Дисертації з теми "Silicon pixel detectors"
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Stewart, Graeme Douglas. "Silicon pixel detectors for synchrotron applications." Thesis, University of Glasgow, 2013. http://theses.gla.ac.uk/4384/.
Повний текст джерелаSamy, Md Arif Abdulla. "Characterization of 3D Silicon Pixel Detectors for the ATLAS ITk." Doctoral thesis, Università degli studi di Trento, 2022. http://hdl.handle.net/11572/347623.
Повний текст джерелаMathes, Markus. "Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics." Bonn Physikalisches Inst, 2008. http://d-nb.info/1000893189/34.
Повний текст джерелаBaselga, Bacardit Marta. "Development of pixel detectors for the IBL and HL-LHC ATLAS experiment upgrade." Doctoral thesis, Universitat Autònoma de Barcelona, 2016. http://hdl.handle.net/10803/384718.
Повний текст джерелаThis thesis presents the development of advanced silicon technology detectors fabricated at CNM-Barcelona for High Energy Physics (HEP) experiments. The pixel size of the tracking silicon detectors for the upgrade of the HL-LHC will have to decrease in size in order to enhance the resolution in position for the measurements and they need to have better occupancy for the electronics. The future experiments at CERN will cope with fluences up to 2·10 16 n eq 1cm2 , and the smaller 3D silicon detectors will have less trapping of the electron-holes generated in the bulk leading to a better performance under high radiation environment. This thesis studies silicon detectors fabricated at CNM-Barcelona applied to HEP experiments with two different kinds of novel projects: 3D and Low Gain Avalanche Detectors (LGAD). The 3D detectors make it possible to reduce the size of the depleted region inside the detector and to work at lower voltages, whereas the LGAD detectors have an intrinsic gain which increase the collected signal with a multiplication mechanism. Chapter 1 introduces the silicon detectors applied to HEP experiments. Chapters 2 and 3 explore the new designs for 3D silicon detectors fabricated at CNM-Barcelona. 3D silicon detectors were first introduced in a HEP experiment in 2013 for a new ATLAS layer, the Insertable B layer (IBL), and some of them are characterized in this work. Now, it is expected that 3D silicon detectors with smaller pixel size will be operative for the next ATLAS upgrade, and they are also simulated in this thesis. Chapter 4 is devoted to segmented LGAD detectors fabricated on epitaxial wafer with the intention to decrease the thickness of the detector and increase the charge collected with the multiplication mechanism. This thesis shows technological simulations, fabrication process, electrical simulations and electrical and charge characterization of those devices.
Tsung, Jieh-Wen [Verfasser]. "Diamond and Silicon Pixel Detectors in High Radiation Environments / Jieh-Wen Tsung." Bonn : Universitäts- und Landesbibliothek Bonn, 2012. http://d-nb.info/1044082771/34.
Повний текст джерелаSIDDHANTA, SABYASACHI. "Studies On Monolithic Active Pixel Sensors and Detector Performance for the Inner Tracking System Upgrade of ALICE." Doctoral thesis, Università degli Studi di Cagliari, 2014. http://hdl.handle.net/11584/266453.
Повний текст джерелаVázquez, Furelos David. "3D pixel sensors for the high luminosity LHC ATLAS detector upgrade." Doctoral thesis, Universitat Autònoma de Barcelona, 2019. http://hdl.handle.net/10803/669548.
Повний текст джерелаRicci, Ester. "The passage from microstrip to pixel silicon detectors for tracking particles in space." Doctoral thesis, Università degli studi di Trento, 2020. http://hdl.handle.net/11572/250674.
Повний текст джерелаRicci, Ester. "The passage from microstrip to pixel silicon detectors for tracking particles in space." Doctoral thesis, Università degli studi di Trento, 2020. http://hdl.handle.net/11572/250674.
