Готові списки джерел за темами / Sn rich solders

Добірка наукової літератури з теми "Sn rich solders"

Автор: Grafiati

Опубліковано: 6 вересня 2023

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Статті в журналах з теми "Sn rich solders"

Wang, Yao, Yuanxing Li, Dengquan Han, Sifu Qiu, and Hui Chen. "Microstructure evolution and mechanical properties of 6N01S-T5 aluminum alloy joints with semi-solid solders by ultrasonic soldering." International Journal of Modern Physics B 33, no. 01n03 (January 30, 2019): 1940027. http://dx.doi.org/10.1142/s0217979219400277.

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Анотація:

The article investigated the properties of 6N01 aluminum alloy joints with Sn-80Zn semi-solid solders by ultrasonic soldering. It was found that semi-solid solders consisted of Zn-rich phase with short rod-like dentrite, which had the lower solidus temperatures, while Zn-rich phase with long dentritic grains used the conventional solders. The joints soldered with Sn-80Zn conventional filler metal reached maximum shear strength of 73 MPa at the soldering temperature of 390[Formula: see text]C. The joint using Sn-80Zn semi-solid solder obtained higher shear strength of 90 MPa at the lower temperature of 370[Formula: see text]C. The effects of the ultrasonic time and the soldering temperature on the mechanical properties of the joints were also investigated with the Sn-80Zn semi-solid solders.

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Canyook, Rungsinee, and Kittichai Fakpan. "Effect of Cu and Ni Addition on Microstructure and Wettability of Sn-Zn Solders." Key Engineering Materials 728 (January 2017): 9–14. http://dx.doi.org/10.4028/www.scientific.net/kem.728.9.

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In present study, Sn–9Zn, Sn–9Zn–xCu and Sn–9Zn–xNi solders (x = 1.0, 2.0 and 3.0 wt%) were prepared via melting process. Effects of Cu and Ni addition on microstructure, thermal behavior, wettability and corrosion resistance of Sn–9Zn solders were investigated. The experimental result showed that microstructure of the Sn–9Zn was composed of β–Sn and Zn–rich phases. Addition of Cu to the Sn–9Zn solders, Cu6Sn5 and Cu5Zn8 IMCs were observed. While addition of Ni to the Sn–9Zn solders, Ni3Sn4 and Ni5Zn21 IMCs were observed. It was also found that, amount of those IMCs obviously increased with increasing of Cu and Ni contents. The results obtained from thermal analysis showed that melting temperature of the Sn–9Zn solder was 199.6°C. While melting temperatures of the Sn–9Zn–1.0Cu and Sn–9Zn–1.0Ni solders were 199.9°C and 204.2°C, respectively. The Cu and Ni contents had little effect on both spread rate and wetting angle of the Sn–9Zn–xCu and Sn–9Zn–xNi solders. However, increasing of Cu and Ni contents significantly increased the corrosion potentials of the Sn–9Zn–xCu and Sn–9Zn–xNi solders.

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Du, Chang Hua, Yi Luo, Jian Su, Li Meng Yin, Zhen Kang Li, and Bin Liu. "Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder." Advanced Materials Research 189-193 (February 2011): 3326–30. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3326.

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Анотація:

The (Sn-9Zn0.05Ce)xBi solders with different Bi contents were prepared by a new process. The characteristics of solders about microstructure, tensile strength, elongation and microhardness were studied. The results showed that addition Bi can induce acicular or granular Zn-rich precipitated phase in Sn-9Zn0.05Ce solder. To increasing Bi content caused more Zn-rich phase distributed disorderly. When the Bi content was added to 4%, the granular Bi precipitated phase was observable. The tensile strength and hardness of (Sn-9Zn0.05Ce)xBi solder will raise, but elongation descend significantly due to the Bi content increasing. It can be funded that there was a more obvious turning point as w(Bi)=2wt﹪.

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Han, Dengquan, Yuanxing Li, Yongpan He, Sifu Qiu, and Hui Chen. "Microstructure evolution and mechanical properties of 5083 aluminum alloy joints by ultrasonic soldering." International Journal of Modern Physics B 31, no. 16-19 (July 26, 2017): 1744040. http://dx.doi.org/10.1142/s0217979217440404.

