Добірка наукової літератури з теми "Printed electronic coating"
Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями
Ознайомтеся зі списками актуальних статей, книг, дисертацій, тез та інших наукових джерел на тему "Printed electronic coating".
Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.
Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.
Статті в журналах з теми "Printed electronic coating":
1
Lu, Taofeng, Gregory Reimonn, Gregory Morose, Evan Yu, and Wan-Ting Chen. "Removing Acrylic Conformal Coating with Safer Solvents for Re-Manufacturing Electronics." Polymers 13, no. 6 (March 18, 2021): 937. http://dx.doi.org/10.3390/polym13060937.
Анотація:
Conformal coating is typically composed of polymeric film and is used to protect delicate electronic components such as printed-circuit boards. Without removing conformal coating, it would be difficult to repair these complicated electronics. Methylene chloride, also called dichloromethane (DCM), has a widespread usage in conformal coating stripper products. The high toxicity of DCM increases human health risk when workers are exposed to DCM during the conformal coating removal processes. Therefore, the replacement of DCM would be beneficial to greatly improve the overall safety profile for workers in the electronics and coating industries. This research identified and evaluated alternative chemicals for replacing DCM used in acrylic conformal coating stripping operations. The solubility of an acrylic conformal coating was measured and characterized using Hansen solubility parameters (HSP) theory. Coating dwell time tests using various solvent blends verified the accuracy of the created HSP solubility sphere. A data processing method was also developed to identify and screen potential alternative solvent blends in terms of safety, toxicity, and cost-effectiveness. The identified safer solvent blends were demonstrated to provide equivalent stripping performance as compared to DCM based coating strippers within an acceptable cost range. The results of this research will be of value to other types of conformal coatings, such as silicone and polyurethane, where DCM is commonly used in similar coating stripping operations. By safely removing conformal coating, delicate electronics would be available for re-manufacturing, enabling a circular economy.
2
Rajendran, Mohana, and Marto Giftlin. "Novel Development of Corrosion Resistant Paint Using Printed Circuit Board from Modern Electronic Wastes." Trends in Sciences 19, no. 6 (February 25, 2022): 2901. http://dx.doi.org/10.48048/tis.2022.2901.
Анотація:
The growth in the industrial technology and communication sectors has enhanced the usage of electronic gadgets exponentially. Thus, it becomes highly essential to find new solution to utilize or dispose these e-wastes, in order to reduce the e-waste generation. Various reports mentioned that the major component of these e-wastes is their Printed Circuit Boards. Therefore, a new ideology is proposed to use these boards to produce a new coating with good corrosion resistance. At first the boards were separated from the discarded electronic appliances and various electrical elements were separated from these boards. Then the plain circuit boards are pulverized into fine particles and mixed with paint in 3 different proportions ranging from 1:4 to 1:2. The resulting mix was applied over the steel specimen and tested for corrosion resistance. The assessment was done in the aspects of contact angle, weight loss percentage, potentio dynamic polarization technique and electro chemical impedance spectroscopy. From the results it was clear that increase in the addition of printed circuit powder content in the corrosion proof paint coating enhanced the efficiency of the corrosion resistant behaviour 3.5 times than the specimen with uncoated steel specimens. This development of corrosion resistant behaviour of printed circuit powder was attributed from the inertness offered by the presence of silicon dioxides towards the corrosive fluids. Although, the coating of 1:2 proved to be optimum to protect the steel elements from the aggressive corrosion environment, by considering the workability aspects the 1:3 combination was suggested for the innovative development of anti-corrosion paint coating from the e-waste resources.
HIGHLIGHTS
Life cycles of every electronic wastes end with the hazardous challenging disposals
Innovative utilizations of these electronic wastes for the corrosion resistant structural applications were detailed
An anti corrosive coating for steel reinforcement was developed from the waste printed circuit boards
Coating by printed circuit board powder enhanced 3.5 times more protection from the corrosion
GRAPHICAL ABSTRACT
3
Szocinski, Michal. "AFM-assisted investigation of conformal coatings in electronics." Anti-Corrosion Methods and Materials 63, no. 4 (June 6, 2016): 289–94. http://dx.doi.org/10.1108/acmm-09-2014-1426.
Анотація:
Purpose This paper aims to presents a new method of investigation of local properties of conformal coatings utilized in microelectronics. Design/methodology/approach It is based on atomic force microscopy (AFM) technique supplemented with the ability of local electrical measurements, which apart from topography acquisition allows recording of local impedance spectra, impedance imaging and dc current mapping. Potentialities of the proposed AFM-assisted approach have been demonstrated on commercially available epoxy-coated electronic printed boards in as-received state and after six-year service. Findings The technique proved to be capable of identification, spatial localization and characterization of conformal coating defects. Practical implications The proposed approach can be utilized for assessment of protective film state in such demanding fields as electronics or electrotechnics where the classical techniques of anticorrosion coatings investigation cannot be employed due to small element dimensions and relatively low coating thickness. Originality/value The approach adopted by the author is novel in the field of organic coatings investigation.
4
Lee, Sang, and Sangyoon Lee. "Fabrication and Characterization of Roll-to-Roll Printed Air-Gap Touch Sensors." Polymers 11, no. 2 (February 2, 2019): 245. http://dx.doi.org/10.3390/polym11020245.
