Статті в журналах з теми "Thermal management challenges"
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Baxendale, Anthony. "Design Challenges in Underbonnet Thermal Management." ATZautotechnology 4, no. 1 (January 2004): 52–55. http://dx.doi.org/10.1007/bf03246807.
Повний текст джерелаSchmidt, R. R., E. E. Cruz, and M. Iyengar. "Challenges of data center thermal management." IBM Journal of Research and Development 49, no. 4.5 (July 2005): 709–23. http://dx.doi.org/10.1147/rd.494.0709.
Повний текст джерелаAffonso, Walter, Ricardo Gandolfi, Ricardo Jose Nunes dos Reis, Carlos Roberto Ilário da Silva, Nicolas Rodio, Timoleon Kipouros, Panagiotis Laskaridis, et al. "Thermal Management challenges for HEA – FUTPRINT 50." IOP Conference Series: Materials Science and Engineering 1024, no. 1 (January 1, 2021): 012075. http://dx.doi.org/10.1088/1757-899x/1024/1/012075.
Повний текст джерелаSingh, Tanuj, Roland Nolte, Antonella Calamiello, and Cedric Rouaud. "Holistic Thermal Management for Future CO2 Challenges." ATZ worldwide 117, no. 7-8 (June 30, 2015): 20–25. http://dx.doi.org/10.1007/s38311-015-0042-9.
Повний текст джерелаNarasimhan, Susheela, Herman Chu, Mudasir Ahmad, and Li Li. "Thermal Challenges in 3D Stacks." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 001354–72. http://dx.doi.org/10.4071/2012dpc-wa11.
Повний текст джерелаFreeman, Jeffrey, Philip Osterkamp, Michael Green, Andrew Gibson, and Benjamin Schiltgen. "Challenges and opportunities for electric aircraft thermal management." Aircraft Engineering and Aerospace Technology 86, no. 6 (September 30, 2014): 519–24. http://dx.doi.org/10.1108/aeat-04-2014-0042.
Повний текст джерелаWang, Evelyn N. "INTRODUCTION: CHALLENGES AND OPPORTUNITIES IN THERMAL MANAGEMENT TECHNOLOGIES." Annual Review of Heat Transfer 18 (2015): 1–6. http://dx.doi.org/10.1615/annualrevheattransfer.2015012604.
Повний текст джерелаNienaber, J. A., and G. L. Hahn. "Livestock production system management responses to thermal challenges." International Journal of Biometeorology 52, no. 2 (May 25, 2007): 149–57. http://dx.doi.org/10.1007/s00484-007-0103-x.
Повний текст джерелаGarimella, Suresh V., Lian-Tuu Yeh, and Tim Persoons. "Thermal Management Challenges in Telecommunication Systems and Data Centers." IEEE Transactions on Components, Packaging and Manufacturing Technology 2, no. 8 (August 2012): 1307–16. http://dx.doi.org/10.1109/tcpmt.2012.2185797.
Повний текст джерелаMoore, Arden L., and Li Shi. "Emerging challenges and materials for thermal management of electronics." Materials Today 17, no. 4 (May 2014): 163–74. http://dx.doi.org/10.1016/j.mattod.2014.04.003.
Повний текст джерелаPischinger, Stefan, Peter Genender, Stefan Klopstein, and David Hemkemeyer. "Challenges in Thermal Management of Hybrid and Electric Vehicles." ATZ worldwide 116, no. 4 (March 12, 2014): 36–41. http://dx.doi.org/10.1007/s38311-014-0164-5.
Повний текст джерелаBalasingam, Balakumar, Mostafa Ahmed, and Krishna Pattipati. "Battery Management Systems—Challenges and Some Solutions." Energies 13, no. 11 (June 2, 2020): 2825. http://dx.doi.org/10.3390/en13112825.
Повний текст джерелаFriedrichs, Peter, and Reinhold Bayerer. "SiC High Power Devices – Challenges for Assembly and Thermal Management." Materials Science Forum 740-742 (January 2013): 869–72. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.869.
