Добірка наукової літератури з теми "Transient thermal management"
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Статті в журналах з теми "Transient thermal management"
Ghebru, Daniel. "Thermal Simulation of the Complete Vehicle — Evaluation of Transient Thermal Management." ATZ worldwide 116, no. 7-8 (July 2014): 50–55. http://dx.doi.org/10.1007/s38311-014-0207-y.
Повний текст джерелаShen, Weijan, and Fock-Lai Tan. "Thermal management of mobile devices." Thermal Science 14, no. 1 (2010): 115–24. http://dx.doi.org/10.2298/tsci1001115s.
Повний текст джерелаZhang, TieJun. "TRANSIENT CHARACTERISTICS AND CONTROL OF ACTIVE THERMAL MANAGEMENT SYSTEMS." Annual Review of Heat Transfer 18 (2015): 245–328. http://dx.doi.org/10.1615/annualrevheattransfer.2015012305.
Повний текст джерелаZao Liu, Sheldon X.-D. Tan, Xin Huang, and Hai Wang. "Task Migrations for Distributed Thermal Management Considering Transient Effects." IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23, no. 2 (February 2015): 397–401. http://dx.doi.org/10.1109/tvlsi.2014.2309331.
Повний текст джерелаCagnon, Hugo, Thierry Vidal, Alain Sellier, and Jean Michel Torrenti. "Transient Thermal Creep at Moderate Temperature." Key Engineering Materials 711 (September 2016): 885–91. http://dx.doi.org/10.4028/www.scientific.net/kem.711.885.
Повний текст джерелаDing, Li, Lamei Che, Yumin Zhang, Hailin Cao, Xiaohong Hao, and Weihua Xie. "The transient temperature field simulation of the micro-grid inverter." Thermal Science 22, Suppl. 2 (2018): 391–99. http://dx.doi.org/10.2298/tsci170930251d.
Повний текст джерелаChang, Norman. "(Invited, Digital Presentation) ML-Based Fast on-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs." ECS Meeting Abstracts MA2022-02, no. 17 (October 9, 2022): 847. http://dx.doi.org/10.1149/ma2022-0217847mtgabs.
Повний текст джерелаLi, S., J. Y. Wu, R. Z. Wang, and Y. Huangfu. "Investigation of transient behavior of a novel thermal management controller." Applied Thermal Engineering 28, no. 8-9 (June 2008): 824–34. http://dx.doi.org/10.1016/j.applthermaleng.2007.07.014.
Повний текст джерелаAzzam, H. "Mathematical networks for thermal transient and non-transient progressive fatigue of engine components." Proceedings of the Institution of Mechanical Engineers, Part G: Journal of Aerospace Engineering 212, no. 2 (February 1, 1998): 125–36. http://dx.doi.org/10.1243/0954410981532199.
Повний текст джерелаHodes, Marc, Randy D. Weinstein, Stephen J. Pence, Jason M. Piccini, Lou Manzione, and Calvin Chen. "Transient Thermal Management of a Handset Using Phase Change Material (PCM)." Journal of Electronic Packaging 124, no. 4 (December 1, 2002): 419–26. http://dx.doi.org/10.1115/1.1523061.
Повний текст джерелаДисертації з теми "Transient thermal management"
Green, Craig Elkton. "Composite thermal capacitors for transient thermal management of multicore microprocessors." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44772.
Повний текст джерелаDonovan, Adam. "Vehicle Level Transient Aircraft Thermal Management Modeling and Simulation." Wright State University / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=wright1472236965.
Повний текст джерелаSvantesson, Einar. "Transient thermal management simulations of complete heavy-duty vehicles." Thesis, KTH, Mekanik, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-266464.
Повний текст джерелаMustaffar, Ahmad Fadhlan Bin. "Irregular aluminium foam and phase change material composite in transient thermal management." Thesis, University of Newcastle upon Tyne, 2016. http://hdl.handle.net/10443/3338.
Повний текст джерелаPark, Je-Hyoung. "East chip-level static and transient thermal analysis method for thermal management of VLSI ICs in packages /." Diss., Digital Dissertations Database. Restricted to UC campuses, 2009. http://uclibs.org/PID/11984.
