Статті в журналах з теми "Reliability characterization"
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Amirabdollahian, Mahsa, and Bithin Datta. "Reliability Evaluation of Groundwater Contamination Source Characterization under Uncertain Flow Field." International Journal of Environmental Science and Development 6, no. 7 (2015): 512–18. http://dx.doi.org/10.7763/ijesd.2015.v6.647.
Повний текст джерелаTsuchiya, Toshiyuki. "Reliability Characterization of MEMS Materials." IEEJ Transactions on Sensors and Micromachines 125, no. 7 (2005): 289–93. http://dx.doi.org/10.1541/ieejsmas.125.289.
Повний текст джерелаSong, William, Saibal Mukhopadhyay, and Sudhakar Yalamanchili. "Architectural Reliability: Lifetime Reliability Characterization and Management ofMany-Core Processors." IEEE Computer Architecture Letters 14, no. 2 (July 1, 2015): 103–6. http://dx.doi.org/10.1109/lca.2014.2340873.
Повний текст джерелаYang, Q. J., H. L. J. Pang, Z. P. Wang, G. H. Lim, F. F. Yap, and R. M. Lin. "Vibration reliability characterization of PBGA assemblies." Microelectronics Reliability 40, no. 7 (July 2000): 1097–107. http://dx.doi.org/10.1016/s0026-2714(00)00036-6.
Повний текст джерелаEkwueme, Chukwuma G., and Gary C. Hart. "Structural reliability characterization of precast concrete." Structural Design of Tall Buildings 3, no. 1 (March 1994): 13–35. http://dx.doi.org/10.1002/tal.4320030103.
Повний текст джерелаLee, J. C., Chen Ih-Chin, and Hu Chenming. "Modeling and characterization of gate oxide reliability." IEEE Transactions on Electron Devices 35, no. 12 (1988): 2268–78. http://dx.doi.org/10.1109/16.8802.
Повний текст джерелаCheng, Bowen, Dirk De Bruyker, Chris Chua, Kunal Sahasrabuddhe, Ivan Shubin, John E. Cunningham, Ying Luo, Karl F. Bohringer, Ashok V. Krishnamoorthy, and Eugene M. Chow. "Microspring Characterization and Flip-Chip Assembly Reliability." IEEE Transactions on Components, Packaging and Manufacturing Technology 3, no. 2 (February 2013): 187–96. http://dx.doi.org/10.1109/tcpmt.2012.2213250.
Повний текст джерелаClaeys, C., E. Simoen, J. M. Rafi, Marcelo A. Pavanello, and Joao A. Martino. "Physical Characterization and Reliability Aspects of MuGFETs." ECS Transactions 9, no. 1 (December 19, 2019): 281–94. http://dx.doi.org/10.1149/1.2766899.
Повний текст джерелаSheikh, A. "A reliability model for fatigue life characterization." International Journal of Fatigue 17, no. 2 (February 1995): 121–28. http://dx.doi.org/10.1016/0142-1123(95)95891-j.
Повний текст джерелаShaddock, David, and Liang Yin. "Reliability of High Temperature Laminates." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 000100–000110. http://dx.doi.org/10.4071/hiten-session3b-paper3b_1.
Повний текст джерелаNAYAK, AMIYA, and NICOLA SANTORO. "ON RELIABILITY ANALYSIS OF CHORDAL RINGS." Journal of Circuits, Systems and Computers 05, no. 02 (June 1995): 199–213. http://dx.doi.org/10.1142/s0218126695000151.
Повний текст джерелаW., TAZBIT, and MIALHE P. "RELIABILITY OF MICROELECTRONIC DEVICES FROM EMITTERBASE JUNCTION CHARACTERIZATION." International Conference on Applied Mechanics and Mechanical Engineering 13, no. 13 (May 1, 2008): 29–37. http://dx.doi.org/10.21608/amme.2008.39820.
Повний текст джерелаTu, Zhijuan, Zhiping Zhou, and Xingjun Wang. "Reliability characterization of silicon-based germanium waveguide photodetectors." Optical Engineering 53, no. 5 (May 5, 2014): 057103. http://dx.doi.org/10.1117/1.oe.53.5.057103.
