Статті в журналах з теми "Thermoplastic adhesives"
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Baurova, Natalia, Alexander Anoprienko, and Yulia Romanova. "The performance evaluation for rivet bonded joints in production and machine maintenance." MATEC Web of Conferences 224 (2018): 02003. http://dx.doi.org/10.1051/matecconf/201822402003.
Повний текст джерелаMercedes Pastor-Blas, M. M. "Compatibility Improvement between Chlorinated Thermoplastic Rubber and Polychloroprene Adhesive." Rubber Chemistry and Technology 82, no. 1 (March 1, 2009): 18–36. http://dx.doi.org/10.5254/1.3548238.
Повний текст джерелаMATYAŠOVSKÝ, JÁN, JÁN SEDLIAČIK, IGOR NOVÁK, PETER DUCHOVIČ, and PETER JURKOVIČ. "Influence of collagen modifications on qualitative parameters of thermoplastic adhesive mixtures and its microbiological stability." Annals of WULS, Forestry and Wood Technology 105 (June 6, 2019): 54–61. http://dx.doi.org/10.5604/01.3001.0013.7716.
Повний текст джерелаMo, Xianfeng, Xinhao Zhang, Lu Fang, and Yu Zhang. "Research Progress of Wood-Based Panels Made of Thermoplastics as Wood Adhesives." Polymers 14, no. 1 (December 28, 2021): 98. http://dx.doi.org/10.3390/polym14010098.
Повний текст джерелаYoon, Tae-Ho, and James E. McGrath. "Enhanced Adhesive Performance of Thermoplastic Poly(imide-siloxane) Segmented Copolymer with PEEK®-Graphite Composites by Gas Plasma Treatment." High Performance Polymers 4, no. 4 (August 1992): 203–14. http://dx.doi.org/10.1088/0954-0083/4/4/001.
Повний текст джерелаPastor-Blas, M. Mercedes, José Miguel Martín-Martínez, and F. J. Boerio. "Mechanisms of Adhesion in Surface Chlorinated Thermoplastic Rubber/Thermoplastic Polyurethane Adhesive Joints." Rubber Chemistry and Technology 75, no. 5 (November 1, 2002): 825–38. http://dx.doi.org/10.5254/1.3547686.
Повний текст джерелаStein, Bland A., William T. Hodges, and James R. Tyeryar. "Rapid adhesive bonding of thermoplastic composites and titanium withthermoplastic adhesives." Journal of Aircraft 23, no. 7 (July 1986): 545–46. http://dx.doi.org/10.2514/3.45341.
Повний текст джерелаBekhta, Pavlo, Marcus Müller, and Ilona Hunko. "Properties of Thermoplastic-Bonded Plywood: Effects of the Wood Species and Types of the Thermoplastic Films." Polymers 12, no. 11 (November 3, 2020): 2582. http://dx.doi.org/10.3390/polym12112582.
Повний текст джерелаSikdar, Soumya, Md Hafizur Rahman, Arpith Siddaiah, and Pradeep L. Menezes. "Gecko-Inspired Adhesive Mechanisms and Adhesives for Robots—A Review." Robotics 11, no. 6 (December 4, 2022): 143. http://dx.doi.org/10.3390/robotics11060143.
Повний текст джерелаBekhta, Pavlo, and Ján Sedliačik. "Environmentally-Friendly High-Density Polyethylene-Bonded Plywood Panels." Polymers 11, no. 7 (July 8, 2019): 1166. http://dx.doi.org/10.3390/polym11071166.
Повний текст джерелаDunky, Manfred. "Wood Adhesives Based on Natural Resources: A Critical Review: Part IV. Special Topics." Reviews of Adhesion and Adhesives 9, no. 2 (June 2, 2021): 189–268. http://dx.doi.org/10.7569/raa.2021.097307.
Повний текст джерелаMatsumura, Katsumasa. "Fully Polymerized Thermoplastic Adhesives for Micro Electronics." Journal of SHM 9, no. 5 (1993): 36–40. http://dx.doi.org/10.5104/jiep1993.9.5_36.
Повний текст джерелаMcCutcheon, Jeremy, and Dongshun Bai. "Advanced Thin Wafer Support Processes for Temporary Wafer Bonding." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000361–63. http://dx.doi.org/10.4071/isom-2010-wa1-paper2.
