Статті в журналах з теми "Semiconductor module"
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Resutík, Patrik, and Slavomír Kaščák. "Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability." Applied Sciences 11, no. 20 (October 9, 2021): 9366. http://dx.doi.org/10.3390/app11209366.
Повний текст джерелаSeki, Kyoshiro, Yoshitaka Tsunekawa, Hiroshi Osada, Jun-Ichi Shida, and Koichi Murakami. "Multisensor module using magnetic semiconductor ferrite." Electronics and Communications in Japan (Part II: Electronics) 73, no. 4 (1990): 46–53. http://dx.doi.org/10.1002/ecjb.4420730406.
Повний текст джерелаYau, Chin Horng, Wen Ren Jong, and H. H. Wang. "Design and Analysis of SCARA Substrate Transfer Robot for Semiconductor and FPD Processing Cluster Tools." Materials Science Forum 505-507 (January 2006): 331–36. http://dx.doi.org/10.4028/www.scientific.net/msf.505-507.331.
Повний текст джерелаWang, Yangang, Yibo Wu, Xiaoping Dai, Steve Jones, and Guoyou Liu. "Investigation of Automotive Power Semiconductor Module Operates at Elevated Cooling Temperature." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 000154–60. http://dx.doi.org/10.4071/hiten-session5-paper5_1.
Повний текст джерелаMorgan, Adam, Ankan De, Haotao Ke, Xin Zhao, Kasunaidu Vechalapu, Douglas C. Hopkins, and Subhashish Bhattacharya. "A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000359–64. http://dx.doi.org/10.4071/isom-2015-wp17.
Повний текст джерелаAnzai, Takeshi, Yoshinori Murakami, Shinji Sato, Hidekazu Tanisawa, Kohei Hiyama, Hiroki Takahashi, Fumiki Kato, and Hiroshi Sato. "Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor Devices." Journal of Microelectronics and Electronic Packaging 12, no. 3 (July 1, 2015): 153–60. http://dx.doi.org/10.4071/imaps.464.
Повний текст джерелаXu Dan, 徐丹, 黄雪松 Huang Xuesong, 姜梦华 Jiang Menghua, 惠勇凌 Hui Yongling, 雷訇 Lei Hong, and 李强 Li Qiang. "500 W fiber-coupled semiconductor laser module." Infrared and Laser Engineering 45, no. 6 (2016): 0606003. http://dx.doi.org/10.3788/irla201645.0606003.
Повний текст джерелаAbdesselam, A., P. J. Adkin, P. P. Allport, J. Alonso, L. Andricek, F. Anghinolfi, A. A. Antonov, et al. "The ATLAS semiconductor tracker end-cap module." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 575, no. 3 (June 2007): 353–89. http://dx.doi.org/10.1016/j.nima.2007.02.019.
Повний текст джерелаEl-Awady, K., C. D. Schaper, and T. Kailath. "Programmable Thermal Processing Module for Semiconductor Substrates." IEEE Transactions on Control Systems Technology 12, no. 4 (July 2004): 493–509. http://dx.doi.org/10.1109/tcst.2004.824775.
Повний текст джерелаParker-Allotey, Nii Adotei, Dean P. Hamilton, Olayiwola Alatise, Michael R. Jennings, Philip A. Mawby, Rob Nash, and Rob Magill. "Improved Energy Efficiency Using an IGBT/SiC-Schottky Diode Pair." Materials Science Forum 717-720 (May 2012): 1147–50. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1147.
Повний текст джерелаTyler, Neil. "Tiny Bluetooth Low Energy Soc and Module." New Electronics 51, no. 20 (November 12, 2019): 9. http://dx.doi.org/10.12968/s0047-9624(22)61475-5.
Повний текст джерелаWu, Yi Bo, Guo You Liu, Ning Hua Xu, and Ze Chun Dou. "Thermal Resistance Analysis and Simulation of IGBT Module with High Power Density." Applied Mechanics and Materials 303-306 (February 2013): 1902–7. http://dx.doi.org/10.4028/www.scientific.net/amm.303-306.1902.
Повний текст джерелаWang, Fengzhe. "A Fast Drying Machine Based On Semiconductor Heat Pump." E3S Web of Conferences 252 (2021): 02024. http://dx.doi.org/10.1051/e3sconf/202125202024.
