Статті в журналах з теми "Reliability of metallic interconnects"
Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями
Ознайомтеся з топ-50 статей у журналах для дослідження на тему "Reliability of metallic interconnects".
Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.
Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.
Переглядайте статті в журналах для різних дисциплін та оформлюйте правильно вашу бібліографію.
Zhao, Wen-Sheng, Kai Fu, Da-Wei Wang, Meng Li, Gaofeng Wang, and Wen-Yan Yin. "Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects." Applied Sciences 9, no. 11 (May 28, 2019): 2174. http://dx.doi.org/10.3390/app9112174.
Повний текст джерелаKuruvilla, Nisha, J. P. Raina, Arun Greig John, and A. Athulya. "Performance and Reliability Analysis of Bundled SWCNT as IC Interconnects." Advanced Materials Research 129-131 (August 2010): 920–25. http://dx.doi.org/10.4028/www.scientific.net/amr.129-131.920.
Повний текст джерелаKatkar, Rajesh, Michael Huynh, and Laura Mirkarimi. "Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip Packages." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (January 1, 2011): 002404–23. http://dx.doi.org/10.4071/2011dpc-tha33.
Повний текст джерелаGelatos, A. V., A. Jain, R. Marsh, and C. J. Mogab. "Chemical Vapor Deposition of Copper for Advanced On-Chip Interconnects." MRS Bulletin 19, no. 8 (August 1994): 49–54. http://dx.doi.org/10.1557/s0883769400047734.
Повний текст джерелаSasagawa, K., N. Yamaji, and S. Fukushi. "Threshold Current Density of Electromigration Damage in Angled Polycrystalline Line." Key Engineering Materials 353-358 (September 2007): 2958–61. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2958.
Повний текст джерелаChen, Giin-Shan, Ching-En Lee, Yi-Lung Cheng, Jau-Shiung Fang, Chien-Nan Hsiao, Wei-Chun Chen, Yiu-Hsiang Chang, Yen-Chang Pan, Wei Lee, and Ting-Hsun Su. "Enhancement of Electromigration Reliability of Electroless-Plated Nanoscaled Copper Interconnects by Complete Encapsulation of a 1 nm-Thin Self-Assembled Monolayer." Journal of The Electrochemical Society 169, no. 8 (August 1, 2022): 082519. http://dx.doi.org/10.1149/1945-7111/ac89b8.
Повний текст джерелаXu, Zhijie, Wei Xu, Elizabeth Stephens, and Brian Koeppel. "Mechanical reliability and life prediction of coated metallic interconnects within solid oxide fuel cells." Renewable Energy 113 (December 2017): 1472–79. http://dx.doi.org/10.1016/j.renene.2017.06.103.
Повний текст джерелаSaito, T., H. Ashihara, K. Ishikawa, M. Miyauchi, Y. Yamada, and H. Nakano. "A Reliability Study of Barrier-Metal-Clad Copper Interconnects With Self-Aligned Metallic Caps." IEEE Transactions on Electron Devices 51, no. 12 (December 2004): 2129–35. http://dx.doi.org/10.1109/ted.2004.838512.
Повний текст джерелаAmoah, Papa K., Christopher E. Sunday, Chukwudi Okoro, Jungjoon Ahn, Lin You, Dmitry Veksler, Joseph Kopanski, and Yaw Obeng. "(Invited) Towards the Physical Reliability of 3D-Integrated Systems: Broadband Dielectric Spectroscopic (BDS) Studies of Material Evolution and Reliability in Integrated Systems." ECS Meeting Abstracts MA2022-02, no. 17 (October 9, 2022): 859. http://dx.doi.org/10.1149/ma2022-0217859mtgabs.
Повний текст джерелаHau-Riege, Stefan P., and Carl V. Thompson. "The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects." Journal of Materials Research 15, no. 8 (August 2000): 1797–802. http://dx.doi.org/10.1557/jmr.2000.0259.
Повний текст джерелаFu, C., D. L. McDowell, and I. C. Ume. "A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects." Journal of Electronic Packaging 120, no. 1 (March 1, 1998): 24–34. http://dx.doi.org/10.1115/1.2792281.
