Дисертації з теми "Thermal management of electronics"
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Mital, Manu. "Integrated Thermal Management Strategies for Embedded Power Electronic Modules." Diss., Virginia Tech, 2006. http://hdl.handle.net/10919/30269.
Повний текст джерелаPh. D.
Wu, Yupeng. "Thermal management of concentrator photovoltaics." Thesis, University of Warwick, 2009. http://wrap.warwick.ac.uk/3218/.
Повний текст джерелаTighe, Christopher James Frederick. "Thermal management of solid state power switches." Thesis, University of Nottingham, 2011. http://eprints.nottingham.ac.uk/12714/.
Повний текст джерелаStinnett, William A. "Thermal Management of Power Electronic Building Blocks." Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/31389.
Повний текст джерелаMaster of Science
McGlen, Ryan James. "Advanced thermal management techniques for high power electronics devices." Thesis, University of Newcastle Upon Tyne, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.533697.
Повний текст джерелаJakaboski, Juan-Carlos. "Innovative Thermal Management of Electronics Used in Oil Well Logging." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/7255.
Повний текст джерелаMahanta, Nayandeep Kumar. "Characterization and Analysis of Graphite Nanocomposites for Thermal Management of Electronics." Case Western Reserve University School of Graduate Studies / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=case1246546934.
Повний текст джерелаRaut, Rahul. "Thermal management of heat sensitive components in Pb-free assembly." Diss., Online access via UMI:, 2005.
Знайти повний текст джерелаPang, Ying-Feng. "Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules." Diss., Virginia Tech, 2005. http://hdl.handle.net/10919/26035.
Повний текст джерелаPh. D.
Green, Craig Elkton. "Composite thermal capacitors for transient thermal management of multicore microprocessors." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44772.
Повний текст джерелаZampino, Marc A. "Embedded Heat Pipes in Cofired Ceramic Substrates for Enhanced Thermal Management of Electronics." FIU Digital Commons, 2001. http://digitalcommons.fiu.edu/etd/24.
Повний текст джерелаYaddanapudi, Satvik Janardhan. "Spray Cooling with HFC-134a and HFO-1234yf for Thermal Management of Automotive Power Electronics." Thesis, University of North Texas, 2015. https://digital.library.unt.edu/ark:/67531/metadc822762/.
Повний текст джерелаMadrid, Lozano Francesc. "Thermal Conductivity and Specific Heat Measurements for Power Electronics Packaging Materials. Effective Thermal Conductivity Steady State and Transient Thermal Parameter Identification Methods." Doctoral thesis, Universitat Autònoma de Barcelona, 2005. http://hdl.handle.net/10803/5348.
Повний текст джерелаRavinuthala, Sridhar. "Thermal management in 3D packaging." Diss., Online access via UMI:, 2008.
Знайти повний текст джерелаIncludes bibliographical references.
Madhura, Hande Handattu Lall Pradeep. "Prognostics health management and damage relationships of lead-free components in thermal cycling harsh environments." Auburn, Ala, 2008. http://hdl.handle.net/10415/8.
Повний текст джерелаChacko, Salvio. "Numerical analysis of unsteady heat transfer for thermal management." Thesis, University of Warwick, 2012. http://wrap.warwick.ac.uk/54478/.
Повний текст джерелаDesai, Anand Hasmukh. "Thermal management of small scale electronic systems." Diss., Online access via UMI:, 2006.
Знайти повний текст джерелаDavidson, Jonathan. "Advanced thermal modelling and management techniques to improve power density in next generation power electronics." Thesis, University of Sheffield, 2015. http://etheses.whiterose.ac.uk/8419/.
Повний текст джерелаKratz, Henrik. "Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft : A Multifunctional Microsystem Approach." Doctoral thesis, Uppsala : Acta Universitatis Upsaliensis : Universitetsbiblioteket [distributör], 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-6316.
Повний текст джерелаHegab, Hisham El-Sayed. "Thermal management of electronic enclosures using heat pipes." Diss., Georgia Institute of Technology, 1994. http://hdl.handle.net/1853/17962.
Повний текст джерелаSewall, Evan Andrew. "Development of a Thermal Management Methodology for a Front-End DPS Power Supply." Thesis, Virginia Tech, 2002. http://hdl.handle.net/10919/35488.
Повний текст джерелаMaster of Science
Pang, Ying-Feng. "Integrated Thermal Design and Optimization Study for Active Integrated Power Electronic Modules (IPEMs)." Thesis, Virginia Tech, 2002. http://hdl.handle.net/10919/34965.
Повний текст джерелаMaster of Science
Cook, Jason Todd. "Interconnect Thermal Management of High Power Packaged Electronic Architectures." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5013.
Повний текст джерелаMcMillin, Timothy Walter. "Thermal management solutions for low volume complex electronic systems." College Park, Md.: University of Maryland, 2007. http://hdl.handle.net/1903/7368.
Повний текст джерелаThesis research directed by: Dept. of Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Wilson, Scott E. "Investigation of Copper Foam Coldplates as a High Heat Flux Electronics Cooling Solution." Thesis, Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/6944.
