Статті в журналах з теми "Transient thermal management"
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Ghebru, Daniel. "Thermal Simulation of the Complete Vehicle — Evaluation of Transient Thermal Management." ATZ worldwide 116, no. 7-8 (July 2014): 50–55. http://dx.doi.org/10.1007/s38311-014-0207-y.
Повний текст джерелаShen, Weijan, and Fock-Lai Tan. "Thermal management of mobile devices." Thermal Science 14, no. 1 (2010): 115–24. http://dx.doi.org/10.2298/tsci1001115s.
Повний текст джерелаZhang, TieJun. "TRANSIENT CHARACTERISTICS AND CONTROL OF ACTIVE THERMAL MANAGEMENT SYSTEMS." Annual Review of Heat Transfer 18 (2015): 245–328. http://dx.doi.org/10.1615/annualrevheattransfer.2015012305.
Повний текст джерелаZao Liu, Sheldon X.-D. Tan, Xin Huang, and Hai Wang. "Task Migrations for Distributed Thermal Management Considering Transient Effects." IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23, no. 2 (February 2015): 397–401. http://dx.doi.org/10.1109/tvlsi.2014.2309331.
Повний текст джерелаCagnon, Hugo, Thierry Vidal, Alain Sellier, and Jean Michel Torrenti. "Transient Thermal Creep at Moderate Temperature." Key Engineering Materials 711 (September 2016): 885–91. http://dx.doi.org/10.4028/www.scientific.net/kem.711.885.
Повний текст джерелаDing, Li, Lamei Che, Yumin Zhang, Hailin Cao, Xiaohong Hao, and Weihua Xie. "The transient temperature field simulation of the micro-grid inverter." Thermal Science 22, Suppl. 2 (2018): 391–99. http://dx.doi.org/10.2298/tsci170930251d.
Повний текст джерелаChang, Norman. "(Invited, Digital Presentation) ML-Based Fast on-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs." ECS Meeting Abstracts MA2022-02, no. 17 (October 9, 2022): 847. http://dx.doi.org/10.1149/ma2022-0217847mtgabs.
Повний текст джерелаLi, S., J. Y. Wu, R. Z. Wang, and Y. Huangfu. "Investigation of transient behavior of a novel thermal management controller." Applied Thermal Engineering 28, no. 8-9 (June 2008): 824–34. http://dx.doi.org/10.1016/j.applthermaleng.2007.07.014.
Повний текст джерелаAzzam, H. "Mathematical networks for thermal transient and non-transient progressive fatigue of engine components." Proceedings of the Institution of Mechanical Engineers, Part G: Journal of Aerospace Engineering 212, no. 2 (February 1, 1998): 125–36. http://dx.doi.org/10.1243/0954410981532199.
Повний текст джерелаHodes, Marc, Randy D. Weinstein, Stephen J. Pence, Jason M. Piccini, Lou Manzione, and Calvin Chen. "Transient Thermal Management of a Handset Using Phase Change Material (PCM)." Journal of Electronic Packaging 124, no. 4 (December 1, 2002): 419–26. http://dx.doi.org/10.1115/1.1523061.
Повний текст джерелаChuttar, Aditya, and Debjyoti Banerjee. "Machine Learning (ML) Based Thermal Management for Cooling of Electronics Chips by Utilizing Thermal Energy Storage (TES) in Packaging That Leverages Phase Change Materials (PCM)." Electronics 10, no. 22 (November 13, 2021): 2785. http://dx.doi.org/10.3390/electronics10222785.
Повний текст джерелаPatil, Jeet P., Vilas Nandedkar, Sushil Mishra, and Sandip K. Saha. "Transient thermal analysis of close pressure thermoforming process." Journal of Manufacturing Processes 62 (February 2021): 513–22. http://dx.doi.org/10.1016/j.jmapro.2020.12.057.
Повний текст джерелаHartsfield, Carl R., Travis E. Shelton, Brian O. Palmer, and Ryan O’Hara. "All-Metallic Phase Change Thermal Management Systems for Transient Spacecraft Loads." Journal of Aerospace Engineering 33, no. 4 (July 2020): 04020039. http://dx.doi.org/10.1061/(asce)as.1943-5525.0001150.