Повний текст джерелаLatko-Durałek, Paulina, Michał Misiak, and Anna Boczkowska. "Electrically Conductive Adhesive Based on Thermoplastic Hot Melt Copolyamide and Multi-Walled Carbon Nanotubes." Polymers 14, no. 20 (October 17, 2022): 4371. http://dx.doi.org/10.3390/polym14204371.
Повний текст джерелаNovosel, Andrija, Tomislav Sedlar, Josip Miklečić, Hrvoje Turkulin, Luka Lučić, Goran Mihulja, and Vjekoslav Živković. "Analysis of Bonding Mechanisms of Various Implants and Adhesives in Laminated Oak-Wood Elements." Polymers 14, no. 24 (December 8, 2022): 5373. http://dx.doi.org/10.3390/polym14245373.
Повний текст джерелаDal Conte, Umberto F., Irene F Villegas, and Julien Tachon. "Ultrasonic plastic welding of CF/PA6 composites to aluminium: Process and mechanical performance of welded joints." Journal of Composite Materials 53, no. 18 (March 12, 2019): 2607–21. http://dx.doi.org/10.1177/0021998319836022.
Повний текст джерелаIbraheem, Eman Mostafa Ahmed, and Hoda Gaafar Hassan Hammad. "Effect of Commercially Available Denture Adhesives on Microhardness of a Flexible Denture Base Material." Open Access Macedonian Journal of Medical Sciences 7, no. 5 (March 15, 2019): 862–68. http://dx.doi.org/10.3889/oamjms.2019.193.
Повний текст джерелаSánchez-Adsuar, María Salvadora, and José Miguel Martín-Martínez. "Structure, composition, and adhesion properties of thermoplastic polyurethane adhesives." Journal of Adhesion Science and Technology 14, no. 8 (January 2000): 1035–55. http://dx.doi.org/10.1163/156856100743068.
Повний текст джерелаKu, H. S., E. Siores, J. A. R. Ball, A. Taube, and F. Siu. "Lap shear strength comparison between different random glass fibre reinforced thermoplastic matrix composites bonded by adhesives using variable-frequency microwave irradiation." Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 217, no. 1 (January 1, 2003): 65–75. http://dx.doi.org/10.1177/146442070321700108.
Повний текст джерелаXu, Yecheng, Yantao Xu, Wenjie Zhu, Wei Zhang, Qiang Gao, and Jianzhang Li. "Improve the Performance of Soy Protein-Based Adhesives by a Polyurethane Elastomer." Polymers 10, no. 9 (September 13, 2018): 1016. http://dx.doi.org/10.3390/polym10091016.
Повний текст джерелаDas, S., L. M. Matuana, and P. Heiden. "Thermoplastic polymers as modifiers for urea–formaldehyde wood adhesives. III.In situ thermoplastic-modified wood composites." Journal of Applied Polymer Science 107, no. 5 (2007): 3200–3211. http://dx.doi.org/10.1002/app.25526.
Повний текст джерелаKaboorani, Alireza, and Bernard Riedl. "Nano-aluminum oxide as a reinforcing material for thermoplastic adhesives." Journal of Industrial and Engineering Chemistry 18, no. 3 (May 2012): 1076–81. http://dx.doi.org/10.1016/j.jiec.2011.12.001.
Повний текст джерелаDonate-Robles, Jessica, and José Miguel Martín-Martínez. "Addition of precipitated calcium carbonate filler to thermoplastic polyurethane adhesives." International Journal of Adhesion and Adhesives 31, no. 8 (December 2011): 795–804. http://dx.doi.org/10.1016/j.ijadhadh.2011.07.008.
Повний текст джерелаBirkar, Smita, Joey Mead, and Carol Barry. "INJECTION MOLDING OF THERMOPLASTIC ELASTOMERS FOR MICROSTRUCTURED SUBSTRATES." Rubber Chemistry and Technology 87, no. 4 (December 1, 2014): 629–46. http://dx.doi.org/10.5254/rct.14.86924.
Повний текст джерелаLatko-Durałek, Paulina, Rafał Kozera, Jan Macutkevič, Kamil Dydek, and Anna Boczkowska. "Relationship between Viscosity, Microstructure and Electrical Conductivity in Copolyamide Hot Melt Adhesives Containing Carbon Nanotubes." Materials 13, no. 20 (October 9, 2020): 4469. http://dx.doi.org/10.3390/ma13204469.