Повний текст джерелаKrasel, Olaf [Verfasser]. "Charge collection in irradiated silicon detectors : a study of the operation conditions of silicon sensors in the ATLAS pixel detector / Olaf Krasel." Dortmund : Universitätsbibliothek Technische Universität Dortmund, 2004. http://d-nb.info/1011531879/34.
Повний текст джерелаFernandez-Perez, Sonia. "A novel depleted monolithic active pixel sensor for future high energy physics detectors." Doctoral thesis, Universitat Autònoma de Barcelona, 2016. http://hdl.handle.net/10803/385732.
Повний текст джерелаA major upgrade of the Large Hadron Collider (LHC) called High Luminosity LHC (HL-LHC) is scheduled for 2024-2026. This will lead to an increase of the luminosity by seven times the current value and to the extension of the currently ongoing physics programme. A completely new Inner Detector for the ATLAS experiment needs to be developed to withstand the extremely harsh environment at the HL-LHC. New pixel detector concepts are being investigated as a possible candidate to the inner and outer layers of the HL-LHC ATLAS Inner Detector. The use of monolithic pixel sensors in the ATLAS Inner Tracker would lead to a new era of pixel detectors as a consequence of its many advantages with respect to the current technologies. The achievement of smaller spatial resolution, lower density, bigger production yield and throughput, and smaller budget cost are the main arguments to pursue this technology. In this context, a novel Depleted Monolithic Pixel Active Detector built on a thick film Silicon-On-Insulator has been fully investigated in this thesis. Chapter 1 introduces LHC and the ATLAS experiment as well as their foreseen scenarios at the HL-LHC upgrade. This naturally motivates the stringent requirements and challenges of the closest sub-detector to the interaction point, the Inner Detector. Chapter 2 describes the basis of a tracking detector for high energy physics applications, detailing the interactions of particles with matter to the formation of a pixel detector from a semiconductor material. Then the momentum, vertex, and impact parameter resolution of a tracking detector are calculated leading to a set of requirements for the detector design. Chapter 3 describes the radiation damage in silicon detectors whose impact to the detector performance is crucial specially for HL-LHC experiments. The radiation damage in the electronics and in the silicon bulk is treated. Chapter 4 revises the current developments and trends on pixel detectors from the well established hybrid pixel technologies to the commercial CMOS pixels. The commercial CMOS pixels section describes the current technologies being considered at ATLAS: high resistivity, high voltage CMOS (currently built as hybrid and as monolithic), and monolithic CMOS-on-SOI. The latter one composes the core of study of this thesis and is described in great detail. The final chapters are dedicated to the description of the validation programme performed to the CMOS-on-SOI technology, together with characterization methods used, measurements performed, and results analysis description. Chapter 5 focuses on the measurements performed to characterize the radiation hardness of the technology against the ionizing radiation expected in the HL-LHC ATLAS detector. The crucial charge collection properties to fulfil the ATLAS detector requirements were measured and are described in Chapter 6. These measurements include leakage current, signal-to-noise ratio, collected charge, and depletion depth on unirradiated and irradiated samples. Additionally, different techniques as radioactive sources, pion beams, and laser beams were used in order to calculate the depletion depth. Chapter 7 describes the characterization of the monolithic CMOS-on-SOI in a pion beam test. The measured charge collection, charge sharing, spatial resolution, and tracking efficiency are discussed. Within the summary, an outlook towards the future of depleted monolithic active pixel sensors on silicon-on-insulator technology for high energy physics is presented.
Nellist, Clara. "Characterisation and beam test data analysis of 3D silicon pixel detectors for the ATLAS upgrade." Thesis, University of Manchester, 2013. https://www.research.manchester.ac.uk/portal/en/theses/characterisation-and-beam-test-data-analysis-of-3d-silicon-pixel-detectors-for-the-atlas-upgrade(22a82583-5588-4675-af5c-c3595b4ceb38).html.
Повний текст джерелаShen, Chao. "Study of CMOS active pixel image sensor on SOI/SOS substrate /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?ELEC%202003%20SHEN.