Повний текст джерелаDing, Shuiting, Ziyao Wang, Guo Li, Chuankai Liu, and Liu Yang. "Transient stress control of aeroengine disks based on active thermal management." Applied Thermal Engineering 103 (June 2016): 16–27. http://dx.doi.org/10.1016/j.applthermaleng.2016.03.121.
Повний текст джерелаHegab, Hisham E., Eric B. Zimmerman, and Gene T. Colwell. "Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers." Journal of Electronic Packaging 124, no. 1 (March 1, 2002): 7–11. http://dx.doi.org/10.1115/1.1392320.
Повний текст джерелаLiu, Yiqun, Y. Gene Liao, and Ming-Chia Lai. "Transient Temperature Distributions on Lithium-Ion Polymer SLI Battery." Vehicles 1, no. 1 (July 25, 2019): 127–37. http://dx.doi.org/10.3390/vehicles1010008.
Повний текст джерелаYee, Cheang Soon, G. A. Quadir, Z. A. Zainal, and K. N. Seetharamu. "Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 2." Journal of Microelectronics and Electronic Packaging 2, no. 2 (April 1, 2005): 98–109. http://dx.doi.org/10.4071/1551-4897-2.2.98.
Повний текст джерелаThenmozhi, R., C. Sharmeela, P. Natarajan, and R. Velraj. "Transient thermal management comparison of a microprocessor using PCMs in various configurations." Journal of Thermal Science 20, no. 6 (November 6, 2011): 516–20. http://dx.doi.org/10.1007/s11630-011-0504-3.
Повний текст джерелаYee, Cheang Soon, K. N. Seetharamu, G. A. Quadir, and Z. A. Zainal. "Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 1." Journal of Microelectronics and Electronic Packaging 2, no. 1 (January 1, 2005): 40–54. http://dx.doi.org/10.4071/1551-4897-2.1.40.
Повний текст джерелаGuo, Huaixin, Tangsheng Chen, and Shang Shi. "Transient Simulation for the Thermal Design Optimization of Pulse Operated AlGaN/GaN HEMTs." Micromachines 11, no. 1 (January 9, 2020): 76. http://dx.doi.org/10.3390/mi11010076.
Повний текст джерелаWang, Tae Joong, Duk Sang Kim, and Tae Shik Ahn. "Simulation study on improving the selective catalytic reduction efficiency by using the temperature rise in a non-road transient cycle." Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering 231, no. 6 (August 29, 2016): 810–27. http://dx.doi.org/10.1177/0954407016664620.
Повний текст джерелаShi, Yingli, Junyun Ji, Yafei Yin, Yuhang Li, and Yufeng Xing. "Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate." Applied Mathematics and Mechanics 41, no. 11 (October 19, 2020): 1599–610. http://dx.doi.org/10.1007/s10483-020-2671-7.
Повний текст джерелаKrishnan, Shankar, and Suresh V. Garimella. "Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?" Journal of Electronic Packaging 126, no. 3 (September 1, 2004): 308–16. http://dx.doi.org/10.1115/1.1772411.
Повний текст джерелаVolle, Fabien, Suresh V. Garimella, and Mark A. Juds. "Thermal Management of a Soft Starter: Transient Thermal Impedance Model and Performance Enhancements Using Phase Change Materials." IEEE Transactions on Power Electronics 25, no. 6 (June 2010): 1395–405. http://dx.doi.org/10.1109/tpel.2010.2040632.
Повний текст джерелаZhu, Yue, Yidong Fang, Lin Su, and Fei Ye. "Experimental investigation of start‐up and transient thermal performance of pumped two‐phase battery thermal management system." International Journal of Energy Research 44, no. 14 (August 19, 2020): 11372–84. http://dx.doi.org/10.1002/er.5757.