Повний текст джерелаCheramy, Severine. "Thermal & mechanical challenges for 3DIC integration." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001622–45. http://dx.doi.org/10.4071/2013dpc-wp32.
Повний текст джерелаvan Heerden, A. S. J., D. M. Judt, S. Jafari, C. P. Lawson, T. Nikolaidis, and D. Bosak. "Aircraft thermal management: Practices, technology, system architectures, future challenges, and opportunities." Progress in Aerospace Sciences 128 (January 2022): 100767. http://dx.doi.org/10.1016/j.paerosci.2021.100767.
Повний текст джерелаPreviati, Giorgio, Giampiero Mastinu, and Massimiliano Gobbi. "Thermal Management of Electrified Vehicles—A Review." Energies 15, no. 4 (February 11, 2022): 1326. http://dx.doi.org/10.3390/en15041326.
Повний текст джерелаOtiaba, K. C., N. N. Ekere, E. H. Amalu, R. S. Bhatti, and S. Mallik. "Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R and D Challenges." Advanced Materials Research 367 (October 2011): 301–7. http://dx.doi.org/10.4028/www.scientific.net/amr.367.301.
Повний текст джерелаDahham, Rami Y., Haiqiao Wei, and Jiaying Pan. "Improving Thermal Efficiency of Internal Combustion Engines: Recent Progress and Remaining Challenges." Energies 15, no. 17 (August 26, 2022): 6222. http://dx.doi.org/10.3390/en15176222.
Повний текст джерелаZakaria, Irnie Azlin, Zeno Michael, and Wan Ahmad Najmi Wan Mohamed. "Nanofluid as Cooling Medium in Polymer Electrolyte Membrane (PEM) Fuel Cell: A Study on Potentials and Possibilities." Advanced Materials Research 1109 (June 2015): 319–23. http://dx.doi.org/10.4028/www.scientific.net/amr.1109.319.
Повний текст джерелаOgunmodimu, Olumide, and Edmund C. Okoroigwe. "Solar thermal electricity in Nigeria: Prospects and challenges." Energy Policy 128 (May 2019): 440–48. http://dx.doi.org/10.1016/j.enpol.2019.01.013.
Повний текст джерелаShah, A. K., M. H. Thaker, and K. B. Vyas. "Challenges in Characterization and Acceptance of Metal Matrix Composite “Carrier Plate” Material for Space Applications." Materials Science Forum 710 (January 2012): 412–17. http://dx.doi.org/10.4028/www.scientific.net/msf.710.412.
Повний текст джерелаPatel, Prachi, and Subhash L. Shinde. "Materials opportunities and challenges for low-energy computing: Thermal management and interconnects." MRS Bulletin 45, no. 6 (June 2020): 422–23. http://dx.doi.org/10.1557/mrs.2020.156.
Повний текст джерелаLiang, Kunfeng, Moran Wang, Chunyan Gao, Bin Dong, Changzhen Feng, Xun Zhou, and Jing Liu. "Advances and challenges of integrated thermal management technologies for pure electric vehicles." Sustainable Energy Technologies and Assessments 46 (August 2021): 101319. http://dx.doi.org/10.1016/j.seta.2021.101319.
Повний текст джерелаGarimella, Suresh V., Tim Persoons, Justin A. Weibel, and Vadim Gektin. "Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions." IEEE Transactions on Components, Packaging and Manufacturing Technology 7, no. 8 (August 2017): 1191–205. http://dx.doi.org/10.1109/tcpmt.2016.2603600.
Повний текст джерелаIqbal, Md Arif, Naveen Kumar Macha, Wafi Danesh, Sehtab Hossain, and Mostafizur Rahman. "Thermal management challenges and mitigation techniques for transistor-level 3-D integration." Microelectronics Journal 91 (September 2019): 61–69. http://dx.doi.org/10.1016/j.mejo.2019.07.004.
