Статті в журналах з теми "Sn rich solders"
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Wang, Yao, Yuanxing Li, Dengquan Han, Sifu Qiu, and Hui Chen. "Microstructure evolution and mechanical properties of 6N01S-T5 aluminum alloy joints with semi-solid solders by ultrasonic soldering." International Journal of Modern Physics B 33, no. 01n03 (January 30, 2019): 1940027. http://dx.doi.org/10.1142/s0217979219400277.
Повний текст джерелаCanyook, Rungsinee, and Kittichai Fakpan. "Effect of Cu and Ni Addition on Microstructure and Wettability of Sn-Zn Solders." Key Engineering Materials 728 (January 2017): 9–14. http://dx.doi.org/10.4028/www.scientific.net/kem.728.9.
Повний текст джерелаDu, Chang Hua, Yi Luo, Jian Su, Li Meng Yin, Zhen Kang Li, and Bin Liu. "Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder." Advanced Materials Research 189-193 (February 2011): 3326–30. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3326.
Повний текст джерелаHan, Dengquan, Yuanxing Li, Yongpan He, Sifu Qiu, and Hui Chen. "Microstructure evolution and mechanical properties of 5083 aluminum alloy joints by ultrasonic soldering." International Journal of Modern Physics B 31, no. 16-19 (July 26, 2017): 1744040. http://dx.doi.org/10.1142/s0217979217440404.
Повний текст джерелаCheng, Shou Chang, and Kwang Lung Lin. "Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C." Journal of Materials Research 18, no. 8 (August 2003): 1795–803. http://dx.doi.org/10.1557/jmr.2003.0249.
Повний текст джерелаMladenovic, Srba, Desimir Markovic, Ljubica Ivanic, Svetlana Ivanov, and Zagorka Acimovic-Pavlovic. "The microstructure and properties of as-cast Sn-Zn-Bi solder alloys." Chemical Industry 66, no. 4 (2012): 595–600. http://dx.doi.org/10.2298/hemind111219015m.
Повний текст джерелаUenishi, Keisuke, and Kojiro F. Kobayashi. "Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings." Materials Science Forum 502 (December 2005): 411–16. http://dx.doi.org/10.4028/www.scientific.net/msf.502.411.
Повний текст джерелаChin, L. T., Peter Hing, K. S. Tan, and A. O. Olofinjana. "Overview and Functional Characterization of Pb–Free Solders." Defect and Diffusion Forum 297-301 (April 2010): 169–79. http://dx.doi.org/10.4028/www.scientific.net/ddf.297-301.169.
Повний текст джерелаYoon, Jeong-Won, Jun Hyung Lim, Hoo-Jeong Lee, Jinho Joo, Seung-Boo Jung, and Won-Chul Moon. "Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C." Journal of Materials Research 21, no. 12 (December 2006): 3196–204. http://dx.doi.org/10.1557/jmr.2006.0390.
Повний текст джерелаSong, Jenn-Ming, Yu-Lin Shen, and Hsin-Yi Chuang. "Sedimentation of Cu-rich intermetallics in liquid lead-free solders." Journal of Materials Research 22, no. 12 (December 2007): 3432–39. http://dx.doi.org/10.1557/jmr.2007.0431.
Повний текст джерелаAbd El-Rehim, Alaa F., Ashraf S. Mahmoud, and Shereen M. Abdelaziz. "Influence of Sb2O3 Nanoparticles Addition on the Thermal, Microstructural and Creep Properties of Hypoeutectic Sn–Bi Solder Alloy." Science of Advanced Materials 13, no. 1 (January 1, 2021): 20–29. http://dx.doi.org/10.1166/sam.2021.3831.
Повний текст джерелаLiu, Xiao Ying, Ming Liang Huang, and Ning Zhao. "Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solder and Cu Substrate." Advanced Materials Research 706-708 (June 2013): 138–41. http://dx.doi.org/10.4028/www.scientific.net/amr.706-708.138.