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Анотація:

Aluminum alloy 5083 was joined with Sn–[Formula: see text]Zn ([Formula: see text], 5, 9, 30 and 60 wt.%) filler metal by ultrasonic soldering at 400[Formula: see text]C. The joint microstructure consisted of [Formula: see text]-Sn and [Formula: see text]-Al solid–solution phases when using pure Sn solder. Zn-rich phases were observed in the joints with Sn–Zn filler metal. The Zn-rich phases grew thicker and larger with the increase in Zn content in the filler metal. The joints soldered with Sn–30Zn filler metal reached a maximum shear strength of 70 MPa. Joint cracking occurred at the interface of pure Sn and Sn–9Zn solders as indicated by SEM observation of the fracture surfaces. The locations of the fracture surface moved from the interface to the seam when using the Sn–30Zn or Sn–60Zn filler metal. The coarse Zn-rich phases were also observed on the fracture surface using Sn–60Sn solder, which results in a shear strength reduction of the joints.

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Cheng, Shou Chang, and Kwang Lung Lin. "Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C." Journal of Materials Research 18, no. 8 (August 2003): 1795–803. http://dx.doi.org/10.1557/jmr.2003.0249.

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Анотація:

The interfacial intermetallic formation at 150 °C between Cu and various solders, including Sn–9Zn, Sn–8.55Zn–1Ag, and Sn–8.55Zn–1Ag–XAl was investigated. The Al contents X of the quaternary solder alloys investigated were 0.01–0.45 wt.%. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn–9Zn/Cu, Sn–Zn–Ag/Cu, and Sn–Zn–Ag–XAl/Cu specimens after aging for 100–600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu–rich phase near to Cu. For long–term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn–Zn–Ag–XAl/Cu specimens after aging.Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn–9Zn, Sn–8.55Zn–1Ag, Sn–8.55Zn–1Ag–0.1Al, Sn–8.55Zn–1Ag–0.25Al, and Sn–8.55Zn–1Ag–0.45Al. The crack was not detected up to 3000 h for the Sn–8.55Zn–1Ag–0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.

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Mladenovic, Srba, Desimir Markovic, Ljubica Ivanic, Svetlana Ivanov, and Zagorka Acimovic-Pavlovic. "The microstructure and properties of as-cast Sn-Zn-Bi solder alloys." Chemical Industry 66, no. 4 (2012): 595–600. http://dx.doi.org/10.2298/hemind111219015m.

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Анотація:

Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have been considered to be one of the most attractive lead-free solders due to its ability to easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. Furthermore, the mechanical properties are comparable or even superior to those of Sn-Pb solder. However, other problems still persist. The solution to overcoming these drawbacks is to add a small amount of alloying elements (Bi, Ag, Cr, Cu, and Sb) to the Sn-Zn alloys. Microstructure, tensile strength, and hardness of the selected Sn-Zn-Bi ternary alloys have been investigated in this study. The SEM-EDS was used for the identification of co-existing phases in the samples. The specimens? microstructures are composed of three phases: Sn-rich solid solution as the matrix, Bi-phase and Zn-rich phase. The Bi precipitates are formed around the Sn-dendrit grains as well as around the Zn-rich phase. The amount of Bi segregation increases with the increase of Bi content. The Sn-Zn-Bi alloys exhibit the high tensile strength and hardness, but the values of these mechanical properties decrease with the increase of Bi content, as well as the reduction of Zn content. The results presented in this paper may offer further knowledge of the effects various parameters have on the properties of lead-free Sn-Zn-Bi solders.

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Uenishi, Keisuke, and Kojiro F. Kobayashi. "Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings." Materials Science Forum 502 (December 2005): 411–16. http://dx.doi.org/10.4028/www.scientific.net/msf.502.411.

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Анотація:

The microstructure and strength for the micro joints of Pb free Sn-Ag based solders with Au/Ni alloy platings were investigated. For the joint using Sn-Ag solder, Ni3Sn4 reaction layer formed at the solder/pad interface and also P-rich layer formed in Ni-P plating. The P-rich layer was confirmed to be composed of Ni-P-Sn ternary compound layer and crystallized Ni3P layer. Both of them introduced defects, which degraded the joint strength. Addition of Cu to Sn-Ag solders suppressed the formation of such a P rich layer while the (Cu, Ni)6Sn5 reaction layer was formed at the solder/pad interface. These different interfacial reactions would affect the changes in the joint strength during heat exposure at 423K. On the contrary, addition of Co to Ni platings enhanced the interfacial reaction and the Sn-Ag solder completely transformed to the intermetallic compounds under higher melting temperature even by heating to 543K. The addition of Co in Ni could change the interfacial reaction layer from Ni3Sn4 to (Ni, Co)Sn2 with higher diffusivity of Ni which enhanced formation of intermetallic phases. The control of interfacial reaction by the alloying elements is important to obtain ideal micro joints.

