Добірка наукової літератури з теми "Room temperature assembly"
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Статті в журналах з теми "Room temperature assembly"
Peng, Lin Fa, Dian Kai Qiu, Pei Yun Yi, and Xin Min Lai. "Investigation of Thermal Influence on the Assembly of Polymer Electrolyte Membrane Fuel Cell Stacks." Advanced Materials Research 512-515 (May 2012): 1509–14. http://dx.doi.org/10.4028/www.scientific.net/amr.512-515.1509.
Повний текст джерелаDeng, Yuchen, Peng Li, Jiatong Li, Daolai Sun, and Huanrong Li. "Color-Tunable Aqueous Room-Temperature Phosphorescence Supramolecular Assembly." ACS Applied Materials & Interfaces 13, no. 12 (March 22, 2021): 14407–16. http://dx.doi.org/10.1021/acsami.1c01174.
Повний текст джерелаChen, Jian, and Wayne A. Weimer. "Room-Temperature Assembly of Directional Carbon Nanotube Strings." Journal of the American Chemical Society 124, no. 5 (February 2002): 758–59. http://dx.doi.org/10.1021/ja017384t.
Повний текст джерелаDubey, V., E. Beyne, J. Derakhshandeh, and I. De Wolf. "Physics of self-aligned assembly at room temperature." Physics of Fluids 30, no. 1 (January 2018): 012001. http://dx.doi.org/10.1063/1.5004797.
Повний текст джерелаYang, Lu-feng, De-qing Chu, Hui-lou Sun, and Ge Ge. "Room temperature synthesis of flower-like CaCO3 architectures." New Journal of Chemistry 40, no. 1 (2016): 571–77. http://dx.doi.org/10.1039/c5nj02141c.
Повний текст джерелаMatteau, Jacques. "NanoBond® Assembly – A Rapid, Room Temperature Soldering Process." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000521–26. http://dx.doi.org/10.4071/isom-2011-wa2-paper5.
Повний текст джерелаToda, Kenji, Hiroki Sato, Akira Sugawara, Saori Tokuoka, Kazuyoshi Uematsu, and Mineo Sato. "Self-Assembly of Perovskite Nanosheet Colloid at Room Temperature." Key Engineering Materials 301 (January 2006): 227–30. http://dx.doi.org/10.4028/www.scientific.net/kem.301.227.
Повний текст джерелаRamanath, G., J. D'Arcy-Gall, T. Maddanimath, A. V. Ellis, P. G. Ganesan, R. Goswami, A. Kumar, and K. Vijayamohanan. "Templateless Room-Temperature Assembly of Nanowire Networks from Nanoparticles." Langmuir 20, no. 13 (June 2004): 5583–87. http://dx.doi.org/10.1021/la0497649.
Повний текст джерелаHuang, Ling-Yuang, Eric W. Bohannan, Chen-Jen Hung, and Jay A. Switzer. "Room-Temperature Electrochemical Assembly of Copper/Cuprous Oxide Nanocomposites." Israel Journal of Chemistry 37, no. 2-3 (1997): 297–301. http://dx.doi.org/10.1002/ijch.199700034.
Повний текст джерелаLi, Jiazhuo, Ying Wang, Xiaoming Jiang, and Peng Wu. "An aqueous room-temperature phosphorescent probe for Gd3+." Chemical Communications 58, no. 16 (2022): 2686–89. http://dx.doi.org/10.1039/d1cc06229h.
Повний текст джерелаДисертації з теми "Room temperature assembly"
Klee, Andreas [Verfasser], Michael [Akademischer Betreuer] Gradzielski, and Werner [Akademischer Betreuer] Kunz. "Surfactant self-assembly in a magnetic room temperature ionic liquid / Andreas Klee. Gutachter: Michael Gradzielski ; Werner Kunz. Betreuer: Michael Gradzielski." Berlin : Technische Universität Berlin, 2015. http://d-nb.info/1073201635/34.
Повний текст джерелаDesbordes, Cloé. "Étude du contact mécanique et électrique réalisé par hybridation de micro-tubes oxyde et de nano-inserts." Electronic Thesis or Diss., Paris, HESAM, 2024. http://www.theses.fr/2024HESAE017.