Анотація:
Although printed electronics technology has been recently employed in the production of various devices, its use for the fabrication of electronic devices with air-gap structures remains challenging. This paper presents a productive roll-to-roll printed electronics method for the fabrication of capacitive touch sensors with air-gap structures. Each layer of the sensor was fabricated by printing or coating. The bottom electrode, and the dielectric and sacrificial layers were roll-to-roll slot-die coated on a flexible substrate. The top electrode was formed by roll-to-roll gravure printing, while the structural layer was formed by spin-coating. In particular, the sacrificial layer was coated with polyvinyl alcohol (PVA) and removed in water to form an air-gap. The successful formation of the air-gap was verified by field emission scanning electron microscopy (FE-SEM). Electrical characteristics of the air-gap touch sensor samples were analyzed in terms of sensitivity, hysteresis, and repeatability. Experimental results showed that the proposed method can be suitable for the fabrication of air-gap sensors by using the roll-to-roll printed electronics technology.
5
Pfeiffenberger, Neal T., and Saeid Biria. "Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000281–85. http://dx.doi.org/10.4071/1085-8024-2021.1.000281.
Анотація:
Abstract Conformal coatings are thin polymeric layers applied on (RF)/microwave printed circuit boards, chips, dies and other electronic components to protect them from moisture and corrosion. Despite this protection, exposure to excessive humidity can cause delamination, increase dissipation factors and dielectric constants of the coating, and changing circuit switching-speed. In this paper, we will discuss dielectric performance of UVA LED-curable resin formulations with enhanced flexibility and adhesion as a new approach compared to traditional mercury UV curable conformal coatings. These advances reduce the potential for delamination, delivering greater protection of different applications, especially those for extreme environments.
6
Tantrairatn, Suradet, Paphakorn Pitayachaval, Sirisak Rangklang, and Jiraphon Srisertpol. "A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength." Advanced Materials Research 421 (December 2011): 489–92. http://dx.doi.org/10.4028/www.scientific.net/amr.421.489.
Анотація:
In electronic flexible printed circuit (E-FPC) manufacturing procedure, the cover laminating process in which the line circuit (copper wire) is covered with hot cover layer on the printed circuits is importance process. This process will help to increase elasticity, strength and corrosion protection to the product therefore this process can affect directly to quality of the printed circuit. The process for laminating printed circuits can be classified into two methods by coating with industry iron and hot bar machine. This article compares the quality of the electrical circuit between industry iron and hot bar machine methods in the cover coating process by using Peeling Strength to indicate the quality in the same temperature and time condition. The experimental result illustrates the electrical circuits using the hot bar machine method give Peeling Strength value in the acceptable range and the laminating surface of circuits is smooth and uniform. On the other hand, Peel Strength value of electrical circuits using the industry iron method is unsteady and lower than the acceptable range. Moreover the result circuit product has wrinkled coating surface and become the waste product.
7
Kellomäki, Tiiti, Johanna Virkki, Sari Merilampi, and Leena Ukkonen. "Towards Washable Wearable Antennas: A Comparison of Coating Materials for Screen-Printed Textile-Based UHF RFID Tags." International Journal of Antennas and Propagation 2012 (2012): 1–11. http://dx.doi.org/10.1155/2012/476570.
Анотація:
(Radio frequency identification) RFID tags integrated into clothing enable monitoring of people without their conscious effort. This requires tags to be an unnoticeable part of clothing and comfortable to wear. In this study, RFID antennas were screen printed on two different fabrics, six different coating materials for the (integrated circuits) ICs were applied, and the reliability of these RFID tags was tested with moisture and laundry tests. Generally, glue-type coating materials were easier to handle and could be spread precisely. All the tags were operational immediately after the coatings were applied, and five of the coating materials were seen to protect the IC from detaching in the laundry. It was found that the uneven fabric surface caused discontinuities and breaks in narrow conductors, and thus hard coatings may also be needed to keep the tag from breaking in laundry.
8
Park, Won-Tae, and Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics." Journal of Materials Chemistry C 5, no. 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.
9
Senophiyah-Mary, J., R. Loganath, and T. Meenambal. "A novel method for the removal of epoxy coating from waste printed circuit board." Waste Management & Research: The Journal for a Sustainable Circular Economy 36, no. 7 (June 20, 2018): 645–52. http://dx.doi.org/10.1177/0734242x18782392.
Анотація:
The printed circuit board, which is the heart of all electronic devices, is a rich source of metal, which could act as a future resource. Bioleaching, a biological treatment, would be an appropriate method for the environmentally sound management of e-waste. Various strippers are used to remove the epoxy coating and it is harmful to remove the epoxy coating with those solvents and salts in the open because of the presence of brominated flame retardants on the surface of the printed circuit board, which leads to serious health issues. An alternate process is required to remove the epoxy coating thereby enhancing the bioleaching process. Sonication is the process of applying sound energy to agitate particles in a solvent bath. The combined process of sonication and solvent stripping in a closed environment could decrease the time for stripping the epoxy coating. An attempt has been made to optimise the stripping agent for the removal of epoxy coating and from the experiment it was found that bath sonication could easily remove the epoxy coating from the waste printed circuit board with no emission of toxic gases. An optimum time of 5 min was enough for the stripping process prior to the soak time of 8 h at 5 N NaOH solution, while a longer time and high concentration of chemicals would be required to remove the epoxy coating with usual methods.