Повний текст джерелаTang, Jian She, Brian J. Brown, Steven Verhaverbeke, Han Wen Chen, Jim Papanu, Raymond Hung, Cathy Cai, and Dennis Yost. "Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow." Solid State Phenomena 103-104 (April 2005): 353–56. http://dx.doi.org/10.4028/www.scientific.net/ssp.103-104.353.
Повний текст джерелаOgurtani, Tarik Omer, and Oncu Akyildiz. "Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints." Solid State Phenomena 139 (April 2008): 151–56. http://dx.doi.org/10.4028/www.scientific.net/ssp.139.151.
Повний текст джерелаWhitt, Reece, and David Huitink. "THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000398–403. http://dx.doi.org/10.4071/2380-4505-2019.1.000398.
Повний текст джерелаNair, K. M., M. F. McCombs, K. E. Souders, and S. E. Gordon. "New Mixed Metal Transition Via-Fill Conductors for Cost Effective DuPont GreenTape™ 951 & 9K7 LTCC Circuits." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000254–60. http://dx.doi.org/10.4071/isom-2010-tp3-paper3.
Повний текст джерелаPlacha, Katarzyna, Richard S. Tuley, Milena Salvo, Valentina Casalegno, and Kevin Simpson. "Solid-Liquid Interdiffusion (SLID) Bonding of p-Type Skutterudite Thermoelectric Material Using Al-Ni Interlayers." Materials 11, no. 12 (December 6, 2018): 2483. http://dx.doi.org/10.3390/ma11122483.
Повний текст джерелаSung, Po-Hsien, and Tei-Chen Chen. "Material Properties of Zr–Cu–Ni–Al Thin Films as Diffusion Barrier Layer." Crystals 10, no. 6 (June 24, 2020): 540. http://dx.doi.org/10.3390/cryst10060540.
Повний текст джерелаNaeemi, A., and J. D. Meindl. "Monolayer metallic nanotube interconnects: promising candidates for short local interconnects." IEEE Electron Device Letters 26, no. 8 (August 2005): 544–46. http://dx.doi.org/10.1109/led.2005.852744.
Повний текст джерелаLi, Baozhen, Timothy D. Sullivan, Tom C. Lee, and Dinesh Badami. "Reliability challenges for copper interconnects." Microelectronics Reliability 44, no. 3 (March 2004): 365–80. http://dx.doi.org/10.1016/j.microrel.2003.11.004.
Повний текст джерелаFergus, Jeffrey W. "Metallic interconnects for solid oxide fuel cells." Materials Science and Engineering: A 397, no. 1-2 (April 2005): 271–83. http://dx.doi.org/10.1016/j.msea.2005.02.047.
Повний текст джерелаGaetano Chiariello, Andrea, Giovanni Miano, Antonio Maffucci, Fabio Villone, and Walter Zamboni. "Electromagnetic models for metallic carbon nanotube interconnects." COMPEL - The international journal for computation and mathematics in electrical and electronic engineering 26, no. 3 (June 19, 2007): 571–85. http://dx.doi.org/10.1108/03321640710751064.
Повний текст джерелаHu, Yaoqiao, Patrick Conlin, Yeonghun Lee, Dongwook Kim, and Kyeongjae Cho. "van der Waals 2D metallic materials for low-resistivity interconnects." Journal of Materials Chemistry C 10, no. 14 (2022): 5627–35. http://dx.doi.org/10.1039/d1tc05872j.
Повний текст джерелаBaklanov, Mikhail R., Christoph Adelmann, Larry Zhao, and Stefan De Gendt. "Advanced Interconnects: Materials, Processing, and Reliability." ECS Journal of Solid State Science and Technology 4, no. 1 (December 17, 2014): Y1—Y4. http://dx.doi.org/10.1149/2.0271501jss.
Повний текст джерелаChangsup Ryu, Kee-Won Kwon, A. L. S. Loke, Haebum Lee, T. Nogami, V. M. Dubin, R. A. Kavari, G. W. Ray, and S. S. Wong. "Microstructure and reliability of copper interconnects." IEEE Transactions on Electron Devices 46, no. 6 (June 1999): 1113–20. http://dx.doi.org/10.1109/16.766872.
