Статті в журналах з теми "RF Microelectronics"
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Krstić, D. "RF microelectronics." Microelectronics Journal 29, no. 12 (December 1998): 1041–42. http://dx.doi.org/10.1016/s0026-2692(98)00059-7.
Повний текст джерелаFrear, D. R., and S. Thomas. "Emerging Materials Challenges in Microelectronics Packaging." MRS Bulletin 28, no. 1 (January 2003): 68–74. http://dx.doi.org/10.1557/mrs2003.20.
Повний текст джерелаSpringer, A., and R. Weigel. "RF microelectronics for W-CDMA mobile communication systems." Electronics & Communication Engineering Journal 14, no. 3 (June 1, 2002): 92–100. http://dx.doi.org/10.1049/ecej:20020301.
Повний текст джерелаPutman, Carol, Rachel Cramm Horn, J. Ambrose Wolf, and Daniel Krueger. "Thermodynamic Analysis of Physical Vapor Deposited Inorganic Thin Films on Low Temperature Cofired Ceramic." Journal of Microelectronics and Electronic Packaging 13, no. 3 (July 1, 2016): 95–101. http://dx.doi.org/10.4071/imaps.518.
Повний текст джерелаPutman, Carol, Rachel Cramm Horn, Ambrose Wolf, and Daniel Krueger. "Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000175–82. http://dx.doi.org/10.4071/2016cicmt-tha13.
Повний текст джерелаSettaouti, Lahouaria, and Abderrahmane Settaouti. "A Monte Carlo Method for Low Pressure Radio Frequency Discharges." Sultan Qaboos University Journal for Science [SQUJS] 8, no. 1 (June 1, 2003): 47. http://dx.doi.org/10.24200/squjs.vol8iss1pp47-54.
Повний текст джерелаShorey, Aric, Shelby Nelson, David Levy, and Paul Ballentine. "Thin Glass Handling Solutions for Microelectronics Packaging." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000192–96. http://dx.doi.org/10.4071/2380-4505-2020.1.000192.
Повний текст джерелаYoung, Nathan, Jay Johnson, and Kevin G. Ewsuk. "Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation." Key Engineering Materials 484 (July 2011): 192–203. http://dx.doi.org/10.4028/www.scientific.net/kem.484.192.
Повний текст джерелаTomikawa, Masao, Hitoshi Araki, Yohei Kiuchi, and Akira Shimada. "Photosensitive Polyimide having low loss tangent for RF application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000476–82. http://dx.doi.org/10.4071/2380-4505-2018.1.000476.
Повний текст джерелаGropp, S., M. Fischer, A. Frank, C. Schäffel, J. Müller, and M. Hoffmann. "Fabrication of an RF-MEMS-Switch on a hybrid Si-Ceramic substrate." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000118–21. http://dx.doi.org/10.4071/2016cicmt-wa24.
Повний текст джерелаMarzouk, Jaouad, Steve Arscott, Abdelhatif El Fellahi, Kamel Haddadi, Tuami Lasri, Christophe Boyaval, and Gilles Dambrine. "MEMS probes for on-wafer RF microwave characterization of future microelectronics: design, fabrication and characterization." Journal of Micromechanics and Microengineering 25, no. 7 (June 24, 2015): 075024. http://dx.doi.org/10.1088/0960-1317/25/7/075024.
Повний текст джерелаMustafa, M. K., U. Majeed, and Y. Iqbal. "Effect on Silicon Nitride thin Films Properties at Various Powers of RF Magnetron Sputtering." International Journal of Engineering & Technology 7, no. 4.30 (November 30, 2018): 39. http://dx.doi.org/10.14419/ijet.v7i4.30.22000.
Повний текст джерелаROMBOLÀ, G., V. BALLARINI, A. CHIODONI, L. GOZZELINO, E. MEZZETTI, B. MINETTI, C. F. PIRRI, E. TRESSO, and C. CAMERLINGO. "R.F. SPUTTERING DEPOSITION OF BUFFER LAYERS FOR Si/YBCO INTEGRATED MICROELECTRONICS." International Journal of Modern Physics B 19, no. 31 (December 20, 2005): 4605–17. http://dx.doi.org/10.1142/s0217979205032929.