Повний текст джерелаFlip chip assembly of fine pixel pitch photonic components, which are particularly sensitive because they are made of heterogeneous materials, encounters several technological issues linked to the use of traditional process including temperature (thermocompression, soldering, etc.). Assembly by insertion at room temperature using interconnections whose manufacture is compatible with traditional foundry processes, therefore proves to be a suitable solution to these problems. The aim of this PhD thesis is to develop this assembly process by implementing and optimising two innovative interconnection technologies: oxide microtubes and nanoinserts. To this end, the assembly of 10 µm pitch oxide microtubes and their electrical conductivity in service were modelled using finite elements. Experiments relating both assembly force and electrical resistance to the insertion depth of the interconnections made it possible to validate the simulated results. The design of the interconnections was then optimised numerically in order to of improve their performance. The models also highlight the benefit of developing nanoinserts with specific dimensions. They were successfully manufactured at pitches ranging from 10 µm to 2 µm
Wang, Yanbin. "Electric Field Modulation of Near Infrared Absorption at Room Temperature in Electrochemically Self Assembled Quantum Dots." VCU Scholars Compass, 2006. http://scholarscompass.vcu.edu/etd_retro/3.
Повний текст джерелаABDI, AMENSISA B. "Probing Electronic and Vibronic States in CdTe Self-Assembled Quantum Dots and CdS Nanowires using Room Temperature Resonant Raman Scattering." University of Cincinnati / OhioLINK, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1155833636.
Повний текст джерелаBhattacharjee, Subham. "Design, Synthesis and Applications of Novel Two-Component Gels and Soft-Nanocomposites." Thesis, 2014. http://etd.iisc.ac.in/handle/2005/2981.
Повний текст джерелаBhattacharjee, Subham. "Design, Synthesis and Applications of Novel Two-Component Gels and Soft-Nanocomposites." Thesis, 2014. http://etd.iisc.ernet.in/handle/2005/2981.
Повний текст джерелаЧастини книг з теми "Room temperature assembly"
Toda, Kenji, Hiroki Sato, Akira Sugawara, Saori Tokuoka, Kazuyoshi Uematsu, and Mineo Sato. "Self-Assembly of Perovskite Nanosheet Colloid at Room Temperature." In Electroceramics in Japan VIII, 227–30. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-982-2.227.
Повний текст джерелаSakai, Kenichi, Takeshi Misono, Masahiko Abe, and Hideki Sakai. "Self-Assembly of Nonionic Surfactants in Room-Temperature Ionic Liquids." In Ionic Liquid-Based Surfactant Science, 47–62. Hoboken, NJ: John Wiley & Sons, Inc, 2015. http://dx.doi.org/10.1002/9781118854501.ch3.
Повний текст джерелаToda, Kenji, Akira Sugawara, Kazuyoshi Uematsu, Mineo Sato, and Minoru Osada. "Self Assemble Synthesis of Potassium Niobate at Room Temperature." In Electroceramics in Japan IX, 7–10. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-411-1.7.
Повний текст джерела"Self-Assembly and Biomimetics." In Nanoscopic Materials: Size-Dependent Phenomena and Growth Principles, 296–326. 2nd ed. The Royal Society of Chemistry, 2014. http://dx.doi.org/10.1039/bk9781849739078-00296.
Повний текст джерела"Bulk and Interface." In Nanoscopic Materials: Size-Dependent Phenomena and Growth Principles, 7–25. 2nd ed. The Royal Society of Chemistry, 2014. http://dx.doi.org/10.1039/bk9781849739078-00007.
Повний текст джерелаTaber, Douglass F. "The Nakada Synthesis of (-)-FR182877." In Organic Synthesis. Oxford University Press, 2013. http://dx.doi.org/10.1093/oso/9780199965724.003.0084.
Повний текст джерелаTaber, Douglass F. "The Nicolaou/Li Synthesis of Tubingensin A." In Organic Synthesis. Oxford University Press, 2015. http://dx.doi.org/10.1093/oso/9780190200794.003.0095.