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Chin, L. T., Peter Hing, K. S. Tan, and A. O. Olofinjana. "Overview and Functional Characterization of Pb–Free Solders." Defect and Diffusion Forum 297-301 (April 2010): 169–79. http://dx.doi.org/10.4028/www.scientific.net/ddf.297-301.169.

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Анотація:

There are now new legislations emerging or being contemplated to restrict the use of Pb in electronic devices. This development has provided the impetus for the development of Pb- free solder alloys and efforts are now geared towards characterizing their operational and functional properties. The most common alloys being recommended and investigated are those primarily based on the Sn-Ag-Cu (SAC) system. These SAC alloys generally have higher melting points than conventional Pb-Sn alloy. Additionally they are susceptible to microstructural evolution of inter-metallic compounds that have been implicated in thermal fatigue life, mechanical strength and fracture toughness of the soldered joints. We have studied the Sn rich corner of the Sn-Ag-Cu system with minor additions aimed at minimizing detrimental microstructural development and improving the solderability and the mechanical strength of soldered joints. Some of the SAC alloys with minor additions showed some interesting properties. Their shear strength measured ranged from 30 – 60 MPa. The combined properties of strength and conductivity recorded compared favorably with that of traditional Pb-Sn solders.

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Yoon, Jeong-Won, Jun Hyung Lim, Hoo-Jeong Lee, Jinho Joo, Seung-Boo Jung, and Won-Chul Moon. "Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C." Journal of Materials Research 21, no. 12 (December 2006): 3196–204. http://dx.doi.org/10.1557/jmr.2006.0390.

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Анотація:

Joint reliability of immersion Ag with two different solders, Sn–37Pb and Sn–3.5Ag, were evaluated. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn–Pb solder produced a Pb-rich phase along the interface between the solder and the Cu substrate during aging. In contrast, the Sn–Ag solder exhibits an off-eutectic reaction to produce the eutectic phase and Ag3Sn precipitate. The shear test results show that the Sn–Pb solder joint fractured along the interface showing brittle failure indications possibly due to the brittle Pb-rich layer. In contrast, the failure of Sn–Ag solder joint was only through the bulk solder, providing evidence that the interface is mechanically reliable. The results from this study confirm that the immersion Ag/Sn–Ag solder joint is mechanically robust, and thus the combination is a viable option for a Pb-free package system.

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Song, Jenn-Ming, Yu-Lin Shen, and Hsin-Yi Chuang. "Sedimentation of Cu-rich intermetallics in liquid lead-free solders." Journal of Materials Research 22, no. 12 (December 2007): 3432–39. http://dx.doi.org/10.1557/jmr.2007.0431.

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Анотація:

This study investigated the behavior of Cu-containing intermetallic compounds (IMCs) in liquid Sn–Ag and Sn–Zn solders. Experimental results show that for the intermetallics investigated, Cu–Sn and Cu–Zn compounds, the occurrence of settling was dominated by the crystalline temperature of IMCs, buoyancy due to difference in densities, and dissolution potential for the compounds into the liquid. The complete dissolution of Cu–Zn compounds, which took place in the Sn–Zn solders when the Cu content exceeded a critical value, might be ascribed to the depletion of Zn in the melt.

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Більше джерел

Дисертації з теми "Sn rich solders"

Kanjilal, Anwesha. "Effect of Length Scale on High Temperature Mechanical Behavior of Sn-Cu Joints: A Mechanics and Material Science Based Treatment." Thesis, 2022. https://etd.iisc.ac.in/handle/2005/5755.

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Анотація:

