Статті в журналах з теми "Sn-Zn eutectic alloy"
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Yen, Yee Wen, Yu Pin Hsieh, Wan Ching Chen, and Chien Chung Jao. "Isothermal Section of the Sn-Fe-Zn Ternary System at 270°C." Applied Mechanics and Materials 284-287 (January 2013): 152–57. http://dx.doi.org/10.4028/www.scientific.net/amm.284-287.152.
Повний текст джерелаGerhátová, Žaneta, Paulína Babincová, Marián Drienovský, Matej Pašák, Ivona Černičková, Libor Ďuriška, Róbert Havlík, and Marián Palcut. "Microstructure and Corrosion Behavior of Sn–Zn Alloys." Materials 15, no. 20 (October 16, 2022): 7210. http://dx.doi.org/10.3390/ma15207210.
Повний текст джерелаAlam, S. N., Prerna Mishra, and Rajnish Kumar. "Effect of Ag on Sn–Cu and Sn–Zn lead free solders." Materials Science-Poland 33, no. 2 (June 1, 2015): 317–30. http://dx.doi.org/10.1515/msp-2015-0048.
Повний текст джерелаFigueroa, I. A., O. Novelo-Peralta, M. A. Suárez, and G. A. Lara-Rodríguez. "Analysis of the microstructural evolution and solidification behaviour of Sn-9 wt% Zn alloy with small additions of Mg." Journal of Mining and Metallurgy, Section B: Metallurgy 49, no. 3 (2013): 293–97. http://dx.doi.org/10.2298/jmmb120321031f.
Повний текст джерелаLin, Kwang-Lung, and Li-Min Sun. "Electrodeposition of eutectic Sn–Zn alloy by pulse plating." Journal of Materials Research 18, no. 9 (September 2003): 2203–7. http://dx.doi.org/10.1557/jmr.2003.0307.
Повний текст джерелаChen, Kang I., Shou Chang Cheng, and Chin Hsiang Cheng. "The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders." Advanced Materials Research 800 (September 2013): 265–70. http://dx.doi.org/10.4028/www.scientific.net/amr.800.265.
Повний текст джерелаChen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.
Повний текст джерелаManasijević, Dragan, Ljubiša Balanović, Vladan Ćosović, Duško Minić, Milena Premović, Milan Gorgievski, Uroš Stamenković, and Nadežda Talijan. "Thermal characterization of the In–Sn–Zn eutectic alloy." Metallurgical and Materials Engineering 25, no. 04 (January 14, 2020): 325–34. http://dx.doi.org/10.30544/456.
Повний текст джерелаFathy, N. "Interfacial Microstructure and Bonding Area of Sn-based Alloy-GG25 Gray Iron Bimetallic Material Using Flux, Sn, and Sn-Zn Interlayer Compound Casting." Engineering, Technology & Applied Science Research 12, no. 2 (April 9, 2022): 8416–20. http://dx.doi.org/10.48084/etasr.4804.
Повний текст джерелаDobosz, Alexandra, Torben Daeneke, Ali Zavabeti, Bao Yue Zhang, Rebecca Orrell-Trigg, Kourosh Kalantar-Zadeh, Anna Wójcik, Wojciech Maziarz, and Tomasz Gancarz. "Investigation of the surface of Ga–Sn–Zn eutectic alloy by the characterisation of oxide nanofilms obtained by the touch-printing method." Nanomaterials 9, no. 2 (February 9, 2019): 235. http://dx.doi.org/10.3390/nano9020235.
Повний текст джерелаShalaby, Rizk Mostafa, Mohamed Munther, Abu-Bakr Al-Bidawi, and Mustafa Kamal. "Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt." JOURNAL OF ADVANCES IN PHYSICS 10, no. 1 (August 5, 2015): 2641–48. http://dx.doi.org/10.24297/jap.v10i1.1343.
Повний текст джерелаShuai, Ge Wang, You Li, and Zheng Hua Guo. "Fabrication and Microstructure of Zn-Sn Target Material Alloy." Advanced Materials Research 785-786 (September 2013): 924–27. http://dx.doi.org/10.4028/www.scientific.net/amr.785-786.924.
Повний текст джерелаYen, Yee-Wen, Chien-Chung Jao, and Chiapyng Lee. "Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag." Journal of Materials Research 21, no. 12 (December 2006): 2986–90. http://dx.doi.org/10.1557/jmr.2006.0369.