10
Nmadu, D., N. C. Eli-Chukwu, U. U. Uma, O. E. Ogah, A. A. Parshuto, M. I. Eheduru, S. I. Ezichi, and C. N. Ogbonna-Mba. "Using High Voltage Electrochemical Oxidation (HVEO) to obtain protective coatings, surface finishing on electronic materials." Digest Journal of Nanomaterials and Biostructures 17, no. 2 (April 2022): 569–77. http://dx.doi.org/10.15251/djnb.2022.172.569.
Анотація:
Electronics and microelectronic components such as printed circuit board, capacitors, CPU heat sinks, hard drive, etc. commonly encounter harsh environmental conditions during their operational lifetime. To protect the electronics materials from conditions like corrosion, wear, humidity and contaminants, aluminium protective coating materials can be used. However, the behavior of materials in harsh environments and their effect on the reliability of electronics in industrial products has been studied only very little. Moreover, the changes in the parameters (current density, temperature and time) of commonly used aluminium under various conditions remain largely unknown. In this paper, High Voltage Electrochemical Oxidation (HVEO) was used to produce a high microhardness of 440HV and high surface thickness of up to 44µm oxide coatings on aluminum alloy AMg2 (analogues of 5052-H32 alloy) for electronic components protection. The process was carried out in electrolyte of tartaric acid and sulfuric acid as an electrolyte under constant duration for each sample and various anodizing temperatures and current densities. The samples used in the study were aluminum used for commercial electronics devices designed for use in harsh conditions.
Дисертації з теми "Printed electronic coating":
1
Mustonen, T. (Tero). "Inkjet printing of carbon nanotubes for electronic applications." Doctoral thesis, University of Oulu, 2009. http://urn.fi/urn:isbn:9789514293092.
Анотація:
Abstract
In this thesis, preparation of carbon nanotube (CNT) inks and inkjet printing of aqueous dispersions of CNTs for certain electrical applications are studied. The nanotube inks prepared in this work are based on chemically oxidized CNTs whose polar side groups enable dispersion in polar solvents. Subsequent centrifugation and decanting processes are used to obtain stable dispersions suitable for inkjet printing. The inks are based on either carboxyl functionalized multi-walled carbon nanotubes (MWCNTs), carboxyl functionalized single wall carbon nanotubes (SWCNTs) or SWCNT-polymer composites.
The applicability of MWCNT inks is firstly demonstrated as printed patterns of tangled nanotube networks with print resolution up to ∼260 dpi and surface resistivity of ∼40 kΩ/□. which could be obtained using an ordinary inkjet office printer. In addition, MWCNT inks are found to exhibit spatial ordering in external magnetic fields due to entrapped iron catalyst nanoparticles in the inner-tubular cavity of the nanotubes. Ordering of nanotubes in the inks and in drying droplets placed in relatively weak magnetic fields (B ≤ 1 T) is demonstrated and studied.
The high electrical conductivity and optical transparency properties of SWCNTs are utilized for enhancing the conductivity of transparent poly(3,4-ethylenedioxythiophene):poly(styrenesulphonate) (PEDOT:PSS) films. Polymer-nanotube composite materials are inkjet printed on flexible substrates. It is demonstrated that incorporation of SWCNTs in the thin polymer films significantly increases the electrical conductivity of the film without losing the high transparency (> 90%). The structure of composite films is studied using atomic force microscopy (AFM).
The electronic properties of deposited random SWCNT networks are studied. The amount of deposited SWCNT is controlled by the inkjet printing technique. In dense networks the current-voltage behaviour is linear whereas for sparse films the behaviour is nonlinear. It is shown that the conduction path in dense films is through the metallic nanotubes, but in sparse films the percolation occurs through random networks of metallic and semiconducting SWCNTs having Schottky-type contacts. The existence of Schottky-junctions in the films is demonstrated with field-effect transistors (FET) on Si-chips and on polymer substrates. The latter is demonstrated as fully printed transistors using a single ink as a material source. FETs are further utilized as chemical-FET sensor applications. The performance of resistive CNT sensors and their comparisons with chem-FETs in terms of selectivity are studied for H2S gas.
2
Bent, Westin R. "Evaluating the effect of conformal coatings in reducing the rate of conductive anodic filament." Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/20128.
3
Öhlund, Thomas. "Metal Films for Printed Electronics : Ink-substrate Interactions and Sintering." Doctoral thesis, Mittuniversitetet, Avdelningen för naturvetenskap, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-23420.
