Статті в журналах з теми "Thermal management of electronics"
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FAULKNER, DAN, MEHDY KHOTAN, and REZA SHEKARRIZ. "Managing Electronics Thermal Management." Heat Transfer Engineering 25, no. 2 (March 2004): 1–4. http://dx.doi.org/10.1080/01457630490275944.
Повний текст джерелаXing, Wenkui, Yue Xu, Chengyi Song, and Tao Deng. "Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics." Nanomaterials 12, no. 19 (September 27, 2022): 3365. http://dx.doi.org/10.3390/nano12193365.
Повний текст джерелаLi, Yuhang, Jiayun Chen, Shuang Zhao, and Jizhou Song. "Recent Advances on Thermal Management of Flexible Inorganic Electronics." Micromachines 11, no. 4 (April 9, 2020): 390. http://dx.doi.org/10.3390/mi11040390.
Повний текст джерелаSong, Jizhou, Xue Feng, and Yonggang Huang. "Mechanics and thermal management of stretchable inorganic electronics." National Science Review 3, no. 1 (November 26, 2015): 128–43. http://dx.doi.org/10.1093/nsr/nwv078.
Повний текст джерелаPang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (April 16, 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.
Повний текст джерелаEgan, Eric, and Cristina H. Amon. "Thermal Management Strategies for Embedded Electronic Components of Wearable Computers." Journal of Electronic Packaging 122, no. 2 (September 15, 1999): 98–106. http://dx.doi.org/10.1115/1.483140.
Повний текст джерелаShi, Yingli, Junyun Ji, Yafei Yin, Yuhang Li, and Yufeng Xing. "Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate." Applied Mathematics and Mechanics 41, no. 11 (October 19, 2020): 1599–610. http://dx.doi.org/10.1007/s10483-020-2671-7.
Повний текст джерелаKosoy, Boris. "Micro channels in macro thermal management solutions." Thermal Science 10, no. 1 (2006): 81–98. http://dx.doi.org/10.2298/tsci0601081k.
Повний текст джерелаYeh, L. T. "Review of Heat Transfer Technologies in Electronic Equipment." Journal of Electronic Packaging 117, no. 4 (December 1, 1995): 333–39. http://dx.doi.org/10.1115/1.2792113.
Повний текст джерелаAnandan, Sundaram, and Velraj Ramalingam. "Thermal management of electronics: A review of literature." Thermal Science 12, no. 2 (2008): 5–26. http://dx.doi.org/10.2298/tsci0802005a.
Повний текст джерелаBabus'Haq, R. F., H. E. George, P. W. O'Callaghan, and B. A. Constant. "Thermal management of electronics: problems and analytical techniques." Computer-Aided Engineering Journal 7, no. 1 (1990): 23. http://dx.doi.org/10.1049/cae.1990.0006.
Повний текст джерелаHamilton, S. "Developments in Passive Thermal Management Systems for Electronics." Circuit World 14, no. 1 (April 1987): 22–25. http://dx.doi.org/10.1108/eb043933.
Повний текст джерелаKercher, D. S., Jeong-Bong Lee, O. Brand, M. G. Allen, and A. Glezer. "Microjet cooling devices for thermal management of electronics." IEEE Transactions on Components and Packaging Technologies 26, no. 2 (June 2003): 359–66. http://dx.doi.org/10.1109/tcapt.2003.815116.
Повний текст джерелаShang, Bofeng, Yupu Ma, Run Hu, Chao Yuan, Jinyan Hu, and Xiaobing Luo. "Passive thermal management system for downhole electronics in harsh thermal environments." Applied Thermal Engineering 118 (May 2017): 593–99. http://dx.doi.org/10.1016/j.applthermaleng.2017.01.118.
Повний текст джерелаLv, Yi-Gao, Gao-Peng Zhang, Qiu-Wang Wang, and Wen-Xiao Chu. "Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review." Energies 15, no. 21 (November 7, 2022): 8316. http://dx.doi.org/10.3390/en15218316.
Повний текст джерелаLi, Mingli, Na Gong, Jinhui Wang, and Zhibin Lin. "Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000649–53. http://dx.doi.org/10.4071/isom-2015-tha44.
Повний текст джерелаZhang, Hongli, Tiezhu Shi, and Aijie Ma. "Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material." Polymers 13, no. 16 (August 20, 2021): 2797. http://dx.doi.org/10.3390/polym13162797.
Повний текст джерелаSato, Kimiyasu, Yuichi Tominaga, and Yusuke Imai. "Nanocelluloses and Related Materials Applicable in Thermal Management of Electronic Devices: A Review." Nanomaterials 10, no. 3 (March 2, 2020): 448. http://dx.doi.org/10.3390/nano10030448.
