Увійти

Готові списки джерел за темами / Stackable / Статті в журналах

Статті в журналах з теми "Stackable"

Щоб переглянути інші типи публікацій з цієї теми, перейдіть за посиланням: Stackable.

Автор: Grafiati

Опубліковано: 10 грудня 2022

Оновлено: 29 січня 2023

Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями

Оберіть тип джерела:

Ознайомтеся з топ-50 статей у журналах для дослідження на тему "Stackable".

Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.

Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.

Переглядайте статті в журналах для різних дисциплін та оформлюйте правильно вашу бібліографію.

1

Xie, Han, Lei Zhiquan, Radoslav Z. Pavlović, Judith Gallucci, and Jovica D. Badjić. "Stackable molecular chairs." Chemical Communications 55, no. 38 (2019): 5479–82. http://dx.doi.org/10.1039/c9cc01664c.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

2

Lavine, M. S. "CHEMISTRY: Stackable Conductors." Science 300, no. 5623 (May 23, 2003): 1205b—1205. http://dx.doi.org/10.1126/science.300.5623.1205b.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

3

Loepere, Keith. "Stackable thread mechanisms." ACM SIGOPS Operating Systems Review 39, no. 4 (October 2005): 4–17. http://dx.doi.org/10.1145/1088446.1088447.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

4

Brown, Michael D., Ben T. Cox, and Bradley E. Treeby. "Stackable acoustic holograms." Applied Physics Letters 116, no. 26 (June 29, 2020): 261901. http://dx.doi.org/10.1063/5.0009829.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

5

Enrique, Lluis, Povilas Cepaitis, Diego Ordoñez, and Carlos Piles. "CASTonCAST: Architectural freeform shapes from precast stackable components." VLC arquitectura. Research Journal 3, no. 1 (April 28, 2016): 85. http://dx.doi.org/10.4995/vlc.2016.4291.

Повний текст джерела

Анотація:

<div data-canvas-width="505.6672666666668">This article introduces the CASTonCAST system for the design and production of architectural freeform shapes from precast stackable components. This system is composed of two complementary parts: a novel manufacturing technique of precast stackable building components and a new geometric method for the design of freeform shapes by means of stackable solid tiles. This paper describes both parts of the system by means of physical prototypes and geometric studies.</div><p class="IJACAbstractText"> </p>

Стилі APA, Harvard, Vancouver, ISO та ін.

6

Marrero-Berrios, Ileana, Anil Shrirao, Charles P. Rabolli, Rishabh Hirday, Rene S. Schloss, and Martin L. Yarmush. "Multi-layer stackable tissue culture platform for 3D co-culture." TECHNOLOGY 08, no. 01n02 (March 2020): 37–49. http://dx.doi.org/10.1142/s233954782050003x.

Повний текст джерела

Анотація:

In vitro tools, which can enable development of models that replicate the cell microenvironment associated with complex diseases such as osteoarthritis (OA), are critically needed. In OA, catabolic and inflammatory processes orchestrated by multiple cell types lead to the eventual destruction of articular cartilage. To address this need, our group developed a device that will enable investigation of complex cell systems. Our stackable tissue culture insert was fabricated and characterized with respect to biocompatibility, ease of use, and potential for tissue culture applications. The stackable tissue culture inserts can be easily modified, fabricated, and assembled into commercially available multi-well plates. In vitro studies conducted with three different cell types demonstrated high cell viability and functional secretion when cultured in the stackable inserts. Furthermore, synergistic effects when the three cell types were cultured together were observed. This demonstrates the need to more fully interrogate in vitro culture systems, and this stackable insert can provide a tool to fill the current technological void to do so.

Стилі APA, Harvard, Vancouver, ISO та ін.

7

Wang, Ching Wu, Tsun Kai Hsu, Ji Han Wu, Jui Hsiang Cheng, Chew Wei Yang, and Ti Chun Yeh. "An Optimal Rapid Energy-Storing Design for the Stackable Piezoelectric Power Generation Devices." Advanced Materials Research 590 (November 2012): 189–94. http://dx.doi.org/10.4028/www.scientific.net/amr.590.189.