Повний текст джерелаDutta, Atanu, and Simon S. Ang. "Design of a Low Inductance Power Module Based on Low Temperature Co-fired Ceramic." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000032–38. http://dx.doi.org/10.4071/2016cicmt-tp2a1.
Повний текст джерелаŠtěpánek, Jan, Luboš Streit, and Tomáš Komrska. "Comparison of Si and SiC based Power Converter Module of 150 kVA for Power System Applications." TRANSACTIONS ON ELECTRICAL ENGINEERING 7, no. 1 (March 30, 2020): 10–13. http://dx.doi.org/10.14311/tee.2018.1.010.
Повний текст джерелаZhuravleva, O. V., A. V. Ivanov, V. D. Kurnosov, K. V. Kurnosov, V. I. Romantsevich, and R. V. Chernov. "Reliability estimate for semiconductor laser module ILPN-134." Semiconductors 44, no. 3 (March 2010): 359–65. http://dx.doi.org/10.1134/s1063782610030152.
Повний текст джерелаMoed, Shulamit. "EndCap module production of the ATLAS Semiconductor Tracker." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 560, no. 1 (May 2006): 75–78. http://dx.doi.org/10.1016/j.nima.2005.11.237.
Повний текст джерелаUshifusa, Nobuyuki, Hiroich Shinohara, Kousei Nagayama, Satoru Ogihara, and Tasao Soga. "4821142 Ceramic multilayer circuit board and semiconductor module." Microelectronics Reliability 29, no. 6 (January 1989): iii. http://dx.doi.org/10.1016/0026-2714(89)90151-0.
Повний текст джерелаRodrigues, Ema G., Robert F. Herrick, James Stewart, Helena Palacios, Francine Laden, William Clark, and Elizabeth Delzell. "Case–control study of brain and other central nervous system cancer among workers at semiconductor and storage device manufacturing facilities." Occupational and Environmental Medicine 77, no. 4 (February 4, 2020): 238–48. http://dx.doi.org/10.1136/oemed-2019-106120.
Повний текст джерелаKrismadinata, Rudi Mulya, and Monica Danni Juwita. "E-learning Courseware Development for Power Electronics Course." International Journal of Interactive Mobile Technologies (iJIM) 16, no. 03 (February 10, 2022): 66–81. http://dx.doi.org/10.3991/ijim.v16i03.27723.
Повний текст джерелаChen, Zheng, Yiying Yao, Wenli Zhang, Dushan Boroyevich, Khai Ngo, Paolo Mattavelli, and Rolando Burgos. "Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications." Journal of Microelectronics and Electronic Packaging 13, no. 2 (April 1, 2016): 39–50. http://dx.doi.org/10.4071/imaps.503.
Повний текст джерелаPapanu, Victor. "Comparative Test Data for TIM Materials for LED Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000655–83. http://dx.doi.org/10.4071/2012dpc-ta41.
Повний текст джерелаFu, Shancan, Guoliang Wang, and Feng Xiao. "Degradation Behavior of High Power Semiconductor Modules by Low-Temperature Sintering Technology." Journal of Physics: Conference Series 2370, no. 1 (November 1, 2022): 012012. http://dx.doi.org/10.1088/1742-6596/2370/1/012012.
Повний текст джерелаHunt, Bob. "The Development and Qualification of a DC-DC Converter for 225°C (437°F) Operating Temperature." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000214–21. http://dx.doi.org/10.4071/hitec-bhunt-wa22.
Повний текст джерелаFlores, David, Salvador Hidalgo, and Jesús Urresti. "New generation of 3.3kV IGBTs with monolitically integrated voltage and current sensors." Facta universitatis - series: Electronics and Energetics 28, no. 2 (2015): 213–21. http://dx.doi.org/10.2298/fuee1502213f.
Повний текст джерелаWang, Wei, Long Qing Zou, Hua Xu, You Wei An, Pei Fa Jia, Bo Li, and Yuan Luo. "A Design Method of Multiple Protocols Communication Module in Semiconductor Equipment Simulation Platform." Advanced Materials Research 462 (February 2012): 516–23. http://dx.doi.org/10.4028/www.scientific.net/amr.462.516.
Повний текст джерелаSeal, Sayan, Michael D. Glover, and H. Alan Mantooth. "The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000065–72. http://dx.doi.org/10.4071/2016cicmt-tp2b1.
