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Статті в журналах з теми "RF stress and thermic cycling"
Hartner, Walter, Martin Niessner, Francesca Arcioni, Markus Fink, Christian Geissler, Birgit Hebler, Gerhard Haubner, and Maciej Wojnowski. "Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar." Journal of Surface Mount Technology 34, no. 1 (April 6, 2021): 32–39. http://dx.doi.org/10.37665/smt.v34i1.12.
Повний текст джерелаPutaala, Jussi, Olli Salmela, Olli Nousiainen, Tero Kangasvieri, Jouko Vähäkangas, Antti Uusimäki, and Jyrki Lappalainen. "Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications." Soldering & Surface Mount Technology 26, no. 3 (May 27, 2014): 117–28. http://dx.doi.org/10.1108/ssmt-07-2013-0018.
Повний текст джерелаKumbhat, Nitesh, Fuhan Liu, Venky Sundaram, Vivek Sridharan, Abhishek Choudhury, Hunter Chan, and Rao Tummala. "Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First Benefits." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000537–42. http://dx.doi.org/10.4071/isom-2010-wp1-paper1.
Повний текст джерелаRazzaghi, Mohammadreza, Afsar Asghari-azghan, Saeed Montazeri, Zahra Razzaghi, Mohammad Mohsen Mazloomfard, and Reza Vafaee. "Intravaginal Pulsed Contractile Radiofrequency for Stress Urinary Incontinence Treatment; A Safety Study." Journal of Lasers in Medical Sciences 12, no. 1 (October 9, 2021): e56-e56. http://dx.doi.org/10.34172/jlms.2021.56.
Повний текст джерелаHarzer, Carla Sophie, Roberta Karla Francesca Della Bella, and Hubert Andreas Gasteiger. "Cathode Loading Impact on PEM Fuel Cell Performance Losses in Voltage Cycling Based Accelerated Stress Tests." ECS Meeting Abstracts MA2023-02, no. 37 (December 22, 2023): 1775. http://dx.doi.org/10.1149/ma2023-02371775mtgabs.
Повний текст джерелаAstudillo, Leonardo Isaias, Roberta Karla Francesca Della Bella, Hubert Andreas Gasteiger, Carla Sophie Harzer, Franziska Carmen Hnyk, Timon Lazaridis, and Christopher Warsch. "Accelerated Stress Tests to Project PEM Fuel Cell Durability." ECS Meeting Abstracts MA2023-02, no. 43 (December 22, 2023): 2164. http://dx.doi.org/10.1149/ma2023-02432164mtgabs.
Повний текст джерелаDella Bella, Roberta Karla Francesca, Björn Marcel Stühmeier, and Hubert Andreas Gasteiger. "Universal Correlation between the Roughness Factor and PEMFC Performance Losses in Voltage Cycling Based Accelerated Stress Tests." ECS Meeting Abstracts MA2022-01, no. 35 (July 7, 2022): 1427. http://dx.doi.org/10.1149/ma2022-01351427mtgabs.
Повний текст джерелаBergoli, César Dalmolin, Rodrigo Furtado de Carvalho, Ivan Balducci, Josete Barbosa Cruz Meira, Maria Amélia Máximo de Araújo, and Marcia Carneiro Valera. "Influence of Fiber Post Cementation Length on Coronal Microleakage Values in vitro and Finite Element Analysis." Journal of Contemporary Dental Practice 15, no. 4 (2014): 444–50. http://dx.doi.org/10.5005/jp-journals-10024-1560.
Повний текст джерелаDella Bella, Roberta Karla Francesca, Björn Marcel Stühmeier, and Hubert Gasteiger. "Universal Correlation between Cathode Roughness Factor and H2/Air Performance Losses in Voltage Cycling-Based Accelerated Stress Tests." Journal of The Electrochemical Society, April 15, 2022. http://dx.doi.org/10.1149/1945-7111/ac67b8.
Повний текст джерелаBehera, Subhashree, Swathi Ippili, Venkatraju Jella, Na‐Yeong Kim, Seong Cheol Jang, Ji‐Won Jung, Soon‐Gil Yoon, and Hyun‐Suk Kim. "Confluence of ZnO and PTFE Binder for Enhancing Performance of Thin‐Film Lithium‐Ion Batteries." ENERGY & ENVIRONMENTAL MATERIALS, March 20, 2024. http://dx.doi.org/10.1002/eem2.12734.
