Статті в журналах з теми "Thick Copper level"
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Li, Yi Nan, Z. L. Peng, and J. C. Yan. "GTA Welding of Copper Thick Plates by Using ERCuTi Welding Materials." Materials Science Forum 697-698 (September 2011): 409–13. http://dx.doi.org/10.4028/www.scientific.net/msf.697-698.409.
Повний текст джерелаHosseini, Vahid A., Kristina Lindgren, Mattias Thuvander, Daniel Gonzalez, James Oliver, and Leif Karlsson. "Nanoscale phase separations in as-fabricated thick super duplex stainless steels." Journal of Materials Science 56, no. 21 (April 19, 2021): 12475–85. http://dx.doi.org/10.1007/s10853-021-06056-0.
Повний текст джерелаLoquet, Yannick, Cedric Perrot, Pierre Bouillon, and Blaise Iteprat. "Chemical-Mechanical Planarization Compatible for Both Copper/Low k Level in a 90 nm Technology and Thick Copper Level in an RF Technology." ECS Transactions 3, no. 41 (December 21, 2019): 1–8. http://dx.doi.org/10.1149/1.2819476.
Повний текст джерелаRichard, Claire Therese, M. M. Frank, Pascal Besson, E. Serret, N. Hotellier, Alessio Beverina, L. Dumas, Lucile Broussous, F. Kovacs, and Thierry Billon. "Barrier and Copper Seedlayer Wet Etching." Solid State Phenomena 103-104 (April 2005): 361–64. http://dx.doi.org/10.4028/www.scientific.net/ssp.103-104.361.
Повний текст джерелаLee, Suhyun, Chien Wern, and Sung Yi. "Novel Fabrication of Silver-Coated Copper Nanowires with Organic Compound Solution." Materials 15, no. 3 (February 1, 2022): 1135. http://dx.doi.org/10.3390/ma15031135.
Повний текст джерелаAoh, Jong Ning, Chih Wei Huang, and Wei Ju Cheng. "Fabrication of Al6061-AMC by Adding Copper-Coated SiC Reinforcement by Friction Stir Processing (FSP)." Materials Science Forum 783-786 (May 2014): 1721–28. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.1721.
Повний текст джерелаGorbatyuk, S. M., A. A. Gerasimova, and N. N. Belkina. "Applying Thermal Coatings to Narrow Walls of the Continuous-Casting Molds." Materials Science Forum 870 (September 2016): 564–67. http://dx.doi.org/10.4028/www.scientific.net/msf.870.564.
Повний текст джерелаMantatova, N. V., Chuluunbatyn Oyuuntsetseg, and S. Ye Sanzhiyeva. "TRACE ELEMENT CONTENT IN BLOOD OF CATTLE WITH ALIMENTARY ANEMIA AND HYPOCUPROSIS, AND IN SOIL SAMPLES OF THE TÖV AIMAG OF MONGOLIAAND THE KYAKHTINSKY DISTRICT OF THE REPUBLIC OF BURYATIA." Vestnik Altajskogo gosudarstvennogo agrarnogo universiteta, no. 8 (2021): 61–66. http://dx.doi.org/10.53083/1996-4277-2021-202-08-61-66.
Повний текст джерелаPrem Kumar, T., V. Muthupriya, A. Antony Christian Rajaa, R. Sasirekab, and R. Sumanc. "World Best Level Efficiency from An Engineered Novel SLG/Mo/p-Cu2ZnSn(Al)Se4/n-CdS/i-ZnO/Al:ZnO/Al Compound Semiconductor Hetero-Junction Thin Film Solar Cells." Shanlax International Journal of Arts, Science and Humanities 9, S1-May (May 14, 2022): 41–46. http://dx.doi.org/10.34293/sijash.v9is1-may.5942.
Повний текст джерелаSchmidt, Ralf, Jens Palm, and Jan M. Knaup. "The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000142–48. http://dx.doi.org/10.4071/1085-8024-2021.1.000142.
Повний текст джерелаVityaz, S. N. "Phytoremediation Potential of Flowering Plants in Relation to Copper." Bioscience Biotechnology Research Communications 14, no. 4 (December 25, 2021): 1786–92. http://dx.doi.org/10.21786/bbrc/14.4.60.