Повний текст джерелаZhao, Ge, Yu Zhang, Yue Yang Liu, Jia Jie Che, Wen Yu Gao, Rui Jin, and Kun Shan Yu. "A Simulation Method of Pressure-Stress Affects Power Press Pack FRD Chip Forward Voltage." Applied Mechanics and Materials 433-435 (October 2013): 2121–24. http://dx.doi.org/10.4028/www.scientific.net/amm.433-435.2121.
Повний текст джерелаANZAI, Takeshi, Yoshinori MURAKAMI, Shinji SATO, Hidekazu TANISAWA, Kohei HIYAMA, Hiroki TAKAHASHI, Fumiki KATO, and Hiroshi SATO. "Sandwich Structured Power Module for High Temperature SiC Power Semiconductor Devices." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000757–62. http://dx.doi.org/10.4071/isom-wp54.
Повний текст джерелаKosenko, Roman, Liisa Liivik, Andrii Chub, and Oleksandr Velihorskyi. "Comparative Analysis of Semiconductor Power Losses of Galvanically Isolated Quasi-Z-Source and Full-Bridge Boost DC-DC Converters." Electrical, Control and Communication Engineering 8, no. 1 (July 1, 2015): 5–12. http://dx.doi.org/10.1515/ecce-2015-0001.
Повний текст джерелаFukuchi, Tomonori, Youichi Arai, Fusao Watanabe, Shinji Motomura, Shin'ichiro Takeda, Yousuke Kanayama, Hiromitsu Haba, Yasuyoshi Watanabe, and Shuichi Enomoto. "A Digital Signal Processing Module for Ge Semiconductor Detectors." IEEE Transactions on Nuclear Science 58, no. 2 (April 2011): 461–67. http://dx.doi.org/10.1109/tns.2011.2109968.
Повний текст джерелаYang, Gui Lin. "Design of the Thermoelectric Generator." Advanced Materials Research 143-144 (October 2010): 543–46. http://dx.doi.org/10.4028/www.scientific.net/amr.143-144.543.
Повний текст джерелаSun, Wanjun, Lijiao Yang, Jianan Xie, Xiaxia Zhang, Yang Sha, Shuai Mi, and Tao Lin. "Thermal analysis and package optimization for the multi-wavelength laser bar module." Journal of Physics: Conference Series 2370, no. 1 (November 1, 2022): 012006. http://dx.doi.org/10.1088/1742-6596/2370/1/012006.
Повний текст джерелаЧэн, Чаншань, and Антон Александрович Голянин. "Designing a Cooler With Natural Cold for A 100 kW Semiconductor Power Converter." Bulletin of Science and Practice, no. 8 (August 15, 2022): 317–24. http://dx.doi.org/10.33619/2414-2948/81/34.
Повний текст джерелаSun, Shou Lei, Gui Tang Wang, Ying Ge Li, and Zheng Li. "Research on Testing Technology of CMOS Camera Module." Applied Mechanics and Materials 378 (August 2013): 408–12. http://dx.doi.org/10.4028/www.scientific.net/amm.378.408.
Повний текст джерелаHan, Yi Lun, Zong Bing Zhang, and Xue Lei Wen. "Visual Intelligent Vehicle Control System’s Design Based on PC9S12XS128 MCU." Advanced Materials Research 562-564 (August 2012): 1571–74. http://dx.doi.org/10.4028/www.scientific.net/amr.562-564.1571.
Повний текст джерелаNing, Puqi, Fred Wang, and Khai D. T. Ngo. "High Temperature SiC Power Module Electrical Evaluation Procedure." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000336–42. http://dx.doi.org/10.4071/hitec-pning-tha13.
Повний текст джерелаSeal, Sayan, Michael D. Glover, and H. Alan Mantooth. "The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer." Journal of Microelectronics and Electronic Packaging 13, no. 4 (October 1, 2016): 169–75. http://dx.doi.org/10.4071/imaps.514.
Повний текст джерелаMachado da Silva, Jamir, Renan Eduardo da Silva, José Rui Camargo, and Ederaldo Godoy Junior. "Optimization of a Thermoelectric Air Conditioning Systems." Defect and Diffusion Forum 336 (March 2013): 111–20. http://dx.doi.org/10.4028/www.scientific.net/ddf.336.111.