Повний текст джерелаIncludes bibliographical references (leaves 67-69). Also available in electronic version. Access restricted to campus users.
Mathes, Markus [Verfasser]. "Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics / von Markus Mathes. Universität Bonn, Physikalisches Institut." Bonn : Physikalisches Inst, 2008. http://d-nb.info/1000893189/34.
Повний текст джерелаPohl, David-Leon [Verfasser]. "3D-Silicon and Passive CMOS Sensors for Pixel Detectors in High Radiation Environments / David-Leon Pohl." Bonn : Universitäts- und Landesbibliothek Bonn, 2020. http://d-nb.info/1221669281/34.
Повний текст джерелаAlanazi, Norah. "CALIBRATION OF THE HEAVY FLAVOR TRACKER (HFT) DETECTOR IN STAR EXPERIMENT AT RHIC." Kent State University / OhioLINK, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=kent1448026418.
Повний текст джерелаRicci, Riccardo. "Study of bent monolithic active pixel sensors for the ALICE inner tracking system 3." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2021. http://amslaurea.unibo.it/23514/.
Повний текст джерелаChen, Zongde. "Depleted CMOS sensor development for pixel particle detectors under high intensity and high radiative dose." Thesis, Aix-Marseille, 2019. http://www.theses.fr/2019AIXM0430.
Повний текст джерелаThe Inner Tracker (ITk) system of the ATLAS experiment will be upgraded for the 2026 High Luminosity Large Hadron Collider (HL-LHC) run. The HL-LHC will operate with a center of mass energy of 14 TeV and a peak instantaneous luminosity five times higher than at present. The increased luminosity will result in roughly ten times higher radiation levels and data rates. To cope with the ATLAS requirements in terms of radiation hardness, readout speed and granularity at the HL-LHC, the replacement of the present ATLAS Inner Tracker (ITk) is needed. Two large-scale depleted CMOS sensors in the 150 nm LF-technology called LF-CPIX and LF-MONOPIX, developed in the framework of the ATLAS Inner Tracker (ITK) upgrade for High Luminosity LHC. The work presented here shows the characterization for these three prototypes, with contributions concerning the setup development, 55Fe and 90Sr source calibration, modifications of the FPGA firmware and development of test programs. A main concern was the investigation on the radiation hardness for both the electronics and the sensor parts. We will show results concerning characterizations for these prototypes in the laboratory performance at CPPM, as well as results in multiple radiation campaigns performed at the 24 GeV IRRAD proton facility at CERN, to study the effects of Non-Ionizing Energy Loss (NIEL) and Total Ionizing Dose (TID) on the prototypes
Altenheiner, Silke [Verfasser], Claus [Akademischer Betreuer] Gößling, and Kevin [Gutachter] Kröninger. "Investigation of n +-in-n planar silicon pixel detectors for application in the ATLAS experiment / Silke Altenheiner. Betreuer: Claus Gößling. Gutachter: Kevin Kröninger." Dortmund : Universitätsbibliothek Dortmund, 2015. http://d-nb.info/1110894201/34.
Повний текст джерелаBergbauer, Bettina. "Study of macroscopic and microscopic homogeneity of DEPFET X-ray detectors." Doctoral thesis, Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-193814.
Повний текст джерелаPozzobon, Nicola. "A Level 1 Tracking Trigger for the CMS Experiment at the LHC Phase 2 Luminosity Upgrade." Doctoral thesis, Università degli studi di Padova, 2011. http://hdl.handle.net/11577/3422049.