Повний текст джерелаZhong, Jianfeng, Zihao Yang, Liangchen Tan, and Shouli Jiang. "Research on Structure Integration and Thermal Control Technology of RF Microsystem." Journal of Physics: Conference Series 2083, no. 2 (November 1, 2021): 022096. http://dx.doi.org/10.1088/1742-6596/2083/2/022096.
Повний текст джерелаAnandan, Sundaram, and Velraj Ramalingam. "Thermal management of electronics: A review of literature." Thermal Science 12, no. 2 (2008): 5–26. http://dx.doi.org/10.2298/tsci0802005a.
Повний текст джерелаLi, Bo, Huang Kuo, Xuehui Wang, Yiyi Chen, Yangang Wang, David Gerada, Sean Worall, Ian Stone, and Yuying Yan. "Thermal Management of Electrified Propulsion System for Low-Carbon Vehicles." Automotive Innovation 3, no. 4 (December 2020): 299–316. http://dx.doi.org/10.1007/s42154-020-00124-y.
Повний текст джерелаPratt, D. M., and D. Moorhouse. "System integration of high intensity energy subsystems – a thermal management challenge." Aeronautical Journal 112, no. 1134 (August 2008): 477–82. http://dx.doi.org/10.1017/s000192400000244x.
Повний текст джерелаCui, Ying, Man Li, and Yongjie Hu. "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities." Journal of Materials Chemistry C 8, no. 31 (2020): 10568–86. http://dx.doi.org/10.1039/c9tc05415d.
Повний текст джерелаCheng, Zhe. "Thermal science and engineering in third-generation semiconductor materials and devices." Acta Physica Sinica 70, no. 23 (2021): 236502. http://dx.doi.org/10.7498/aps.70.20211662.
Повний текст джерелаZheng, Da Yu, Juan Zheng, Xiang Yi Guan, Jia Zheng, and Yi Ming Zhang. "Review of Materials and Environment Management for Solar Thermal Collectors." Applied Mechanics and Materials 521 (February 2014): 539–42. http://dx.doi.org/10.4028/www.scientific.net/amm.521.539.
Повний текст джерелаWang, Kang-Jia, Hong-Chang Sun, Cui-Ling Li, Guo-Dong Wang, and Hong-Wei Zhu. "Thermal management of the hotspots in 3-D integrated circuits." Thermal Science 22, no. 4 (2018): 1685–90. http://dx.doi.org/10.2298/tsci1804685w.
Повний текст джерелаJafari, Soheil, and Theoklis Nikolaidis. "Thermal Management Systems for Civil Aircraft Engines: Review, Challenges and Exploring the Future." Applied Sciences 8, no. 11 (October 24, 2018): 2044. http://dx.doi.org/10.3390/app8112044.
Повний текст джерелаSivageerthi, T., Bathrinath Sankaranarayanan, Syed Mithun Ali, Ali AlArjani, and Koppiahraj Karuppiah. "Modeling Challenges for Improving the Heat Rate Performance in a Thermal Power Plant: Implications for SDGs in Energy Supply Chains." Sustainability 14, no. 8 (April 10, 2022): 4510. http://dx.doi.org/10.3390/su14084510.
Повний текст джерелаShahjalal, Mohammad, Tamanna Shams, Md Emtiajul Islam, Wasif Alam, Mrinmoy Modak, Sadat Bin Hossain, Venkatasailanathan Ramadesigan, Md Rishad Ahmed, Hafiz Ahmed, and Atif Iqbal. "A review of thermal management for Li-ion batteries: Prospects, challenges, and issues." Journal of Energy Storage 39 (July 2021): 102518. http://dx.doi.org/10.1016/j.est.2021.102518.
Повний текст джерелаSatapathy, Suchismita. "An Investigation on sustainable supply chain management challenges for Indian thermal power plants." International Journal of Logistics Systems and Management 1, no. 1 (2020): 1. http://dx.doi.org/10.1504/ijlsm.2020.10020884.