Анотація:
A new manufacturing paradigm may lower the cost and environmental impact of existing products, as well as enable completely new products. Large scale, roll-to-roll manufacturing of flexible electronics and other functionality has great potential. However, a commercial breakthrough depends on a lower consumption of materials and energy compared with competing alternatives, and that sufficiently high performance and reliability of the products can be maintained. The substrate constitutes a large part of the product, and therefore its cost and environmental sustainability are important. Electrically conducting thin films are required in many functional devices and applications. In demanding applications, metal films offer the highest conductivity. In this thesis, paper substrates of various type and construction were characterized, and the characteristics were related to the performance of inkjet-printed metal patterns. Fast absorption of the ink carrier was beneficial for well-defined pattern geometry, as well as high conductivity. Surface roughness with topography variations of sufficiently large amplitude and frequency, was detrimental to the pattern definition and conductivity. Porosity was another important factor, where the characteristic pore size was much more important than the total pore volume. Apparent surface energy was important for non-absorbing substrates, but of limited importance for coatings with a high absorption rate. Applying thin polymer–based coatings on flexible non-porous films to provide a mechanism for ink solvent removal, improved the pattern definition significantly. Inkjet-printing of a ZnO-dispersion on uncoated paper provided a thin spot-coating, allowing conductivity of silver nanoparticle films. Conductive nanoparticle films could not form directly on the uncoated paper. The resulting performance of printed metal patterns was highly dependent on a well adapted sintering methodology. Several sintering methods were examined in this thesis, including conventional oven sintering, electrical sintering, microwave sintering, chemical sintering and intense pulsed light sintering. Specially designed coated papers with modified chemical and physical properties, were utilized for chemical low-temperature sintering of silver nanoparticle inks. For intense pulsed light sintering and material conversion of patterns, custom equipment was designed and built. Using the equipment, inkjet-printed copper oxide patterns were processed into highly conducting copper patterns. Custom-designed papers with mesoporous coatings and porous precoatings improved the reliablility and performance of the reduction and sintering process. The thesis aims to clarify how ink-substrate interactions and sintering methodology affect the performance and reliability of inkjet-printed nanoparticle patterns on flexible substrates. This improves the selection, adaptation, design and manufacturing of suitable substrates for inkjet-printed high conductivity patterns, such as circuit boards or RFID antennas.
4
Åkerfeldt, Maria. "Electrically conductive textile coatings with PEDOT:PSS." Doctoral thesis, Högskolan i Borås, Akademin för textil, teknik och ekonomi, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:hb:diva-19.
Анотація:
In smart textiles, electrical conductivity is often required for several functions, especially contacting (electroding) and interconnecting. This thesis explores electrically conductive textile surfaces made by combining conventional textile coating methods with the intrinsically conductive polymer complex poly(3,4-ethylene dioxythiophene)-poly(styrene sulfonate) (PEDOT:PSS). PEDOT:PSS was used in textile coating formulations including polymer binder, ethylene glycol (EG) and rheology modifier. Shear viscometry was used to identify suitable viscosities of the formulations for each coating method. The coating methods were knife coating, pad coating and screen printing. The first part of the work studied the influence of composition of the coating formulation, the amount of coating and the film formation process on the surface resistivity and the surface appearance of knife-coated textiles. The electrical resistivity was largely affected by the amount of PEDOT:PSS in the coating and indicated percolation behaviour within the system. Addition of a high-boiling solvent, i.e. EG, decreased the surface resistivity with more than four orders of magnitude. Studies of tear strength and bending rigidity showed that textiles coated with formulations containing larger amounts of PEDOT:PSS and EG were softer, more ductile and stronger than those coated with formulations containing more binder. The coated textiles were found to be durable to abrasion and cyclic strain, as well as quite resilient to the harsh treatment of shear flexing. Washing increased the surface resistivity, but the samples remained conductive after five wash cycles. The second part of the work focused on using the coatings to transfer the voltage signal from piezoelectric textile fibres; the coatings were first applied using pad coating as the outer electrode on a woven sensor and then as screen-printed interconnections in a sensing glove based on stretchy, warp-knitted fabric. Sensor data from the glove was successfully used as input to a microcontroller running a robot gripper. These applications showed the viability of the concept and that the coatings could be made very flexible and integrated into the textile garment without substantial loss of the textile characteristics. The industrial feasibility of the approach was also verified through the variations of coating methods.
5
Leopold, Diatezo. "Multifunctional materials for intelligent textile : Toward automotive applications." Electronic Thesis or Diss., Lyon, INSA, 2023. http://www.theses.fr/2023ISAL0114.
Анотація:
Ce projet de recherche de doctorant concerne l’élaboration et l’utilisation de matériaux multifonctionnels imprimable, en mettant l’accent sur les compromis entre propriétés matériaux et spécification applicative, avec un focus autour des fonctions de chauffage par effet joule et d’électroluminescence. L’originalité des travaux repose sur une approche couplée entre matériaux multifonctionnels et intégration textile. Le premier point de l’étude concerne la sélection des matériaux multifonctionnels jugés comme potentiellement intéressants pour la création de textiles intelligents adaptés aux secteurs cibles de la société TESCA-groupe. Cette sélection impliquait la caractérisation des propriétés électriques et thermiques des matériaux conducteurs ainsi que du substrat textile. De plus, des analyses à l'aide d'appareils de microscopie électronique à balayage (MEB)/ spectroscopie à dispersion d'énergie (EDS) et diffraction de rayon X (DRX) étaient effectuées pour étudier la microstructure, notamment l'adhérence, l'épaisseur des couches déposées et la composition chimique des matériaux. Le second aspect met l’accent sur une étude du vieillissement accéléré sur des éprouvettes unitaires des substrats