Повний текст джерелаFu, Meng, Stan Skafidas, and Iven Mareels. "A Novel Delay-Based GFSK Demodulator in 65 nm CMOS for Low Power Biomedical Applications." International Journal of Interdisciplinary Telecommunications and Networking 10, no. 3 (July 2018): 21–32. http://dx.doi.org/10.4018/ijitn.2018070103.
Повний текст джерелаBora, B., H. Bhuyan, M. Favre, E. Wyndham, and H. Chuaqui. "Characterization of Capacitively Coupled Radio-Frequency Argon Plasma by Electrical Circuit Simulation." Applied Mechanics and Materials 110-116 (October 2011): 5373–79. http://dx.doi.org/10.4028/www.scientific.net/amm.110-116.5373.
Повний текст джерелаShorey, Aric, Shelby Nelson, David Levy, and Paul Ballentine. "Thin Glass Substrates with Through-Glass Vias." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000147–51. http://dx.doi.org/10.4071/2380-4505-2019.1.000147.
Повний текст джерелаBernal-Salamanca, Monica, Zorica Konstantinović, Carlos Frontera, Víctor Fuentes, Alberto Pomar, Lluis Balcells, and Benjamín Martínez. "Formation of Nickel Oxide Nanocuboids in Ferromagnetic La2Ni1−xMn1+xO6." Nanomaterials 11, no. 3 (March 21, 2021): 804. http://dx.doi.org/10.3390/nano11030804.
Повний текст джерелаPeterson, Ken A., Daniel S. Krueger, and Charles E. Sandoval. "Selected Applications and Processing for Low Temperature Cofired Ceramic." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000248–53. http://dx.doi.org/10.4071/isom-2010-tp3-paper2.
Повний текст джерелаPeng, Qi Zhen, Ye Ko San, Samuel Khong, Jonathan Sim, Santhiagu Ezhilvalavan, Jan Ma, and Hng Huey Hoon. "Thermoelectric Properties of N-Type Bi2Te2.7Se0.3 and P-Type Bi0.5Sb1.5Te3 Films for Micro-Cooler Applications." Solid State Phenomena 185 (February 2012): 9–11. http://dx.doi.org/10.4028/www.scientific.net/ssp.185.9.
Повний текст джерелаChiriac, Victor Adrian, and Tien-Yu Tom Lee. "Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance." Journal of Electronic Packaging 125, no. 4 (December 1, 2003): 589–96. http://dx.doi.org/10.1115/1.1604804.
Повний текст джерелаOjha, Manish, Yousuf S. Mohamed, Helmut Baumgart, and Abdelmageed Elmustafa. "Magnetron Sputtering Deposition of Lead-Free (SAC) Thin-Film Alloys and Mechanical Characterization Using Nanoindentation." ECS Meeting Abstracts MA2022-02, no. 64 (October 9, 2022): 2357. http://dx.doi.org/10.1149/ma2022-02642357mtgabs.
Повний текст джерелаWang, San-Fu, Yu-Wei Chang, and Chun-Yen Tang. "A Novel Dual-Band Six-Phase Voltage-Control Oscillator." Sensors 18, no. 11 (November 19, 2018): 4025. http://dx.doi.org/10.3390/s18114025.
Повний текст джерелаGoeke, R. S., R. K. Grubbs, D. Yazzie, A. L. Casias, and K. A. Peterson. "Gas Permeation Measurements on Low Temperature Cofired Ceramics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000323–27. http://dx.doi.org/10.4071/cicmt-2012-wa25.
Повний текст джерелаFilipovic, Lado, and Siegfried Selberherr. "Application of Two-Dimensional Materials towards CMOS-Integrated Gas Sensors." Nanomaterials 12, no. 20 (October 18, 2022): 3651. http://dx.doi.org/10.3390/nano12203651.
Повний текст джерелаDas, Rabindra, J. M. Lauffer, and F. D. Egitto. "Versatile Z-Axis Interconnection for High Performance Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001033–50. http://dx.doi.org/10.4071/2013dpc-wa13.
