Книги з теми "Reliability of metallic interconnects"

Digital signal integrity: Modeling and simulation with interconnects and packages. Upper Saddle River, NJ: Prentice Hall PTR, 2001.

Electromigration in thin films and electronic devices: Materials and reliability. Oxford: Woodhead Publishing, 2011.

Gunawan, Indra. Fundamentals of reliability engineering: Applications in multistage interconnection networks. Hoboken, N.J: John Wiley & Sons, Inc., 2014.

Wei dian zi ji shu de ke kao xing: Hu lian , qi jian ji xi tong = Reliability of Microtechnology : Interconnects, Devices and Systems. Beijing: Ke xue chu ban she, 2013.

Symposium on Reliability of Metals in Electronics (1995 Reno, Nev.). Proceedings of the Symposium on Reliability of Metals in Electronics. Pennington, NJ: Electrochemical Society, 1995.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

J, McKerrow Andrew, Materials Research Society Meeting, and Symposim on Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (2003 : San Francisco, Calif.), eds. Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003: Symposium held April 21-25, 2003, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2003.

Maex, Karen. Materials, technology and reliability for advanced interconnects and low-k dielectrics: Symposium held April 23-27, 2000, San Fransico, California, U.S.A. Warrendale, Pa: Materials Research Society, 2001.

Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics" (2011 San Francisco, Calif.). Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011: Symposium held April 25-29, 2011, San Francisco, California, U.S.A. Edited by Baklanov Mikhail R and Materials Research Society Meeting. Warrendale, Penn: Materials Research Society, 2012.

R, Baklanov Mikhail, and Materials Research Society Meeting, eds. Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011: Symposium held April 25-29, 2011, San Francisco, California, U.S.A. Warrendale, Penn: Materials Research Society, 2012.

Martin, Gall, and Materials Research Society Meeting, eds. Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2009: Symposium held April 14-17, 2009, San Francisco, California, U.S.A. Warrendale, Penn: Materials Research Society, 2009.

Erol, Sancaktar, Lee Jong Seh, American Society of Mechanical Engineers. Design Engineering Division., and International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.), eds. Reliability, stress analysis, and failure prevention aspects of composite and active materials: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. New York: American Society of Mechanical Engineers, 1994.

International Symposium on Thin Film Materials, Processes, and Reliability (2003 Paris, France). Thin film materials, processes, and reliability: Plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. Edited by Mathad G. S, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2003.

S, Ho P., ed. Stress-induced phenomena in metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. Melville, N.Y: American Institute of Physics, 2004.

Sarkka, Jussi, Johan Liu, and Olli Salmela. Reliability of Microtechnology: Interconnects, Devices and Systems. Springer, 2011.

Reliability Of Microtechnology Interconnects Devices And Systems. Springer, 2011.

Morris, James E., Cristina Andersson, Jussi Sarkka, Johan Liu, Olli Salmela, and Per-Erik Tegehall. Reliability of Microtechnology: Interconnects, Devices and Systems. Springer, 2014.

Morris, James E., Jussi Sarkka, Johan Liu, Olli Salmela, and Per-Erik Tegehall. Reliability of Microtechnology: Interconnects, Devices and Systems. Springer, 2011.

Reliability Of Rohscompliant 2d And 3d Ic Interconnects. McGraw-Hill Professional Publishing, 2010.

Wong, C. P., Paul R. Besser, Andrew J. McKerrow, Francsca Iacopi, and Joost J. Vlassak. Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863. University of Cambridge ESOL Examinations, 2014.

Lin, Qinghuang, E. Todd Ryan, Wen-li Wu, and Do Yeung Yoon. Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics. University of Cambridge ESOL Examinations, 2014.

Koike, Junichi, Alfred Grill, Martin Gall, Francesca Lacopi, and Takamasa Usui. Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics - 2009. University of Cambridge ESOL Examinations, 2014.

Carter, R. J., C. S. Hau-Riege, G. M. Kloster, T. M. Lu, and S. E. Schulz. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004. University of Cambridge ESOL Examinations, 2014.

Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials. Pennington, NJ: Electrochemical Society, 1993.

Ogawa, S., K. Maex, G. S. Oehrlein, J. T. Wetzel, and Y. C. Joo. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612. University of Cambridge ESOL Examinations, 2014.

Kim, Choong-Un. Electromigration in Thin Films and Electronic Devices: Materials and Reliability. Woodhead Publishing, 2016.

(Editor), A. J. McKerrow, J. Leu (Editor), and O. Kraft (Editor), eds. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics--2003: Volume 766. Materials Research Society, 2003.

Gunawan, Indra. Fundamentals of Reliability Engineering: Applications in Multistage Interconnection Networks. Wiley & Sons, Incorporated, John, 2014.

Fundamentals of Reliability Engineering: Applications in Multistage Interconnection Networks. Wiley & Sons, Incorporated, John, 2014.

Gunawan, Indra. Fundamentals of Reliability Engineering: Applications in Multistage Interconnection Networks. Wiley & Sons, Incorporated, John, 2014.

Gunawan, Indra. Fundamentals of Reliability Engineering: Applications in Multistage Interconnection Networks. Wiley & Sons, Limited, John, 2014.

Gunawan, Indra. Fundamentals of Reliability Engineering: Applications in Multistage Interconnection Networks. Wiley & Sons, Incorporated, John, 2014.

V, Zaretsky Erwin, United States. National Aeronautics and Space Administration. Scientific and Technical Information Program., and Lewis Research Center, eds. MMC life system development (phase I): A NASA/Pratt & Whitney Life Prediction Cooperative Program. [Cleveland, Ohio]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1996.

(Editor), Daniel C. Edelstein, Takamaro Kikkawa (Editor), Mehmet C. Ozturk (Editor), King-Ning Tu (Editor), and Elizabeth J. Weitzman (Editor), eds. Advanced Interconnects and Contacts: Symposium Held April 5-7, 1999, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings). Materials Research Society, 1999.

R, Besser Paul, and Materials Research Society. Meeting Symposium B, eds. Materials, technology and reliability for advanced interconnects--2005: Symposium held March 28-April 1, 2005, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2005.

Carter, R. J. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics--2004: Symposium Held April 13-15, 2004, San Francisco, Califor. Materials Research Society, 2004.

1948-, Carter R. J., Materials Research Society Meeting, and Symposim on Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (2004 : San Francisco, Calif.), eds. Materials, technology, and reliability for advanced interconnects and low-k dielectrics--2004: Symposium held April 13-15, 2004, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2004.

(Editor), G. S. Oehrlein, K. Maex (Editor), Y. C. Joo (Editor), S. Ogawa (Editor), and Jeffrey T. Wetzel (Editor), eds. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Proceedings of Symposium Helt April 23-27, 2000, San Francisco, California U.S.A. Materials Research Society, 2001.

Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics: Symposium held April 10-12, 2007, San Francisco, California, U.S.A. United States: Materials Res Soc, 2007.

Sh, Gildenblat Gennady, Schwartz Gary P, and Society of Photo-optical Instrumentation Engineers., eds. Metallization: Performance and reliability issues for VLSI and ULSI ; 12-13 September 1991, San Jose, California. Bellingham, Wash: SPIE, 1991.

Besser, Paul R. Materials, Technology and Reliability of Advanced Interconnects: 2005: Symposium Held March 28-April 1, 2005, San Francisco, California, U.S.A. (Materials ... Society Symposium Proceedings (Hardcover)). Materials Research Society, 2005.

Tsui, Ting Y. Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects: Symposium Held April 18-21, 2006, San Francisco, California, U.S. ... Society Symposium Proceedings (Hardcover)). Materials Research Society, 2006.

(Editor), Paul S. Ho, Shefford P. Baker (Editor), Tomoji Nakamura (Editor), and Cynthia A. Volkert (Editor), eds. Stress-Induced Phenomena in Metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings / AIP ... Phenomena Metallizat.). American Institute of Physics, 2004.