textiles revêtus d'encre conductrice, en conformité avec les spécifications requises de la société Tesca. L'objectif de cette démarche était d'identifier les limites inhérentes à chaque matériau, telles que la déformation maximale, les variations de température, l'adhérence, la compatibilité des processus, etc., dans le but de proposer des axes d'optimisation ou de tenir compte de ces limitations lors de la conception des transducteurs intégrés sur substrat textile. Cette première étape nous permettait d'établir une base de matériaux multifonctionnels pouvant être utilisés pour des applications spécifiques, telles que les nappes chauffantes, les interrupteurs capacitifs ou résistifs, les transducteurs, les capteurs de grandeurs mécaniques, entre autres. Le troisième volet de cette recherche consistait à assembler ces éléments de base pour créer des sous-fonctions qualifiées d’intelligente. En effet, la réalisation de transducteurs impliquait généralement la combinaison de différents matériaux multifonctionnels afin de répondre aux exigences spécifiques de l'application viséeThis PhD student research project concerns the development and use of printable multifunctional materials, focusing on the trade-offs between material properties and application specification, with a particular emphasis on joule heating and electroluminescence functions. The originality of the work lies in a coupled approach between multifunctional materials and textile integration. The first part of the study concerned the selection of multifunctional materials deemed potentially interesting for the creation of intelligent textiles adapted to TESCA-groupe's target sectors. This involved characterizing the electrical and thermal properties of both the conductive materials and the textile substrate. In addition, analyses using scanning electron microscopy (SEM)/energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) were carried out to study the microstructure, including adhesion, the thickness of the deposited layers and the chemical composition of the materials. The second aspect focused on an accelerated ageing study on unit specimens of textile substrates coated with conductive ink, in compliance with the specifications required by Tesca. The aim of this approach was to identify the inherent limitations of each material, such as maximum deformation, temperature variations, adhesion, process compatibility, etc., with a view to proposing areas for optimization or taking these limitations into account when designing transducers integrated on textile substrates. This first step enabled us to establish a base of multifunctional materials that could be used for specific applications, such as heating mats, capacitive or resistive switches, transducers, sensors for mechanical quantities, among others. The third aspect of this research consisted in assembling these basic elements to create sub-functions described as "intelligent". In fact, the production of transducers generally involved combining different multifunctional materials to meet the specific requirements of the target application
Книги з теми "Printed electronic coating":
1
Dunn, Barrie D. Evaluation of conformal coatings for future spacecraft applications. Paris, France: European Space Agency, 1994.
Частини книг з теми "Printed electronic coating":
1
Tan, Loon-Seng. "Poly(amide imide)." In Polymer Data Handbook, 347–55. Oxford University PressNew York, NY, 2009. http://dx.doi.org/10.1093/oso/9780195181012.003.0056.
Анотація:
Abstract Major Applications A wide variety of injection-molded automotive parts such as housings, connectors, switches, relays, thrust washers, spline liners, valve seats, bushings, piston rings and seals, wear rings, ball bearings, rollers, thermal insulators etc.; laminated parts such as printed circuit boards, honeycomb core, radomes, etc.; coating for magnet wires; mechanical parts for business machines; aerospace applications such as jet-engine components, compressor and generator parts, and electronic devices; hydraulic/pneumatic parts such as bushings, seals, vanes, and flow-control parts.
2
Tiancheng Wei, Wei, Yu Sun, and Eunkyoung Shim. "Progress of Recycled Polyester in Rheological Performance in Molding, and Economic Analysis of Recycled Fibers in Fashion and Textile Industry." In Next-Generation Textiles [Working Title]. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.103864.
Анотація:
In textiles, in particular wearable technology structured, battery-illuminated electronic fabrics are moving toward to both electrical and esthetic aspects of printed LED (PLED) textiles. It is on one dimension that have had questioned an economic resolution of extensional methods as for battery-charged interior materials, and also has gained a more general questions on how to develop its recycle both yarn and fiber as traditional raw goods in together with any recyclable electronic parts or graphene, carbon nanotube contained components with that textile materials. Furthermore, recyclable assembled electronic parts back to the renewable materials are continuous moving in the low-energy, high-reusable rate evaluation in the lifecycle assessment (LCA) of them. Specifically, during the de-sulfurization and decoloring in the post-production processing in the quick removal of active carbon fiber or nanoparticle coating on surface of fiber-porous geo-matrix could advance the renewing production efficiency. In assumption of low-energy and high-conductible transformation from off-market polyester with dyes or metallic yarns for polyester in e-textiles, recyclable conductive graphene/microfibers/composites are articulated, as far as industrial lifecycle management of braided, fibers, and ultra-high-density polyethylene has impeccable performance in the high mechanical property, medium rheological expansion over molding process, and high-yield strength as in the following sustainability in the wearable garment.
3
Shelley, Mee Y., and Jennifer L. Braun. "Epoxy Resins." In Polymer Data Handbook, 138–45. Oxford University PressNew York, NY, 2009. http://dx.doi.org/10.1093/oso/9780195181012.003.0023.
Анотація:
Abstract Trade Names Araldite, DER, Epi-Cure, Epi-Res, Epikote, Epon, Epotuf, etc. Class Thermoset polymers, after curing (the uncured base resins are thermoplastic) Major Resin Types DGEBA (diglycidyl ether of bisphenol A), novolacs, peracid resins, hydantoin resins, etc. Other Ingredients in Epoxy Formulation Diluents, resinuous modifiers (to affect flexibility, toughness, peel strength, adhesion, etc.), fillers, colorants and dyes, other additives (e.g., rheological additives, flame retardants). Major Applications Protective coatings (for appliance, automotive primers, pipes, etc.). Encapsulation of electrical and electronic devices. Adhesives. Bonding materials for dental uses. Replacement of welding and riveting in aircraft and automobiles. In composites for materials in space industry, printed circuitry, pressure vessels and pipes. Construction uses such as flooring, paving, and airport runway repair.