Повний текст джерелаJiang, Tong, Fubin Song, Chaoran Yang, and S. W. Ricky Lee. "Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000314–18. http://dx.doi.org/10.4071/isom-2010-tp4-paper5.
Повний текст джерелаSun, Jia, Huaxin Liang, Shaofu Sun, Juntao Hu, Chunyu Teng, Lingyan Zhao, and Hailong Bai. "Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy." Metals 12, no. 10 (September 29, 2022): 1640. http://dx.doi.org/10.3390/met12101640.
Повний текст джерелаChen, Kang I., Shou Chang Cheng, and Chin Hsiang Cheng. "The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders." Advanced Materials Research 800 (September 2013): 265–70. http://dx.doi.org/10.4028/www.scientific.net/amr.800.265.
Повний текст джерелаJang, Jin-Wook, Ananda P. De Silva, Jong-Kai Lin, and Darrel R. Frear. "Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps." Journal of Materials Research 19, no. 6 (June 2004): 1826–34. http://dx.doi.org/10.1557/jmr.2004.0235.
Повний текст джерелаLi, Chia-Ying, and Jenq-Gong Duh. "Phase Equilibria in the Sn-Rich Corner of the Sn–Cu–Ni Ternary Alloy System at 240 °C." Journal of Materials Research 20, no. 11 (November 2005): 3118–24. http://dx.doi.org/10.1557/jmr.2005.0391.
Повний текст джерелаSummers, T. S. E., and J. W. Morris. "Isothermal Fatigue Behavior of Sn-Pb Solder Joints." Journal of Electronic Packaging 112, no. 2 (June 1, 1990): 94–99. http://dx.doi.org/10.1115/1.2904364.
Повний текст джерелаIslam, M. N., Y. C. Chan, and A. Sharif. "Interfacial reactions of Sn–Cu and Sn–Pb–Ag solder with Au/Ni during extended time reflow in ball grid array packages." Journal of Materials Research 19, no. 10 (October 1, 2004): 2897–904. http://dx.doi.org/10.1557/jmr.2004.0399.
Повний текст джерелаChoi, Hyeokgi, Chang-Lae Kim, and Yoonchul Sohn. "Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes." Materials 15, no. 23 (November 26, 2022): 8419. http://dx.doi.org/10.3390/ma15238419.
Повний текст джерелаAthichalinthorn, Panaaek, Jidsucha Darayen, Wachira Puttichaem, Ratchatee Techapiesancharoenkij, and Boonrat Lohwongwatana. "The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in Microelectronics." Key Engineering Materials 751 (August 2017): 3–8. http://dx.doi.org/10.4028/www.scientific.net/kem.751.3.
Повний текст джерелаRerek, T., L. Skowronski, M. Kobierski, M. K. Naparty, and B. Derkowska-Zielinska. "Microstructure and opto-electronic properties of Sn-rich Au-Sn diffusive solders." Applied Surface Science 451 (September 2018): 32–39. http://dx.doi.org/10.1016/j.apsusc.2018.04.209.
Повний текст джерелаTang, Wenming, Anqiang He, Qi Liu, and Douglas G. Ivey. "Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders." Journal of Electronic Materials 37, no. 6 (February 27, 2008): 837–44. http://dx.doi.org/10.1007/s11664-008-0401-z.
Повний текст джерелаChuang, C. M., T. S. Lui, and L. H. Chen. "Effect of lead content on vibration fracture behavior of Pb–Sn eutectic solder." Journal of Materials Research 16, no. 9 (September 2001): 2644–52. http://dx.doi.org/10.1557/jmr.2001.0363.
Повний текст джерелаZhang, Hongwen, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis Mutuku, and Ning-Cheng Lee. "A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000356–61. http://dx.doi.org/10.4071/1085-8024-2021.1.000356.
