Добірка наукової літератури з теми "Robustesse de composants"
Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями
Зміст
Ознайомтеся зі списками актуальних статей, книг, дисертацій, тез та інших наукових джерел на тему "Robustesse de composants".
Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.
Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.
Статті в журналах з теми "Robustesse de composants"
FRIGGENS, N. C., D. SAUVANT, and O. MARTIN. "Vers des définitions opérationnelles de la robustesse s’appuyant sur des faits biologiques. L’exemple de la nutrition." INRAE Productions Animales 23, no. 1 (February 8, 2010): 43–52. http://dx.doi.org/10.20870/productions-animales.2010.23.1.3284.
Повний текст джерелаBouchafa, Samia. "Décision cumulative pour la vision dynamique des systèmes." Revue Française de Photogrammétrie et de Télédétection, no. 202 (April 16, 2014): 2–26. http://dx.doi.org/10.52638/rfpt.2013.48.
Повний текст джерелаSilva, Julio Carlos Bittencourt Viega, Claire Lamine, and Alfio Brandenburg. "Dossier : Perspectives franco-brésiliennes autour de l’agroécologie – Le rôle de l’écoformation dans les processus d’écologisation : le cas de l’agriculture familiale au Paraná (Brésil)." Natures Sciences Sociétés 27, no. 1 (January 2019): 39–52. http://dx.doi.org/10.1051/nss/2019016.
Повний текст джерелаDjellouli, F., A. Bouanani, and K. Baba-Hamed. "Caractérisation de la sécheresse et du comportement hydrologique au niveau du bassin versant de l’oued Louza (Algérie occidentale)." Techniques Sciences Méthodes, no. 6 (June 2019): 23–34. http://dx.doi.org/10.1051/tsm/201906023.
Повний текст джерелаSanté, V., X. Fernandez, G. Monin, and J. P. Renou. "Nouvelles méthodes de mesure de la qualité des viandes de volaille." INRAE Productions Animales 14, no. 4 (August 17, 2001): 247–54. http://dx.doi.org/10.20870/productions-animales.2001.14.4.3747.
Повний текст джерелаPHOCAS, F., J. AGABRIEL, M. DUPONT-NIVET, J. GEURDEN, F. MÉDALE, S. MIGNON-GRASTEAU, H. GILBERT, and J. Y. DOURMAD. "Le phénotypage de l’efficacité alimentaire et de ses composantes, une nécessité pour accroître l’efficience des productions animales." INRAE Productions Animales 27, no. 3 (August 28, 2014): 235–48. http://dx.doi.org/10.20870/productions-animales.2014.27.3.3070.
Повний текст джерелаZahm, Frédéric, Adeline Alonso Ugaglia, Jean-Marc Barbier, Héloïse Boureau, Bernard Del’homme, Mohamed Gafsi, Pierre Gasselin, et al. "Évaluer la durabilité des exploitations agricoles. La méthode IDEA v4, un cadre conceptuel combinant dimensions et propriétés de la durabilité." Cahiers Agricultures 28 (2019): 5. http://dx.doi.org/10.1051/cagri/2019004.
Повний текст джерелаSAUVANT, Daniel. "Modélisation de l'efficience et de la robustesse chez les ruminants, le point de vue nutritionnel." INRAE Productions Animales 33, no. 1 (March 13, 2020). http://dx.doi.org/10.20870/productions-animales.2020.33.1.3128.
Повний текст джерелаДисертації з теми "Robustesse de composants"
Huang, He. "Développement de modèles prédictifs pour la robustesse électromagnétique des composants électroniques." Thesis, Toulouse, INSA, 2015. http://www.theses.fr/2015ISAT0036/document.
Повний текст джерелаOne important objective of the electromagnetic compatibility (EMC) studies is to make the products compliant with the EMC requirement of the customers or the standards. However, all the EMC compliance verifications are applied before the delivery of final products. So we might have some new questions about the EMC performance during their lifetime. Will the product still be EMC compliant in several years? Can a product keep the same EMC performance during its whole lifetime? If not, how long the EMC compliance can be maintained? The study of the long-term EMC level, which is called “electromagnetic robustness”, appeared in the recent years. Past works showed that the degradation caused by aging could induce failures of electronic system, including a harmful evolution of electromagnetic compatibility. In this study, the long-term evolution of the EMC levels of two electronic component groups has been studied. The first electronic component type is the integrated circuit. The high-frequency currents and voltages during the switching activities of ICs are responsible for unintentional emissions or coupling. Besides, ICs are also very often the victim of electromagnetic interference. Another group of components is the passive component. In an electronic system, the IC components usually work together with the passive components at PCB level. The functions of passive components in an electronic system, such as filtering and decoupling, also have an important influence on the EMC levels.In order to analyze the long-term evolution of the EMC level of the electronic components, the study in this thesis tends to propose general predictive methods for the electromagnetic compatibility levels of electronic components which evolve with time
Guilhaume, Agnès. "Evaluation de la robustesse de circuits intégrés vis-à-vis des décharges électrostatiques." Lyon, INSA, 2002. http://theses.insa-lyon.fr/publication/2002ISAL0044/these.pdf.