Тези доповідей конференцій з теми "Printed electronic coating":
1
Gorges, Roger, William Bisgrove, Ryan Curtis, Jeff Carter, James W. George, Jonathan Ritchie, Ingo Wirth, Volker Zoellmer, and Tim Rusch. "Integration of Printed Sensors in Plain Engine Bearings." In ASME 2018 Internal Combustion Engine Division Fall Technical Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/icef2018-9545.
Анотація:
The integration of sensors in engine components has been a long-standing wish of engine manufacturers and researchers. Conventional probes are particularly difficult to mount in moving engine parts and require time-intensive and costly preparation, while often still not reaching the site of interest close enough. The advances recently made in the field of printed electronics enable new possibilities for sensor integration that previously were not possible. Particularly, crankshaft engine bearings are an interesting component to apply those new sensors to. An important enabling factor for the successful sensor integration has been the increasing market penetration of polymer overlays for crankshaft bearings. The driving force behind this development was the pressure from legislation to reduce CO2 emissions, which in turn brought about new technologies such as start-stop and mild hybrids. Engine components now have to operate in much more aggressive environments, which in many cases only polymer overlays withstand. The unique application process of those coatings together with their material properties, such as robustness and non-conductivity, now allow embedding of electronic components right at the running surface of the bearings. This paper details the development of a printed sensor that has been integrated into the bearing polymer overlay coating. Various results from respective rig testing of the sensor feedback throughout different load and speed conditions during operation are reported.
2
Glassmaker, Nicholas, Ye Mi, Mukerrem Cakmak, and Ali Shakouri. "Roll to Roll Manufacturing and In-Line Imaging and Characterization of Functional Films." In ASME 2022 17th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/msec2022-85553.
Анотація:
Abstract Roll-to-roll manufacturing is a promising platform to produce low cost, high quality electrical components and sensors for Internet of Things (IoT) applications. Within the roll-to-roll laboratories at Purdue University, a range of processes and machines have been developed to: 1) print patterns of conductive and sensing materials for use in electronic sensors, 2) cast films precisely with integrated functional materials, and 3) monitor quality of the printing and casting processes in-line in real time. A major development is the custom-designed and built Maxwell coating machine, which has enabled substantial quality improvements in slot-die coatings, as demonstrated by precise in-line thickness monitoring and imaging. As an illustrative example, we will show how we converted a design for a printed ion-selective electrode from a batch process to a roll-to-roll process. In-line process monitoring of coating thickness allowed us to identify high variability in the coating thickness due to an interaction between underlying printed electrodes and the drying process. By modifying the drying process, we demonstrated a substantial improvement as evidenced by the same in-line measurement technique. The overall process integrates several existing machines and processes in a novel way to create functional parts continuously, with data on individual parts gathered in real time.
3
Huang, Mengyu, Lan Li, Chao Yuan, Bin Xie, Xingjian Yu, and Xiaobing Luo. "Simulation of stamp-printed coating process in light-emitting diodes packaging by Lattice Boltzmann method." In 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2015. http://dx.doi.org/10.1109/icept.2015.7236764.
4
Singh, Prabjit. "Arcing and Spacing Requirements for High Voltage Printed Circuit Boards." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48180.
Анотація:
The electronic hardware miniaturization trend continues unabated. The reduced feature spacing expose the high voltage power supply circuits to arcing. The power MOSFET gate to drain and the drain to source lead gaps are narrow enough for zinc whiskers emanating from under the raised floor zinc plated tiles to arc across the MOSFET leads. Arcing can also occur because of paper cellulose fibers and dust in high relative humidity environments. The physics of arcing will be presented. Paschen’s law of arcing will be described; it will be shown how the law led to a novel way of testing power supplies for propensity to arcing. Examples of application of the test, called the partial vacuum test, to power supplies will be described. Testing the integrity of conformal coating is one useful application of the partial vacuum test. A novel zinc whisker spray test, developed to determine the spacing required to avoid arcing between features at high electric potential between them, will be described and its results will be presented that verify the UL feature spacing guidelines.
5
Fenger, H. S., and T. E. Wong. "COTS BGA Thermal Fatigue Test for Avionics Applications." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35017.
Анотація:
The objectives of the present studies are to design and test representative commercial off-the-shelf plastic encapsulated microcircuits, including various types of ball grid array (BGA) components, chip scale package, and flip chip over military thermal environment. The approach is to demonstrate the solder joint reliability performance of these components through the design of an electrical daisy-chain pattern printed wiring board (PWB) assembly test vehicle (TV), in which the design and manufacturing variables are included. The variables, including the types of PWBs, conformal coating, and BGA underfilled materials, with each having either two or three levels of variation are used to address test criteria and to construct 12 different types of TV configurations. All TV configurations are then subjected to temperature cycling tests (−55°C to +125°C) while continuously monitoring solder joint integrity. Based on the measured results, a destructive physical analysis is then conducted to further isolate the failure locations and determine the failure mechanisms of the solder joints. Based on the lesson-learned from the above TV, a second TV (defined as TV2) has been designed, constructed and tested. The four selected parameters in TV2 are BGA under-fill materials, conformal coating, solder pad sizes on PWB, and BGA rework, with each also having either two or three levels of variation. Test results from these two groups of TVs indicate that the influence of these design and manufacturing parameters on fatigue life is dependent on the particular package, in some instances improving the fatigue life tenfold. All these test results are recommended to be used for calibrating BGA solder joint thermal fatigue life prediction models, which will be presented in other publications.