Повний текст джерелаSidhu, R. S., and N. Chawla. "Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders." Metallurgical and Materials Transactions A 39, no. 4 (February 16, 2008): 799–810. http://dx.doi.org/10.1007/s11661-008-9480-y.
Повний текст джерелаHirose, Akio, Tomoyuki Hiramori, Mototaka Ito, Yoshiharu Tanii, and Kojiro F. Kobayashi. "Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization." Materials Science Forum 512 (April 2006): 355–60. http://dx.doi.org/10.4028/www.scientific.net/msf.512.355.
Повний текст джерелаShaik Osman, Shazlin, and Mohd Sharif Nurulakmal. "Effect of Alloying Elements on the Microstructure and IMC Formation of SnAgCu Solder on Ni (P) Substrate." Advanced Materials Research 545 (July 2012): 251–55. http://dx.doi.org/10.4028/www.scientific.net/amr.545.251.
Повний текст джерелаPeng, Yan Zhi, Cai Ju Li, Jiao Jiao Yang, Jia Tao Zhang, Ju Bo Peng, Guang Ji Zhou, Cun Ji Pu, and Jian Hong Yi. "Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders." Metals 11, no. 4 (March 26, 2021): 538. http://dx.doi.org/10.3390/met11040538.
Повний текст джерелаIslam, M. N., Y. C. Chan, M. O. Alam, and A. Sharif. "Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy." Journal of Electronic Packaging 127, no. 4 (December 22, 2004): 365–69. http://dx.doi.org/10.1115/1.2056567.
Повний текст джерелаHe, M., A. Kumar, P. T. Yeo, G. J. Qi, and Z. Chen. "Interfacial reaction between Sn-rich solders and Ni-based metallization." Thin Solid Films 462-463 (September 2004): 387–94. http://dx.doi.org/10.1016/j.tsf.2004.05.062.
Повний текст джерелаHuang, M. L., F. F. Huang, and Y. C. Yang. "Composition design of Sn-rich Sn–Au–Ag solders using cluster-plus-glue-atom model." Journal of Materials Science: Materials in Electronics 28, no. 15 (April 27, 2017): 11192–201. http://dx.doi.org/10.1007/s10854-017-6907-5.
Повний текст джерелаVentura, Tina, Young Hee Cho, and Arne K. Dahle. "Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System." Materials Science Forum 654-656 (June 2010): 1381–84. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1381.
Повний текст джерелаHuang, M. L., Y. C. Yang, Y. Chen, and C. Dong. "Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model." Materials Science and Engineering: A 664 (May 2016): 221–26. http://dx.doi.org/10.1016/j.msea.2016.03.123.
Повний текст джерелаCheung, Noé, Amauri Garcia, and José Eduardo Spinelli. "Microstructure and Mechanical Properties of Directionally Solidified Unmodified and Ni-Modified Sn-0.7wt%Cu Lead-Free Solder Alloy." Defect and Diffusion Forum 333 (January 2013): 107–15. http://dx.doi.org/10.4028/www.scientific.net/ddf.333.107.
Повний текст джерелаYang, Wenchao, Jun Mao, Yueyuan Ma, Shuyuan Yu, Hongping He, Da Qi, and Yongzhong Zhan. "Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy." Materials 14, no. 10 (May 14, 2021): 2549. http://dx.doi.org/10.3390/ma14102549.
Повний текст джерелаPietrzak, K., A. Klasik, M. Maj, A. Wojciechowski, and N. Sobczak. "Microstructural Aspects of Fatigue Parameters of Lead-Free Sn-Zn Solders with Various Zn Content." Archives of Foundry Engineering 17, no. 1 (March 1, 2017): 131–36. http://dx.doi.org/10.1515/afe-2017-0024.
Повний текст джерелаCho, Moon Gi, Hyun You Kim, Sun-Kyoung Seo та Hyuck Mo Lee. "Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures". Applied Physics Letters 95, № 2 (13 липня 2009): 021905. http://dx.doi.org/10.1063/1.3177335.