Повний текст джерелаDurante il secondo decennio di operazioni al Large Hadron Collider, a partire dall'anno 2020, è previsto un notevole aumento della luminosità istantanea del collisionatore, di un ordine di grandezza superiore rispetto a quella di progetto. Questa luminosità presenta numeose sfide per gli esperimenti a LHC. Il Tracciatore attualmente impiegato nell'esperimento Compact Muon Solenoid dovrà essere rimpiazzato con un sistema in grado di garantire una tracciatura di qualità eccellente ad alte luminosità e, allo stesso tempo, fornire informazioni utili per l'attuale "Livello 0" del sistema di Trigger a CMS, alla frequenza di collisioni di 40 MHz. Le richieste minime per un Trigger basato sul Tracciatore sono la capacità di confermare la presenza di tracce ad alto pT associate a Trigger di Livello 0 ottenuti con i Calorimetri o i rivelatori di muoni. La capacità di fornire criteri efficaci di isolazione può essere ulteriormente richiesa e in ogni caso migliorerebbe significativamente le prestazioni del Trigger. Il rateo dei dati associati con la generazione nel Tracciatore di informazione di Trigger può essere mantenuto in una larghezza di banda sufficientemente maneggevole richiedendo che i moduli sensitivi siano in grado di ridurre localmente i dati. I principali candidati per una simile riduzione locale del rateo i dati sono caratterizzati dalla capacità di fornire la direzione della traccia nel piano trasverso, oltre alla sua posizione, da cui poter dedurre la quantità di moto della traccia stessa. Questi "pT-modules" trasmetterebbero di conseguenza al Trigger di primo livello degli abbozzi di traccia ("stub") generati da particelle con pT al di sopra di 2 GeV/c. La scelta di una simile soglia permetterebbe la riduzione dei dati di un fattore superiore a 10, consentendo quindi un rateo facilmente tollerabile. I moduli di Trigger possono essere realizzati con due sensori di silicio paralleli leggermente separati, caratterizzati da una risoluzione sulla misura del singolo punto d'impatto tale che gli stub, ottenuti tramite correlazione tra i punti misurati nel modulo, possano fornire un'adeguata misura della direzione della traccia, nonostante il braccio di leva sia dell'ordine del millimetro. Un'ipotetica configurazione per il Tracciatore, composto da "lunghi barili", che prevede un Tracciatore esterno realizzato totalmente con moduli di Trigger, è stata proposta. Essa è particolarmente flessibile negli studi di simulazione per il Trigger realizzato con il Tracciatore giacché consente di combinare tra loro, tramite proiezioni geometriche, le informazioni provenienti da diversi strati del Tracciatore. Pertanto è un campo di prova per confrontare le prestazioni di diverse concezioni e diverse configurazioni. Il Tracciatore proposto permette anche la generazione di oggetti più articolati degli stub per il Trigger, come ad esempio le "tracklet", che consistono in coppie di stub opportunamente associate tra loro, le quali possono a loro volta essere usate come punto di partenza per la costruzione di Tracce di Primo Livello. La scelta di moduli di Trigger realizzati con sensori accoppiati è rafforzata da risultati recenti ottenuti con dei prototipi innovativi di rivelatori a Pixel Monolitici durante dei test sotto fascio riportati in questa tesi. Lo sviluppo di simulazioni per un Trigger con il Tracciatore è anch'esso presentato come un significativo progresso verso la progettazione di un nuovo Tracciatore realistico e capace di fornire informazioni utili per il Trigger. Particolarmente impegnativo è lo sforzo per un Trigger che selezioni i leptoni tau prodotti in numerosi processi rari di interesse per gli esperimenti a LHC. Le prestazioni di un Trigger con il Tracciatore su stati finali contenenti leptoni tau saranno fondamentali a luminosità molto elevate e sono illustrate alla fine di questo documento, come naturale prosecuzione del lavoro descritto.
Wang, H. (Hongbo). "Silicon X-ray smart sensor micromodule and microsystem." Doctoral thesis, University of Oulu, 2002. http://urn.fi/urn:isbn:951426746X.
Повний текст джерелаPersson, Mats. "Spectral Computed Tomography with a Photon-Counting Silicon-Strip Detector." Doctoral thesis, KTH, Medicinsk bildfysik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-187263.