With the ongoing miniaturization of microelectronic devices, the size of compliant solder in microscale solder joints has significantly reduced, proportion of brittle phases has increased, and the microscale joints have become highly constrained to deform because of their geometry and stiffness mismatch with substrates. Due to the varied nature of microstructure, a mere understanding of the mechanical behaviour of bulk alloys cannot be directly extended to judiciously predict the same in miniature joints. Accordingly, the aim of this work is to develop a comprehensive understanding of the effect of microstructure and size of Sn based joints on the mechanical behavior and microstructure from bulk specimens to microscale joints. This was first addressed by investigating the joint size dependence of the tensile properties of Sn-Cu joints. Maximum strength increased as the joint size reduced, and the mode of failure changed from necking in thick joints to constrained necking with cavitation in microscale Sn-Cu joints and solder-IMC failure in miniature Sn-Ag-Cu/Cu joints. The cause of this tensile strengthening was captured by crystal plasticity (CP) modeling along with existing analytical models to capture the size dependence of the tensile strength. Subsequently the effect of length scale on the creep properties of the Sn-Cu joints was investigated. This was addressed by first evaluating the creep behaviour of bulk Sn and Sn-Ag-Cu solder alloys over a range of temperature to compute the activation energy, QC, and stress exponent, n. The creep rate decreased with increasing Ag content. The creep mechanism was dislocation climb controlled by core diffusion at T<150 oC and lattice diffusion at T>150 oC with QC and n changing from 55 kJ/mol and 7 to 100 kJ/mol and 5. Subsequently the size of deformable Sn and solder was reduced by constraining metal layers of different size (from 1.4 mm to ~170 µm) and aspect ratio between Cu substrates as joints. The secondary creep rate decreased by three orders of magnitude with an order of magnitude decrease in joint size at same stress. However, no change in creep mechanism was evident in the joints. Using Finite Element Analysis this creep strengthening can be partly attributed to geometric constraints imposed by Cu which reduces the effective stress and increases the triaxiality in joints. While FE results were in close agreement with experiment in thick joints and bulk specimen, the former overpredicted the creep rate of small joints due to difference in microstructure between bulk Sn which has multiple grains and miniature joints having 2-3 grains, as confirmed by electron backscattered diffraction. This microstructural effect was captured by dislocation based crystal plasticity modeling from which it was evident that orientation anisotropy of Sn and constraints imposed by substrates on dislocation motion can lead to additional strengthening in small joints and reduce the prefactor B in Norton power law. Subsequently, a unified model was developed to quantify both these effects and predict the creep rate of arbitrary joints. In the tertiary creep stage bulk specimens exhibited strain localization by necking in pure Sn along with cavitation in precipitate containing Sn-Ag-Cu alloys. Moreover, the extent of necking and cavitation in Sn-Cu joints was sensitive to the joint size. A combined necking and cavitation based creep failure model was developed and the effect of initial geometry of instability, creep stress exponent and cavity fraction on strain localization was analyzed. The model showed that the strain at the onset of complete localization in neck will be independent of stress in pure Sn whereas it decreases with stress in Sn-Ag-Cu alloy and the predictions were found to qualitatively agree with experiment. The model also was adapted to capture the joint size dependence of tertiary creep due to necking and cavitation in the Sn-Cu and SAC-Cu joints. The model predictions and experiments showed a decrease in strain accumulated in tertiary stage with decrease in joint size, as the strain due to necking reduced and the strain due to cavitation increased from bulk Sn and solders to the very thin joints.

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Частини книг з теми "Sn rich solders"

Zhu, Q. S., H. Y. Liu, L. Zhang, Q. L. Zeng, Z. G. Wang, and J. K. Shang. "Electromechanical Coupling in Sn-Rich Solder Interconnects." In Lead-Free Solders: Materials Reliability for Electronics, 251–71. Chichester, UK: John Wiley & Sons, Ltd, 2012. http://dx.doi.org/10.1002/9781119966203.ch10.

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Тези доповідей конференцій з теми "Sn rich solders"

He, A., and D. G. Ivey. "Electrodeposition of Au-Sn alloys for lead-free solders: Au-rich eutectic and Sn-rich eutectic compositions." In 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013). IEEE, 2013. http://dx.doi.org/10.1109/isapm.2013.6510388.

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Wang, Pin J., Jong S. Kim, Dongwook Kim, and Chin C. Lee. "Fluxless Bonding of Silicon to Molybdenum Using Sn-rich Solders." In 2007 Proceedings 57th Electronic Components and Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/ectc.2007.374005.

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Lakhkar, Nikhil, Mohammad M. Hossain, Puligandla Viswanadham, and Dereje Agonafer. "Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33543.

