Статті в журналах з теми "Sintering of silver powder"
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Li, Wei, Chunxiu Yu, Yunkai Wang, Yuan Yao, Xianglei Yu, Chuan Zuo, and Yang Yu. "Experimental Investigation of Effect of Flake Silver Powder Content on Sintering Structure and Properties of Front Silver Paste of Silicon Solar Cell." Materials 15, no. 20 (October 13, 2022): 7142. http://dx.doi.org/10.3390/ma15207142.
Повний текст джерелаFan, Mao Yan, Guo You Gan, Jian Hong Yi, Ji Kang Yan, Jing Hong Du, Jia Min Zhang, Yi Chun Liu, and Xin Xin He. "Effects of Na-Ca System Glass Powder on Properties of Silver Paste." Advanced Materials Research 833 (November 2013): 295–300. http://dx.doi.org/10.4028/www.scientific.net/amr.833.295.
Повний текст джерелаPathak, L. C., S. K. Mishra (Pathak), and S. Srikanth. "Sintering characteristics of Y–Ba–Cu oxide–Agx superconductors under argon atmosphere." Journal of Materials Research 17, no. 4 (April 2002): 895–900. http://dx.doi.org/10.1557/jmr.2002.0130.
Повний текст джерелаDurairaj, Rajkumar, M. Das, E. Morris, and Satesh Namasivayam. "Investigation on the Morphology of Sintered Silver Nanomaterial for Electronic Packaging Application." Advanced Materials Research 832 (November 2013): 21–26. http://dx.doi.org/10.4028/www.scientific.net/amr.832.21.
Повний текст джерелаBiguereau, E., D. Bouvard, J. M. Chaix, and S. Roure. "On the swelling of silver powder during sintering." Powder Metallurgy 59, no. 5 (October 19, 2016): 394–400. http://dx.doi.org/10.1080/00325899.2016.1250037.
Повний текст джерелаHutsch, Thomas, Thomas Schubert, Thomas Weißgärber, and Bernd Kieback. "Silver/Diamond Composite Material - Powder Metallurgical Route and Thermo-Physical Properties." Key Engineering Materials 742 (July 2017): 151–57. http://dx.doi.org/10.4028/www.scientific.net/kem.742.151.
Повний текст джерелаJiao, Ruo Bing, Tao Wu, Bo Ping Zhang, and Liang Liang Li. "Firing and Contact Resistivity of Ag2O-Aided Pb-Free Silver Paste for Crystalline Silicon Solar Cells." Materials Science Forum 847 (March 2016): 123–30. http://dx.doi.org/10.4028/www.scientific.net/msf.847.123.
Повний текст джерелаDubnika, Arita, Dagnija Loca, Aigars Reinis, Maris Kodols, and Liga Berzina-Cimdina. "Impact of sintering temperature on the phase composition and antibacterial properties of silver-doped hydroxyapatite." Pure and Applied Chemistry 85, no. 2 (January 12, 2013): 453–62. http://dx.doi.org/10.1351/pac-con-12-08-12.
Повний текст джерелаOkada, Atsuyuki, and Takashi Ogihara. "Sintering Behavior of Silver Particles in Electrode for Multilayer Ceramic Substrate." Key Engineering Materials 421-422 (December 2009): 289–92. http://dx.doi.org/10.4028/www.scientific.net/kem.421-422.289.
Повний текст джерелаYan, Fang Chun, Yuan Teng, Ji Kang Yan, Jing Hong Du, Jian Hong Yi, Jian Yang, and Guo You Gan. "Effects of Paste Composition and Sintering Process on Performance of Silver Paste for Silicon Solar Cells." Materials Science Forum 849 (March 2016): 852–59. http://dx.doi.org/10.4028/www.scientific.net/msf.849.852.
Повний текст джерелаSharipova, A. F., S. G. Psakhie, I. Gotman, M. I. Lerner, A. S. Lozhkomoev, and E. Y. Gutmanas. "Cold sintering of Fe-Ag and Fe-Cu by consolidation in high pressure gradient." Izvestiya Vuzov Tsvetnaya Metallurgiya (Proceedings of Higher Schools Nonferrous Metallurgy, no. 1 (February 22, 2019): 67–74. http://dx.doi.org/10.17073/0021-3438-2019-1-67-74.