Повний текст джерелаDoyle, R., B. O'Flynn, W. Lawton, J. Barrett, and J. Buckley. "Glob-top reliability characterization: evaluation and analysis methods." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 21, no. 2 (June 1998): 292–300. http://dx.doi.org/10.1109/95.705478.
Повний текст джерелаRoss, R. G., G. R. Mon, L. Wen, C. C. Gonzalez, and R. S. Sugimura. "Measurement and characterization of thin film module reliability." Solar Cells 24, no. 3-4 (July 1988): 271–78. http://dx.doi.org/10.1016/0379-6787(88)90078-6.
Повний текст джерелаvan Beek, Andries, Peter Borm, and Marieke Quant. "Axiomatic Characterizations of a Proportional Influence Measure for Sequential Projects with Imperfect Reliability." Axioms 10, no. 4 (September 30, 2021): 247. http://dx.doi.org/10.3390/axioms10040247.
Повний текст джерелаLi, Qingshen, Yigang Lin, Shoudong Wang, Shanshan Wang, and Xiangou Zhu. "Storage Reliability Assessment Method for Aerospace Electromagnetic Relay Based on Belief Reliability Theory." Applied Sciences 12, no. 17 (August 29, 2022): 8637. http://dx.doi.org/10.3390/app12178637.
Повний текст джерелаDolnicar, Peter, Drago Milosevic, Zoran Jovovic, Vladimir Meglic, Marko Maras, and Ana Velimirovic. "Reliability of morphological and molecular characterization of lightsprouts for differentiation of potato accessions." Genetika 48, no. 2 (2016): 525–32. http://dx.doi.org/10.2298/gensr1602525d.
Повний текст джерелаBadger, Lacey L., Nikholas G. Toledo, Derek W. Slottke, John Thomas, Miguel Alamillo, Elliott Gunnarsson, Mark L. Le Rutt, and Ilan Tsameret. "Ultra-Fine Pitch Wedge bonding for Device Reliability Characterization." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000561–65. http://dx.doi.org/10.4071/2380-4505-2018.1.000561.
Повний текст джерелаCholda, Piotr, Janos Tapolcai, Tibor Cinkler, Krzysztof Wajda, and Andrzej Jajszczyk. "Quality of resilience as a network reliability characterization tool." IEEE Network 23, no. 2 (March 2009): 11–19. http://dx.doi.org/10.1109/mnet.2009.4804331.
Повний текст джерелаLin, Hua Tay, and Mattison K. Ferber. "Characterization of Mechanical Reliability of Silicon Nitride Microturbine Rotors." Key Engineering Materials 287 (June 2005): 393–403. http://dx.doi.org/10.4028/www.scientific.net/kem.287.393.
Повний текст джерелаCastellazzi, Alberto, and Mauro Ciappa. "Electrothermal Characterization for Reliability of Modern Low-Voltage PowerMOSFETs." IEEE Transactions on Device and Materials Reliability 7, no. 4 (December 2007): 571–80. http://dx.doi.org/10.1109/tdmr.2007.910439.
Повний текст джерелаSy, Fatoumata, Quentin Rafhay, Julien Poette, Gregory Grosa, Gaelle Beylier, Philippe Grosse, David Roy, and Jean-Emmanuel Broquin. "Reliability Characterization and Modeling of High Speed Ge Photodetectors." IEEE Transactions on Device and Materials Reliability 19, no. 4 (December 2019): 688–95. http://dx.doi.org/10.1109/tdmr.2019.2945996.
Повний текст джерелаDuong, Q. H., L. Buchaillot, D. Collard, P. Schmitt, X. Lafontan, P. Pons, F. Flourens, and F. Pressecq. "Thermal and electrostatic reliability characterization in RF MEMS switches." Microelectronics Reliability 45, no. 9-11 (September 2005): 1790–93. http://dx.doi.org/10.1016/j.microrel.2005.07.095.