Повний текст джерелаBombonati, Carlo. "Commissioning of the Silicon Pixel Detector of ALICE and perspectives for beauty production at LHC." Doctoral thesis, Università degli studi di Padova, 2009. http://hdl.handle.net/11577/3426447.
Повний текст джерелаL'attività svolta nell’ambito della presente tesi è stata mirata alla preparazione per lo studio della produzione di beauty. Ha perciò incluso la costruzione dei settori, il tuning dell'impianto di raffreddamento ed il commissioning dell’SPD. Più in dettaglio: • Assemblaggio dei sensori a pixel sul supporto di fibra di carbonio. Dato il suo ruolo come tracciatore, l'assemblaggio dell'SPD richiede l'impiego di specifiche procedure per assicurare un’alta precisione. • Tuning e funzionamento del sistema di raffreddamento dell'SPD. La dissipazione dell'SPD è di circa 1.5 kW. Questo vuol dire che, senza raffreddamento, la temperatura dei sensori aumenterebbe alla velocità di circa 1°C/s. L’impianto di raffreddamento è quindi di vitale importanza per il funzionamento del rivelatore. • Sviluppo di un set di strumenti per il monitoraggio dell'allineamento dell'ITS ed, in particolare, dell'SPD. Il misallineamento del rivelatore dev'essere valutato e riportato nel software della geometria per ottimizzare la risoluzione spaziale. Questa operazione viene fatta utilizzando dei programmi dedicati. Per controllare i risultati ottenuti da questi programmi e per valutare la risoluzione spaziale del rivelatore, è stato sviluppato uno strumento software apposito. • Valutazione sulla possibilità di usare i decadimenti semi-elettronici del beauty per lo studio del QGP, con particolare riferimento alle problematiche inerenti ai primi run ad LHC (identificazione degli elettroni e misallineamento). Gli studi di simulazione riportati qui sono mirati alla valutazione delle performance di ALICE per la misura del fattore di modifica nucleare (RAA) e dell'anisotropia azimutale (v2) degli elettroni provenienti da decadimenti del beauty. Inoltre, sfruttando precedenti studi sulla produzione del charm, è stato possibile stimare la sensitività per la dipendenza dalla massa della perdita d'energia partonica.
Zimmermann, Marco [Verfasser]. "Particle Rate Studies and Technical Design Development for the P2 Silicon Pixel Tracking Detector / Marco Zimmermann." Mainz : Universitätsbibliothek Mainz, 2019. http://d-nb.info/1197837809/34.
Повний текст джерелаHellenschmidt, Annabell Desiree [Verfasser]. "Experimental studies on small diameter carbon dioxide evaporators for optimal Silicon Pixel Detector cooling / Annabell Desiree Hellenschmidt." Bonn : Universitäts- und Landesbibliothek Bonn, 2020. http://d-nb.info/1224966163/34.
Повний текст джерелаChapa, Matthew R. "Analysis of 3D silicon pixel vertex detector damage effects due to radiation levels present in the LHC at CERN." Thesis, Massachusetts Institute of Technology, 2012. http://hdl.handle.net/1721.1/76932.
Повний текст джерела"June 2012." Cataloged from PDF version of thesis.
Includes bibliographical references (p. 45).