Повний текст джерелаMadrid, Lozano Francesc. "Thermal Conductivity and Specific Heat Measurements for Power Electronics Packaging Materials. Effective Thermal Conductivity Steady State and Transient Thermal Parameter Identification Methods." Doctoral thesis, Universitat Autònoma de Barcelona, 2005. http://hdl.handle.net/10803/5348.
Повний текст джерелаButt, Nathaniel J. "Development and Thermal Management of a Dynamically Efficient, Transient High Energy Pulse System Model." Wright State University / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=wright1527602141695356.
Повний текст джерелаAhmed, Saad Verfasser], Hermann [Gutachter] [Rottengruber, and Dominique [Gutachter] Thévenin. "Modular methodology for transient vehicle thermal management simulations / Saad Ahmed ; Gutachter: Hermann Rottengruber, Dominique Thévenin." Magdeburg : Universitätsbibliothek Otto-von-Guericke-Universität, 2021. http://d-nb.info/1238779964/34.
Повний текст джерелаRao, P. Sharath Chandra. "Analysis of fluid circulation in a spherical cryogenic storage tank and conjugate heat transfer in a circular microtube." [Tampa, Fla.] : University of South Florida, 2004. http://purl.fcla.edu/fcla/etd/SFE0000461.
Повний текст джерелаHsu, Tien-Liang, and 許天亮. "Study of static and transient thermal management for green power electronics device." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/gw6937.
Повний текст джерела國立交通大學
機械工程系所
104
AlGaN/GaN power transistors, compared to conventional silicon-based transistors, have characteristics of high electron mobility, high breakdown voltage, suitable for operating at high power and high frequency conductions. Temperature has significant influence on both performance and reliability of semiconductor devices. However, the thermal conductivity of GaN (130W/m-K) is lower than silicon carbide(490W/m-K).The increasing of the active region temperature will reduce crucial device parameters. Thus, the packaging design of the component must have good thermal management. In this research, the Transient Dual Interface Measurement Procedure to calculate steady state thermal resistance through simulation is proposed. We also present the short time thermal transient measurement method and the structure function to analyze packed GaN transistor. Finally, T3ster measurement experiment and the result of simulation are compared to verify the correctness of proposed thermal simulation procedure for power device packaging design.
Книги з теми "Transient thermal management"
Nagy, Istvan. VR1 in inflammatory thermal hyperalgesia. Edited by Paul Farquhar-Smith, Pierre Beaulieu, and Sian Jagger. Oxford University Press, 2018. http://dx.doi.org/10.1093/med/9780198834359.003.0028.
Повний текст джерелаЧастини книг з теми "Transient thermal management"
Liu, Daguang, John Barrett, and Séan Cian Ó. Mathúna. "Investigation of Die Attach Integrity Using Transient Thermal Analysis Techniques." In Thermal Management of Electronic Systems, 297–306. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_27.
Повний текст джерелаKlemm, David, Wolfgang Rößner, Nils Widdecke, and Jochen Wiedemann. "Approach for the Transient Thermal Modeling of a Vehicle Cabin." In Energy and Thermal Management, Air-Conditioning, and Waste Heat Utilization, 101–18. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-030-00819-2_8.
Повний текст джерелаPagani, Santiago, Jian-Jia Chen, Muhammad Shafique, and Jörg Henkel. "Transient and Peak Temperature Computation Based on Matrix Exponentials (MatEx)." In Advanced Techniques for Power, Energy, and Thermal Management for Clustered Manycores, 93–109. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-77479-4_6.
Повний текст джерелаRaad, Peter E., Pavel L. Komarov, and Travis L. Sandy. "The transient thermoreflectance approach for high-resolution temperature mapping of GaN devices." In Thermal Management of Gallium Nitride Electronics, 231–50. Elsevier, 2022. http://dx.doi.org/10.1016/b978-0-12-821084-0.00007-x.
Повний текст джерела"Cooling system simulation for an off-road machine under transient conditions." In Vehicle Thermal Management Systems Conference Proceedings (VTMS11), 165–82. Elsevier, 2013. http://dx.doi.org/10.1533/9780857094735.4.165.