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Анотація:

Lead (Pb)-free implementation for electronic assembly has created a stir in electronic packaging industry during the last five years since Europe and eastern Asian countries decided to restrict the use of lead in electronic packages. Lead (Pb) content in solders is mandated to be less than 0.2 wt % (USA) and 0.1 wt % (EU). Sn-Ag-Cu (Tin, Silver, and Copper) solder is selected as one of the options to replace tin-lead solders. This solder is a preferred option as it comes closest to tin-lead solder in terms of parameters such as melting temperature (∼217°C), wettability, cost, availability, and reliability. Various agencies like NEMI, JEIDA and IDEALS recommend Tin-rich Lead (Pb) free solders as the possible alternatives to Pb-Sn solder [1]. Addition of elements like Au, Co, Fe, Ni, etc in small quantities can affect the properties of Sn-Ag-Cu solder. It has been reported that the addition of Au in small quantities improves the properties of lead-free solder. Au has very high reactivity with Sn and also improves the wettability of solder. Au forms a β-phase with Sn at the interface. This phase is considered beneficial in terms of improving fatigue life and fracture toughness as this β phase acts as a crack arrester thereby improving its strength Addition of Au also reduces the liquidus temperature to 204 °C. In this paper we tested and compared the strength of pure Sn-Ag-Cu solder and Sn-Ag-Cu solder with Au addition and it was concluded that the strength of material increases from 50 MPa to 70 MPa under tensile loading.

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Park, Seungbae, Ramji Dhakal, Lawrence Lehman, and Eric Cotts. "Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73058.

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Анотація:

The thermo-mechanical behavior of near eutectic lead-free SnAgCu (SAC) solder joints under Deep Thermal Cycling (DTC) and in-situ thermal loading was examined. Crossed polarizer, optical microscopy revealed that in ball grid array (BGA) solder joints, these Sn rich, Pb-free solders exhibit large grained Sn structures. After imaging, these SnAgCu solder joints were subjected to repeated thermal stresses under an inert atmosphere. Subsequent to this thermal loading, the samples were again examined with optical microscopy. Using both data sets, the intergrain strains and deformations were quantified by Digital image correlation, a full field optical measurement technique. The relations between the positions of grains as well as intermetallics compounds, their boundaries and Sn deformation fields were examined.

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Bunis, Carl B. "Characterization of Gold Embrittlement in Solder Joints." In ISTFA 1999. ASM International, 1999. http://dx.doi.org/10.31399/asm.cp.istfa1999p0305.

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Abstract Mechanical strength, integrity, and reliability of solder connections used in the microelectronics industry are important factors in overall quality and reliability of the finished product. In most cases tin (Sn) rich solders are attached to a base metal plated with nickel (Ni) and then with gold (Au). Formation of AuSn4 intermetallics in the solder may result in loss of more than 80% of the initial impact toughness, resulting in loss of reliability of the connection. Gold (Au) embrittlement is a major concern in tin/lead (Sn/Pb) soldering or any other joining process with Au and Sn as major constituents. Noncompliance to Au plating-thickness specifications by vendors or insufficient Sn wicking of Au surfaces can result in embrittled joints and unreliable parts.

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Schoeller, Harry, Shubhra Bansal, Aaron Knobloch, David Shaddock, and Junghyun Cho. "Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb." In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-68952.

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Анотація:

Lead-free solders have garnered much attention in recent years due to legislation banning the use of lead in electronics. As use of lead solders is phased out, there is a need for lead-free alternatives for niche applications such as high temperature environments where traditionally high lead solders are used. Electronics and sensors exposed to high-temperature environments such as those associated with deep well drilling require solder interconnects that can withstand high thermal-mechanical stresses. In an effort to characterize solder alloys for such applications, this study focuses on deformation behavior of the Sn95-Sb5 solder under high-temperature exposures (from 298°K to 473°K). As compared to conventional high-temperature Pb-based solder 90Pb–10Sn, Sn95–Sb5 exhibited very high tensile strength and modulus, as well as superior creep properties despite its lower melting temperature. Importantly, high-temperature deformation was shown to be influenced by the presence of the second phase (SnSb) distributed within the Sn-rich matrix. These second phase precipitates appeared to be dissolved into the Sn-rich phase above 453°K, which converted the solder into a single-phase alloy and resulted in a change in its deformation mechanism. Furthermore, as the service temperature is of such high homologous temperature (T > 0.5Tm), creep deformation will contribute significantly toward the life of the solder joint during thermal cycling. In order to characterize the creep behavior and to identify controlling mechanism(s), creep tests were carried out, from which the stress exponent and activation energy were determined. In this study, detailed microstructures under high-temperature are presented in conjunction with the corresponding mechanical behavior to further understand the controlling deformation mechanisms.

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Song, Fubin, and S. W. Ricky Lee. "Experimental Investigation of the Effect of Reflow Cooling Rate on the IMC Growth of SAC Lead-Free Solder Alloy." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-82095.

