Книги з теми "Reliability characterization"

McCauley, James W., and Volker Weiss, eds. Materials Characterization for Systems Performance and Reliability. Boston, MA: Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4.

Material Characterization for Systems Performance and Reliability (Conference) (1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York: Plenum, 1986.

Sagamore Army Materials Research Conference (31st 1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York: Plenum Press, 1986.

McCauley, James W. Materials Characterization for Systems Performance and Reliability. Boston, MA: Springer US, 1986.

Rajeshuni, Ramesham, Society of Photo-optical Instrumentation Engineers., and Semiconductor Equipment and Materials International., eds. Reliability, testing, and characterization of MEMS/MOEMS: 22-24 October 2001, San Francisco, USA. Bellingham, Wash: SPIE, 2001.

D, Todd M., U.S. Nuclear Regulatory Commission. Office of Nuclear Regulatory Research. Division of Engineering., and Oak Ridge National Laboratory, eds. A characterization of check valve degradation and failure experience in the nuclear power industry. Washington, DC: Division of Engineering, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1993.

L, Veteran Janice, ed. Silicon materials--processing, characterization and reliability: Symposium held April 1-5, 2002, San Francisco, California, U.S.A. Warrendale, PA: Materials Research Society, 2002.

1952-, Tanner Danelle Mary, Ramesham Rajeshuni, and Society of Photo-optical Instrumentation Engineers., eds. Reliability, testing, and characterization of MEMS/MOEMS III: 26-28 January, 2004, San Jose, California, USA. Bellingham, Wash: SPIE, 2004.

Hartzell, Allyson L. Reliability, packaging, testing, and characterization of MEMS/MOEMS VII: 21-22 January 2008, San Jose, California, USA. Bellingham, Wash: SPIE, 2008.

1952-, Tanner Danelle Mary, Ramesham Rajeshuni, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. Reliability, packaging, testing, and characterization of MEMS/MOEMS IV: 24-25 January 2005, San Jose, California, USA. Bellingham, Wash: SPIE, 2005.

Hacke, P. Characterization of multicrystalline silicon modules with system bias voltage applied in damp heat. Golden, CO]: National Renewable Energy Laboratory, 2011.

Workshop on Model Uncertainty, Its Characterization and Quantification (1993 Annapolis, Maryland). Proceedings of Workshop on Model Uncertainty, Its Characterization and Quantification: Annapolis, Maryland, USA, October 20-22, 1993. College Park, MD, U.S.A: University Printing Services, University of Maryland, 1995.

name, No. Reliability, testing, and characterization of MEMS/MOEMS II: 27-29 January 2003, San Jose, California, USA. Bellingham, WA: SPIE, 2003.

Garcia-Blanco, Sonia. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X: 24-25 January 2011, San Francisco, California, United States. Edited by SPIE (Society), Institut national d'optique (Canada), DALSA Corporation (Canada), and Smart Equipment Technology (France). Bellingham, Wash: SPIE, 2011.

Kullberg, Richard C., and Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX: 25-26 January 2010, San Francisco, California, United States. Edited by SPIE (Society). Bellingham, Wash: SPIE, 2010.

Garcia-Blanco, Sonia, and Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices XI: 23-24 January 2012, San Francisco, California, United States. Edited by SPIE (Society), Dyoptyka (Firm), Vuzix Corporation, and Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Bellingham, Wash: SPIE, 2012.

Kostas, Amberiadis, European Optical Society, Society of Photo-optical Instrumentation Engineers., European Commission. Directorate-General XII, Science, Research, and Development., Scottish Enterprise, Sira Technology Centre (U.K.), and Institution of Electrical Engineers, eds. In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing: 19-21 May, 1999, Edinburgh, Scotland. Bellingham, Wash., USA: SPIE, 1999.

T, Kundu, Qu Jianmin, American Society of Mechanical Engineers. Applied Mechanics Division., American Society of Mechanical Engineers. NDE Engineering Division., and International Mechanical Engineering Congress and Exposition (2000 : Orlando, Fla.), eds. Nondestructive evaluation and characterization of engineering materials for reliability and durability predictions: Presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. New York, N.Y: American Society of Mechanical Engineers, 2000.

Ueda, Osamu. Materials and Reliability Handbook for Semiconductor Optical and Electron Devices. New York, NY: Springer New York, 2013.

Gudrun, Kissinger, Weiland Larg H, Society of Photo-optical Instrumentation Engineers., Scottish Enterprise, European Optical Society, and Institution of Electrical Engineers, eds. In-line characterization, yield, reliability, and failure analysis in microelectronic manufacturing II: 31 May-1 June 2001, Edinburgh, UK. Bellingham, Washington: SPIE, 2001.