Повний текст джерелаThe aim of this dissertation is to define criteria to select proper devices to withstand ElectroStatic Discharges (ESD). The industrial tests (HBM, MM) do not take into account the dynamic behaviour of devices and the users of electronic components are puzzled by the variety of new ESD tests (TLP, CDM…). A methodical approach, allying experimental characterisations and physical simulations, was thus presented and validated. It was applied to elementary structures of ESD protection (GGNMOS, SCR, LVTSCR) built either with the same technology or with different technologies (micronic and submicronic). We were then able to compare the current-voltage characteristics and the physical behaviour of those devices. This work gives data on the impact of the process evolutions on the ESD ruggedness and on the most useful ESD tests. It also helps to define pieces of advice dedicated to users of components and related to the choice of highly protected devices
Guilhaume, Agnès Chante Jean-Pierre. "Evaluation de la robustesse de circuits intégrés vis-à-vis des décharges électrostatiques." [S.l.] : [s.n.], 2002. http://csidoc.insa-lyon.fr/these/2002/guilhaume/index.html.
Повний текст джерелаRollet, Antoine. "Test de robustesse des systèmes temps-réel." Reims, 2004. http://theses.univ-reims.fr/exl-doc/GED00000108.pdf.
Повний текст джерелаNowadays, real-time systems are getting more an more complex and take often care of human lifes or sensitive systems. Therefore, such systems have to be validated before beeing used. This document deals with robustness testing, especially for real-time and component based systems. Firstly, we present a robustness testing method for real-time systems, considering two specifications given in the timed automata model : a nominal one and a degraded one. We provoque an unexpected situation for the system by adding some hazards in the test sequences. Secondly, we expose an architecture an a test execution algorithm for real-time component based systems. Thirdly, we present our tool for sequence generation
Chibani, Kais. "Analyse de robustesse de systèmes intégrés numériques." Thesis, Université Grenoble Alpes (ComUE), 2016. http://www.theses.fr/2016GREAT080/document.
Повний текст джерелаIntegrated circuits are not immune to natural or malicious interferences that may cause transient faults which lead to errors (soft errors) and potentially to wrong behavior. This must be mastered particularly in the case of critical systems which impose safety and/or security constraints. To optimize protection strategies of such systems, it is essential to identify the most critical elements. The assessment of the criticality of each block allows limiting the protection to the most sensitive blocks. This thesis aims at proposing approaches in order to analyze, early in the design flow, the robustness of a digital system. The key criterion used is the lifetime of data stored in the registers for a given application. In the case of microprocessor-based systems, an analytical approach has been developed and validated on a SparcV8 microprocessor (LEON3). This approach is based on a new methodology to refine assessments of registers criticality. Then a more generic and complementary approach was implemented to compute the criticality of all flip-flops from a synthesizable description. The tool implementing this approach was tested on significant systems such as hardware crypto accelerators and a hardware/software system based on the LEON3 processor. Fault injection campaigns have validated the two approaches proposed in this thesis. In addition, these approaches are characterized by their generality, their efficiency in terms of accuracy and speed and a low-cost implementation. Another benefit is also their ability to re-use the functional verification environments
Chihani, Omar. "Etude de la fiabilité de composants GaN en conversion d'énergie." Thesis, Bordeaux, 2018. http://www.theses.fr/2018BORD0148/document.
Повний текст джерелаThe aeronautical and terrestrial transport industries know a steady increase in the electrification of their functions. In fact, the mechanical or hydraulic actuators are gradually replaced by electric ones.The components dominating the market today seem unable to follow the trend anymore. In fact, silicon-based power components still prevail in the current market, thanks to their low cost. However, this material begins to reach its theoretical limits in terms of performance. In this context, different wide bandgap semiconductor structures are emerging to take on from silicon.The aim of this study is to assess the reliability of power transistors based on Gallium Nitride. These components are very promising for medium power applications. However, the failure mechanisms of these components are not yet sufficiently studied. The study consists in the application of aging tests combining thermal and electrical stresses. These agings are carried out under different conditions of tension and temperature. The objective of this method is, firstly, to isolate the effect of each stressor on the state of the components, and secondly, to identify the failure mechanisms activated according to the aging conditions.This work made it possible to identify the existence of different failure mechanisms that can be activated according to the aging conditions. Indeed, it has emerged that the aging temperature range used influences the predominance of activated failure mechanisms. The results challenge the adequacy of current qualification standards for Gallium Nitride components. These standards should revise upwards the aging temperatures used to cover ranges closer to the operating temperatures of this kind of components
Lachkar, Chadia. "Fiabilité et robustesse des cartes d alimentations des nouvelles générations des modules RADAR." Thesis, Normandie, 2018. http://www.theses.fr/2018NORMR118/document.