Повний текст джерела

Анотація:

The optimal design for stackable piezoelectric power generation device and its micropower energy storage method is presented in this work. In this configuration, three different arrangement designs of piezoelectric power generation devices were put and compared for obtaining a greater produced output power. Evidence shows that the Sample 2 among the three different arrangement stackable piezoelectric power generation devices could avoid damage to the PZT-5H and achieve a highest instantaneous output power (5.175mW). Moreover, to establish the high efficiency energy storage system, using low power buck converter IC (LTC3588-1) was proposed. The obtained results show that a 15mAh Ni-MH battery could be fully-charged within two hours by utilizing the optimal arrangement design stackable piezoelectric power generation device combining with micropower energy storage system.

Стилі APA, Harvard, Vancouver, ISO та ін.

8

Hermiller, Susan, and Conchita Martínez-Pérez. "HNN extensions and stackable groups." Groups, Geometry, and Dynamics 12, no. 3 (August 13, 2018): 1123–58. http://dx.doi.org/10.4171/ggd/467.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

9

Lee, D., J. Riddle, S. Lathrop, and J. Bollinger. "Synthesis of Stackable Pseudo-Triphenylenes." Synfacts 2006, no. 11 (November 2006): 1123. http://dx.doi.org/10.1055/s-2006-949466.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

10

Murawski, Pamela. "Stackable Credentials Deliver Widespread Benefits." Journal - American Water Works Association 111, no. 10 (October 2019): 70–73. http://dx.doi.org/10.1002/awwa.1384.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

11

Enrique Monzó, Lluís, and Joseph Schwartz. "Design of CASTonCAST shell structures based on load path network method." International Journal of Space Structures 32, no. 3-4 (June 2017): 216–25. http://dx.doi.org/10.1177/0266351117736650.

Повний текст джерела

Анотація:

The CASTonCAST system consists in designing and producing architectural freeform shapes from precast stackable components. This allows fabricating and constructing curved shapes in concrete in an efficient and sustainable manner. Currently, the geometric modeling process of the system does not ensure that the shapes are load-bearing. This article introduces a method for the design of shell structures from stackable components based on the CASTonCAST system. In this research, the structural analysis is conducted using load path network method since this method helps integrating design, realization, and structural aspects.

Стилі APA, Harvard, Vancouver, ISO та ін.

12

Xu, Kerui, Matthew R. Begley, and James P. Landers. "Simultaneous metering and dispensing of multiple reagents on a passively controlled microdevice solely by finger pressing." Lab on a Chip 15, no. 3 (2015): 867–76. http://dx.doi.org/10.1039/c4lc01319k.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

13

Woo, Seo, and Yi. "A Static Balancing Method for Variable Payloads by Combination of a Counterweight and Spring and Its Application as a Surgical Platform." Applied Sciences 9, no. 19 (September 20, 2019): 3955. http://dx.doi.org/10.3390/app9193955.

Повний текст джерела

Анотація:

Stackable mechanism architecture has demonstrated effective gravity-balancing over entire workspaces. Adjustable balancing is required when balancing is broken due to changing the payload at the distal end of a mechanism. In this paper, adjustable balancing of the stackable mechanism for a variable payload is investigated. For this, balancing conditions for three adjustable balancing methods are suggested, and a new balancing method combining a spring and counterweight is considered as an effective means of adjustable balancing for variable payloads. The excellent performance of the system is proven through experiments. Electromyography (EMG) sensors are employed to measure the amount of energy expenditure during the drilling task. It was verified through several tests that an operator holding a drill mounted at the distal end of a stackable arm felt less energy compared to an operator holding the drill directly in free space. The developed balancing arm was successfully applied during a mastoidectomy. A 3-step warning algorithm along with a braking function was found to be effective for safe surgery.

Стилі APA, Harvard, Vancouver, ISO та ін.