Повний текст джерелаCho, Moon Gi, Sun-Kyoung Seo, and Hyuck Mo Lee. "Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies." MATERIALS TRANSACTIONS 50, no. 9 (2009): 2291–96. http://dx.doi.org/10.2320/matertrans.m2009127.
Повний текст джерелаWentlent, Luke A., James Wilcox, and Xuanyi Ding. "Strain Rate Sensitivity of Mixed SAC-SnBi Solder Joints." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000480–87. http://dx.doi.org/10.4071/2380-4505-2019.1.000480.
Повний текст джерелаSaud, N., and A. Jalar. "Sn-rich phase coarsening during isothermal annealing for as-soldered Sn–Ag–Cu solder." Journal of Materials Science: Materials in Electronics 21, no. 10 (December 10, 2009): 1083–89. http://dx.doi.org/10.1007/s10854-009-0032-z.
Повний текст джерелаShen, Yu-An, and John A. Wu. "Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints." Materials 15, no. 14 (July 21, 2022): 5086. http://dx.doi.org/10.3390/ma15145086.
Повний текст джерелаScandurra, Antonino, Antonino Licciardello, Alberto Torrisi, Antonio La Mantia, and Orazio Puglisi. "Fatigue failure in Pb–Sn–Ag alloy during plastic deformation: A 3D-SIMS imaging study." Journal of Materials Research 7, no. 9 (September 1992): 2395–402. http://dx.doi.org/10.1557/jmr.1992.2395.
Повний текст джерелаGan, Guisheng, Da-quan Xia, Xin Liu, Cong Liu, Hanlin Cheng, Zhongzhen Ming, Haoyang Gao, Dong-hua Yang, and Yi-ping Wu. "Influence of thermal shock cycles on Sn-37Pb solder bumps." Soldering & Surface Mount Technology 31, no. 2 (April 1, 2019): 85–92. http://dx.doi.org/10.1108/ssmt-08-2018-0026.
Повний текст джерелаChantaramanee, Suchart, Worawit Sriwittayakul, and Phairote Sungkhaphaitoon. "Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate." Materials Science Forum 928 (August 2018): 188–93. http://dx.doi.org/10.4028/www.scientific.net/msf.928.188.
Повний текст джерелаSong, Ho Geon, John W Morris, Jr., and Fay Hua. "Anomalous Creep in Sn-Rich Solder Joints." MATERIALS TRANSACTIONS 43, no. 8 (2002): 1847–53. http://dx.doi.org/10.2320/matertrans.43.1847.
Повний текст джерелаSungkhaphaitoon, Phairote, and Thawatchai Plookphol. "Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy." Key Engineering Materials 675-676 (January 2016): 513–16. http://dx.doi.org/10.4028/www.scientific.net/kem.675-676.513.
Повний текст джерелаLeong, Wai Keong, Ahmad Azmin Mohamad, and Muhammad Firdaus Mohd Nazeri. "Effect of the nickel coated precipitated calcium carbonate addition on microstructure, phase and wettability of Sn-9Zn solder." Journal of Physics: Conference Series 2169, no. 1 (January 1, 2022): 012031. http://dx.doi.org/10.1088/1742-6596/2169/1/012031.
Повний текст джерелаLiu, Yeh-Hsiu, and Kwang-Lung Lin. "Damages and Microstructural Variation of High-lead and Eutectic SnPb Composite Flip Chip Solder Bumps Induced by Electromigration." Journal of Materials Research 20, no. 8 (August 1, 2005): 2184–93. http://dx.doi.org/10.1557/jmr.2005.0271.
Повний текст джерелаChantaramanee, Suchart, Phairote Sungkhaphaitoon, and Thawatchai Plookphol. "Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys." Solid State Phenomena 266 (October 2017): 196–200. http://dx.doi.org/10.4028/www.scientific.net/ssp.266.196.
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