A, Mosleh, U.S. Nuclear Regulatory Commission, EG & G Idaho, University of Maryland at College Park, and U.S. Nuclear Regulatory Commission. Division of Safety Issue Resolution, eds. Proceedings of Workshop I in Advanced Topics in Risk and Reliability Analysis: Model uncertainty, its characterization and quantification : held at Governor Calvert House and Conference Center, Annapolis, Maryland, October 20-22, 1993. Washington, DC: Division of Safety Issue Resolution, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1994.

Borys, Michael. Fundamentals of Mass Determination. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012.

service), SpringerLink (Online, ed. Handbook of Technical Diagnostics: Fundamentals and Application to Structures and Systems. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013.

Sabbagh, Harold A. Computational Electromagnetics and Model-Based Inversion: A Modern Paradigm for Eddy-Current Nondestructive Evaluation. New York, NY: Springer New York, 2013.

Ho, Paul S., Janice L. Veteran, David L. O'Meara, and Veena Misra. Silicon Materials: Processing, Characterization and Reliability. University of Cambridge ESOL Examinations, 2014.

McCauley, James W., and Volker Weiss. Materials Characterization for Systems Performance and Reliability. Springer, 2013.

Altenbach, Holm, and Andreas Öchsner. Properties and Characterization of Modern Materials. Ingramcontent, 2016.

Altenbach, Holm, and Andreas Öchsner. Properties and Characterization of Modern Materials. Springer, 2018.

Aliofkhazraei, Mahmood. Handbook of Functional Nanomaterials Vol. 2: Characterization and Reliability. Nova Science Publishers, Incorporated, 2013.

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2020.

Stovl Fighter Propulsion Reliability Maintainability and Supportability Characterization/Ada 224221. Natl Technical Information, 1990.

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2015.

Aliofkhazraei, Mahmood. Comprehensive Guide for Nanocoatings Technology, Volume 2: Characterization and Reliability. Nova Science Publishers, Incorporated, 2015.

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer New York, 2016.

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2019.

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2015.

(Editor), Volker Weiss, ed. Materials Characterization for Systems Performance and Reliability (Sagamore Army Materials Research Conference//Proceedings). Springer, 1986.

Kim, Young Hee, and Jack C. Lee. Hf-Based High-K Dielectrics: Process Development, Performance Characterization, and Reliability. Springer International Publishing AG, 2007.

Kim, Young Hee, and Jack C. Lee. Hf-Based High-K Dielectrics: Process Development, Performance Characterization, and Reliability. Morgan & Claypool Publishers, 2006.

Veteran, Janice L. Silicon Materials--Processing, Characterization and Reliability (Materials Research Society Symposia Proceedings, 716.). Materials Research Society, 2002.

(Editor), Danelle M. Tanner, and Rajeshuni Ramesham (Editor), eds. Reliability, Packaging, Testing and Characterization of Mems / Moems 5 (Proceedings of Spie). SPIE-International Society for Optical Engine, 2006.

Ramesham, Rajeshuni, and Herbert R. Shea. Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII. SPIE, 2014.

Smolyansky, Dmitry A. Enhanced accuracy time domain reflection and transmission measurements for IC interconnect characterization. 1994.

Reliability, testing, and characterization of MEMS/MOEMS III: 24-28 January 2004, San Jose, California, USA. Bellingham, WA: SPIE, 2004.

Rajeshuni, Ramesham, Tanner Danelle Mary 1952-, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. Reliability, testing, and characterization of MEMS/MOEMS II: 27-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2003.

SPIE. Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII: 28-29 January 2009, San Jose, California, United States. SPIE, 2009.

American Society of Mechanical Engineers. Applied Mechanics Division (Corporate Author), American Society of Mechanical Engineers Nde Engineering Division (Corporate Author), Jianmin Qu (Editor), American Society of Mechanical Engineers (Editor), and T. Kundu (Editor), eds. Nondestructive Evaluation & Characterization of Energy Materials for Reliability & Durability Predictions: Presented at the 2000 Asme International Mechanical ... Orlando, Florida (Amd (Series), Vol. 240.). American Society of Mechanical Engineers, 1998.

Reliability, packaging, testing, and characterization of MEMS/MOEMS VI: 23-24 January, 2007, San Jose, California, USA. Bellingham, Wash: SPIE, 2007.

Pearton, Stephen J., and Osamu Ueda. Materials and Reliability Handbook for Semiconductor Optical and Electron Devices. Springer, 2014.

Kim Young-Hee and Jack C. Lee. Hf-Based High-k Dielectrics: Process Development, Performance Characterization, and Reliability (Synthesis Lectures on Solid State Materials and Devices). Morgan & Claypool Publishers, 2005.