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Анотація:

The present research is conducted to investigate a critical issue for Lead-free solder alloy. Near-ternary eutectic Sn-Ag-Cu alloys have been studied since they are the leading Lead-free candidate solders for various applications. There are three main phases in the near-ternary eutectic alloys: β-Sn rich phase, Ag3Sn and Cu6Sn5. Cooling rate is an important processing factor that affects the microstructure of these alloys and then significantly influences mechanical behavior of the Sn-Ag-Cu solder joints. It is demonstrated that the amount and size of large Ag3Sn plates increase with decreasing of the cooling rate. When large Ag3Sn plates present in the solder joints at the lower cooling rate, they may affect the mechanical integrity of the joints by providing a crack initialization during the mechanical testing under room-temperature condition. In the present paper, the effects of cooling rate on the microstructure and mechanical properties are studied on Sn-3.8Ag-0.7Cu solder ball, including shear strength and ball pull test. There are two kinds of fracture mode for Ag3Sn plates preformed mechanical loading in room-temperature condition. One is brittle fracture inside Ag3Sn plate itself; the other is interfacial fracture of Ag3Sn plates and the IMC layer. Moreover, the fractures of large Ag3Sn plates induce the decrease of mechanical properties on Sn-3.8Ag-0.7Cu solder ball. The critical cooling rate of large Ag3Sn plate formation is also investigated.

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Kang, Sung K., Moon Gi Cho, Da-Yuan Shih, Sun-Kyoung Seo, and Hyuck Mo Lee. "Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders." In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550015.

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Yao, Yao, Jared Fry, Morris Fine, and Leon Keer. "Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-88634.

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Анотація:

Due to the limitation of available experimental data for thermal conductivity of lead free solder and Intermetallic Compound (IMC) materials, the Wiedemann-Franz-Lorenz (WFL) relation is presented in this paper as a possible solution to predict thermal conductivity with known electrical conductivity. The method is based upon the fact that heat and electrical transport both involve the free electrons. The thermal and electrical conductivities of Cu, Ni, Sn, and different Sn rich lead free solder and IMC materials are studied by employing the WFL relation. Generally, the analysis to the experimental data shows that the WFL relation is obeyed in both solder alloy and IMC materials especially matches close to the relation for Sn, with a positive deviation from the theoretical Lorenz number. Thus, with the available electrical conductivity data, the thermal conductivity of solder and IMC materials can be obtained based on the proper WFL relation, vice versa. With the reduction of size of electronic devices and solder interconnects, it has been observed experimentally that solders fail by crack nucleation and propagation near the interface of IMC and bulk solder. A coupled thermal-electrical finite element analysis is performed to study the behavior of lead free solder/IMC interconnects under different electrical current densities. The joule heating, temperature concentration and electrical current concentration effects with a crack propagating near the interface of solder and IMC are investigated numerically. Solder and IMC material properties predicted using the WFL relation are adopted in the computational model. The effects of different thermal and electrical conductivities of solder and IMC materials on interfacial crack tip temperature are analyzed in the present study. By applying the WFL relation, the amount of experiments required to determine the material properties for different lead free solder/IMC interconnects can be significantly reduced, which can lead to pronounced saving of time and cost.

Стилі APA, Harvard, Vancouver, ISO та ін.

Kong, Ming, Sungeun Jeon, Chiwon Hwang, and Y. C. Lee. "Effects of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronics Assembly." In ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-37181.

Повний текст джерела

Анотація:

Solder self-alignment is one of the most important technologies for cost effective optoelectronics assembly. In this study, the wetting of Sn-rich solder to the metal pads of chip and substrate was identified as a critical factor significantly affecting self-alignment accuracy during the assembly. Insufficient wetting of solder to the metallization pads was responsible for large chip-to-substrate misalignment post-assembly, while fabrication deviations, such as solder volume variation and pad diameter deviation, only account for misalignments in the range of submicrons. To aid the design of flip-chip assemblies requiring high alignment accuracy, a force optimization model was developed and validated experimentally. With the input parameters of design and manufacturing process for optoelectronics flip-chip assembly using solders, such as insufficient solder metallurgical wetting areas, positions and diameters of metallization pads, volume of individual solder bump, coefficient of solder surface tension, mass of chip, external forces acting on chip, and initial pick-and-place position of chip before assembly, the model predicts the assembled position of the chip in terms of the misalignments in the X-Y planes and the rotation angles along the Z axis. The model further confirmed that insufficient wetting of solder is the most critical modulator among the undesirable factors affecting solder self-alignment accuracy.

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