14

Kim, Joo Hyun, Sangkyu Lee, Junghyun Choi, Taeseup Song, and Ungyu Paik. "Stackable, three dimensional carbon–metal oxide composite for high performance supercapacitors." Journal of Materials Chemistry A 3, no. 41 (2015): 20459–64. http://dx.doi.org/10.1039/c5ta06266g.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

15

TAKAHASHI, Tomokazu, Hayato SHIMIZU, Masato SUZUKI, and Seiji AOYAGI. "High Efficiency Stackable Micro Pneumatic Actuator." Journal of the Japan Society for Precision Engineering 81, no. 1 (2015): 74–79. http://dx.doi.org/10.2493/jjspe.81.74.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

16

Kwan, Wei Lek, Ricky J. Tseng, and Yang Yang. "Multi-layer stackable polymer memory devices." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 367, no. 1905 (October 28, 2009): 4159–67. http://dx.doi.org/10.1098/rsta.2008.0263.

Повний текст джерела

Анотація:

Multi-layer stackable polymer memory architecture is an interesting new direction for polymer memory. The memory density can be increased by increasing the number of stacked layers without reducing the minimum feature size. To achieve multi-level stacking, the polymer used must be able to be cross-linked so that it will not be dissolved upon deposition of additional layers. This requirement also makes the polymer robust enough to withstand conventional lithographic processes. In this paper, the various approaches to achieve cross-linkable polymer memory are discussed. Device fabrication and performance are also reported.

Стилі APA, Harvard, Vancouver, ISO та ін.

17

Chen, Waterson. "Loudspeaker system with stackable loudspeaker units." Journal of the Acoustical Society of America 112, no. 3 (2002): 796. http://dx.doi.org/10.1121/1.1514511.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

18

Heidemann, John S., and Gerald J. Popek. "File-system development with stackable layers." ACM Transactions on Computer Systems 12, no. 1 (February 1994): 58–89. http://dx.doi.org/10.1145/174613.174616.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

19

Fatila, Elisabeth M., Maren Pink, Eric B. Twum, Jonathan A. Karty, and Amar H. Flood. "Phosphate–phosphate oligomerization drives higher order co-assemblies with stacks of cyanostar macrocycles." Chemical Science 9, no. 11 (2018): 2863–72. http://dx.doi.org/10.1039/c7sc05290a.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

20

Gupta, Rupesh, Sarang Sharma, Sheifali Gupta, and Deepali Gupta. "Stackable Smart Footwear Rack Using Infrared Sensor." Journal of Computational and Theoretical Nanoscience 16, no. 10 (October 1, 2019): 4232–35. http://dx.doi.org/10.1166/jctn.2019.8505.

Повний текст джерела

Анотація:

The present solution relates to a stackable smart footwear rack and a cabinet housing the stackable smart footwear rack. The present solution provides easy access to organize, store and retrieve footwear in the racks in addition to providing efficient utilization of storage space in a smart and intelligent manner by means of human machine interface and sensors coupled to motor mechanisms. The present solution also helps negate disorganized arrangement of footwear in the racks and is easy to use thereby contributing to a comfortable lifestyle for people of all age groups. Additionally, the present solution also provides a means to minimize any incidences of dust, odor or dirt in the cabinets and racks due to soiled footwear leading to increased levels of hygiene when handling the contents.

Стилі APA, Harvard, Vancouver, ISO та ін.

21

Zheng, Mei Na, Yan Song Li, and Jun Liu. "Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors." Advanced Materials Research 1092-1093 (March 2015): 539–42. http://dx.doi.org/10.4028/www.scientific.net/amr.1092-1093.539.

Повний текст джерела

Анотація:

In this paper, thermal model of the symmetric rectangular stackable supercapacitors are established. By using the finite element method, the temperature distribution of the supercapacitor is simulated. Then the supercapacitor's thermal behavior under the ambient temperature, but with different current density is analyzed. The simulation results show that the maximum temperature during the discharge process occurs in the center of the supercapacitor. The maximum temperature is associated with the applied current, and the higher the applied current is, the higher the maximum temperature is. It's necessary to control the maximum temperature within the allowable values, by establishing reasonable thermal management systems and cooling systems.

Стилі APA, Harvard, Vancouver, ISO та ін.