Повний текст джерелаTazibt, W., P. Mialhe, J. P. Charles, and M. A. Belkhir. "A junction characterization for microelectronic devices quality and reliability." Microelectronics Reliability 48, no. 3 (March 2008): 348–53. http://dx.doi.org/10.1016/j.microrel.2007.06.002.
Повний текст джерелаMatmat, Mohamed, Fabio Coccetti, Antoine Marty, Robert Plana, Christophe Escriba, Jean-Yves Fourniols, and Daniel Esteve. "Capacitive RF MEMS analytical predictive reliability and lifetime characterization." Microelectronics Reliability 49, no. 9-11 (September 2009): 1304–8. http://dx.doi.org/10.1016/j.microrel.2009.06.049.
Повний текст джерелаBernal, S., F. J. Botana, R. García, F. Ramírez, and J. M. Rodríguez-Izquierdo. "Characterization of an experimental TPD-MS system. Reliability problems." Thermochimica Acta 98 (February 1986): 319–26. http://dx.doi.org/10.1016/0040-6031(86)87102-7.
Повний текст джерелаDubey, Vaibhav, and Deepak Khushalani. "Reliability characterization of MEMS switch using MIM test structures." Journal of Electrical Systems and Information Technology 1, no. 3 (December 2014): 187–97. http://dx.doi.org/10.1016/j.jesit.2014.12.002.
Повний текст джерелаMartin, Andreas. "Review on the reliability characterization of plasma-induced damage." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 27, no. 1 (2009): 426. http://dx.doi.org/10.1116/1.3054356.
Повний текст джерелаSuehle, J. S. "Ultrathin gate oxide reliability: physical models, statistics, and characterization." IEEE Transactions on Electron Devices 49, no. 6 (June 2002): 958–71. http://dx.doi.org/10.1109/ted.2002.1003712.
Повний текст джерелаLiu, Hongxia, and Yue Hao. "A new method of thin gate SiO2 reliability characterization." Surface and Interface Analysis 34, no. 1 (2002): 437–40. http://dx.doi.org/10.1002/sia.1333.
Повний текст джерелаLall, Pradeep, Michael Pecht, and Edward B. Hakim. "Characterization of functional relationship between temperature and microelectronic reliability." Microelectronics Reliability 35, no. 3 (March 1995): 377–402. http://dx.doi.org/10.1016/0026-2714(95)93067-k.
Повний текст джерелаDugan, M. Patrick. "Reliability characterization of a 3-mum cmos/sos process." Quality and Reliability Engineering International 3, no. 2 (April 1987): 99–105. http://dx.doi.org/10.1002/qre.4680030207.
Повний текст джерелаSundresh, Tippure S. "Macroscopic characterization of software and its relationship to reliability." Bell Labs Technical Journal 10, no. 1 (May 5, 2005): 169–74. http://dx.doi.org/10.1002/bltj.20086.
Повний текст джерелаCalò, C., A. Lay-Ekuakille, P. Vergallo, C. Chiffi, A. Trotta, A. Fasanella, and A. M. Fasanella. "Measurements and Characterization of Photovoltaic Modules for Tolerance Verification." International Journal of Measurement Technologies and Instrumentation Engineering 1, no. 2 (April 2011): 73–83. http://dx.doi.org/10.4018/ijmtie.2011040106.
Повний текст джерелаRushdi, Ali Muhammad Ali, and Fares Ahmad Muhammad Ghaleb. "Reliability Characterization of Binary-Imaged Multi-State Coherent Threshold Systems." International Journal of Mathematical, Engineering and Management Sciences 6, no. 1 (October 29, 2020): 309–21. http://dx.doi.org/10.33889/ijmems.2021.6.1.020.
Повний текст джерелаResch-Genger, Ute, and Paul C. DeRose. "Characterization of photoluminescence measuring systems (IUPAC Technical Report)." Pure and Applied Chemistry 84, no. 8 (June 4, 2012): 1815–35. http://dx.doi.org/10.1351/pac-rep-10-07-07.