Повний текст джерелаДисертації з теми "RF stress and thermic cycling"
Pinault, Bastien. "Évaluation de topologies d'amplificateurs faible bruit et robustes en filière GaN pour applications radar ou télécom en bande X." Electronic Thesis or Diss., Université de Toulouse (2023-....), 2024. http://www.theses.fr/2024TLSES070.
Повний текст джерелаIn order to increase telecommunication data rates and enhance the precision and range of modern radar systems, improving the noise factor of a communication link has become crucial. As demonstrated by the FRIIS formula, the noise factor of a reception architecture is mainly determined by the noise factor of the first stage. It is, therefore, necessary to place a low-noise amplifier (LNA) upstream of the first stage. LNAs may face electromagnetic (EM) aggressions that can degrade or even render the system inoperative, depending on the intended application. Hence, it is essential to design LNAs that are robust against these EM aggressions. Due to their intrinsic characteristics (wide bandgap, high breakdown voltage, and good thermal conductivity), gallium nitride (GaN) technologies are excellent candidates for implementing low-noise amplifiers. The natural robustness offered by this material allows for the elimination of protection devices such as power limiters used in GaAs or SiGe technologies. Modern system constraints compel them to maintain their characteristics even when subjected to EM aggressions. Low-noise amplifier topologies must, therefore, meet the dual objective of high detectivity (low HF noise factor) and high linearity (high power) at usage frequencies. To increase the linearity of an LNA, one strategy involves oversizing the transistor (physical or electrical dimensions larger than those necessary for optimal noise factor). This approach improves nonlinear performance at the expense of noise parameters and/or small signals. This thesis proposes a novel approach that simultaneously exploits the nonlinear characteristics of an LNA design initially optimized for noise parameters by enhancing the nonlinear behavior of the active element through a change in its operating point. A comparative study and a broader state-of-the-art analysis position our solution within the spectrum of possibilities for achieving a low-noise and robust system
Peretti, Vanni. "Development of reliable RF-MEMS switches for antennas and space applications." Doctoral thesis, Università degli studi di Padova, 2008. http://hdl.handle.net/11577/3425657.
Повний текст джерелаGli switchMicro-Elettro Meccanici per Radio Frequenza (RF-MEMS) sono tra i dispositivi più promettenti per le future generazioni di network riconfigurabili ad alta frequenza e basso consumo di potenza. Vi sono applicazioni RF in cui un singolo dispositivo MEMS può sostituire e migliorare in termini di prestazioni un intero circuito a stato solido; in altri campi invece, un opportuno connubio fra tecnologia MEMS e dispositivi attivi può portare alla nascita di sistemi di comunicazioni estremamente brillanti e performanti. Infatti, i dispositivi MEMS hanno in loro le potenzialità per sorpassare i limiti delle attuali tecnologie impiegate basate su circuiti integrati. Tuttavia, la mancanza di maturità di una tecnologia così innovativa porta con sé inevitabili problemi affidabilistici. L’obbiettivo di questa tesi è di analizzare l’aspetto affidabilistico degli switch RF MEMS, cominciando da metodi comuni di caratterizzazione e stress, come la caratterizzazione DC e il Cycling stress, fino a test più specifici, come la robustezza a scariche elettrostatiche (ESD) o il monitoraggio di danni indotti da radiazione per la qualificazione dei dispositivi per missioni spaziali.
Тези доповідей конференцій з теми "RF stress and thermic cycling"
Motalab, Mohammad, Munshi Basit, Jeffrey C. Suhling, and Pradeep Lall. "A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73232.
Повний текст джерелаBasit, Munshi, Mohammad Motalab, Jeffrey C. Suhling, and Pradeep Lall. "Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48619.
Повний текст джерелаKhinda, Gurvinder Singh, Ashraf Umar, Ryan J. Cadwell, Mohammed Alhendi, Nancy C. Stoffel, Peter Borgesen, and Mark D. Poliks. "Flexible inkjet-printed Patch antenna array on mesoporous PET substrate for 5G applications with stable RF performance after mechanical stress cycling." In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, 2020. http://dx.doi.org/10.1109/ectc32862.2020.00285.
Повний текст джерелаCunningham, Shawn J., Yvonne Heng, Nabeel Idrisi, Brad Nelson, and John McKillop. "Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73222.
Повний текст джерелаPark, Jun-Hyub, Man Sik Myung, and Yun-Jae Kim. "Specimen Size Effect on Fatigue Properties of Surface-Micromachined Al-3%Ti Thin Films." In 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2007. http://dx.doi.org/10.1115/mnc2007-21280.
Повний текст джерела