Повний текст джерелаWang, Z., J. Han, A. Alajbegovic, T. Kuthada, T. Stoll, C. Makens, and T. Schwenn. "Long term transient cabin heating simulation with multiple fluid node approach." In Vehicle Thermal Management Systems Conference Proceedings (VTMS11), 319–33. Elsevier, 2013. http://dx.doi.org/10.1533/9780857094735.7.319.
Повний текст джерелаLury, S. "Factors affecting transient cooling system performance for arduous drive cycles." In Vehicle Thermal Management Systems Conference and Exhibition (VTMS10), 537–47. Elsevier, 2011. http://dx.doi.org/10.1533/9780857095053.7.537.
Повний текст джерелаGullberg, P., R. Sengupta, and K. Horrigan. "Transient fan modelling and effects of blade deformation in a truck cooling fan installation." In Vehicle Thermal Management Systems Conference Proceedings (VTMS11), 219–27. Elsevier, 2013. http://dx.doi.org/10.1533/9780857094735.5.219.
Повний текст джерелаWen, John T., Daniel T. Pollock, and Zehao Yang. "Hierarchical Systems Level Thermal Management for Multiple High Transient Heat Loads." In Encyclopedia of Two-Phase Heat Transfer and Flow III, 39–90. WORLD SCIENTIFIC, 2018. http://dx.doi.org/10.1142/9789813229464_0003.
Повний текст джерелаIyengar, Madhusudan, Karl J. L. Geisler, Bahgat Sammakia, and Avram Bar-Cohen. "An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges." In Encyclopedia of Thermal Packaging, 197–209. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814327664_0009.
Повний текст джерелаТези доповідей конференцій з теми "Transient thermal management"
Nelson, Cameron, Jesse Galloway, and Phillip Fosnot. "Extracting TIM properties with localized transient pulses." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892218.
Повний текст джерелаRozenfeld, T., R. Hayat, Y. Kozak, and G. Ziskind. "Enhanced Melting for Transient Thermal Management." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48369.
Повний текст джерелаParrino, Maurizio, Alberto Mannoni, Elvio Bonisoli, and Massimo Sorli. "Block-oriented Models for Transient HVAC Simulations." In Vehicle Thermal Management Systems Conference & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2005. http://dx.doi.org/10.4271/2005-01-2002.
Повний текст джерелаPawar, Rajesh Chhotulal, Preetam Ghodake, and Ravindra Tupake. "Transient Hot Shut Down, CFD Simulation Technique for Underhood Thermal Management." In Thermal Management Systems Conference 2020. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2020. http://dx.doi.org/10.4271/2020-28-0032.
Повний текст джерелаVan Zwieten, Andrew T., Gokcin Cinar, Elena Garcia, Jonathan C. Gladin, and Dimitri N. Mavris. "Transient Surrogate Modeling for Thermal Management Systems." In AIAA Scitech 2020 Forum. Reston, Virginia: American Institute of Aeronautics and Astronautics, 2020. http://dx.doi.org/10.2514/6.2020-1616.
Повний текст джерелаMaize, K., J, Christofferson, and A. Shakouri. "Transient Thermal Imaging Using Thermoreflectance." In 2008 Twenty-fourth Annual IEEE Semionductor Thermal Measurement and Management Symposium. IEEE, 2008. http://dx.doi.org/10.1109/stherm.2008.4509366.
Повний текст джерелаSrinivasan, Karthik, Stephen Pan, Zhigang Feng, Norman Chang, and Tim Pawlak. "An efficient transient thermal simulation methodology for Power Management IC designs." In 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2017. http://dx.doi.org/10.1109/semi-therm.2017.7896909.
Повний текст джерелаCipollone, Roberto, and Carlo Villante. "A Fully Transient Model For Advanced Engine Thermal Management." In Vehicle Thermal Management Systems Conference & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2005. http://dx.doi.org/10.4271/2005-01-2059.
Повний текст джерелаHu, Xiao, Sivasubramani Krishnaswamy, Saeed Asgari, and Scott Stanton. "An efficient transient thermal model for electronics thermal management based on singular value decomposition." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100173.
Повний текст джерелаBurzo, Mihai G., and Ming Li. "Investigation of pressure dependence of interface thermal resistance in thermal greases by transient thermoreflectance." In 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2018. http://dx.doi.org/10.1109/semi-therm.2018.8357373.
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