22

SAITO, Wataru, Kenta TAKEI, Wataru KITAGAWA, Takahuru TAKESHITA, and Yoshio FUJIMURA. "Drive Characteristics Analysis for Stackable Electromagnetic Actuator." Journal of the Japan Society of Applied Electromagnetics and Mechanics 29, no. 1 (2021): 45–51. http://dx.doi.org/10.14243/jsaem.29.45.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

23

Nishimura, Satoshi, Mutsuo Sano, and Katsuo Ikeda. "A Stackable Filesystem for Realtime Network Backup." IEEJ Transactions on Electronics, Information and Systems 130, no. 3 (2010): 503–9. http://dx.doi.org/10.1541/ieejeiss.130.503.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

24

Lee, Ho-Yul, and Young-Jin Choi. "Planar Manipulator using Stackable 4-BAR Mechanisms." Journal of Institute of Control, Robotics and Systems 16, no. 5 (May 1, 2010): 456–62. http://dx.doi.org/10.5302/j.icros.2010.16.5.456.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

25

Becker, K. F., E. Jung, A. Ostmann, T. Braun, A. Neumann, R. Aschenbrenner, and H. Reichl. "Stackable System-On-Packages With Integrated Components." IEEE Transactions on Advanced Packaging 27, no. 2 (May 2004): 268–77. http://dx.doi.org/10.1109/tadvp.2004.828826.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

26

Peng, Zhiwei, Jian Lin, Ruquan Ye, Errol L. G. Samuel, and James M. Tour. "Flexible and Stackable Laser-Induced Graphene Supercapacitors." ACS Applied Materials & Interfaces 7, no. 5 (January 28, 2015): 3414–19. http://dx.doi.org/10.1021/am509065d.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

27

Heidemann, J., and G. Popek. "Performance of cache coherence in stackable filing." ACM SIGOPS Operating Systems Review 29, no. 5 (December 3, 1995): 127–41. http://dx.doi.org/10.1145/224057.224067.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

28

Wang, Kai, Li Zhang, Bingcheng Ji, and Jinlei Yuan. "The thermal analysis on the stackable supercapacitor." Energy 59 (September 2013): 440–44. http://dx.doi.org/10.1016/j.energy.2013.07.064.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

29

Vyawahare, Saurabh, Michael Brundage, Aleksandra Kijac, Michael Gutierrez, Martina de Geus, Supriyo Sinha, and Andrew Homyk. "Sorting droplets into many outlets." Lab on a Chip 21, no. 21 (2021): 4262–73. http://dx.doi.org/10.1039/d1lc00493j.

Повний текст джерела

Анотація:

Droplet sorter manufacturable in plastic (COC) or elastomer (PDMS), featuring ionic liquid electrodes and stackable sorting junctions. We use it to make a cell sorter, introducing methods for breaking emulsions and collecting single droplets.

Стилі APA, Harvard, Vancouver, ISO та ін.

30

George, Babu. "Mega Universities, Nanodegrees, and the Digital Disruption in Higher Education." Journal of Risk and Financial Management 15, no. 11 (October 26, 2022): 496. http://dx.doi.org/10.3390/jrfm15110496.

Повний текст джерела

Анотація:

Traditional universities are facing a huge threat from exogenous innovators who have perfected the idea of conceiving and developing various kinds of micro-credentials that are stackable, reconfigurable, and storable in the blockchains (Khatun et al [...]

Стилі APA, Harvard, Vancouver, ISO та ін.

31

Hall-Ellis, Sylvia D. "Stackable micro-credentials – a framework for the future." Bottom Line 29, no. 4 (November 14, 2016): 233–36. http://dx.doi.org/10.1108/bl-02-2016-0006.

Повний текст джерела

Анотація:

Purpose The purpose of this column is to express a viewpoint about stackable micro-credentials in the library profession. Design/methodology/approach This is an opinion piece. Findings There are no formal research findings. Originality/value This is an original viewpoint.

Стилі APA, Harvard, Vancouver, ISO та ін.

32

Becker, K. F., T. Braun, A. Neumann, A. Ostmann, E. Coko, M. Koch, V. Bader, R. Aschenbrenner, and H. Reichl. "A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing." Journal of Electronic Packaging 127, no. 1 (March 1, 2005): 1–6. http://dx.doi.org/10.1115/1.1846058.