Повний текст джерелаNitzan, Abraham. "Chemical Reactions In Condensed Phases." In Chemical Dynamics in Condensed Phases. Oxford University Press, 2006. http://dx.doi.org/10.1093/oso/9780198529798.003.0021.
Повний текст джерелаТези доповідей конференцій з теми "Room temperature assembly"
Teh, Weng Hong, Leong Tee Koh, Shou Mian Chen, Joseph Xie, Chao Yong Li, and Pang Dow Foo. "Investigation of near-room-temperature self-annealing of electrochemical-deposited (ECD) blanket copper films." In International Symposium on Microelectronics and Assembly, edited by H. Barry Harrison, Andrew T. S. Wee, and Subhash Gupta. SPIE, 2000. http://dx.doi.org/10.1117/12.405382.
Повний текст джерелаCanning, John, Lachlan Lindoy, George Huyang, Masood Naqshbandi, Kevin Cook, Maxwell J. Crossley, Yanhua Luo, et al. "Room temperature self-assembly of silica nanoparticle layers on optical fibres." In Workshop on Specialty Optical Fibers and their Applications. Washington, D.C.: OSA, 2013. http://dx.doi.org/10.1364/wsof.2013.f2.3.
Повний текст джерелаMatthias, Thorsten, Gunter Pauzenberger, Juergen Burggraf, Daniel Burgstaller, and Paul Lindner. "Room temperature debonding — An enabling technology for TSV and 3D integration." In 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2012. http://dx.doi.org/10.1109/impact.2012.6420231.
Повний текст джерелаJie An Lin and Chih Chen. "Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature." In 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2012. http://dx.doi.org/10.1109/impact.2012.6420297.
Повний текст джерелаCanning, John, Lachlan Lindoy, George Huyang, Masood Naqshbandi, Kevin Cook, Maxwell J. Crossley, Yanhua Luo, Gang-Ding Peng, Lars Glavind, and Martin Kristensen. "Exploring the room temperature self-assembly of silica nanoparticle layers on optical fibres." In Fourth International Conference on Smart Materials and Nanotechnology in Engineering, edited by Jayantha A. Epaarachchi, Alan Kin-tak Lau, and Jinsong Leng. SPIE, 2013. http://dx.doi.org/10.1117/12.2027934.
Повний текст джерелаOh, S. J. "Room-Temperature Fabrication of High-Resolution Carbon Nanotube Field-Emission Cathodes by Self-Assembly." In MOLECULAR NANOSTRUCTURES: XVII International Winterschool Euroconference on Electronic Properties of Novel Materials. AIP, 2003. http://dx.doi.org/10.1063/1.1628089.
Повний текст джерелаRosidian, Aprillya, Yanjing Liu, and Richard O. Claus. "Formation of ultrahard metal oxide nanocluster coatings at room temperature by electrostatic self-assembly." In 1999 Symposium on Smart Structures and Materials, edited by Manfred R. Wuttig. SPIE, 1999. http://dx.doi.org/10.1117/12.352784.
Повний текст джерелаROUSTAIE, F., S. QUEDNAU, F. DASSINGER, and O. BIRLEM. "Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing." In 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2020. http://dx.doi.org/10.1109/impact50485.2020.9268570.
Повний текст джерелаFan, S. Q., C. J. Li, G. J. Yang, L. Z. Zhang, J. C. Gao, and Y. X. Xi. "Fabrication of Nano-TiO2 Coating for Dye-sensitized Solar Cell by Vacuum Cold Spraying at Room Temperature." In ITSC2007, edited by B. R. Marple, M. M. Hyland, Y. C. Lau, C. J. Li, R. S. Lima, and G. Montavon. ASM International, 2007. http://dx.doi.org/10.31399/asm.cp.itsc2007p0683.
Повний текст джерелаBrowning, C. A., C. Young, R. Thurber, M. Liesenfelt, J. P. Hayward, J. Preston, and M. Cooper. "Design and Assembly of High Resolution Fast-Neutron Radiography Panel." In 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD). IEEE, 2023. http://dx.doi.org/10.1109/nssmicrtsd49126.2023.10337924.
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