Повний текст джерелаRydosz, Artur, Katarzyna Dyndał, Wojciech Andrysiewicz, Dominik Grochala, and Konstanty Marszałek. "GLAD Magnetron Sputtered Ultra-Thin Copper Oxide Films for Gas-Sensing Application." Coatings 10, no. 4 (April 11, 2020): 378. http://dx.doi.org/10.3390/coatings10040378.
Повний текст джерелаMironovs, Viktors, Alexey Tatarinov, Ervins Blumbergs, and Irina Boiko. "Investigation of Properties of Coated Hollow Mini-Spheres." Key Engineering Materials 799 (April 2019): 26–30. http://dx.doi.org/10.4028/www.scientific.net/kem.799.26.
Повний текст джерелаLee, Seong Hee, Seung Zeon Han, and Cha Yong Lim. "Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding." Key Engineering Materials 317-318 (August 2006): 239–42. http://dx.doi.org/10.4028/www.scientific.net/kem.317-318.239.
Повний текст джерелаVanstreels, K., S. H. Brongersma, Zs Tokei, L. Carbonell, W. De Ceuninck, J. D’Haen, and M. D’Olieslaeger. "Increasing the mean grain size in copper films and features." Journal of Materials Research 23, no. 3 (March 2008): 642–62. http://dx.doi.org/10.1557/jmr.2008.0080.
Повний текст джерелаTivol, W. F., and J. R. Fryer. "Electron diffraction of copper perfluorophthalocyanine on the HVEM." Proceedings, annual meeting, Electron Microscopy Society of America 53 (August 13, 1995): 158–59. http://dx.doi.org/10.1017/s0424820100137161.
Повний текст джерелаSong, Jian, Songsong Yao, Quan Li, Jiamiao Ni, Zhuoxin Yan, Kunming Yang, Guisen Liu, Yue Liu, and Jian Wang. "Reorientation Mechanisms of Graphene Coated Copper {001} Surfaces." Metals 13, no. 5 (May 8, 2023): 910. http://dx.doi.org/10.3390/met13050910.
Повний текст джерелаSkrynnikov, Alexander A., Anastasia I. Fedoseeva, Natalia B. Morozova, Alexey I. Dontsov, Aleksander V. Vvedenskii, and Oleg A. Kozaderov. "Pd–Pb nanoscale films as surface modifiers of Pd,Cu alloy membranes used for hydrogen ultrapurification." Kondensirovannye sredy i mezhfaznye granitsy = Condensed Matter and Interphases 23, no. 4 (November 24, 2021): 561–69. http://dx.doi.org/10.17308/kcmf.2021.23/3675.
Повний текст джерелаAnderson, Ron, John Benedict, and Stanley J. Klepeis. "TEM microstructure of laser-trimmed Si-Cr devices." Proceedings, annual meeting, Electron Microscopy Society of America 47 (August 6, 1989): 470–71. http://dx.doi.org/10.1017/s0424820100154329.
Повний текст джерелаLakhera, Nishant, Emmanuel Labroye, Catherine Pronga, Florence Molinie, and Samuel Lesnakowski. "Reliability of Heavy Gage Aluminum Wire-bonds under High Temperature Aging." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000234–39. http://dx.doi.org/10.4071/isom-2016-wa54.
Повний текст джерелаGernhardt, Robert, Friedrich Müller, Markus Woehrmann, Habib Hichri, Karin Hauck, Michael Toepper, Markus Arendt та Klaus-Dieter Lang. "Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process". International Symposium on Microelectronics 2017, № 1 (1 жовтня 2017): 000120–25. http://dx.doi.org/10.4071/isom-2017-tp45_130.
Повний текст джерелаFukunaka, Yasuhiro. "(Invited) Gravitational Level Effects on Electrochemical Interfacial Phenomena." ECS Meeting Abstracts MA2023-02, no. 66 (December 22, 2023): 3196. http://dx.doi.org/10.1149/ma2023-02663196mtgabs.
Повний текст джерелаBoettcher, Lars, D. Manessis, S. Karaszkiewicz, A. Ostmann, and H. Reichl. "Next Generation System in a Package Manufacturing by Embedded Chip Technologies." Journal of Microelectronics and Electronic Packaging 7, no. 3 (July 1, 2010): 131–37. http://dx.doi.org/10.4071/imaps.261.
Повний текст джерелаLevson, Victor M. "Quaternary geology of the Babine porphyry copper district: implications for geochemical exploration." Canadian Journal of Earth Sciences 38, no. 4 (April 1, 2001): 733–49. http://dx.doi.org/10.1139/e00-102.