Повний текст джерелаSarkar, Asok K., I. Maartense, and T. L. Peterson. "Limit of superconductivity in silver/superconductor metal-matrix composites prepared with Bi–Pb–Sr–Ca–Cu–O ceramic powders." Journal of Materials Research 7, no. 7 (July 1992): 1672–78. http://dx.doi.org/10.1557/jmr.1992.1672.
Повний текст джерелаAl-Rawy, Wehad A., and Emad S. Al-Hassani. "Effect of Adding Silver Element and Zirconia Ceramic on Corrosion Behavior and Mechanical Properties of Pure Titanium." Engineering and Technology Journal 39, no. 5A (May 25, 2021): 674–94. http://dx.doi.org/10.30684/etj.v39i5a.1087.
Повний текст джерелаJia, Dongming, Junbing Ma, Xueping Gan, Jingmei Tao, Ming Xie, Jianhong Yi, and Yichun Liu. "A Comparison Study of Ag Composites Prepared by Spark Plasma Sintering and Hot Pressing with Silver-Coated CNTs as the Reinforcements." Materials 12, no. 12 (June 17, 2019): 1949. http://dx.doi.org/10.3390/ma12121949.
Повний текст джерелаZhang, Bao Lin, and Shun Hua Wu. "Low-Temperature Sintering Lead-Free Barium Titanate-Based X7P Ceramics with Bi2O3 Dopant and ZnO–B2O3 Flux Agent." Advanced Materials Research 560-561 (August 2012): 886–91. http://dx.doi.org/10.4028/www.scientific.net/amr.560-561.886.
Повний текст джерелаZhu, Chunli, Xiaofen Fu, Xing Gao, and Haotian Kan. "Preparation of 3D printed silver nanocomposites and their antibacterial properties." E3S Web of Conferences 267 (2021): 02003. http://dx.doi.org/10.1051/e3sconf/202126702003.
Повний текст джерелаMosialek, M., M. Tatko, M. Dudek, E. Bielańska та G. Mordarski. "Composite Ag-La0.6Sr0.4Co0.8Fe0.2O3-δ Cathode Material for Solid Oxide Fuel Cells, Preparation and Characteristic". Archives of Metallurgy and Materials 58, № 4 (1 грудня 2013): 1341–45. http://dx.doi.org/10.2478/amm-2013-0171.
Повний текст джерелаLeżański, Jan, and Marcin Madej. "The Influence of Production Process Parameters on the Properties W-Ag, Mo-Ag Composites." Materials Science Forum 534-536 (January 2007): 1513–16. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.1513.
Повний текст джерелаPatelka, Maciej, Nicholas Krasco, Sho Ikeda, Toshiyuki Sato, Miguel Goni, Elbara Ziade, and Aaron J. Schmidt. "Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000051–55. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000051.
Повний текст джерелаJin, Howard (Hwail), Kewei Xu, Loreto Naungayan, and Jose Quinones. "High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000326–31. http://dx.doi.org/10.4071/isom-2016-wp41.
Повний текст джерелаPan, Z. J., L. J. Wei, M. W. Zheng, J. T. Liang, M. G. Zhao, and Y. J. Liu. "A research on silver powder sinters for dilution refrigerator heat exchangers." IOP Conference Series: Materials Science and Engineering 1240, no. 1 (May 1, 2022): 012050. http://dx.doi.org/10.1088/1757-899x/1240/1/012050.
Повний текст джерелаMansourirad, Nima, Mohammad Ardestani, and Reza Afshar. "Synthesis and characterization of Ag-8 %wt Cr2O3 composites prepared by different densification processes." Science of Sintering 50, no. 3 (2018): 323–35. http://dx.doi.org/10.2298/sos1803323m.
Повний текст джерелаDudina, Dina, Alexander Matvienko, Anatoly Sidelnikov, Mikhail Legan, Vyacheslav Mali, Maksim Esikov, Alexander Anisimov, Pavel Gribov, and Vladimir Boldyrev. "Electric Current-Assisted Joining of Copper Plates Using Silver Formed by In-Situ Decomposition of Ag2C2O4." Metals 8, no. 7 (July 12, 2018): 538. http://dx.doi.org/10.3390/met8070538.
Повний текст джерелаMüller, Jonas, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Görlich, and Takatoshi Nishimura. "Silver Sintering of Packaged GaN-Devices on Printed Circuit Board." Journal of Microelectronics and Electronic Packaging 19, no. 1 (January 1, 2022): 18–24. http://dx.doi.org/10.4071/imaps.1675410.