Повний текст джерелаBaldwin, D. F., and J. T. Beerensson. "Thermal Management in Direct Chip Attach Assemblies." Journal of Electronic Packaging 121, no. 4 (December 1, 1999): 222–30. http://dx.doi.org/10.1115/1.2793844.
Повний текст джерелаYin, Yafei, Min Li, Wei Yuan, Xiaolian Chen, and Yuhang Li. "A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source structures." Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 475, no. 2228 (August 2019): 20190402. http://dx.doi.org/10.1098/rspa.2019.0402.
Повний текст джерелаHabib, Numan, Muftooh ur Rehman Siddiqi, and Muhammad Tahir. "Thermal analysis of proposed heat sink design under natural convection for the thermal management of electronics." Thermal Science 26, no. 2 Part B (2022): 1487–501. http://dx.doi.org/10.2298/tsci210402307h.
Повний текст джерелаYang, Tianyu, Thomas Foulkes, Beomjin Kwon, Jin Gu Kang, Paul V. Braun, William P. King, and Nenad Miljkovic. "An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics." IEEE Transactions on Components, Packaging and Manufacturing Technology 9, no. 12 (December 2019): 2341–51. http://dx.doi.org/10.1109/tcpmt.2019.2930089.
Повний текст джерелаHaynes, A. S., and R. Sadangi. "Novel thermal barrier oxides for electronics thermal management: an assessment of WO3." Journal of Materials Science: Materials in Electronics 28, no. 21 (July 12, 2017): 16021–25. http://dx.doi.org/10.1007/s10854-017-7501-6.
Повний текст джерелаMoore, Arden L., and Li Shi. "Emerging challenges and materials for thermal management of electronics." Materials Today 17, no. 4 (May 2014): 163–74. http://dx.doi.org/10.1016/j.mattod.2014.04.003.
Повний текст джерелаAndresen, M., and M. Liserre. "Impact of active thermal management on power electronics design." Microelectronics Reliability 54, no. 9-10 (September 2014): 1935–39. http://dx.doi.org/10.1016/j.microrel.2014.07.069.
Повний текст джерелаSaravanan, V., and G. Kumaraguruparan. "Thermal management of microwave electronics in the radar system." ISSS Journal of Micro and Smart Systems 8, no. 2 (November 2019): 143–53. http://dx.doi.org/10.1007/s41683-019-00043-z.
Повний текст джерелаPanão, Miguel R. O., André M. Correia, and António L. N. Moreira. "High-power electronics thermal management with intermittent multijet sprays." Applied Thermal Engineering 37 (May 2012): 293–301. http://dx.doi.org/10.1016/j.applthermaleng.2011.11.031.
Повний текст джерелаStiubianu, George-Theodor, Adrian Bele, Marian Grigoras, Codrin Tugui, Bianca-Iulia Ciubotaru, Mirela-Fernanda Zaltariov, Firuța Borza, Leandru-Gheorghe Bujoreanu, and Maria Cazacu. "Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics." Batteries 8, no. 8 (August 18, 2022): 95. http://dx.doi.org/10.3390/batteries8080095.
Повний текст джерелаChowdhury, Srabanti. "Integrating Diamond for Cooling Electronics." ECS Meeting Abstracts MA2022-02, no. 32 (October 9, 2022): 1211. http://dx.doi.org/10.1149/ma2022-02321211mtgabs.
Повний текст джерелаPaul, Riya, Amol Deshpande, Fang Luo, and Wei Fan. "Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000259–63. http://dx.doi.org/10.4071/2380-4505-2020.1.000259.
Повний текст джерелаMalik, Faraz Kaiser, and Kristel Fobelets. "A review of thermal rectification in solid-state devices." Journal of Semiconductors 43, no. 10 (October 1, 2022): 103101. http://dx.doi.org/10.1088/1674-4926/43/10/103101.
Повний текст джерелаAbo-Zahhad, Essam M., Ahmed Amine Hachicha, Zafar Said, Chaouki Ghenai, and Shinichi Ookawara. "Thermal management system for high, dense, and compact power electronics." Energy Conversion and Management 268 (September 2022): 115975. http://dx.doi.org/10.1016/j.enconman.2022.115975.
Повний текст джерелаWang, Chien-Ping. "Thermal Management for Portable Electronics Using a Piezoelectric Micro-Blower." IEEE Transactions on Device and Materials Reliability 19, no. 3 (September 2019): 563–67. http://dx.doi.org/10.1109/tdmr.2019.2933021.
Повний текст джерелаPark, Sangyoung, Soohee Han, and Naehyuck Chang. "Control-Theoretic Dynamic Thermal Management of Automotive Electronics Control Units." IEEE Journal on Emerging and Selected Topics in Circuits and Systems 1, no. 2 (June 2011): 102–8. http://dx.doi.org/10.1109/jetcas.2011.2158342.