Повний текст джерелаNadaraja, Shri Kumaran, and Boon Kar Yap. "In depth study of lead frame tape residuein quad flat non-leaded package." Microelectronics International 36, no. 4 (October 7, 2019): 129–36. http://dx.doi.org/10.1108/mi-12-2018-0077.
Повний текст джерелаMcCutcheon, Jeremy, Robert Brown, and JoElle Dachsteiner. "ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications." Journal of Microelectronics and Electronic Packaging 7, no. 3 (July 1, 2010): 138–42. http://dx.doi.org/10.4071/imaps.269.
Повний текст джерелаRaj, Indu, Femitha Syed, and Tony Joy. "CUSTOMIZED THERMOPLAST RETENTIVE AID FOR PARTIAL AURICULAR PROSTHESIS-A CASE REPORT." International Journal of Advanced Research 11, no. 02 (February 28, 2023): 212–20. http://dx.doi.org/10.21474/ijar01/16242.
Повний текст джерелаWoitun, Dominic, Michael Roderus, Thilo Bein, and Elmar Kroner. "Metal Polymer Connections: Laser-Induced Surface Enlargement Increases Joint Strength." Key Engineering Materials 809 (June 2019): 190–96. http://dx.doi.org/10.4028/www.scientific.net/kem.809.190.
Повний текст джерелаMoon, K., C. Rockett, C. Kretz, W. F. Burgoyne, and C. P. Wong. "Improvement of adhesion and electrical properties of reworkable thermoplastic conductive adhesives." Journal of Adhesion Science and Technology 17, no. 13 (January 2003): 1785–99. http://dx.doi.org/10.1163/156856103322538688.
Повний текст джерелаKim, Jae-Woo, Karana Carlborn, Laurent M. Matuana, and Patricia A. Heiden. "Thermoplastic modification of urea–formaldehyde wood adhesives to improve moisture resistance." Journal of Applied Polymer Science 101, no. 6 (2006): 4222–29. http://dx.doi.org/10.1002/app.23654.
Повний текст джерелаVega-Baudrit, José, Virtudes Navarro-Bañón, Patricia Vázquez, and José Miguel Martín-Martínez. "Addition of nanosilicas with different silanol content to thermoplastic polyurethane adhesives." International Journal of Adhesion and Adhesives 26, no. 5 (August 2006): 378–87. http://dx.doi.org/10.1016/j.ijadhadh.2005.06.004.
Повний текст джерелаKumar, Devendra, and Alka D. Gupta. "Novel processable aromatic thermoplastic polyimides: Films, adhesives, moldings, and graphite composites." Polymers for Advanced Technologies 3, no. 1 (February 1992): 1–7. http://dx.doi.org/10.1002/pat.1992.220030101.
Повний текст джерелаFuensanta, Vallino-Moyano, and Martín-Martínez. "Balanced Viscoelastic Properties of Pressure Sensitive Adhesives Made with Thermoplastic Polyurethanes Blends." Polymers 11, no. 10 (October 3, 2019): 1608. http://dx.doi.org/10.3390/polym11101608.
Повний текст джерелаVattathurvalappil, Suhail Hyder, and Mahmoodul Haq. "Thermomechanical characterization of Nano-Fe3O4 reinforced thermoplastic adhesives and single lap-joints." Composites Part B: Engineering 175 (October 2019): 107162. http://dx.doi.org/10.1016/j.compositesb.2019.107162.
Повний текст джерелаLiu, Yinan, Xuemin Li, Weihong Wang, Yanan Sun, and Haigang Wang. "Decorated wood fiber/high density polyethylene composites with thermoplastic film as adhesives." International Journal of Adhesion and Adhesives 95 (December 2019): 102391. http://dx.doi.org/10.1016/j.ijadhadh.2019.05.008.
Повний текст джерелаPettit, Jared, and John Moore. "Extreme Temporary Coatings and Adhesives for High-Thermal, Low-Pressure, and Low-Stress 3D-Processing." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000215–22. http://dx.doi.org/10.4071/isom-2011-tp1-paper6.
Повний текст джерелаKhan, Tayyab, Farrukh Hafeez, and Rehan Umer. "Repair of Aerospace Composite Structures Using Liquid Thermoplastic Resin." Polymers 15, no. 6 (March 10, 2023): 1377. http://dx.doi.org/10.3390/polym15061377.