Повний текст джерела

Анотація:

One of the general trends in microelectronics packaging is the constant miniaturization of devices. This has led to the development of maximum miniaturization of components on Si level, i.e., CSPs and Flip Chips. To further integrate more functionality into devices, and to further increase the degree of miniaturization, packaging development focus is switching from single chip packaging to the realization of systems in package, SiPs. Two main approaches do exist to realize this goal: one is to integrate all components into one dedicated package, yielding maximum miniaturization for a special application, but little flexibility as far as system design is concerned. The other is to create modular stackable components that can be assembled into a functional system. This integrates both flexibility in system design by exchangeable components and increased reliability potential, as single components can be tested separately. This last approach was considered a promising choice for the generation of SiPs. Within this paper a packaging process is introduced that allows the wafer level manufacturing of stackable, encapsulated devices. Using a transfer molded epoxy demonstrator, a proof-of-concept is performed showing the feasibility of the stackable package approach. This is achieved by combining wafer level encapsulation and molded interconnect device technology. An electroless process for metallization and laser techniques for structuring the metallization layer have been applied to generate structures for reliable interconnects capable for the use of lead-free solders. Summarized, this paper presents the process development and feasibility analysis of wafer level packaging technologies for modular SiP solutions based on a duromer MID approach.

Стилі APA, Harvard, Vancouver, ISO та ін.

33

Ando, Yoshinori, Shota Kuroiwa, Kazuya Kobori, and Iwanori Murakami. "Development of magnetic harmonic gear with stackable structure." International Journal of Applied Electromagnetics and Mechanics 52, no. 1-2 (December 29, 2016): 809–16. http://dx.doi.org/10.3233/jae-162095.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

34

Schwartz, Frank J. "A Leadless Stackable Trap for Harvesting Common Carp." North American Journal of Fisheries Management 6, no. 4 (October 1986): 596–98. http://dx.doi.org/10.1577/1548-8659(1986)6<596:alstfh>2.0.co;2.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

35

Yong, Xin, Antonina Simakova, Saadyah Averick, Junkal Gutierrez, Olga Kuksenok, Anna C. Balazs, and Krzysztof Matyjaszewski. "Stackable, Covalently Fused Gels: Repair and Composite Formation." Macromolecules 48, no. 4 (February 3, 2015): 1169–78. http://dx.doi.org/10.1021/ma502367f.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

36

Valdez‐Resendiz, Jesus E., Julio C. Rosas‐Caro, Jonathan C. Mayo‐Maldonado, and Armando Llamas‐Terres. "Quadratic boost converter based on stackable switching stages." IET Power Electronics 11, no. 8 (May 22, 2018): 1373–81. http://dx.doi.org/10.1049/iet-pel.2017.0278.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

37

TAMURA, Shota, and Hiroshi SUGIMOTO. "Fabrication of Stackable Knudsen Pump Driven by Hot Water." Journal of the Vacuum Society of Japan 60, no. 12 (2017): 481–83. http://dx.doi.org/10.3131/jvsj2.60.481.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

38

Wang, Hao, Chuanqing Zhu, Weichen Wang, Ruijiang Xu, Pengfei Chen, Taili Du, Tingxi Xue, Zhaoyang Wang, and Minyi Xu. "A Stackable Triboelectric Nanogenerator for Wave-Driven Marine Buoys." Nanomaterials 12, no. 4 (February 10, 2022): 594. http://dx.doi.org/10.3390/nano12040594.

Повний текст джерела

Анотація:

Marine distributed devices are essential infrastructure for exploring and utilizing the ocean. As the most common carrier of these devices, floating and submerged buoys are subject to a bottleneck of power supply. Recent progress in nanogenerators could convert the high-entropy marine kinetic energy (e.g., wave) robustly, which may form an in-situ power solution to marine distributed devices. This study is devoted to develop a stackable triboelectric nanogenerator (S-TENG), while each layer of it is made into multiple channels carrying PTFE balls in between Aluminum electrodes. In the experiments based on forced motion, the peak power density of the S-TENG reaches 49 W/m3, about 29% promotion from our previous benchmark. The S-TENG has also become less vulnerable to directional variation of the excitation, making its integration on various platforms more flexible in real conditions. In practice, the S-TENG has demonstrated its capability of powering LEDs as well as various sensors measuring salinity, temperature and acidity, which means the S-TENG could self-power many compact marine buoys.

Стилі APA, Harvard, Vancouver, ISO та ін.