Повний текст джерелаLin, Kuo-Tong, and Jenn-Ming Wu. "Rf-Magnetron Sputtering of Titanium Dioxide for Microelectronic Applications." Japanese Journal of Applied Physics 43, no. 1 (January 13, 2004): 232–36. http://dx.doi.org/10.1143/jjap.43.232.
Повний текст джерелаRajan, S. D., V. Sarihan, and M. Mahalingam. "Methodology for Automated Design of Microelectronic Packages." Journal of Electronic Packaging 116, no. 4 (December 1, 1994): 274–81. http://dx.doi.org/10.1115/1.2905698.
Повний текст джерелаKondaiah, P., Habibuddin Shaik, and G. Mohan Rao. "Studies on RF magnetron sputtered HfO2 thin films for microelectronic applications." Electronic Materials Letters 11, no. 4 (July 2015): 592–600. http://dx.doi.org/10.1007/s13391-015-4490-6.
Повний текст джерелаBhatt, Vivekanand, and Sudhir Chandra. "Silicon dioxide films by RF sputtering for microelectronic and MEMS applications." Journal of Micromechanics and Microengineering 17, no. 5 (April 24, 2007): 1066–77. http://dx.doi.org/10.1088/0960-1317/17/5/029.
Повний текст джерелаCharbonneau, Paul, Hans Ohman, and Marc Fortin. "Solder Joint Reliability Assessment for a High Performance RF Ceramic Package." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000062–67. http://dx.doi.org/10.4071/isom-ta26.
Повний текст джерелаSutanto, Jemmy, D. H. Kang, J. H. Yoon, K. S. Oh, Michael Oh, R. Lanzone, and R. Huemoeller. "CoC (Chip on Chip) or FtoF (Face to Face) - PossumTM Technology for 3D MEMS and ASIC eliminating the need of TSV or Wire Bonding." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 000916–36. http://dx.doi.org/10.4071/2013dpc-tp33.
Повний текст джерелаTseng, K. F., Y. H. Hsion, and B. J. Lwo. "A multifunctional test chip for microelectronic packaging and its application on RF property measurements." International Journal of Electronics 94, no. 6 (June 2007): 633–43. http://dx.doi.org/10.1080/00207210701298305.
Повний текст джерелаNdip, Ivan, Michael Töpper, Kai Löbbicke, Abdurrahman Öz, Stephan Guttowski, Herbert Reichl, and Klaus-Dieter Lang. "Characterization of Interconnects and RF Components on Glass Interposers." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000770–80. http://dx.doi.org/10.4071/isom-2012-wp13.
Повний текст джерелаDONG, C. J., M. XU, W. LU, and Q. Z. HUANG. "GROWTH OF HIGHLY (0002) ORIENTED InN FILMS ON AlInN/AlN BILAYER." Surface Review and Letters 20, no. 02 (April 2013): 1350015. http://dx.doi.org/10.1142/s0218625x13500157.
Повний текст джерелаTrulli, Susan, Craig Armiento, Christopher Laighton, Elicia Harper, Mahdi Haghzadeh, and Alkim Akyurtlu. "Additive Packaging for Microwave Applications." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000768–72. http://dx.doi.org/10.4071/isom-2017-thp53_148.
Повний текст джерелаAndreev, SK, LI Popova, VK Gueorguiev, and EB Manolov. "High-temperature-annealing effects on the electrical properties of RF sputtered SnO2 thin films for microelectronic sensors." Vacuum 47, no. 11 (November 1996): 1325–28. http://dx.doi.org/10.1016/s0042-207x(96)00191-1.
Повний текст джерелаLi, Yonglong, Bingrui Yu, Shengxian Chen, Ming Hu, Xiangwei Zhu, and Xuelin Yuan. "Failure Mechanism of pHEMT in Navigation LNA under UWB EMP." Micromachines 13, no. 12 (December 8, 2022): 2179. http://dx.doi.org/10.3390/mi13122179.