Повний текст джерелаDudek, Rainer, Peter Sommer, Andreas Fix, Joerg Trodler, Sven Rzepka, and Bernd Michel. "Reliability investigations for high temperature interconnects." Soldering & Surface Mount Technology 26, no. 1 (January 28, 2014): 27–36. http://dx.doi.org/10.1108/ssmt-10-2013-0030.
Повний текст джерелаTőkei, Zsolt, Kristof Croes, and Gerald P. Beyer. "Reliability of copper low-k interconnects." Microelectronic Engineering 87, no. 3 (March 2010): 348–54. http://dx.doi.org/10.1016/j.mee.2009.06.025.
Повний текст джерелаMcPherson, J. W., H. A. Le, and C. D. Graas. "Reliability challenges for deep submicron interconnects." Microelectronics Reliability 37, no. 10-11 (October 1997): 1469–77. http://dx.doi.org/10.1016/s0026-2714(97)00089-9.
Повний текст джерелаKopera, Paul M. "Reliability of passive fiber-optic interconnects." Fiber and Integrated Optics 9, no. 1 (March 1990): 53–59. http://dx.doi.org/10.1080/01468039008202894.
Повний текст джерелаTang, Liang. "Commentary: Metallic nanodevices for chip-scale optical interconnects." Journal of Nanophotonics 3, no. 1 (March 1, 2009): 030302. http://dx.doi.org/10.1117/1.3111849.
Повний текст джерелаHarris, D. B., and M. G. Pecht. "A Reliability Study of Fuzz Button Interconnects." Circuit World 21, no. 2 (February 1995): 12–18. http://dx.doi.org/10.1108/eb046298.
Повний текст джерелаGambino, Jeff, Tom C. Lee, Fen Chen, and Timothy D. Sullivan. "Reliability of Copper Interconnects: Stress-Induced Voids." ECS Transactions 18, no. 1 (December 18, 2019): 205–11. http://dx.doi.org/10.1149/1.3096451.
Повний текст джерелаHassan, Muhammad Aqib, and Othman Bin Mamat. "Mitigation of Chromium Poisoning of Ferritic Interconnect from Annealed Spinel of CuFe2O4." Processes 8, no. 9 (September 8, 2020): 1113. http://dx.doi.org/10.3390/pr8091113.
Повний текст джерелаHwang, Byungil, Yurim Han, and Paolo Matteini. "BENDING FATIGUE BEHAVIOR OF AG NANOWIRE/CU THIN-FILM HYBRID INTERCONNECTS FOR WEARABLE ELECTRONICS." Facta Universitatis, Series: Mechanical Engineering 20, no. 3 (November 30, 2022): 553. http://dx.doi.org/10.22190/fume220730040h.
Повний текст джерелаBrylewski, Tomasz, and Kazimierz Przybylski. "Perovskite and Spinel Functional Coatings for SOFC Metallic Interconnects." Materials Science Forum 595-598 (September 2008): 813–22. http://dx.doi.org/10.4028/www.scientific.net/msf.595-598.813.
Повний текст джерелаZeng, Z. "Corrosion of metallic interconnects for SOFC in fuel gases." Solid State Ionics 167, no. 1-2 (February 12, 2004): 9–16. http://dx.doi.org/10.1016/j.ssi.2003.11.026.
Повний текст джерелаArmstrong, Tad J. "Oxidation Kinetics of Metallic Interconnects for Intermediate Temperature SOFC." ECS Proceedings Volumes 2005-07, no. 1 (January 2005): 1795–805. http://dx.doi.org/10.1149/200507.1795pv.
Повний текст джерелаHolcomb, Gordon R., Malgorzata Ziomek-Moroz, Stephen D. Cramer, Bernard S. Covino, and Sophie J. Bullard. "Dual-Environment Effects on the Oxidation of Metallic Interconnects." Journal of Materials Engineering and Performance 15, no. 4 (August 1, 2006): 404–9. http://dx.doi.org/10.1361/105994906x117198.