Повний текст джерелаLee, Chang-Chun, and Jing-Yan He. "Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation." Molecules 25, no. 21 (November 3, 2020): 5107. http://dx.doi.org/10.3390/molecules25215107.
Повний текст джерелаBoettcher, Lars, S. Karaszkiewicz, D. Manessis, and A. Ostmann. "Development of Embedded High Power Electronics Modules for Automotive Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001717–43. http://dx.doi.org/10.4071/2013dpc-wp35.
Повний текст джерелаSergeev, N. N., A. N. Sergeev, S. N. Kutepov, A. E. Gvozdev, E. V. Ageev, and D. S. Klement'yev. "APPLICATION OF TECHNOLOGY IN THE PRODUCTION OF «CORTICAL» METHOD OF FORMING INSERTS FOR DIE CASTING COPPER ALLOYS." Proceedings of the Southwest State University 22, no. 3 (June 28, 2018): 67–83. http://dx.doi.org/10.21869/2223-1560-2018-22-3-67-83.
Повний текст джерелаBoettcher, Lars, A. Ostmann, D. Manessis, S. Karaszkiewicz, and H. Reichl. "Next Generation System in a Package Manufacturing by Embedded Chip Technologies." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 002075–103. http://dx.doi.org/10.4071/2010dpc-tha13.
Повний текст джерелаZhai, Yu, Ding Xu, and Yan Zhang. "Ka-Band Lightweight High-Efficiency Wideband 3D Printed Reflector Antenna." International Journal of Antennas and Propagation 2017 (2017): 1–7. http://dx.doi.org/10.1155/2017/7360329.
Повний текст джерелаKotliarenko, Alisa, Oscar Azzolini, Giorgio Keppel, Cristian Pira, and Juan Esposito. "Investigation of a Possible Material-Saving Approach of Sputtering Techniques for Radiopharmaceutical Target Production." Applied Sciences 11, no. 19 (October 3, 2021): 9219. http://dx.doi.org/10.3390/app11199219.
Повний текст джерелаEmon, Sharmin Zaman, Anowara Begum, Md Latiful Bari, and K. Siddique e. Rabbani. "In-vitro inactivation of Escherichia coli of surface water using metals." Bangladesh Journal of Microbiology 39, no. 2 (May 17, 2023): 54–59. http://dx.doi.org/10.3329/bjm.v39i2.66265.
Повний текст джерелаWelker, T., S. Günschmann, N. Gutzeit, and J. Müller. "Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (September 1, 2015): 000062–66. http://dx.doi.org/10.4071/cicmt-tp13.
Повний текст джерелаMOURIER, Thierry, Stephane Minoret, Sabrina Fadloun, Larissa Djomeni, Sylvain Maitrejean, Steve Burgess, Andy Price, Chris Jones, Anne Roule, and Laurent Vandroux. "Low temperature MOCVD TiN barrier deposition for high aspect ratio TSVs : A solution for 3D integration." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001322–42. http://dx.doi.org/10.4071/2013dpc-wp12.
Повний текст джерелаHofmann, Christian, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Maik Wiemer, Karla Hiller, and Harald Kuhn. "Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils." Micromachines 13, no. 8 (August 12, 2022): 1307. http://dx.doi.org/10.3390/mi13081307.
Повний текст джерелаBirsan, D. C., and G. Simion. "Numerical Modelling of Thermo-Mechanical Effects Developed in Resistance Spot Welding of E304 Steel with Copper Interlayer." Annals of Dunarea de Jos University of Galati. Fascicle XII, Welding Equipment and Technology 33 (December 15, 2022): 89–94. http://dx.doi.org/10.35219/awet.2022.07.
Повний текст джерелаWentlent, Luke A., James Wilcox, and Mohammed Genanu. "Applicability of Selective Laser Reflow for Thin Die Stacking." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000741–47. http://dx.doi.org/10.4071/2380-4505-2018.1.000741.
Повний текст джерелаChen, Scott, Simon Wang, Coltrane Lee, and John Hunt. "Low Cost Chip Last Fanout Package using Coreless Substrate." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 000272–300. http://dx.doi.org/10.4071/2015dpc-ta24.