Повний текст джерелаBurton, Ludovic Nicolas. "Multi-Scale Thermal Modeling Methodology for High Power-Electronic Cabinets." Thesis, Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/19808.
Повний текст джерелаBurzynski, Katherine Morris. "Printed Nanocomposite Heat Sinks for High-Power, Flexible Electronics." University of Dayton / OhioLINK, 2021. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1619702252056433.
Повний текст джерелаWang, Yong. "Microfuidic technology for integrated thermal management micromachined synthetic jet /." Available online, Georgia Institute of Technology, 2004:, 2003. http://etd.gatech.edu/theses/available/etd-04082004-180443/unrestricted/wang%5fyong%5f200312%5fphd.pdf.
Повний текст джерелаBen, Aissia Hazem. "Model reduction for thermal management of high power electronic components for aerospace application." Thesis, Lyon, 2019. http://www.theses.fr/2019LYSEI071.
Повний текст джерелаIn the transition to more electric aircraft, one of the technological locks is the overheating of electronic components, which affects deeply their reliability and their lifetimes. Therefore, it is necessary to control the temperature of the electronic components. This thesis aims to build two reduced thermal models to monitor in real time the temperature of electronic components. The difference between the direct reduced model (DROM) and the inverse reduced order model (IROM) lies in the input parameters and the mathematical formalism of their constructions. For the DROM, the input parameters are the boundary conditions. This model is developed in two stages. The first step is to build a reduced base representative of the solution by applying POD (Proper Orthogonal Decomposition) on a snapshots matrix. The snapshots matrix is obtained from the finite element model (FEM) solution. The second step is to calculate the coordinates of a new solution using the Galerkin projection of the FEM on the reduced basis. A DROM built with 10 modes decreases drastically the computational time and the obtained absolute error is less than 0.1 °C except during sudden power variations. For the IROM, the input parameters are the temperature of the sensors placed far from the electronic components. This model does not need to know the boundary conditions as the DROM. The first step is to build a reduced base that couples the temperature or electronic components and the temperature of sensors using the POD. The second step is to identify the coordinates of the electronic components temperature from the measurements using a minimization algorithm. The error of the IROM of order 3 does not exceed 0.6 °C except during sudden power variations
Wang, Yong. "Microfluidic technology for integrated thermal management: micromachined synthetic jet." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/5438.
Повний текст джерелаCao, Xiao. "Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress." Diss., Virginia Tech, 2011. http://hdl.handle.net/10919/77252.
Повний текст джерелаPh. D.
Sahu, Vivek. "Hybrid solid-state/fluidic cooling for thermal management of electronic components." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/45817.
Повний текст джерелаAltalidi, Sulaiman Saleh. "Two-Phase Spray Cooling with HFC-134a and HFO-1234yf for Thermal Management of Automotive Power Electronics using Practical Enhanced Surfaces." Thesis, University of North Texas, 2017. https://digital.library.unt.edu/ark:/67531/metadc1011876/.
Повний текст джерелаKrist, Michael S. "The Design and Manufacture of a Light Emitting Diode Package for General Lighting." DigitalCommons@CalPoly, 2010. https://digitalcommons.calpoly.edu/theses/255.
Повний текст джерелаTse, Ka Chun. "Carbon nanotube based advanced thin interface materials for thermal management /." View abstract or full-text, 2007. http://library.ust.hk/cgi/db/thesis.pl?CHEM%202007%20TSE.
Повний текст джерелаBaranyai, Roland. "Novel materials and methods for thermal management of GaN-based electronic devices." Thesis, University of Bristol, 2016. https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.742981.
Повний текст джерелаSmarra, Devin. "Thermal Management and Packaging Techniques for High Performance Electrical Systems." University of Dayton / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1591122977788952.
Повний текст джерелаJain, Sameer. "Research and application of a thermal management device (CoolCap TM) for electronic assemblies." Diss., Online access via UMI:, 2006.
Знайти повний текст джерелаMinter, Dion Len. "Development of Strategies in Finding the Optimal Cooling of Systems of Integrated Circuits." Thesis, Virginia Tech, 2004. http://hdl.handle.net/10919/9961.
Повний текст джерелаMaster of Science
Sinha, Ashish. "An adsorption based cooling solution for electronics used in thermally harsh environments." Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/37077.
Повний текст джерелаMurthy, Sunil S. "Thin two-phase heat spreaders with boiling enhancement microstructures for thermal management of electronic systems." College Park, Md. : University of Maryland, 2004. http://hdl.handle.net/1903/179.
Повний текст джерелаThesis research directed by: Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Nie, Qihong. "Experimentally validated multiscale thermal modeling of electronic cabinets." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26492.
Повний текст джерелаCommittee Chair: Joshi, Yogendra; Committee Member: Gallivan, Martha; Committee Member: Graham, Samuel; Committee Member: Yeung, Pui-Kuen; Committee Member: Zhang, Zhuomin. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Fältström, Love. "Graphite sheets and graphite gap pads used as thermal interface materials : A thermal and mechanical evaluation." Thesis, KTH, Tillämpad termodynamik och kylteknik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-147339.