Повний текст джерелаYUKI, Kazuhisa, Kio TAKAI, Ken-taro ANJU, Risako KIBUSHI, Noriyuki UNNO, Tetsuro OGUSHI, Masaaki MURAKAMI, and Takuya IDE. "Thermal management of electronics by uni-directional porous heat sinks." Proceedings of Mechanical Engineering Congress, Japan 2017 (2017): J0330103. http://dx.doi.org/10.1299/jsmemecj.2017.j0330103.
Повний текст джерелаSuzuki, Osamu. "Thermal management for electronics equipment : problems and perspectives in industry." Reference Collection of Annual Meeting 2004.8 (2004): 334–35. http://dx.doi.org/10.1299/jsmemecjsm.2004.8.0_334.
Повний текст джерелаLu, T. J. "Thermal management of high power electronics with phase change cooling." International Journal of Heat and Mass Transfer 43, no. 13 (July 2000): 2245–56. http://dx.doi.org/10.1016/s0017-9310(99)00318-x.
Повний текст джерелаChrysler, Gregory M., and David T. Vader. "Electronics package with improved thermal management by thermoacoustic heat pumping." Journal of the Acoustical Society of America 96, no. 4 (October 1994): 2617. http://dx.doi.org/10.1121/1.410084.
Повний текст джерелаLan, Wei, Jiawei Zhang, Jiale Peng, Yiming Ma, Shuling Zhou, and Xiaobing Luo. "Distributed thermal management system for downhole electronics at high temperature." Applied Thermal Engineering 180 (November 2020): 115853. http://dx.doi.org/10.1016/j.applthermaleng.2020.115853.
Повний текст джерелаKandasamy, Ravi, Xiang-Qi Wang, and Arun S. Mujumdar. "Application of phase change materials in thermal management of electronics." Applied Thermal Engineering 27, no. 17-18 (December 2007): 2822–32. http://dx.doi.org/10.1016/j.applthermaleng.2006.12.013.
Повний текст джерелаWhitt, Reece, and David Huitink. "THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000398–403. http://dx.doi.org/10.4071/2380-4505-2019.1.000398.
Повний текст джерелаNovikov, A., J. Maxa, M. Nowottnick, M. Heimann, and K. Jarchoff. "Investigation of phase change materials for efficient thermal management of electronic modules." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000045–51. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000045.
Повний текст джерелаDeng, Yueguang, and Yi Jiang. "High-performance, safe, and reliable soft-metal thermal pad for thermal management of electronics." Applied Thermal Engineering 199 (November 2021): 117555. http://dx.doi.org/10.1016/j.applthermaleng.2021.117555.
Повний текст джерелаCui, Ying, Man Li, and Yongjie Hu. "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities." Journal of Materials Chemistry C 8, no. 31 (2020): 10568–86. http://dx.doi.org/10.1039/c9tc05415d.
Повний текст джерелаSang, Mingyu, Jongwoon Shin, Kiho Kim, and Ki Yu. "Electronic and Thermal Properties of Graphene and Recent Advances in Graphene Based Electronics Applications." Nanomaterials 9, no. 3 (March 5, 2019): 374. http://dx.doi.org/10.3390/nano9030374.
Повний текст джерелаShashidhar, Nagaraja, and Abhijit Rao. "Low thermal resistance packaging for high power electronics." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000131–38. http://dx.doi.org/10.4071/2380-4505-2019.1.000131.
Повний текст джерелаHegab, Hisham E., Eric B. Zimmerman, and Gene T. Colwell. "Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers." Journal of Electronic Packaging 124, no. 1 (March 1, 2002): 7–11. http://dx.doi.org/10.1115/1.1392320.
Повний текст джерелаHithaish, Doddamani, V. Saravanan, C. K. Umesh, and K. N. Seetharamu. "Thermal management of Electronics: Numerical investigation of triangular finned heat sink." Thermal Science and Engineering Progress 30 (May 2022): 101246. http://dx.doi.org/10.1016/j.tsep.2022.101246.
Повний текст джерелаAnderson, Kevin R., Thomas Gross, Christopher McNamara, and Ariel Gatti. "Venus Lander Electronics Payload Thermal Management Using a Multistage Refrigeration System." Journal of Thermophysics and Heat Transfer 32, no. 3 (July 2018): 659–68. http://dx.doi.org/10.2514/1.t5286.
Повний текст джерелаMoita, Ana, António Moreira, and José Pereira. "Nanofluids for the Next Generation Thermal Management of Electronics: A Review." Symmetry 13, no. 8 (July 27, 2021): 1362. http://dx.doi.org/10.3390/sym13081362.
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