Повний текст джерелаChang, Y. J., and D. Kuhlmann-Wilsdorf. "Effects of Ambient Gases on Friction and Interfacial Resistance." Journal of Tribology 110, no. 3 (July 1, 1988): 508–15. http://dx.doi.org/10.1115/1.3261660.
Повний текст джерелаPollard, Kimberly D., Nichelle Gilbert, Don Pfettscher, and Spencer Hochstetler. "Proven Cleaning Technology Solutions for Lead-Free Micro-Bumping Processes." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 002399–427. http://dx.doi.org/10.4071/2012dpc-tha24.
Повний текст джерелаPopov, Petko, Tudor Berza, Alexander Grubic, and Dumitru Ioane. "Late Cretaceous Apuseni-Banat-Timok-Srednogorie (ABTS) magmatic and metallogenic belt in the Carpathian-Balkan orogen." Geologica Balcanica 32, no. 2-4 (December 30, 2002): 145–63. http://dx.doi.org/10.52321/geolbalc.32.2-4.145.
Повний текст джерелаWojcik, Mariusz, Dariusz Witek, Tomasz Klej, and Edward Ramotowski. "Embedding components in voltage converter PCB for size reduction and heat management." Circuit World 42, no. 1 (February 1, 2016): 17–22. http://dx.doi.org/10.1108/cw-10-2015-0048.
Повний текст джерелаMathew, Varughese, Sheila Chopin, Oliver Chyan, Nick Ross, Alex Lambert, and Muthappan Asokan. "Aluminum bond pad corrosion of wirebond packages." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000227–33. http://dx.doi.org/10.4071/isom-2016-wa53.
Повний текст джерелаWillan, Robert C. R. "Structural setting and timing of hydrothermal veins and breccias on Hurd Peninsula, South Shetland Islands: a possible volcanic-related epithermal system in deformed turbidites." Geological Magazine 131, no. 4 (July 1994): 465–83. http://dx.doi.org/10.1017/s0016756800012103.
Повний текст джерелаLanger, Gregor, Markus Leitgeb, Johann Nicolics, Michael Unger, Hans Hoschopf, and Franz P. Wenzl. "Advanced Thermal Management Solutions on PCBs for High Power Applications." Journal of Microelectronics and Electronic Packaging 11, no. 3 (July 1, 2014): 104–14. http://dx.doi.org/10.4071/imaps.422.
Повний текст джерелаChen, Scott, Simon Wang, Coltrane Lee, Adren Hsieh, John Hunt, and William Chen. "Chip Last Fan Out as an Alternative to Chip First." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000245–50. http://dx.doi.org/10.4071/isom-2015-wa33.
Повний текст джерелаPanaskar, Nitin, and Ravi Prakash Terkar. "Optimization of friction stir welding process parameters for AA6063-ETP copper using central composite design." World Journal of Engineering 17, no. 4 (May 11, 2020): 491–507. http://dx.doi.org/10.1108/wje-11-2019-0322.
Повний текст джерелаMathew, Varughese, and Sheila Chopin. "Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materials." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000286–91. http://dx.doi.org/10.4071/isom-2015-wa51.
Повний текст джерелаBurrows, David R., Michael Rennison, David Burt, and Rod Davies. "The Onto Cu-Au Discovery, Eastern Sumbawa, Indonesia: A Large, Middle Pleistocene Lithocap-Hosted High-Sulfidation Covellite-Pyrite Porphyry Deposit." Economic Geology 115, no. 7 (November 1, 2020): 1385–412. http://dx.doi.org/10.5382/econgeo.4766.
Повний текст джерелаGupta, Atul, Eric Snyder, Christiane Gottschalke, Kevin Wenzel, James Gunn, Hao Lu, Yuya Suzuki, Venky Sundaram, and Rao Tummala. "First Demonstration of Fine Line RDL Yield Enhancement using an Innovative Ozone Treatment Process for Panel Fan-out and Interposers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (January 1, 2017): 1–19. http://dx.doi.org/10.4071/2017dpc-tp1_presentation2.
Повний текст джерелаMakkonen, Hannu V., and Pekka Tuisku. "Geology and crystallization conditions of the Särkiniemiintrusion and related nickel-copper ore, central Finland – implications for depth of emplacement of 1.88 Ga nickel-bearing intrusions." Bulletin of the Geological Society of Finland 92, no. 2 (December 15, 2020): 111–30. http://dx.doi.org/10.17741/bgsf/92.2.003.
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