Повний текст джерелаLiu, Xianfei, Zirui Zhang, Fang Wang, Hui Zhang, Zhiqiang Li, Caixia Zhu, Doudou Zhao, Yuhang Liu, and Hao Jiang. "Transient thermal analysis of the thermal management of high-power fast charging module using phase change material." Energy Reports 9 (December 2023): 1333–41. http://dx.doi.org/10.1016/j.egyr.2022.12.055.
Повний текст джерелаHadia, Fofana Gaoussou, and You Tong Zhang. "Thermal Management Simulation of Lithium Ion Batteries for EV/HEV." Applied Mechanics and Materials 457-458 (October 2013): 350–53. http://dx.doi.org/10.4028/www.scientific.net/amm.457-458.350.
Повний текст джерелаAvila, R., J. Cervantes, and C. Estrada-Gasca. "Transient thermal response in nuclear waste repositories." Nuclear Engineering and Design 198, no. 3 (June 2000): 307–16. http://dx.doi.org/10.1016/s0029-5493(99)00311-8.
Повний текст джерелаCastellazzi, A., and M. Ciappa. "Novel simulation approach for transient analysis and reliable thermal management of power devices." Microelectronics Reliability 48, no. 8-9 (August 2008): 1500–1504. http://dx.doi.org/10.1016/j.microrel.2008.07.041.
Повний текст джерелаNarayanan, Shankar. "A dynamically controllable evaporative cooling system for thermal management of transient heat loads." International Journal of Heat and Mass Transfer 148 (February 2020): 119098. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2019.119098.
Повний текст джерелаBen Salah, Sana, and Mohamed Bechir Ben Hamida. "Alternate PCM with air cavities in LED heat sink for transient thermal management." International Journal of Numerical Methods for Heat & Fluid Flow 29, no. 11 (November 4, 2019): 4377–93. http://dx.doi.org/10.1108/hff-02-2019-0099.
Повний текст джерелаVesligaj, M. J., and C. H. Amon. "Transient thermal management of temperature fluctuations during time varying workloads on portable electronics." IEEE Transactions on Components and Packaging Technologies 22, no. 4 (1999): 541–50. http://dx.doi.org/10.1109/6144.814970.
Повний текст джерелаShi, Zhaochun, Guohua Wang, Chunli Liu, Qiang Lv, Baoli Gong, Yingchao Zhang, and Yuying Yan. "Optimizing the Transient Performance of Thermoelectric Generator with PCM by Taguchi Method." Energies 16, no. 2 (January 10, 2023): 805. http://dx.doi.org/10.3390/en16020805.
Повний текст джерелаAskar, Serena, Shahram Fotowat, Mahdi Momeni, and Amir Fartaj. "Transient experimental study of a latent heat thermal energy storage in a heat exchanger for effective thermal management." Journal of Energy Storage 55 (November 2022): 105680. http://dx.doi.org/10.1016/j.est.2022.105680.
Повний текст джерелаZhao, H., J. A. Souza, and J. C. Ordonez. "THERMAL MODEL FOR ELECTROMAGNETIC LAUNCHERS." Revista de Engenharia Térmica 7, no. 2 (December 31, 2008): 60. http://dx.doi.org/10.5380/reterm.v7i2.61779.
Повний текст джерелаBaddour, R. E. "Computer simulation of ice control with thermal-bubble plumes — line source configuration." Canadian Journal of Civil Engineering 17, no. 4 (August 1, 1990): 509–13. http://dx.doi.org/10.1139/l90-058.
Повний текст джерелаMajumdar, Rudrodip, Sandip K. Saha, and Suneet Singh. "Evaluation of transient characteristics of medium temperature solar thermal systems utilizing thermal stratification." Applied Energy 224 (August 2018): 69–85. http://dx.doi.org/10.1016/j.apenergy.2018.04.083.
Повний текст джерелаNémeth, Márton, and András Poppe. "Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment." Periodica Polytechnica Electrical Engineering and Computer Science 62, no. 1 (February 15, 2018): 1–15. http://dx.doi.org/10.3311/ppee.11058.
Повний текст джерелаShamberger, Patrick J., and Nickolaus M. Bruno. "Review of metallic phase change materials for high heat flux transient thermal management applications." Applied Energy 258 (January 2020): 113955. http://dx.doi.org/10.1016/j.apenergy.2019.113955.