Повний текст джерелаSato, Shinya, Hidekazu Tanisawa, Takeshi Anzai, Hiroki Takahashi, Yoshinori Murakami, Fumiki Kato, Kinuyo Watanabe, and Hiroshi Sato. "Development of a Wire-Bonding-Less SiC Power Module Operating over a Wide Temperature Range." Materials Science Forum 858 (May 2016): 1066–69. http://dx.doi.org/10.4028/www.scientific.net/msf.858.1066.
Повний текст джерелаDonghan Lee, Gwan-Chong Joo, Kwang-Ryong Oh, Hee-Tae Lee, Nam Hwang, Sang-Hwan Lee, Seong-Su Park, Min-Kyu Song, and Seung-Goo Kang. "Fabrication of semiconductor optical switch module using laser welding technique." IEEE Transactions on Advanced Packaging 23, no. 4 (2000): 672–80. http://dx.doi.org/10.1109/6040.883757.
Повний текст джерелаRaja, Arslan S., Junqiu Liu, Nicolas Volet, Rui Ning Wang, Jijun He, Erwan Lucas, Romain Bouchandand, Paul Morton, John Bowers, and Tobias J. Kippenberg. "Chip-based soliton microcomb module using a hybrid semiconductor laser." Optics Express 28, no. 3 (January 21, 2020): 2714. http://dx.doi.org/10.1364/oe.28.002714.
Повний текст джерелаWood-Hi Cheng, Maw-Tyan Sheen, Chih-Pen Chien, Hung-Lun Chang, and Jao-Hwa Kuang. "Reduction of fiber alignment shifts in semiconductor laser module packaging." Journal of Lightwave Technology 18, no. 6 (June 2000): 842–48. http://dx.doi.org/10.1109/50.848395.
Повний текст джерелаVertiy, A. A., I. V. Ivanchenko, N. A. Popenko, S. I. Tarapov, and V. P. Shestopalov. "High frequency module and semiconductor research in low-temperature range." International Journal of Infrared and Millimeter Waves 12, no. 10 (October 1991): 1195–203. http://dx.doi.org/10.1007/bf01008562.
Повний текст джерелаMatsumori, Tadayoshi, Atsushi Kawamoto, and Tsuguo Kondoh. "Topology optimization for thermal stress reduction in power semiconductor module." Structural and Multidisciplinary Optimization 60, no. 6 (August 2, 2019): 2615–20. http://dx.doi.org/10.1007/s00158-019-02341-4.
Повний текст джерелаGiaretto, Valter, and Elena Campagnoli. "The Elusive Thomson Effect in Thermoelectric Devices. Experimental Investigation from 363 K to 213 K on Various Peltier Modules." Metals 10, no. 2 (February 23, 2020): 291. http://dx.doi.org/10.3390/met10020291.
Повний текст джерелаOSONE, Yasuo, Norio NAKAZATO, Yasunari UMEMOTO, and Mikio NEGISHI. "Thermal Design of Power Semiconductor Modules for Mobile Communication System (Numerical Estimation of Module Thermal Resistance)." Transactions of the Japan Society of Mechanical Engineers Series B 71, no. 708 (2005): 2139–46. http://dx.doi.org/10.1299/kikaib.71.2139.
Повний текст джерелаShin, Woo, Suk Ko, Hyung Song, Young Ju, Hye Hwang, and Gi Kang. "Origin of Bypass Diode Fault in c-Si Photovoltaic Modules: Leakage Current under High Surrounding Temperature." Energies 11, no. 9 (September 12, 2018): 2416. http://dx.doi.org/10.3390/en11092416.
Повний текст джерелаGadzhieva, S. M., T. A. Chelushkina, D. S. Gadzhiev, P. S. Magomedova, and I. M. Kurbanov. "Precision thermoelectric semiconductor sensor." Herald of Dagestan State Technical University. Technical Sciences 48, no. 4 (February 9, 2022): 6–15. http://dx.doi.org/10.21822/2073-6185-2021-48-4-6-15.
Повний текст джерелаAlizadeh, Rana, Kaoru Uema Porter, Tom Cannon, and Simon S. Ang. "Fabrication of Ceramic Interposers for Module Packaging." Journal of Microelectronics and Electronic Packaging 17, no. 2 (April 1, 2020): 67–72. http://dx.doi.org/10.4071/imaps.1114553.
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