Повний текст джерелаZaghloul, Usama, George J. Papaioannou, Bharat Bhushan, Fabio Coccetti, Patrick Pons, and Robert Plana. "New insights into reliability of electrostatic capacitive RF MEMS switches." International Journal of Microwave and Wireless Technologies 3, no. 5 (September 1, 2011): 571–86. http://dx.doi.org/10.1017/s1759078711000766.
Повний текст джерелаShaddock, David, Liang Yin, Zhenzhen Shen, Zhangming Zhou, and R. Wayne Johnson. "DIP Test Socket Characterization for 300°C." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (January 1, 2013): 000213–19. http://dx.doi.org/10.4071/hiten-wa12.
Повний текст джерелаPark, Heejin. "Reliability Evaluation Through Moisture Sorption Characterization of Electronic Packaging Materials." Transactions of the Korean Society of Mechanical Engineers A 37, no. 9 (September 1, 2013): 1151–58. http://dx.doi.org/10.3795/ksme-a.2013.37.9.1151.
Повний текст джерелаBruinsma, Wendy E., Thierry G. Guitton, Jon JP Warner, and David Ring. "Interobserver Reliability of Classification and Characterization of Proximal Humeral Fractures." Journal of Bone and Joint Surgery-American Volume 95, no. 17 (September 2013): 1600–1604. http://dx.doi.org/10.2106/jbjs.l.00586.
Повний текст джерелаAMAGAI, Masazumi. "Chip Scale Package Solder Joint Reliability Modeling and Material Characterization." Journal of Japan Institute of Electronics Packaging 3, no. 1 (2000): 45–56. http://dx.doi.org/10.5104/jiep.3.45.
Повний текст джерелаMathew, Varughese, and Tu Anh Tran. "Characterization of Over Pad Metallization (OPM) for High Temperature Reliability." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 001097–104. http://dx.doi.org/10.4071/isom-2012-thp32.
Повний текст джерелаDas, H., S. Sunkari, M. Domeij, A. Konstantinov, F. Allerstam, and T. Neyer. "(Invited) Enabling SiC Yield and Reliability through Epitaxy and Characterization." ECS Transactions 69, no. 11 (October 2, 2015): 29–32. http://dx.doi.org/10.1149/06911.0029ecst.
Повний текст джерелаYoung, C. D., K. Akarvardar, K. Matthews, M. O. Baykan, J. Pater, I. Ok, T. Ngai, et al. "(Invited) Electrical Characterization and Reliability Assessment of Double-Gate FinFETs." ECS Transactions 50, no. 4 (March 15, 2013): 201–6. http://dx.doi.org/10.1149/05004.0201ecst.
Повний текст джерелаCheng, Y. L., W. Y. Chang, B. J. Wei, F. H. Lu, and Y. L. Wang. "Electrical and Reliability Characterization of Ti/TiN Thin Film Resistor." ECS Transactions 45, no. 6 (April 27, 2012): 81–90. http://dx.doi.org/10.1149/1.3700941.
Повний текст джерелаTardibuono, Mark J. "Characterization of PCB plated‐through‐hole reliability using statistical analysis." Circuit World 31, no. 1 (March 2005): 8–15. http://dx.doi.org/10.1108/03056120510553176.
Повний текст джерелаManzini, Stefano, and Mattia Rossetti. "Electrical Characterization and Reliability of Split-Gate High-Voltage Transistors." IEEE Transactions on Device and Materials Reliability 18, no. 2 (June 2018): 279–83. http://dx.doi.org/10.1109/tdmr.2018.2828985.
Повний текст джерелаKerber, Andreas, Tanya Nigam, Peter Paliwoda, and Fernando Guarin. "Reliability Characterization of Ring Oscillator Circuits for Advanced CMOS Technologies." IEEE Transactions on Device and Materials Reliability 20, no. 2 (June 2020): 230–41. http://dx.doi.org/10.1109/tdmr.2020.2981010.
Повний текст джерелаHong, Sung-Jei, Jong-Woong Kim, and Seung-Boo Jung. "Characterization of Reliability of Printed Indium Tin Oxide Thin Films." Journal of Nanoscience and Nanotechnology 13, no. 11 (November 1, 2013): 7770–73. http://dx.doi.org/10.1166/jnn.2013.7813.
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