Добірка наукової літератури з теми "SEMI-CONDUCTORS CHIPS"

Abstract Flexible Hybrid Electronics (FHE) can be described as thinned, flexible silicon chips packaged on flexible circuit board (FCB) with printed conductors and passives. The flexibility of ICs can be achieved only if the thickness of the silicon is reduced to 50μm or less. The bend testing of the ultra-thin dies is a critical issue in the FHE technology as it allows to establish the fundamental relationships between the die flexural strength, die geometry, and the methods for thinning and dicing the silicon. The conventional bend tests are not adequate for testing ultra-thin dies. Presented is a semi-empirical test method, which allows for the estimation of the flexural strength of the highly compliant ultra-thin dies. The limiting Radius of Curvature (RoC) is an important parameter for the FHE device since it accounts for the bending characteristics of the entire FHE device, not only the IC. Presented is a simple analytical approach that allows to estimate the minimum RoC for an FHE assembly.

<p>With a rapid growth in semiconductor Industry, complex applications are being implemented using small size chips, with the use of Complementary Metal Oxide Semi-Conductors (CMOS). With the introduction of new Integrated Circuit (IC) technology, the speed of the circuits has been increased by around 30%. But it was observed that for every two years, the power dissipation of a circuit doubles. The main reason for this power dissipation is leakage currents in the circuit. To reduce these leakage currents, we can reduce the width of the device. In addition to this, we can use lector techniques that use Leakage Control Transistors (LCT) and High Threshold Leakage Control Transistors(HTLCT). In this paper, we present a circuit technique that uses 130 nano-meter CMOS VLSI circuits that use two extra transistors to mitigate the leakage currents. The estimation of power and delay will be discussed using LCT’s and HTLCT’s</p>

Abstract With a rapid growth in semiconductor Industry, complex applications are being implemented using small size chips, with the use of Complementary Metal Oxide Semi-Conductors (CMOS). With the introduction of new Integrated Circuit (IC) technology, the speed of the circuits has been increased by around 30%. But it was observed that for every two years, the power dissipation of a circuit doubles. The main reason for this power dissipation is leakage currents in the circuit. To reduce these leakage currents, we can reduce the width of the device. In addition to this, we can use lector techniques that use Leakage Control Transistors (LCT) and High Threshold Leakage Control Transistors (HTLCT).In this paper; we present a circuit technique that uses 130 nano-meter CMOS VLSI circuits that use two extra transistors to mitigate the leakage currents. The proposed technique overcomes the limitations posed by the existing methods for leakage reductions an average leakage reductions is 82.5%.The estimation of power and delay will be discussed using LCT’s and HTLCT’s.

During the Covid-19 pandemic period the tiny particles - the microchips proved to be in high demand by various industries – from IT to the production of simple consumer goods. Main objective of this analysis is to explain the reasons for the shortage of chips and semi-conductors for the automotive industry as the auto maker resumed their activities after the lock downs. Haltering of orders by the major auto producer and rerouting of chip production towards supplies for the electronic industry which proved willing to pay more are the main reasons. Trade specialization and globalization which are endemic for the contemporary world economy do not help to restore the broken supply-demand equilibrium of microchips.

In today’s world, high quality product are need of the time. The low-quality product results in the high cost. This can be explained from the quality graph below 1) Prevention cost can be define as the issue/bugs found out before the deployment/delivered to customer. This cost is initially very low but in the longer run goes up 2) Failure cost includes cost of losing customers, Root cause analysis and rectification. This cost is defiantly very huge Figure 11 : Cost of Quality Source: https://www.researchgate.net/ 5 If there can be any mechanism that can help to identify the expected issues in the prevention cost then the overall all cost of quality can be reduce as shown in below graph Figure 12 : Modified Cost of Quality Source: https://www.researchgate.net/ Electronic and Design Automation (EDA) Industry is backbone of Semiconductor Industry as it provide software tool aiding in the development of Semi-Conductors chips. EDA tools are from specification to the foundry input. Below figure shows mapping of Chip design verification and currently available tools technologies Modified prevention cost Modified TCQ 6 Figure 13 : Tools offered by EDA Industry Sourced: https://en.wikipedia.org/wiki/Electronic_design_automation Term tape out means the chip out of foundry and ready for use in electronic circuit. Re- spin means incident post Tape-out chips does not function as required and re-build is required. Cost of the tape out is minimum 5 million of dollars. Major re-spin reason is functionality issues, therefore function verification tools delivered by EDA needs to be always of high quality. A major problem faced by the Functional verification tool R&D team is to predict the numbers of the bugs that might have been introduced during the design phase to sign off the completeness and quality. If these bugs can be predicted, then the COQ can be reduced. Hence saving million of dollar to company and customer. Machine learning, a upcoming new discipline, define scientific study of algorithm and using computing power develop prediction model so that certainty of the task can be managed. In this project, prediction model for expected bugs during the development of the software is designed to help the Product manager to get confidence on quality. For the data, explanatory research and Interview was conducted with-in the Synopsys. This project has been successfully adopted with-in the Verification IP group of EDA leader and is in process to get it implemented in all different Business Units.

Abstract The present paper deals with physics based computational modeling of the wiresaw Free Abrasive Machining (FAM). The wiresaw is used to slice large diameter wafers of predominantly brittle semi-conductors such as silicon. The wiresawing model proposed in the present paper involves cutting action by ‘floating’ abrasives. It is proposed that the abrasive carrying slurry forms a film in the cutting zone by an elasto-hydrodynamic action. Finite Element Analysis shows this film to be in general thicker than the average abrasive size. This signifies a ‘float’ machining condition, wherein there is no direct pressing of abrasives by the wire. Typical rolling and indenting of abrasives under such free body abrasion environment is supported by hydrodynamic shear and pressure respectively. The abrasive is assumed to remove material by typical indentation fracture. Finite element analysis of stresses underneath an indenting abrasive shows that cracks leading to chipping occur only during unloading of indented abrasives (during rolling). The volume of the chip removed in a single indentation is proportional to the volume of plastic zone underneath the indenter. We integrate the elasto-hydrodynamic model and the single abrasive indentation model into a complete representative model of wiresawing.