Повний текст джерелаSatapathy, Suchismita. "An investigation on sustainable supply chain management challenges for Indian thermal power plants." International Journal of Logistics Systems and Management 37, no. 2 (2020): 173. http://dx.doi.org/10.1504/ijlsm.2020.110582.
Повний текст джерелаLin, Jiayuan, Xinhua Liu, Shen Li, Cheng Zhang, and Shichun Yang. "A review on recent progress, challenges and perspective of battery thermal management system." International Journal of Heat and Mass Transfer 167 (March 2021): 120834. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2020.120834.
Повний текст джерелаZhang, Hongli, Tiezhu Shi, and Aijie Ma. "Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material." Polymers 13, no. 16 (August 20, 2021): 2797. http://dx.doi.org/10.3390/polym13162797.
Повний текст джерелаEl-Azab, Rasha. "Smart homes: potentials and challenges." Clean Energy 5, no. 2 (June 1, 2021): 302–15. http://dx.doi.org/10.1093/ce/zkab010.
Повний текст джерелаHsu, Yih-Yun. "Some challenges to the thermal-hydraulic codes." Nuclear Engineering and Design 151, no. 1 (November 1994): 103–11. http://dx.doi.org/10.1016/0029-5493(94)90036-1.
Повний текст джерелаYin, Jing, Shangming Wang, Xuehao Sang, Zhifu Zhou, Bin Chen, Panidis Thrassos, Alexandros Romeos, and Athanasios Giannadakis. "Spray Cooling as a High-Efficient Thermal Management Solution: A Review." Energies 15, no. 22 (November 15, 2022): 8547. http://dx.doi.org/10.3390/en15228547.
Повний текст джерелаChiriac, Victor. "Optimal Thermal Management of Microelectronic Packages." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 001617–34. http://dx.doi.org/10.4071/2010dpc-poster8.
Повний текст джерелаKumar, Sunil, Stephen R. Smith, Geoff Fowler, Costas Velis, S. Jyoti Kumar, Shashi Arya, Rena, Rakesh Kumar, and Christopher Cheeseman. "Challenges and opportunities associated with waste management in India." Royal Society Open Science 4, no. 3 (March 2017): 160764. http://dx.doi.org/10.1098/rsos.160764.
Повний текст джерелаLiu, Jian, Mengyao Xu, Rongdi Zhang, Xirui Zhang, and Wenxiong Xi. "Progress of Porous/Lattice Structures Applied in Thermal Management Technology of Aerospace Applications." Aerospace 9, no. 12 (December 15, 2022): 827. http://dx.doi.org/10.3390/aerospace9120827.
Повний текст джерелаAppert, Jonathan. "Examining Whether to GEL or PAD." New Electronics 54, no. 11 (June 22, 2021): 20–21. http://dx.doi.org/10.12968/s0047-9624(22)60301-8.
Повний текст джерелаGrosu, Vicentiu, Chris Lindgren, Tamas Vejsz, Ya-Chi Chen, and Avijit Bhunia. "Thermal Management Solutions for Network File Server Used in Avionics Applications." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000419–27. http://dx.doi.org/10.4071/isom-wa24.
Повний текст джерелаXie, John Y., Hong Shi, Yuan Li, Zhe Li, Arif Rahman, Karthik Chandrasekar, Deepa Ratakonda, et al. "Enabling the 2.5D Integration." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000254–67. http://dx.doi.org/10.4071/isom-2012-tp15.
Повний текст джерелаGhahfarokhi, Payam Shams, Andrejs Podgornovs, Ants Kallaste, Antonio J. Marques Cardoso, Anouar Belahcen, Toomas Vaimann, Hans Tiismus, and Bilal Asad. "Opportunities and Challenges of Utilizing Additive Manufacturing Approaches in Thermal Management of Electrical Machines." IEEE Access 9 (2021): 36368–81. http://dx.doi.org/10.1109/access.2021.3062618.
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