6
Furuta, Atsuhiro, Kazuki Honjo, and Jun Taniguchi. "Fabrication of Flexible Interposer Using Printing Method." In JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/lemp2020-8524.
Анотація:
Abstract In recent years, flexible electronic devices such as printed electronics are gathering attention. To make flexible connect between one circuit device and another circuit device, interposer is necessary. However, most of conventional interposers are not flexible, because there are made of silicon or glass substrate. To solve this problem, we have been developed fabrication process of flexible interposer. Master mold was fabricated by photolithography process. First, SU-8 resist was coated on silicon substrate with 5μm thickness. Then, photolithography process was carried out to SU-8 resist. After development, pillar shape master molds with diameters of 10 or 20 μm were obtained. After release coating of master molds, hole patterns for vias were transferred by UV nanoimprint lithography. The obtained hole patterns were diameter of 10 μm or 20 μm, and pitch of 21.0 μm and 40.1 μm, respectively. Next, these holes were filled with silver ink by roll press method. Then, sintering process was carried out to evaporate of solvent of silver ink. After that, flexible interposer was obtained. As a result, we have been succeeded in filling the holes array with silver ink. Obtained interposer vias, which were silver region, were 8.2 μm diameter and 3.3 μm height, or 20.3 μm diameter and 5.3 μm height for 10 mm square size.
7
Wong, T. E., C. Y. Lau, L. A. Kachatorian, H. S. Fenger, and I. C. Chen. "Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-32827.
Анотація:
The objective of the present study is to evaluate the impact of electronic packaging design/manufacturing process parameters on the thermal fatigue life of ball grid array (BGA) solder joints. The four selected parameters are BGA under-fill materials, conformal coating, solder pad sizes on printed wiring board, and BGA rework, with each having either two or three levels of variation. A test vehicle (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed and fabricated, and then subjected to temperature cycling (−55°C to +125°C) with continuous monitoring of solder joint integrity. The total of 15 experimental cases is used in the present study. Based on monitored results, a destructive physical analysis is conducted to further isolate the failure locations and determine the failure mechanisms of the solder joints. Test results indicate that the influence of these design parameters on fatigue life is dependent on the particular package, in some instances improving the fatigue life tenfold.
8
Cho, Sungdong, Jin-Gul Hyun, and Kuyng-Wook Paik. "Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35149.
Анотація:
Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electronic package systems. High dielectric constant epoxy/ceramic composites have been of great interest as embedded capacitor materials, because they have good process compatibility with multilayer organic substrates applications such as printed circuit boards (PCBs). In this work, it was demonstrated that low (less than ±5%) tolerance epoxy/BaTiO3 composite capacitors were successfully fabricated on PCBs using newly developed embedded capacitor films (ECFs), which were composed of specially formulated epoxy resin, latent curing agent, and BaTiO3 powders. And some properties of the capacitors were characterized. Compared with the dielectric layer formation method by spin coating using epoxy/BaTiO3 suspension, ECFs have excellent advantages such as lower (<5%) capacitance tolerance over large area, no waste of materials, good film formation capability, and processability, long shelf life, and good thermo-mechanical stability after final epoxy cure. Dielectric constant about 93 was obtained using two different size BaTiO3 powders mixture. Epoxy resin formulation, curing agent, solvents, and dispersant were optimized to produce good film formation capability, fast curing characteristics at 180°C within 5 minutes, good BaTiO3 powder dispersion control, and excellent shelf life for handling. And the effects of BaTiO3 particle size and BaTiO3 powder content on dielectric constant and adhesion strength were investigated. These capacitor films can be embedded on selective areas of PCBs during build-up processes or other substrates such as Si wafers and ceramic substrates.
9
Beyler Çiğil, Aslı, Hatice Birtane, and Okan Esentürk. "Preparation of conductive and flame-retardant PU/GO/DOPO printed films." In 11th International Symposium on Graphic Engineering and Design. University of Novi Sad, Faculty of technical sciences, Department of graphic engineering and design, 2022. http://dx.doi.org/10.24867/grid-2022-p13.
Анотація:
Printed electronics are emerging technology products that we use in every moment of our daily lives. It is used in many fields from health, textile, electronics to communication. Inks with nanometal or organic content can be used in printed electronics. The ability of printed electronics to withstand temperature makes its use widespread in the electronics industry. Main aim of the study is to combine surface modified graphene oxide-based conductive inks with flame retardant materials. In this study, an effective and simple approach for the preparation of polyurethane acrylate (PUA) screen printing ink containing surface modified reduced graphene oxide (rGO) which has flame retardant activity. A new and effective flame-retardant additive; 9,10-dihydro-9,10-oxa-10-phosphaphenanthrene-10-oxide (DOPO), silane coupling agent and reduced graphene oxide was synthesized. In this synthesis, first reduced graphene oxide was modified with (methacryloyloxy)propyltrimethoxysilane, and then reacted with DOPO to obtain a flame-retardant monomer containing P and Si. Based on the successful modification reactions, screen-printing ink containing polyurethane acrylate and different amounts of modified graphene oxide content (0, 5 and 10 wt%) were prepared and screen printed on the paper surface. In addition, coatings were made on the paper surface to determine some the properties. LOI values, thermal properties, contact angle values, conductivity and surface properties of the obtained prints and coatings films were investigated. As a result, conductive screen-printing ink resistant to high temperatures was successfully produced and printed coatings and free films were formed.