Повний текст джерелаHASSAN, NAJAM UL, ZAHID HUSSAIN, M. NAEEM, ISHFAQ AHMAD SHAH, G. HUSNAIN, ISHAQ AHMAD, and ZAKA ULLAH. "INFLUENCE OF ION BEAM IRRADIATION ON STRUCTURAL, MAGNETIC AND ELECTRICAL CHARACTERISTICS OF Ho-DOPED AlN THIN FILMS." Surface Review and Letters 24, no. 02 (January 30, 2017): 1750021. http://dx.doi.org/10.1142/s0218625x17500214.
Повний текст джерелаTian, W., J. C. Jiang, and X. Q. Pan. "Nonorthogonal Twining in Epitaxial SrRuO3 Thin Films Grown on (001) LaAlO3." Microscopy and Microanalysis 7, S2 (August 2001): 332–33. http://dx.doi.org/10.1017/s1431927600027732.
Повний текст джерелаHess, Dennis W. "(Invited) Surface Modification to Control Wetting and Adhesion of Aqueous Solutions." ECS Meeting Abstracts MA2022-02, no. 30 (October 9, 2022): 1082. http://dx.doi.org/10.1149/ma2022-02301082mtgabs.
Повний текст джерелаAebischer, H. A. "Inductance Formula for Square Spiral Inductors with Rectangular Conductor Cross Section." Advanced Electromagnetics 8, no. 4 (September 10, 2019): 80–88. http://dx.doi.org/10.7716/aem.v8i4.1074.
Повний текст джерелаMednikarov, B. "Deposition and Characterization of Aluminium Nitride (AlN) and Diamond Like Carbon (DLC) Hard Coatings." Solid State Phenomena 159 (January 2010): 63–70. http://dx.doi.org/10.4028/www.scientific.net/ssp.159.63.
Повний текст джерелаArina, Fan Shermin Chow Hui, Banu Abdul Bari Shamira, Ai Lin Chia, Ye Ko San, Samuel Khong, Jonathan Sim, Santhiagu Ezhilvalavan, Jan Ma, and Heng Hui Hoon. "Effect of Sputtering Process Parameters on the Thermoelectric Properties of P and N-Type Bi2Te3 Films." Solid State Phenomena 185 (February 2012): 94–98. http://dx.doi.org/10.4028/www.scientific.net/ssp.185.94.
Повний текст джерелаAebischer, H. A. "Comparative Study of the Accuracy of Analytical Inductance Formulae for Square Planar Spiral Inductors." Advanced Electromagnetics 7, no. 5 (September 19, 2018): 37–48. http://dx.doi.org/10.7716/aem.v7i5.862.
Повний текст джерелаWu, Haibo, Wei Zhang, Shenghan Gao, Tiejun Li, and Bin Liu. "Synthesis of Multiscale Ultrafine Copper Powder via Radio Frequency Induction Coupled Plasma Treatment." Metals 12, no. 3 (March 14, 2022): 490. http://dx.doi.org/10.3390/met12030490.
Повний текст джерелаFlemming, Jeb, Roger Cook, Kevin Dunn, and James Gouker. "Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000791–810. http://dx.doi.org/10.4071/2012dpc-tp12.
Повний текст джерелаPeterson, K. A., K. D. Patel, C. K. Ho, B. R. Rohrer, C. D. Nordquist, B. D. Wroblewski, and K. B. Pfeifer. "LTCC Microsystems and Microsystem Packaging and Integration Applications." Journal of Microelectronics and Electronic Packaging 3, no. 3 (July 1, 2006): 109–20. http://dx.doi.org/10.4071/1551-4897-3.3.109.
Повний текст джерела"Predicting failure in modern microelectronics." Research Features, no. 134 (March 4, 2021). http://dx.doi.org/10.26904/rf-134-158161.
Повний текст джерелаGandhi, S. Girish, I. Govardhani, and M. Venkata Narayana. "An Advanced Real Time Lead RF-MEMS Based Switch Design for AI Applications." International Journal of Integrated Engineering 14, no. 7 (December 31, 2022). http://dx.doi.org/10.30880/ijie.2022.14.07.003.
Повний текст джерелаSavrun, E., M. Sarikaya, A. Luan, and T. Pearsall. "Silicide Metallization of Aluminum Nitride Substrates for High-Temperature Microelectronics." MRS Proceedings 402 (1995). http://dx.doi.org/10.1557/proc-402-561.
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