In high energy physics experiments, very high precision tracking of charged particles is needed. Solid state detectors achieve the high precision necessary to provide track and vertex reconstruction of the particles that traverse them, but tracking performance begins to deteriorate at fluxes of radiation around 10¹⁴ - 10¹⁵ hadrons/cm 2. These radiation levels are congruent with those experienced by the ATLAS pixel detector, the inner most part of the ATLAS tracking system, which is vital to track and vertex reconstruction. During the planned shut-down of the Large Hadron Collider (LHC) in 2013-2014, the energy and luminosity of the LHC will both be increased. The current pixel detector has begun to suffer deterioration of performance, so the ATLAS Collaboration has initiated an upgrade to take place during the scheduled shut-down beginning in 2013, the Insertable B-Layer (IBL). The IBL will be assembled and placed in between a reduced diameter beam pipe and the current pixel detector, acting as the fourth layer of the ATLAS inner detector. The pixel sensors of the IBL will have to sustain a radiation dose of 5 * 10¹⁵neq/cm². Two sensor technologies are being considered for the IBL upgrade: planar n-in-p silicon pixel sensors and 3D double sided n-in-p pixel sensors. Research of both these technologies is being done by the IFAE in collaboration with CNM-Barcelona. To cope with the increased data rate after the LHC upgrade, a new front-end chip has also been produced, the FE-14 front-end chip. Test results and data analysis from five different 3D pixel sensor devices, all fabricated at CNM-Barcelona were done. Evaluation of these technologies and the test results of irradiated 3D pixel sensor devices are carried out in this thesis.
by Matthew R. Chapa.
S.B.
Liu, Jian. "Etude d'un détecteur pixel monolithique pour le trajectographe d'ATLAS auprès du LHC de haute luminosité." Thesis, Aix-Marseille, 2016. http://www.theses.fr/2016AIXM4015/document.
Повний текст джерелаA major upgrade to the Large Hadron Collider (LHC), scheduled for 2024 will be brought to the machine so as to extend its discovery potential. This PhD is part of the ATLAS program and aims at studying a new monolithic technology in the framework of the design of an upgraded ATLAS inner tracker. This new type of sensor is based on a HV/HR CMOS technology, which would potentially offer lower material budget, reduced pixel pitch and lower cost with respect to the traditional hybrid pixel detector concept.Various prototypes have been developed using different HV/HR CMOS technologies from several industrial partners, within the ATLAS HV/HR collaboration, for instance Global Foundry (GF) BCDlite 130 nm and LFoundry (LF) 150 nm. In order to understand the electric behavior and the detection capabilities of these technologies, 3D and 2D Technology Computer Aided Design (TCAD) simulations have been performed to extract the depletion zone profile, the breakdown voltage, the leakage current, the capacitance as well as the charge collection of the prototypes. Test setup developments and characterizations of the HV/HR CMOS prototypes were also part of this thesis. The data acquisition programs, in particular dedicated to the proton test beams, X-ray sources and threshold tuning, have been implemented into various test setups. Several HV/HR CMOS prototypes developed in three HV/HR technologies, AMS 0.18 µm HV, GF BCDlite 130 nm and LF 150 nm, have been characterized
Norlin, Börje. "Characterisation and application of photon counting X-ray detector systems." Doctoral thesis, Mittuniversitetet, Institutionen för informationsteknologi och medier, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-38.
Повний текст джерелаDenna avhandling berör utveckling och karaktärisering av fotonräknande röntgensystem. ”Färgröntgen” öppnar nya perspektiv för medicinsk röntgendiagnostik och även för materialröntgen inom industrin. Skillnaden i absorption av olika ”färger” kan användas för att särskilja olika material i ett objekt. Färginformationen kan till exempel användas i sjukvården för att identifiera benskörhet. Färgen på röntgenfotonen kan identifieras om detektorsystemet kan detektera varje foton individuellt. Sådana detektorsystem kallas ”fotonräknande” system. Med modern teknik är det möjligt att konstruera fotonräknande detektorsystem som kan urskilja detaljer ner till en upplösning på circa 50 µm. Med så små pixlar kommer ett problem att uppstå. I en halvledardetektor ger varje absorberad foton upphov till ett laddningsmoln som bidrar till den erhållna bilden. För höga fotonenergier är storleken på laddningsmolnet jämförbar med 50 µm och molnet kan därför fördelas över flera pixlar i bilden. Laddningsdelning är ett centralt problem delvis på grund av att bildens upplösning försämras, men framför allt för att färginformationen i bilden förstörs. Denna avhandling presenterar karaktärisering och simulering för att ge en mer detaljerad förståelse för fysikaliska processer som bidrar till laddningsdelning i detektorer från MEDIPIX-projekter. Designstrategier för summering av laddning genom kommunikation från pixel till pixel föreslås. Laddningsdelning kan också begränsas genom att introducera detektorkonstruktioner i 3D-struktur. I nästa generation av MEDIPIX-systemet, Medipix3, kommer summering av laddning att vara implementerat. Detta system, utrustat med en 3D-detektor i kisel, eller en tunn plan detektor av högabsorberande material med god kvalitet, har potentialen att kunna kommersialiseras för medicinska röntgensystem. Detta skulle bidra till bättre folkhälsa inom hela Europeiska Unionen.