39

Lafi, Walid, Didier Lattard, and Ahmed Jerraya. "A Stackable LTE Chip for Cost-effective 3D Systems." IPSJ Transactions on System LSI Design Methodology 5 (2012): 2–13. http://dx.doi.org/10.2197/ipsjtsldm.5.2.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

40

Nooruzzaman, Md, Osanori Koyama, Makoto Yamada, and Yutaka Katsuyama. "Scalable Single-Fiber CWDM Ring Networks With Stackable ROADMs." Journal of Optical Communications and Networking 5, no. 8 (July 25, 2013): 910. http://dx.doi.org/10.1364/jocn.5.000910.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

41

Lee, Hoyul, Youngjin Choi, and Byung-Ju Yi. "Stackable 4-BAR Manipulators for Single Port Access Surgery." IEEE/ASME Transactions on Mechatronics 17, no. 1 (February 2012): 157–66. http://dx.doi.org/10.1109/tmech.2010.2098970.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

42

KUROIWA, Shota, Yoshinori ANDO, and Iwanori MURAKAMI. "Development of surface permanent magnetic gear with stackable structure." Journal of the Japan Society of Applied Electromagnetics and Mechanics 22, no. 2 (2014): 82–87. http://dx.doi.org/10.14243/jsaem.22.82.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

43

Kang, Dongwann, Sanghyun Seo, Seungtaek Ryoo, and Kyunghyun Yoon. "A study on stackable mosaic generation for mobile devices." Multimedia Tools and Applications 63, no. 1 (March 24, 2012): 145–59. http://dx.doi.org/10.1007/s11042-012-1065-5.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

44

Fraiwan, Arwa, and Seokheun Choi. "A stackable, two-chambered, paper-based microbial fuel cell." Biosensors and Bioelectronics 83 (September 2016): 27–32. http://dx.doi.org/10.1016/j.bios.2016.04.025.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

45

Jeong, Jaeyong, Seong Kwang Kim, Jongmin Kim, Dae-Myeong Geum, Juyeong Park, Jae-Hyung Jang, and Sanghyeon Kim. "Stackable InGaAs-on-Insulator HEMTs for Monolithic 3-D Integration." IEEE Transactions on Electron Devices 68, no. 5 (May 2021): 2205–11. http://dx.doi.org/10.1109/ted.2021.3064527.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

46

ZHANG, Ji, Yiqing DING, Xiaoyong XUE, Gang JIN, Yuxin WU, Yufeng XIE, and Yinyin LIN. "A 3D RRAM Using a Stackable Multi-Layer 1TXR Cell." IEICE Transactions on Electronics E93-C, no. 12 (2010): 1692–99. http://dx.doi.org/10.1587/transele.e93.c.1692.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

47

Kails, Kevin, Quan Li, and Markus Mueller. "Modular and stackable power generators for efficient renewable power generation." IET Renewable Power Generation 13, no. 15 (October 23, 2019): 2774–82. http://dx.doi.org/10.1049/iet-rpg.2019.0570.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

48

Lee, Chieh, Yue-Der Chih, Jonathan Chang, Chrong Jung Lin, and Ya-Chin King. "Memory-Logic Hybrid Gate With 3-D Stackable Complementary Latches." IEEE Transactions on Electron Devices 67, no. 8 (August 2020): 3109–14. http://dx.doi.org/10.1109/ted.2020.3000737.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

49

Diaz, R. E., and I. Scherbatko. "A simple stackable re-radiating boundary condition (rRBC) for FDTD." IEEE Antennas and Propagation Magazine 46, no. 1 (February 2004): 124–30. http://dx.doi.org/10.1109/map.2004.1296162.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

50

Jang, Giho, Chulwoo Lee, Hoyul Lee, and Youngjin Choi. "Robotic index finger prosthesis using stackable double 4-BAR mechanisms." Mechatronics 23, no. 3 (April 2013): 318–25. http://dx.doi.org/10.1016/j.mechatronics.2013.01.006.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

Ми пропонуємо знижки на всі преміум-плани для авторів, чиї праці увійшли до тематичних добірок літератури. Зв'яжіться з нами, щоб отримати унікальний промокод!