Повний текст джерелаManilevich, Fedor, Yuriy Pirskyy, Andrii Kutsyi, and Boris Danil’tsev. "REGULARITIES OF HYDROLYSIS OF ALUMINUM ACTIVATED BY Ga-In-Sn EUTECTIC ALLOY AND ZINC." Ukrainian Chemistry Journal 86, no. 2 (February 5, 2020): 63–77. http://dx.doi.org/10.33609/0041-6045.86.2.2020.63-77.
Повний текст джерелаGo Roa, Stewart M., Eduardo Magdaluyo Jr., and Wojciech Gierlotka. "Microstructural Characterization and Properties of Sn-Ag-Cu (SAC) Compound Induced by Zn Alloying." Nano Hybrids and Composites 16 (June 2017): 33–36. http://dx.doi.org/10.4028/www.scientific.net/nhc.16.33.
Повний текст джерелаZernitsa, Denis, and Vasili Shepelevich. "Study of structure and properties of rapidly solidified tin—zinc eutectic alloys doped with antimony." Material Science 5 (May 2022): 9–21. http://dx.doi.org/10.31044/1684-579x-2022-0-5-9-21.
Повний текст джерелаYu, Shan-Pu, Moo-Chin Wang, and Min-Hsiung Hon. "Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface." Journal of Materials Research 16, no. 1 (January 2001): 76–82. http://dx.doi.org/10.1557/jmr.2001.0015.
Повний текст джерелаNishikawa, Hiroshi, Yuki Hirata, Chih-han Yang, and Shih-kang Lin. "Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging." JOM 74, no. 4 (February 1, 2022): 1751–59. http://dx.doi.org/10.1007/s11837-021-05146-3.
Повний текст джерелаDobosz, A., Yu Plevachuk, V. Sklyarchuk, B. Sokoliuk, and T. Gancarz. "Thermophysical properties of the liquid Ga–Sn–Zn eutectic alloy." Fluid Phase Equilibria 465 (June 2018): 1–9. http://dx.doi.org/10.1016/j.fluid.2018.03.001.
Повний текст джерелаMladenovic, Srba, Desimir Markovic, Ljubica Ivanic, Svetlana Ivanov, and Zagorka Acimovic-Pavlovic. "The microstructure and properties of as-cast Sn-Zn-Bi solder alloys." Chemical Industry 66, no. 4 (2012): 595–600. http://dx.doi.org/10.2298/hemind111219015m.
Повний текст джерелаEl-Bediwi, Abu Bakr, Reham Samir, and Mustafa Kamal. "Electrochemical Corrosion Behavior, Microstructure and Soldering Properties of Tin Based Alloys." Material Science Research India 15, no. 1 (February 1, 2018): 12–22. http://dx.doi.org/10.13005/msri/150102.
Повний текст джерелаVolkovich, Vladimir A., Dmitry S. Maltsev, Mariya N. Soldatova, Aleksandr A. Ryzhov, and Aleksandr B. Ivanov. "Application of Low Melting Metals for Separation of Uranium and Zirconium in a “Fused Chloride—Liquid Alloy” System." Metals 11, no. 4 (March 28, 2021): 550. http://dx.doi.org/10.3390/met11040550.
Повний текст джерелаPstruś, J. "The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system." Journal of Mining and Metallurgy, Section B: Metallurgy 53, no. 3 (2017): 309–18. http://dx.doi.org/10.2298/jmmb170728037p.
Повний текст джерелаPstruś, Janusz, Tomasz Gancarz, and Przemyslaw Fima. "Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces." Advances in Materials Science and Engineering 2017 (2017): 1–8. http://dx.doi.org/10.1155/2017/9756769.
Повний текст джерелаPstruś, J. "Early stages of wetting of copper by Sn–Zn eutectic alloy." Journal of Materials Science: Materials in Electronics 29, no. 24 (October 17, 2018): 20531–45. http://dx.doi.org/10.1007/s10854-018-0197-4.
Повний текст джерелаPopescu, Ana Maria, Cristina Donath, Elena Ionela Neacsu, Vasile Soare, Ionut Constantin, Marian Burada, Daniela Violeta Dumitrescu, Kazimir Yanuskevich, and Virgil Constantin. "The Use of Deep Eutectic Solvents Ionic Liquids for Selective Dissolution and Recovery of Sn, Pb and Zn from Electric and Electronic Waste (WEEE)." Revista de Chimie 68, no. 9 (October 15, 2017): 1963–68. http://dx.doi.org/10.37358/rc.17.9.5802.