Повний текст джерелаToday, the increasing demands in terms of competitiveness require the design of electronic power systems having a minimal bulk while maintaining a good reliability. The combination of these two features is required at a system level as well as at a component level. It is particularly the case of liquid electrolyte aluminum capacitors, which are widely used as storage tanks forelectrostatic energy. This function is necessary in electronic power systems to provide energy to the different parts with each current draw. According to the literature, the study and the evaluation of the reliability of these systems rely heavily on that of liquid electrolyte aluminum capacitors as well as on other components identified as critical (MOS switching transistors, insulators in transformers, etc.). The first chapter begins with a detailed presentation of the technology of capacitors by indicating the various parameters that characterize them and the different work done in the literary on the study and evaluation of the reliability of these components. In the second chapter, aging tests are developed based on the mission profile of the system. Then, the evolutions of characteristics having a significant degradation are modeled. The third chapter deals with the physico-chemical characterization of the capacitor in order to understand and to explain the failure modes recorded during the aging tests. The last chapter is devoted to performing aging tests on a system which is simulating the heat dissipation of components adjacent to capacitors. Electrical measurements are realized in real time to monitor the voltage at their terminals. Finally, a mechanical stress test is carried out to evaluate the impact of vibrations on the connection of new and aged capacitors
Giraldo, Sandra. "Étude de la robustesse d'amplificateurs embarqués dans des applications portables soumis à des décharges électrostatiques (ESD) au niveau système." Toulouse 3, 2013. http://thesesups.ups-tlse.fr/2189/.
Повний текст джерелаWith improvement in electronic technology shrinking, electronic components are increasingly becoming sensitive to ElectroStatic Discharge (ESD). Nowadays, the reliability of integrated circuits in the manufacturing field are guaranteed by a set of standards that define levels of robustness. Nevertheless the protection strategies implemented in integrated circuits, designed to meet these standards, are not always enough to ensure the robustness of the components in their final application. The new reliability problems are not well understood, given the complexity of the phenomena involved in real systems in operation. Taking into account these facts, we can question the effectiveness of the strategies used to protect against " classical ESD " and system-type stresses. All the work presented in this thesis aims to improve the robustness with respect to these new requirements, in the case study of analog components dedicated to portable applications (telephony, multimedia). Starting from a concrete case, for which there is a large difference in the system ESD robustness between the biased and unbiased product, we will present the various results of analysis (failure analysis, electrical characterization by impulse like TLP VFTLP, SPICE-type simulations) that led us to the proposal of an integrated security solution that meets the requirements
Phulpin, Tanguy. "Contribution à l'analyse des mécanismes de défaillance lors de décharges électrostatiques et de radiations aux ions lourds de composants MESFET en carbure de silicium." Thesis, Toulouse 3, 2017. http://www.theses.fr/2017TOU30049/document.
Повний текст джерелаPower management is nowadays crucial with the global warming and the electronic needs of the society. Wideband gap semi-conductors like Silicon Carbide (SiC) are emerging in power electronic landscape because of their better properties in comparison with Silicon. Nevertheless reliability and knowledge about internal physic during electrostatic discharge (ESD) or radiation event is still missing and need specific studies. In this work, several SiC MESFET have been tested and results show two mains failure mechanism. First the passivation oxide clamping, and secondly the SiC sublimation induced by a parasitic structure in the device. An ESD protection was tested and validated. Unfortunately, this solution isn't efficient for heavy ion protection. Indeed, no impact on the radiation robustness is noticed on the MESFET during a radiation event. SiC ESD reliability doesn't look better than for Silicon devices. ESD robustness improvements are proposed in this work even if integration of this MESFET is still required to validate the improvement
Tran, Duc Anh. "Architecture hybride tolérante aux fautes pour l'amélioration de la robustesse des circuits et systèmes intégrés numériques." Thesis, Montpellier 2, 2012. http://www.theses.fr/2012MON20132/document.
Повний текст джерелаEvolution of CMOS technology consists in continuous downscaling of transistor features sizes, which allows the production of smaller and cheaper integrated circuits with higher performance and lower power consumption. However, each new CMOS technology node is facing reliability problems due to increasing rate of faults and errors. Consequently, fault-tolerance techniques, which employ redundant resources to guarantee correct operations of digital circuits and systems despite the presence of faults, have become essential in digital design. This thesis studies a novel hybrid fault-tolerant architecture for robustness improvement of digital circuits and systems. It targets all kinds of error in combinational part of logic circuits, i.e. hard, SETs and timing errors. Combining information redundancy for error detection, timing redundancy for transient error correction and hardware redundancy for permanent error corrections, the proposed architecture allows significant power consumption saving, while having similar silicon area compared to existing solutions. Furthermore, it can also be used in other applications, such as dealing with aging phenomenon, tolerating faults in pipeline architecture, and being combined with advanced SEUs protection scheme for sequential parts of logic circuits
Книги з теми "Robustesse de composants"
Koudé, Roger K., ed. Discours sur la Paix, la Justice et les Institutions efficaces. Editions des archives contemporaines, 2020. http://dx.doi.org/10.17184/eac.9782813004147.
Повний текст джерела