Повний текст джерелаButtay, Cyril, Amandine Masson, Jianfeng Li, Mark Johnson, Mihai Lazar, Christophe Raynaud, and Hervé Morel. "Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000084–90. http://dx.doi.org/10.4071/hiten-paper7-cbuttay.
Повний текст джерелаYang, Wendong, Felix Hermerschmidt, Florian Mathies, and Emil J. W. List-Kratochvil. "Comparing low-temperature thermal and plasma sintering processes of a tailored silver particle-free ink." Journal of Materials Science: Materials in Electronics 32, no. 5 (February 5, 2021): 6312–22. http://dx.doi.org/10.1007/s10854-021-05347-1.
Повний текст джерелаLis, M., A. Wrona, J. Mazur, C. Dupont, M. Kamińska, D. Kopyto, and M. Kwarciński. "Fabrication And Properties Of Silver Based Multiwall Carbon Nanotube Composite Prepared By Spark Plasma Sintering Method." Archives of Metallurgy and Materials 60, no. 2 (June 1, 2015): 1351–55. http://dx.doi.org/10.1515/amm-2015-0129.
Повний текст джерелаHan, Zhaohui, Lei Xu, Shenghui Guo, Qingtian Wu, Libo Zhang, and Jianhua Liu. "Study on the microwave sintering characteristics of spherical tin-silver alloy powder." Materials Research Express 6, no. 12 (March 20, 2020): 1265k7. http://dx.doi.org/10.1088/2053-1591/ab5e58.
Повний текст джерелаHascoët, Stanislas, Cyril Buttay, Dominique Planson, Rodica Chiriac, and Amandine Masson. "Pressureless Silver Sintering Die-Attach for SiC Power Devices." Materials Science Forum 740-742 (January 2013): 851–54. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.851.
Повний текст джерелаHeuck, Nicolas, G. Palm, T. Sauerberg, A. Stranz, A. Waag, and Andrey Bakin. "SiC-Die-Attachment for High Temperature Applications." Materials Science Forum 645-648 (April 2010): 741–44. http://dx.doi.org/10.4028/www.scientific.net/msf.645-648.741.
Повний текст джерелаEberstein, Markus, Marco Wenzel, Claudia Feller, Thomas Seuthe, and Frieder Gora. "Silver processing in thick film technology for power electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000018–24. http://dx.doi.org/10.4071/cicmt-2012-ta13.
Повний текст джерелаShen, Zhenzhen, Aleksey Reiderman, and Casey Anude. "Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000342–48. http://dx.doi.org/10.4071/isom-2015-wp14.
Повний текст джерелаRape, A., X. Liu, A. Kulkarni, and J. Singh. "Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites." Advances in Materials Science and Engineering 2014 (2014): 1–8. http://dx.doi.org/10.1155/2014/832308.
Повний текст джерелаLo, Ming, Seyed Amir Paknejad, Harry Borrill, Wan K. Kong, Addo Addo-Kwabena, Mohamed Saidoune, Chris Powley, Naim Kapadia, Yang Zuo, and Samjid H. Mannan. "Comparative study of how additives affect sintered silver microstructure in die-attach applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000061–65. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000061.
Повний текст джерелаFujino, Masahisa, Hirozumi Narusawa, Yuzuru Kuramochi, Eiji Higurashi, Tadatomo Suga, Toshiyuki Shiratori, and Masataka Mizukoshi. "Transient liquid-phase sintering using silver and tin powder mixture for die bonding." Japanese Journal of Applied Physics 55, no. 4S (March 24, 2016): 04EC14. http://dx.doi.org/10.7567/jjap.55.04ec14.
Повний текст джерелаLarismaa, Juha, Outi Söderberg, Jesse Syrén, Eero Haimi, and Simo Pekka Hannula. "Processing and Characterization of Porous Silica-Ag-Nanoparticle Composites Produced by Pulsed Electric Current Sintering." Key Engineering Materials 527 (November 2012): 38–43. http://dx.doi.org/10.4028/www.scientific.net/kem.527.38.
Повний текст джерелаHussain, Arif, Hee-Lak Lee, Yoon-Jae Moon, Heuiseok Kang, Seung-Jae Moon, and Jun-Young Hwang. "Temperature Estimation during Pulsed Laser Sintering of Silver Nanoparticles." Applied Sciences 12, no. 7 (March 29, 2022): 3467. http://dx.doi.org/10.3390/app12073467.