Повний текст джерелаЗерница, Денис Александрович, and Василий Григорьевич Шепелевич. "THE STRUCTURE FORMATION OF RAPIDLY SOLIDIFIED FOIL OF THE EUTECTIC ALLOY SN-8,8 WT. % ZN." Physical and Chemical Aspects of the Study of Clusters, Nanostructures and Nanomaterials, no. 12() (December 15, 2020): 601–8. http://dx.doi.org/10.26456/pcascnn/2020.12.601.
Повний текст джерелаBlagojevic, N. Z., R. M. Zejnilovic, A. R. Despic, and Z. Blecic. "Determination of the zinc and cadmium contents in low-alloyed tin." Journal of the Serbian Chemical Society 64, no. 11 (1999): 707–20. http://dx.doi.org/10.2298/jsc9911707b.
Повний текст джерелаPietrzak, K., A. Klasik, M. Maj, A. Wojciechowski, and N. Sobczak. "Microstructural Aspects of Fatigue Parameters of Lead-Free Sn-Zn Solders with Various Zn Content." Archives of Foundry Engineering 17, no. 1 (March 1, 2017): 131–36. http://dx.doi.org/10.1515/afe-2017-0024.
Повний текст джерелаGain, Asit Kumar, and Liangchi Zhang. "Nanoindentation Creep, Elastic Properties, and Shear Strength Correlated with the Structure of Sn-9Zn-0.5nano-Ag Alloy for Advanced Green Electronics." Metals 10, no. 9 (August 24, 2020): 1137. http://dx.doi.org/10.3390/met10091137.
Повний текст джерелаRamos, Lidiane Silva, Rodrigo Valenzuela Reyes, Leonardo Fernandes Gomes, Amauri Garcia, José Eduardo Spinelli, and Bismarck Luiz Silva. "The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy." Materials Science and Engineering: A 776 (March 2020): 138959. http://dx.doi.org/10.1016/j.msea.2020.138959.
Повний текст джерелаLee, Kee Ahn, Sung Jun Kim, and Moon Chul Kim. "Mechanical Properties and Microstructure of Strip Casted Ag-27%Cu-25%Zn-3%Sn Brazing Alloy." Advanced Materials Research 26-28 (October 2007): 485–88. http://dx.doi.org/10.4028/www.scientific.net/amr.26-28.485.
Повний текст джерелаDeng, Yangchao, Guang Zeng, Jingwei Xian, Hongyi Zhan, Chuming Liu, and Christopher M. Gourlay. "Eutectic intermetallic formation during solidification of a Mg-Sn-Al-Zn-Mn alloy." Materials Characterization 186 (April 2022): 111807. http://dx.doi.org/10.1016/j.matchar.2022.111807.
Повний текст джерелаZahran, Heba Y., Hany Nazmy Soliman, Alaa F. Abd El-Rehim, and Doaa M. Habashy. "Modelling the Effect of Cu Content on the Microstructure and Vickers Microhardness of Sn-9Zn Binary Eutectic Alloy Using an Artificial Neural Network." Crystals 11, no. 5 (April 26, 2021): 481. http://dx.doi.org/10.3390/cryst11050481.
Повний текст джерелаWu, Jiale, Yunbiao Duan, Jin Hu, Youwen Zhai, Zhiyi Wang, Yongjin Feng, Ziqiang Zhao, Hongtao Fan, Weijun Zhang, and Kaijun Wang. "Comprehensive study on structure, shielding properties of Ga-In-Sn-Bi-Zn alloys: potential use for low energy radiation." Physica Scripta 97, no. 11 (October 26, 2022): 115302. http://dx.doi.org/10.1088/1402-4896/ac9a10.
Повний текст джерелаJumali, Nordarina, Nurwahida Mohd Zaini, Nur Syamira Sa'don, Ahmad Azmin Mohamad, and Muhammad Firdaus Mohd Nazeri. "The Effect of Al Micro-Alloying on Corrosion and Thermal Properties of Sn-Zn Alloy." Materials Science Forum 1010 (September 2020): 98–103. http://dx.doi.org/10.4028/www.scientific.net/msf.1010.98.
Повний текст джерелаShepelevich, Vasili G., and Denis A. Zernitsa. "The structure of rapidly solidified foil of the eutectic Sn – 8.8 wt. % Zn alloy." Journal of the Belarusian State University. Physics, no. 1 (January 31, 2020): 67–72. http://dx.doi.org/10.33581/2520-2243-2020-1-67-72.
Повний текст джерелаBillur, Canan Alper, and Buket Saatçi. "The solid–liquid interfacial energy for solid Zn solution at the eutectic Zn–Sn–Mg ternary alloy." Thermochimica Acta 589 (August 2014): 85–89. http://dx.doi.org/10.1016/j.tca.2014.05.010.
