http://dx.doi.org/10.21236/ada384359.
Повний текст джерелаMojdeh Delshad, Gary A. Pope, and Kamy Sepehrnoori. Modeling Wettability Alteration using Chemical EOR Processes in Naturally Fractured Reservoirs. Office of Scientific and Technical Information (OSTI), September 2007. http://dx.doi.org/10.2172/927590.
Повний текст джерелаZhylenko, Tetyana I., Ivan S. Koziy, Vladyslav S. Bozhenko, and Irina A. Shuda. Using a web application to realize the effect of AR in assessing the environmental impact of emissions source. [б. в.], November 2020. http://dx.doi.org/10.31812/123456789/4408.
Повний текст джерелаErsoy, Daniel. 693JK31810003 Non-Destructive Tools for Surface to Bulk Correlations of Yield Strength Toughness and Chemistry. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), February 2022. http://dx.doi.org/10.55274/r0012206.
Повний текст джерелаYou, Siming, Ondřej Mašek, Bauyrzhan Biakhmetov, Simon Ascher, Sudeshna Lahiri, PreetiChaturvedi Bhargava, Thallada Bhaskar, Supravat Sarangi, and Sunita Varjani. Feasibility and impacts of Bioenergy Trigeneration systems (BioTrig) in disadvantaged rural areas in India. University of Glasgow, August 2023. http://dx.doi.org/10.36399/gla.pubs.305660.
Повний текст джерела