Terzo, Stefano [Verfasser], Siegfried [Akademischer Betreuer] Bethke, and Stephan [Akademischer Betreuer] Paul. "Development of radiation hard pixel modules employing planar n-in-p silicon sensors with active edges for the ATLAS detector at HL-LHC / Stefano Terzo. Betreuer: Siegfried Bethke. Gutachter: Stephan Paul ; Siegfried Bethke." München : Universitätsbibliothek der TU München, 2015. http://d-nb.info/1080299467/34.
Повний текст джерелаBenoit, Mathieu. "Étude des détecteurs planaires pixels durcis aux radiations pour la mise à jour du détecteur de vertex d'ATLAS." Phd thesis, Université Paris Sud - Paris XI, 2011. http://tel.archives-ouvertes.fr/tel-00610015.
Повний текст джерелаWen, Hsien-tzu, and 溫仙智. "Development of Silicon Pixel Detectors." Thesis, 1997. http://ndltd.ncl.edu.tw/handle/28827022555585218542.
Повний текст джерела國立清華大學
物理學系
85
Four kinds of the silicon pixel sensors with integrated coupling capacitors and polysilicon bias resistors have been designed and fabricated. The pixel sensors were processed on n- type silicon wafers with the thickness of 280 μm and the orientation of <111>. Each sensor with area of 1.2 × 1.2 c㎡ includes 30 × 30 diodes. A 80 nm gate oxide thickness was chosen to provide a coupling capacitance of 53.3 nF/c㎡. A full depletion voltage of 70 V and the leakage currents of 0.0975, 0.0585, 40.279, and 0.1078 μA/c㎡ for the sensors areas of12475 × 12480, 12475 × 12480, 12450 × 12480, and 12450 × 12455 μ ㎡ respectively were measured. The electrical tests indicate that the leakage current and the junction capacitance of the silicon pixel sensors are smaller than that of the silicon microstrip detector in this study. The characteristic measurements show that the developed pixel sensors can work except a defective one.
Ceccarelli, Rudy. "Development of Radiation Resistant Pixel Detectors for the Luminosity Frontier and Measurement of the Higgs Boson Production via Vector Boson Fusion with the CMS Experiment at the LHC." Doctoral thesis, 2022. http://hdl.handle.net/2158/1264218.
Повний текст джерелаLebel, Céline. "Effets de rayonnement sur les détecteurs au silicium à pixels du détecteur ATLAS." Thèse, 2007. http://hdl.handle.net/1866/6412.
Повний текст джерелаBergbauer, Bettina. "Study of macroscopic and microscopic homogeneity of DEPFET X-ray detectors." Doctoral thesis, 2015. https://monarch.qucosa.de/id/qucosa%3A19355.
Повний текст джерелаSchorlemmer, André Lukas. "Monitoring Radiation Damage in the ATLAS Pixel Detector." Doctoral thesis, 2014. http://hdl.handle.net/11858/00-1735-0000-0023-992B-D.
Повний текст джерелаLiao, Yu-Ting, and 廖鈺婷. "Fabrication of Two-dimensional Position Sensitivity Single-sided Silicon Strip-pixel Detector." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/34727285905100880283.