10
Lall, Pradeep, Kalyan Dornala, Jeff Suhling, and John Deep. "Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74322.
Анотація:
Electronics components operating under extreme thermo-mechanical stresses are often protected with conformal coating and potting encapsulation to isolate the thermal and vibration shock loads. Development of predictive models for high-g shock survivability of electronics requires the measurement of the interface properties of the potting compounds with the printed circuit board materials. There is scarcity of interface fracture properties of porting compounds with printed circuit board materials. Potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. The cured potting materials are prone to interfacial delamination under dynamic shock loading which in turn potentially cause failures in the package interconnects. The study of interfacial fracture resistance in PCB/epoxy potting systems under dynamic shock loading is important in mitigating the risk of system failure in mission critical applications. In this paper three types of epoxy potting compounds were used as an encapsulation on PCB samples. The potting compounds were selected on the basis of their ultimate elongation under quasi-static loading. Potting compound, A is stiffer material with 5% of ultimate elongation before failure. Potting compound, B is a moderately stiff material with 12% ultimate elongation. Finally potting compound C is a softer material with 90% ultimate elongation before failure. The fracture properties and interfacial crack delamination of the PCB/epoxy interface was determined using three-point bend loading with a pre-crack in the epoxy near the interface. The fracture toughness and crack initiation of the three epoxy systems was compared with the cure schedule and temperature. Fracture modeling was performed with crack tip elements in ABAQUS finite element models to determine the crack initiation and interfacial stresses. A comparison of the fracture properties and the performance of epoxy system resistance to delamination was shown through the three-point bend tests. The finite element model results were correlated with the experimental findings.
Звіти організацій з теми "Printed electronic coating":
1
Delwiche, Michael, Boaz Zion, Robert BonDurant, Judith Rishpon, Ephraim Maltz, and Miriam Rosenberg. Biosensors for On-Line Measurement of Reproductive Hormones and Milk Proteins to Improve Dairy Herd Management. United States Department of Agriculture, February 2001. http://dx.doi.org/10.32747/2001.7573998.bard.
Анотація:
The original objectives of this research project were to: (1) develop immunoassays, photometric sensors, and electrochemical sensors for real-time measurement of progesterone and estradiol in milk, (2) develop biosensors for measurement of caseins in milk, and (3) integrate and adapt these sensor technologies to create an automated electronic sensing system for operation in dairy parlors during milking. The overall direction of research was not changed, although the work was expanded to include other milk components such as urea and lactose. A second generation biosensor for on-line measurement of bovine progesterone was designed and tested. Anti-progesterone antibody was coated on small disks of nitrocellulose membrane, which were inserted in the reaction chamber prior to testing, and a real-time assay was developed. The biosensor was designed using micropumps and valves under computer control, and assayed fluid volumes on the order of 1 ml. An automated sampler was designed to draw a test volume of milk from the long milk tube using a 4-way pinch valve. The system could execute a measurement cycle in about 10 min. Progesterone could be measured at concentrations low enough to distinguish luteal-phase from follicular-phase cows. The potential of the sensor to detect actual ovulatory events was compared with standard methods of estrus detection, including human observation and an activity monitor. The biosensor correctly identified all ovulatory events during its testperiod, but the variability at low progesterone concentrations triggered some false positives. Direct on-line measurement and intelligent interpretation of reproductive hormone profiles offers the potential for substantial improvement in reproductive management. A simple potentiometric method for measurement of milk protein was developed and tested. The method was based on the fact that proteins bind iodine. When proteins are added to a solution of the redox couple iodine/iodide (I-I2), the concentration of free iodine is changed and, as a consequence, the potential between two electrodes immersed in the solution is changed. The method worked well with analytical casein solutions and accurately measured concentrations of analytical caseins added to fresh milk. When tested with actual milk samples, the correlation between the sensor readings and the reference lab results (of both total proteins and casein content) was inferior to that of analytical casein. A number of different technologies were explored for the analysis of milk urea, and a manometric technique was selected for the final design. In the new sensor, urea in the sample was hydrolyzed to ammonium and carbonate by the enzyme urease, and subsequent shaking of the sample with citric acid in a sealed cell allowed urea to be estimated as a change in partial pressure of carbon dioxide. The pressure change in the cell was measured with a miniature piezoresistive pressure sensor, and effects of background dissolved gases and vapor pressures were corrected for by repeating the measurement of pressure developed in the sample without the addition of urease. Results were accurate in the physiological range of milk, the assay was faster than the typical milking period, and no toxic reagents were required. A sampling device was designed and built to passively draw milk from the long milk tube in the parlor. An electrochemical sensor for lactose was developed starting with a three-cascaded-enzyme sensor, evolving into two enzymes and CO2[Fe (CN)6] as a mediator, and then into a microflow injection system using poly-osmium modified screen-printed electrodes. The sensor was designed to serve multiple milking positions, using a manifold valve, a sampling valve, and two pumps. Disposable screen-printed electrodes with enzymatic membranes were used. The sensor was optimized for electrode coating components, flow rate, pH, and sample size, and the results correlated well (r2= 0.967) with known lactose concentrations.