Повний текст джерелаPaeglis, A. U., and F. X. O'Shea. "Thermoplastic Elastomer Compounds from Sulfonated EPDM Ionomers." Rubber Chemistry and Technology 61, no. 2 (May 1, 1988): 223–37. http://dx.doi.org/10.5254/1.3536184.
Повний текст джерелаTang, Jie Fang, Li Jun Wang, Feng Yuan Zou, and Hong Yi Sou. "Study on the Heat-Press Bonding Optimum Technics of Stitchless Apparel." Advanced Materials Research 418-420 (December 2011): 22–25. http://dx.doi.org/10.4028/www.scientific.net/amr.418-420.22.
Повний текст джерелаKerr, S. R. "Radiation Cured, Thermoplastic Elastomer Films Based on "Macromolecular Monomers" for Heat Activated Adhesives." Journal of Plastic Film & Sheeting 2, no. 2 (April 1986): 127–43. http://dx.doi.org/10.1177/875608798600200206.
Повний текст джерелаLegon’kova, O. A., and M. S. Fedotova. "Biodeterioration of adhesives based on thermoplastic polyurethanes under the action of soil microorganisms." Polymer Science Series D 5, no. 1 (January 2012): 30–32. http://dx.doi.org/10.1134/s1995421212010091.
Повний текст джерелаGilleo, Ken, and Peter Ongley. "Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications." Microelectronics International 16, no. 2 (August 1999): 34–38. http://dx.doi.org/10.1108/13565369910268259.
Повний текст джерелаKadiyala, Ajay Kumar, and Jayashree Bijwe. "Investigations on performance and failure mechanisms of high temperature thermoplastic polymers as adhesives." International Journal of Adhesion and Adhesives 70 (October 2016): 90–101. http://dx.doi.org/10.1016/j.ijadhadh.2016.05.011.
Повний текст джерелаKim, Tae K., Byung K. Kim, Yong S. Kim, Yang L. Cho, Sang Y. Lee, Youn B. Cho, Joe H. Kim, and Han M. Jeong. "The properties of reactive hot melt polyurethane adhesives modified with novel thermoplastic polyurethanes." Journal of Applied Polymer Science 114, no. 2 (October 15, 2009): 1169–75. http://dx.doi.org/10.1002/app.30730.
Повний текст джерелаPark, Soo-Jeong, Kyo-Moon Lee, Seong-Jae Park, and Yun-Hae Kim. "Overlapped repair performance for carbon–PPS composites in vacuum-assisted thermal bonding." Modern Physics Letters B 34, no. 07n09 (March 16, 2020): 2040027. http://dx.doi.org/10.1142/s0217984920400278.
Повний текст джерелаLi, Hui, and Karl Englund. "Recycling of carbon fiber-reinforced thermoplastic composite wastes from the aerospace industry." Journal of Composite Materials 51, no. 9 (September 26, 2016): 1265–73. http://dx.doi.org/10.1177/0021998316671796.
Повний текст джерелаAbdelmoula, Maisa, Hajer Ben Hlima, Frédéric Michalet, Gérard Bourduche, Jean-Yves Chavant, Alexis Gravier, Cédric Delattre, et al. "Chitosan-Based Adhesive: Optimization of Tensile Shear Strength in Dry and Wet Conditions." Polysaccharides 2, no. 1 (February 28, 2021): 110–20. http://dx.doi.org/10.3390/polysaccharides2010008.
Повний текст джерелаKhaled, Walid Bin, and Dan Sameoto. "Fabrication and Characterization of Thermoplastic Elastomer Dry Adhesives with High Strength and Low Contamination." ACS Applied Materials & Interfaces 6, no. 9 (April 22, 2014): 6806–15. http://dx.doi.org/10.1021/am500616a.
Повний текст джерелаLuo, Jie, Zhijie Cheng, Chaowei Li, Liangjie Wang, Cuiping Yu, Yue Zhao, Minghai Chen, Qingwen Li, and Yagang Yao. "Electrically conductive adhesives based on thermoplastic polyurethane filled with silver flakes and carbon nanotubes." Composites Science and Technology 129 (June 2016): 191–97. http://dx.doi.org/10.1016/j.compscitech.2016.04.026.
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