Повний текст джерелаElektronikbranschen rör sig mot högre elektriska effektertätheter, det vill säga högre effekt per volymenhet. Som en följd av detta ökar också efterfrågan på god kylning. Kylningen måste hanteras på alla nivåer, från komponenten som ska kylas, ända ut till omgivningen. Termiska interface material (TIM) används för att förbättra värmeöverföringen mellan två ytor i kontakt med varandra eller för att leda värmen över större gap. Det finns flera olika TIM med olika tillämpningsområden, fördelar och nackdelar. Denna studie gick ut på att utvärdera termiska och mekaniska egenskaper hos grafitfilmer och så kallade ”graphite gap pads” då de används som TIM. Projektet gjordes i sammarbete med Ericsson AB. En testuppställning baserat på ASTM D5470-standarden användes för att utvärdera värmeledningsförmågan och den termiska resistansen hos de olika materialen vid olika trycknivåer. Resultaten visade att flera grafitfilmer och ”gap pads” presterade bättre än materialen som används Ericssons produkter idag. Enligt testerna skulle den termiska resistansen kunna minskas med 50 % för grafitfilmerna och 90 % för ”gap padsen”. Materialens fördelaktiga egenskaper verifierades i en radioenhet där temperaturerna kunde sänkas i jämförelse med ett referenstest med standard-TIM. De nya materialen var mjukare än referensmaterialen och skulle därför inte orsaka några mekaniska problem vid användning. Den långsiktiga tillförlitligheten för grafitbaserade ”gap pads” måste dock undersökas vidare eftersom de elektriskt ledande materialen skulle kunna skapa kortslutningar på kretskorten.
Alrasheed, Mohammed R. A. "A modified particle swarm optimization and its application in thermal management of an electronic cooling system." Thesis, University of British Columbia, 2011. http://hdl.handle.net/2429/37900.
Повний текст джерелаMinichiello, Angela. "The development of a Heat Transfer Module (HTM) for the thermal management of sealed electronic enclosures." Thesis, Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/16358.
Повний текст джерелаRemella, Siva Rama Karthik. "Operation and Heuristic Design of Closed Loop Two-Phase Wicked Thermosyphons (CLTPWT) for Cooling Light Emitting Diodes (LEDs)." University of Cincinnati / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1522314073895889.
Повний текст джерелаRussell, Griffith B. "Local-and system-level thermal management of a single level integrated module (SLIM) using synthetic jet actuators." Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/18908.
Повний текст джерелаWei, Xiaojin. "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/4873.
Повний текст джерелаZhang, Shuangfeng. "Wide Bandgap Semiconductor Components Integration in a PCB Substrate for the Development of a High Density Power Electronics Converter." Thesis, Université Paris-Saclay (ComUE), 2018. http://www.theses.fr/2018SACLS398/document.
Повний текст джерелаThe emerging wide bandgap (WBG) semiconductor devices have been developed for power conversion applications instead of silicon devices due to higher switching frequencies (from few 100 kHz to several MHz) and lower on-state losses resulting in a better efficiency. In order to take full advantage of the WBG components, PCB technology is attractive for high power density integration thanks to its flexibility and low cost. However, due to poor thermal conductivity of the commonly used material Flame Retardant-4 (FR4), efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrates. So it is of the first importance to seek technological means in order to improve the thermal performances. In this thesis, three main thermal management solutions for PCB structures have been investigated including thermal vias, thick copper thickness on the PCB substrate as well as thermoelectric cooling (TEC) devices. Our studies are based on the electro-thermal modeling and 3D finite element (FE) methods. Firstly, optimization of the thermal via parameters (via diameter, via plating thickness, via-cluster surface, via pattern, pitch distance between vias etc.) has been realized to improve their cooing performances. We presented and evaluated thermal performances of the PCB structures by analyzing the thermal resistance of the PCB substrate with different thermal vias. Secondly, it is found that thermal performances of the PCB structures can be enhanced by using thick copper thickness on top of the PCB substrate, which increases the lateral heat flux along the copper layer. Influences of the copper thickness (35 µm to 500 µm) has been discussed. This solution is easy to realize and can be combined with other cooling solutions. Thirdly, thermoelectric cooler like Peltier device is a solid-state cooling technology that can meet the local cooling requirements. Influences of Peltier parameters (Thermoelectric material properties, number of Peltier elements, distance between the heating source and the Peltier devices etc.) have been identified. All these analyses demonstrate the potential application of Peltier devices placed beside the heating source for PCB structures, which is a benefit for developing the embedding technology in such structures
Ongkodjojo, Ong Andojo. "Electrohydrodynamic Microfabricated Ionic Wind Pumps for Electronics Cooling Applications." Case Western Reserve University School of Graduate Studies / OhioLINK, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=case1354638816.
Повний текст джерела