Повний текст джерела國立清華大學
工程與系統科學系
102
From the early times of the electron microscopy, film has been used for recording the electron images in TEM. A standard detector option commonly used instead of film is the charged coupled device (CCD), which was first used in electron microscopy in the late 1980s. The CCD systems have enabled the immediate access to images in real-time, and have significantly increased throughput in the electron microscopy field. The CCD camera system is an indirect imaging detection system because the CCD will suffer from radiation damage and charge saturation during direct exposure of electron beam in TEM. A scintillator is thus needed to convert the electron image to a photonic image, which is then relayed to the CCD cameras for image acquisition. Hence, indirect imaging detection system have some inherent restrictions, including spatial and temporal resolution, efficiency and frame rate. In order to improve performance of electron detection systems, the application of silicon strip detector in TEM as a direct imaging systems was proposed. The application of silicon strip detector in TEM can meet the requirements for two-dimensional position sensitivity, spatial resolution and frame rate with direct sensing. Compared to pixel detector like CCD, silicon strip detector has advantages of simple structure, less number of readout circuits and lower manufacturing complexity. But silicon strip detector has one major issue, ghost images, which is unavoidable. If more than one particle hits the silicon strip detector, the measured particles position is no longer unambiguous and ghost hits appear. In this work, we proposed a direct electron detector with unique readout metal strip arrangement, called silicon strip-pixel detector, to relieve multi-hits induced ghost image problems and greatly reduce the number of readout circuits compared with pixel detector. Owing to characteristics integration of silicon strip detector and pixel detector, it was called silicon strip-pixel detector. The silicon strip-pixel detector is fabricated by single-sided process on high resistivity n-doped 4 inch diameter silicon wafer with a thickness of 250 μm. The pitch of strips determines the spatial resolution of the detector. The performance of P-N junction can be obtained by fine-tuning of implantation energy, dose and annealing parameters. The guard rings are designed around the active area to reduce leakage current. The dark current of silicon strip-pixel detector is 0.3 pA, breakdown voltage is -120 V and leakage current is 2.3 μA. The detector with guard rings design can greatly reduce leakage current with 3.48 times and increase breakdown voltage of 75 V compared with detector without guard ring. The threshold energy of detector sensitivity is 5 keV, minimum signal current is 15.1 pA and signal to noise ratio (in full depletion) is 3.12. According to theoretical calculations, charge collection efficiency is 0.703, DQE is 0.016 and theoretical frame rate is 0.7 ms per frame. The strip-pixel detector can meet the generic requirements for direct electron imaging system and has great potential to be used as imaging sensor in TEM.
(9385172), Simran Sunil Gurdasani. "Pixel Sensor Module Assembly Procedures for The CMS High Luminosity LHC Upgrade." Thesis, 2020.
Знайти повний текст джерелаThe high luminosity phase of the LHC, poised to start taking data in 2027, aims to increase the instantaneous luminosity of the machine to 7.5 x 1034 cm-2 s-1. This will make it possible for experiments at CERN to make higher precision measurements on known physics phenomenon as well as to search for “new physics”. However, this motivates the need for hardware upgrades at the various experiments in order to ensure compatibility with the HL-LHC. This thesis describes some of the efforts to upgrade the inner-most layers of the Compact Muon Solenoid, namely the CMS silicon pixel tracking detector.
Silicon sensors used to track particles are installed in the detector as part of a pixel sensor module. Modules consist of a silicon sensor-readout chip assembly that is wire-bonded to an HDI, or High Density Interconnects to provide power and signals.
As part of the upgrade, 2,541 modules need to be assembled delicately and identically with alignment error margins as low as 10 microns. Assembly will be across three production sites in clean rooms to avoid dust and humidity contamination.
In addition, the modules need to survive high magnetic fields and extended close-range radiation as part of the HL-LHC.
In line with this effort, new materials and assembly procedures able to sustain such damage are investigated. Techniques to assemble modules are explored, specifically precision placing of parts with a robotic gantry and techniques to protect wirebonds. This is followed by a discussion of the accuracy and repeatability.