Повний текст джерелаMaffucci, A., G. Miano, and F. Villone. "A transmission line model for metallic carbon nanotube interconnects." International Journal of Circuit Theory and Applications 36, no. 1 (January 2008): 31–51. http://dx.doi.org/10.1002/cta.396.
Повний текст джерелаKacker, Karan, and Suresh K. Sitaraman. "Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect." Journal of Microelectronics and Electronic Packaging 6, no. 1 (January 1, 2009): 59–65. http://dx.doi.org/10.4071/1551-4897-6.1.59.
Повний текст джерелаCoakley, Kevin J., Pavel Kabos, Stephane Moreau, and Yaw Obeng. "(Invited) Empirical Modeling of Broadband Insertion Losses in TSV-Interconnects." ECS Meeting Abstracts MA2022-02, no. 17 (October 9, 2022): 860. http://dx.doi.org/10.1149/ma2022-0217860mtgabs.
Повний текст джерелаHsu, Yung-Yu, Cole Papakyrikos, Daniel Liu, Xianyan Wang, Milan Raj, Baosheng Zhang, and Roozbeh Ghaffari. "Design for reliability of multi-layer stretchable interconnects." Journal of Micromechanics and Microengineering 24, no. 9 (August 11, 2014): 095014. http://dx.doi.org/10.1088/0960-1317/24/9/095014.
Повний текст джерелаNguyen, Luu T. "Foreword Wafer-Level Packaging: Interconnects for Enhanced Reliability." IEEE Transactions on Advanced Packaging 32, no. 2 (May 2009): 360–61. http://dx.doi.org/10.1109/tadvp.2009.2022602.
Повний текст джерелаHuang, M. L. "(Invited) Electromigration Reliability of Lead-Free Solder Interconnects." ECS Transactions 60, no. 1 (February 27, 2014): 811–16. http://dx.doi.org/10.1149/06001.0811ecst.
Повний текст джерелаIgarashi, Yasushi, Tomomi Yamanobe, and Toshio Ito. "High-Reliability Copper Interconnects through Dry Etching Process." Japanese Journal of Applied Physics 34, Part 1, No. 2B (February 28, 1995): 1012–15. http://dx.doi.org/10.1143/jjap.34.1012.
Повний текст джерелаRobert Kao, C., Albert T. Wu, King-Ning Tu, and Yi-Shao Lai. "Reliability of micro-interconnects in 3D IC packages." Microelectronics Reliability 53, no. 1 (January 2013): 1. http://dx.doi.org/10.1016/j.microrel.2012.11.005.
Повний текст джерелаSato, Motonobu, Takashi Hyakushima, Akio Kawabata, Tatsuhiro Nozue, Shintaro Sato, Mizuhisa Nihei, and Yuji Awano. "High-Current Reliability of Carbon Nanotube Via Interconnects." Japanese Journal of Applied Physics 49, no. 10 (October 20, 2010): 105102. http://dx.doi.org/10.1143/jjap.49.105102.
Повний текст джерелаKeller, Robert. "(Invited) Assessing Reliability of Materials for Electronic Interconnects." ECS Meeting Abstracts MA2022-02, no. 17 (October 9, 2022): 861. http://dx.doi.org/10.1149/ma2022-0217861mtgabs.
Повний текст джерелаXu, Pingye, and Michael C. Hamilton. "Design and fabrication of MEMS-type compliant overhang flip-chip interconnect for RF applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 002082–94. http://dx.doi.org/10.4071/2015dpc-tha32.
Повний текст джерелаKacker, Karan, Thomas Sokol, Wansuk Yun, Madhavan Swaminathan, and Suresh K. Sitaraman. "A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance." Journal of Electronic Packaging 129, no. 4 (April 9, 2007): 460–68. http://dx.doi.org/10.1115/1.2804096.
Повний текст джерелаD, Nirmal. "DESIGN AND EFFICIENCY ANALYSIS OF NANOCARBON INTERCONNECT STRUCTURES." Journal of Electronics and Informatics 01, no. 01 (September 6, 2019): 12–23. http://dx.doi.org/10.36548/jei.2019.1.002.
Повний текст джерела