Повний текст джерелаHeligman, Brian Theodore, Karl Joseph Kreder, and Arumugam Manthiram. "Zn-Sn Interdigitated Eutectic Alloy Anodes with High Volumetric Capacity for Lithium-Ion Batteries." Joule 3, no. 4 (April 2019): 1051–63. http://dx.doi.org/10.1016/j.joule.2019.01.005.
Повний текст джерелаShuai, Cijun, Lianfeng Xue, Chengde Gao, Shuping Peng, and Zhenyu Zhao. "Rod-like Eutectic Structure in Biodegradable Zn–Al–Sn Alloy Exhibiting Enhanced Mechanical Strength." ACS Biomaterials Science & Engineering 6, no. 7 (May 20, 2020): 3821–31. http://dx.doi.org/10.1021/acsbiomaterials.0c00290.
Повний текст джерелаFang, Can Feng, Guang Xu Liu, Ling Gang Meng, and Xing Guo Zhang. "Microstructure and Mechanical Properties of Mg-Based Composites Reinforced with TiB2 Particles." Advanced Materials Research 900 (February 2014): 141–45. http://dx.doi.org/10.4028/www.scientific.net/amr.900.141.
Повний текст джерелаGarcia, Leonardo R., Leandro C. Peixoto, Wislei R. Osório, and Amauri Garcia. "Globular-to-needle Zn-rich phase transition during transient solidification of a eutectic Sn–9%Zn solder alloy." Materials Letters 63, no. 15 (June 2009): 1314–16. http://dx.doi.org/10.1016/j.matlet.2009.03.011.
Повний текст джерелаChen, X., M. Li, X. X. Ren, A. M. Hu, and D. L. Mao. "Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy." Journal of Electronic Materials 35, no. 9 (September 2006): 1734–39. http://dx.doi.org/10.1007/s11664-006-0227-5.
Повний текст джерелаŞahin, Mevlüt, and Fatih Karakurt. "The effect of the solidification rate on the physical properties of the Sn-Zn eutectic alloy." Physica B: Condensed Matter 545 (September 2018): 48–54. http://dx.doi.org/10.1016/j.physb.2018.06.003.
Повний текст джерелаPandey, P., C. S. Tiwary, and K. Chattopadhyay. "Effects of Minute Addition of Ni on Microstructure and Mechanical Properties of Sn-Zn Eutectic Alloy." Journal of Electronic Materials 45, no. 10 (June 30, 2016): 5468–77. http://dx.doi.org/10.1007/s11664-016-4742-8.
Повний текст джерелаLee, Jae-Ean, Keun-Soo Kim, Masahiro Inoue, Junxiang Jiang, and Katsuaki Suganuma. "Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy." Journal of Alloys and Compounds 454, no. 1-2 (April 2008): 310–20. http://dx.doi.org/10.1016/j.jallcom.2006.12.037.
Повний текст джерелаSilva, Bismarck Luiz, Rodrigo Valenzuela Reyes, Amauri Garcia, and José Eduardo Spinelli. "Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn–Zn–Cu Solder Alloy." Acta Metallurgica Sinica (English Letters) 30, no. 6 (March 20, 2017): 528–40. http://dx.doi.org/10.1007/s40195-017-0572-9.
Повний текст джерелаManasijevic, I., Lj Balanovic, D. Minic, M. Gorgievski, and U. Stamenkovic. "Investigation of latent heat of melting and thermal conductivity of the low-melting Bi-Sn-Zn eutectic alloy." Metallic Materials 57, no. 04 (2020): 267–73. http://dx.doi.org/10.4149/km_2019_4_267.
Повний текст джерелаDobosz, Alexandra, Yuriy Plevachuk, Vasyl Sklyarchuk, Bogdan Sokoliuk, Olha Tkach, and Tomasz Gancarz. "Liquid metals in cooling systems: Experimental design of thermophysical properties of eutectic Ga-Sn-Zn alloy with Pb additions." Journal of Molecular Liquids 281 (May 2019): 542–48. http://dx.doi.org/10.1016/j.molliq.2019.02.121.
Повний текст джерелаPandey, P., C. S. Tiwary, and K. Chattopadhyay. "Effects of Cu and In Trace Elements on Microstructure and Thermal and Mechanical Properties of Sn-Zn Eutectic Alloy." Journal of Electronic Materials 48, no. 5 (December 19, 2018): 2660–69. http://dx.doi.org/10.1007/s11664-018-06869-x.
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