Повний текст джерелаLipeng Cao, J. P. Krusius, M. A. Korhonen, and T. S. Fisher. "Transient thermal management of portable electronics using heat storage and dynamic power dissipation control." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 21, no. 1 (March 1998): 113–23. http://dx.doi.org/10.1109/95.679040.
Повний текст джерелаHuang, Yuqi, Shun Wang, Yiji Lu, Rui Huang, and Xiaoli Yu. "Study on a liquid cooled battery thermal management system pertaining to the transient regime." Applied Thermal Engineering 180 (November 2020): 115793. http://dx.doi.org/10.1016/j.applthermaleng.2020.115793.
Повний текст джерелаFulpagare, Yogesh, Yogendra Joshi, and Atul Bhargav. "Rack level transient CFD modeling of data center." International Journal of Numerical Methods for Heat & Fluid Flow 28, no. 2 (February 5, 2018): 381–94. http://dx.doi.org/10.1108/hff-10-2016-0426.
Повний текст джерелаIqbal, Saqib, Jianwei Tang, Gulfam Raza, Izzat Iqbal Cheema, Mohsin Ali Kazmi, Zirui Li, Baoming Wang, and Yong Liu. "Experimental and Numerical Analyses of Thermal Storage Tile-Bricks for Efficient Thermal Management of Buildings." Buildings 11, no. 8 (August 17, 2021): 357. http://dx.doi.org/10.3390/buildings11080357.
Повний текст джерелаRaypah, Muna E., Dheepan M.K., Mutharasu Devarajan, Shanmugan Subramani, and Fauziah Sulaiman. "Variation of thermal resistance with input current and ambient temperature in low-power SMD LED." Microelectronics International 35, no. 1 (January 2, 2018): 1–11. http://dx.doi.org/10.1108/mi-08-2016-0055.
Повний текст джерелаCao, Shubo, Shiyu Zhou, Jiying Liu, Xiaoping Liu, and Yucheng Zhou. "Wood classification study based on thermal physical parameters with intelligent method of artificial neural networks." BioResources 17, no. 1 (January 5, 2022): 1187–204. http://dx.doi.org/10.15376/biores.17.1.1187-1204.
Повний текст джерелаMaity, Srijeeta, Anirban Ghose, Soumyajit Dey, and Swarnendu Biswas. "Thermal-aware Adaptive Platform Management for Heterogeneous Embedded Systems." ACM Transactions on Embedded Computing Systems 20, no. 5s (October 31, 2021): 1–28. http://dx.doi.org/10.1145/3477028.
Повний текст джерелаOrtega Guerrero, Marcos Adrián. "Numerical Analysis of the Groundwater Flow System and Heat Transport for Sustainable Water Management in a Regional Semi-Arid Basin in Central Mexico." Water 14, no. 9 (April 24, 2022): 1377. http://dx.doi.org/10.3390/w14091377.
Повний текст джерелаOrtega Guerrero, Marcos Adrián. "Numerical Analysis of the Groundwater Flow System and Heat Transport for Sustainable Water Management in a Regional Semi-Arid Basin in Central Mexico." Water 14, no. 9 (April 24, 2022): 1377. http://dx.doi.org/10.3390/w14091377.
Повний текст джерелаKrishnan, S., S. V. Garimella, and S. S. Kang. "A novel hybrid heat sink using phase change materials for transient thermal management of electronics." IEEE Transactions on Components and Packaging Technologies 28, no. 2 (June 2005): 281–89. http://dx.doi.org/10.1109/tcapt.2005.848534.
Повний текст джерелаRahmani, Mohamed Ali, Rebei Bel Fdhila, Asa Gronqvist, Magnus Tysell, Torbjorn L. Persson, Miroslaw Benendo, and Zacharias Uvgard. "Thermal Management and Design Optimization of Heatsink for Cooling Performance Improvement During Transient Heat Generation." Energy Procedia 61 (2014): 1665–68. http://dx.doi.org/10.1016/j.egypro.2014.12.187.
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