Повний текст джерелаYang, Hui, and Jihui Wu. "Improvement of Sintering Performance of Nanosilver Paste by Tin Doping." Journal of Nanomaterials 2020 (January 22, 2020): 1–6. http://dx.doi.org/10.1155/2020/3925276.
Повний текст джерелаHe, Xinjun, Yong Wang, Haifei Lu, Dan Ouyang, Zhanfeng Huang, and Wallace C. H. Choy. "Realizing the ultimate goal of fully solution-processed organic solar cells: a compatible self-sintering method to achieve silver back electrode." Journal of Materials Chemistry A 8, no. 12 (2020): 6083–91. http://dx.doi.org/10.1039/d0ta00807a.
Повний текст джерелаWATANABE, Shizuharu, Takayuki KODERA, and Takashi OGIHARA. "Preparation and sintering of tellurium-doped silver powder for electrodes in silicon solar cells." Journal of the Ceramic Society of Japan 123, no. 1437 (2015): 345–50. http://dx.doi.org/10.2109/jcersj2.123.345.
Повний текст джерелаKim, Minha, Hongsub Jee, and Jaehyeong Lee. "Photo-Sintered Silver Thin Films by a High-Power UV-LED Module for Flexible Electronic Applications." Nanomaterials 11, no. 11 (October 25, 2021): 2840. http://dx.doi.org/10.3390/nano11112840.
Повний текст джерелаYahya, Iziana, Noor Asikin Ab Ghani, Mohd Arif Anuar Mohd Salleh, Hamidi Abd Hamid, Zainal Arifin Ahmad, and Ramani Mayappan. "Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method." Advanced Materials Research 501 (April 2012): 160–64. http://dx.doi.org/10.4028/www.scientific.net/amr.501.160.
Повний текст джерелаBenabou, Lahouari, Quang Bang Tao, Thien An Nguyen-Van, Xu Dong Wang, and Luc Chassagne. "Mechanical and Microstructural Analysis of an Ultra-Flexible Nano-Silver Paste Sintered Joint." Key Engineering Materials 865 (September 2020): 25–30. http://dx.doi.org/10.4028/www.scientific.net/kem.865.25.
Повний текст джерелаEberstein, Markus, Christel Kretzschmar, Thomas Seuthe, Manja Marcinkowski, Martin Ihle, Steffen Ziesche, Uwe Partsch, and Frieder Gora. "Towards highly conductive silver pastes for LTCC power electronics." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000553–58. http://dx.doi.org/10.4071/isom-2011-wa3-paper5.
Повний текст джерелаCalabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, and Gaetano Sequenzia. "Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling." Applied Sciences 11, no. 15 (July 29, 2021): 7012. http://dx.doi.org/10.3390/app11157012.
Повний текст джерелаZhang, Ping, Rongzhuan Wei, Jianhua Zeng, Miao Cai, Jing Xiao, and Daoguo Yang. "Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging." Journal of Nanomaterials 2016 (2016): 1–6. http://dx.doi.org/10.1155/2016/8681513.
Повний текст джерелаMosiałek, M., M. Przybyła, M. Tatko, P. Nowak, M. Dudek та M. Zimowska. "Composite Ag-La0.8Sr0.2MnO3-σ Cathode for Solid Oxide Fuel Cells". Archives of Metallurgy and Materials 58, № 4 (1 грудня 2013): 1337–40. http://dx.doi.org/10.2478/amm-2013-0170.
Повний текст джерелаOsadnik, Małgorzata, Marian Czepelak, and Małgorzata Kamińska. "Production and Properties of AgW50 Composites Designated for Electric Contacts." Key Engineering Materials 641 (April 2015): 93–98. http://dx.doi.org/10.4028/www.scientific.net/kem.641.93.
Повний текст джерелаRahimi, Esmaeil, Mohammad Hossein Sheikhi, Zahra Karami Horastani, S. Masoud Sayedi, Sedigheh Zeinali, and Abbas Zarifkar. "Ethanol Sensing Properties of Tin Oxide Doped Using Silver Nanoparticles." Advanced Materials Research 829 (November 2013): 600–604. http://dx.doi.org/10.4028/www.scientific.net/amr.829.600.
Повний текст джерелаFalak, Peyman, and Iman Ebrahimzadeh. "Fabrication of bulk nanostructured silver by spark plasma sintering from nanostructured silver powders." Materials Research Express 6, no. 10 (August 7, 2019): 105009. http://dx.doi.org/10.1088/2053-1591/ab34ed.
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