Статті в журналах: "Power Electronics Reliability"

1

Iannuzzo, Francesco, and Mauro Ciappa. "Reliability issues in power electronics." Microelectronics Reliability 58 (March 2016): 1–2. http://dx.doi.org/10.1016/j.microrel.2016.01.012.

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2

White, Robert V. "Advancing Power Electronics Reliability [White Hot]." IEEE Power Electronics Magazine 8, no. 2 (June 2021): 100–99. http://dx.doi.org/10.1109/mpel.2021.3075786.

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3

Scheuermann, U. "Reliability challenges of automotive power electronics." Microelectronics Reliability 49, no. 9-11 (September 2009): 1319–25. http://dx.doi.org/10.1016/j.microrel.2009.06.045.

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4

Pires, Igor Amariz, Rafael Atila Silva, Anderson Vagner Rocha, Matheus Pereira Porto, Thales Alexandre Carvalho Maia, and Braz de Jesus Cardoso Filho. "Oil Immersed Power Electronics and Reliability Enhancement." IEEE Transactions on Industry Applications 55, no. 4 (July 2019): 4407–16. http://dx.doi.org/10.1109/tia.2019.2915276.

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5

Lu, Hua, Chris Bailey, and Chunyan Yin. "Design for reliability of power electronics modules." Microelectronics Reliability 49, no. 9-11 (September 2009): 1250–55. http://dx.doi.org/10.1016/j.microrel.2009.07.055.

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6

Jiao, Chaoqun, Juan Zhang, Zhibin Zhao, Zuoming Zhang, and Yuanliang Fan. "Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices." Sensors 19, no. 19 (September 26, 2019): 4176. http://dx.doi.org/10.3390/s19194176.

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With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

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7

Zeng, Jia Si, Yi Bo Gao, Feng Yang, Xi Dong Xu, Peng Qiu, Yi Lu, and Xiao Ming Huang. "Reliability Evaluation of Mid-Voltage DC Distribution Network with Multiple Topologies." Applied Mechanics and Materials 666 (October 2014): 112–18. http://dx.doi.org/10.4028/www.scientific.net/amm.666.112.

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With the development of power electronics, DC distribution network has advantages in power supplying for DC loads, saving transmission loss of reactive power and improving power quality, when compared with traditional AC distribution network. Since DC distribution network has several multiple topologies, lots of power electronic components and DGs, the traditional reliability evaluation methods aren’t applicable any more. Hence, the reliability models of power electronics and DGs are built in this paper, and a hybrid method combining minimum-cut with non-sequential Monte Carlo is presented. Moreover, three topologies of mid-voltage DC distribution network are designed based on IEEE RBTS bus6, by which the feasibility of the method is validated. Results show that two-terminal network is more reliable than radial and looped network.

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8

Zacharias, Peter. "Design and Applications of Controllable Magnetic Devices in Power Electronic Circuits and Power Systems." Journal of Electronics and Advanced Electrical Engineering 1, no. 2 (May 3, 2021): 6–14. http://dx.doi.org/10.47890/jeaee/2020/peterzacharias/11120007.

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Magnetic components are characterized by high robustness and reliability. Controllable magnetic components, which used to dominate, have been out of fashion for about 50 years. However, they have great advantages in terms of longevity, radiation resistance and overload capacity and become smaller and smaller with increasing operating frequency. This makes them interesting in modern power electronics applications with the increasing use of WGB semiconductors. The article shows how the performance of power electronic converters can be improved with modern power electronics and with field-controlled magnetic components using modern magnetic materials. Keywords: Magnetic components; Passive components; Modelling; Magnetic amplifiers; Controllable filters;

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9

Hozoji, Hiroshi, Fumiki Kato, So Tanaka, Jiro Shinkai, and Hiroshi Sato. "Power Electronics Packaging Materials for High Heat Reliability." Journal of The Japan Institute of Electronics Packaging 24, no. 3 (May 1, 2021): 233–40. http://dx.doi.org/10.5104/jiep.24.233.

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10

Gurav, Abhijit, John Bultitude, John McConnell, and Reggie Phillips. "Robust Reliability of Ceramic Capacitors for Power Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000138–42. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000138.

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Abstract For applications using Wide Band Gap (WBG) semiconductors, and for electronics for down-hole drilling, oil exploration, geothermal energy generation and power electronics, there is a growing need for capacitors that have robust reliability at temperatures of 125°C, 150°C or above. The development of more energy efficient power converters and inverters based on WBG semiconductors is driving the adoption of higher temperatures in a growing number of power electronics and automotive circuits since these operate at higher junction temperatures than traditional silicon. This has led to a growing need for high temperature capacitors with robust reliability. A Class-I C0G dielectric has been developed using Nickel electrodes for high temperature application up to 200°C and beyond. Since it is a paraelectric linear dielectric, these capacitors exhibit highly stable capacitance as a function of temperature and voltage, possess low loss (DF) and can conduct high RMS currents with a low temperature rise compared to other capacitor solutions. To maximize the capacitance density and achieve a high degree of mechanical robustness, stacks and leaded form factors are commonly needed. Materials for assembly of stacks are of interest due to the challenge of higher cost of attachment materials based on gold-solders or nano-silver pastes, as well as due to the presence of lead (Pb) in common high melting point (HMP) solders. This paper will report electrical properties and reliability test data on these Class-I C0G ceramic capacitors and stacks at high temperatures. It will also review thermal robustness and electrical characteristics of stacks assembled using Pb-free transient liquid phase sintering (TLPS) materials based on Sn-Cu and In-Ag.

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11

Mestha, Soumya Rani, and Pinto Pius A.J. "Investigation of reliability assessement in power electronics circuits using machine learning." International Journal of Power Electronics and Drive Systems (IJPEDS) 12, no. 1 (March 1, 2021): 558. http://dx.doi.org/10.11591/ijpeds.v12.i1.pp558-566.

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<p>Recent advances in power electronics (PE) and machine learning (ML) have prompted the technologists to adapt these new technologies to improve the reliability of PE systems. During the process, a lot of investigations on the performance and reliability of PE systems is carried out. The intention of this paper is to present a comprehensive study of advances in the field of reliability of PE systems using machine learning. Recent publications in this regard are analysed and findings are tabulated. In addition to this, literatures published in the prediction of remaining useful life (RUL) of power electronic components is discussed with emphasis on its limitations.</p>

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12

Brewer, Roger. "High Reliability Electronics for Demanding Aircraft Applications – An Overview." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (January 1, 2016): 000011–17. http://dx.doi.org/10.4071/2016-hitec-11.

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Abstract The primary form of generated power on any typical aircraft (Tactical, Airlift, Commercial) requires conversion in multiple different forms (voltage levels, aircraft compliant frequency) and at various power levels to meet the total needs of the vehicle. DC:AC Power Conversion (Inverters), AC-DC Generator (conditioning) electronics, AC-AC frequency conditioning and DC:DC Power Conversion are all forms of conversion within the power system (primary, secondary tiers) typical of any aircraft. Additionally, within the power distribution network often solid state power switches in later generation aircraft and fighters are used to control and manage power (control power ramp-up for example) to loads and isolate electrical faults. The conditioning, conversion and control of this power with high reliability devices can often occur in more extreme environments (high temperatures, high vibration and confined spaces) and can present challenging issues for aerospace and specifically aircraft. Weight objectives can further add to the challenges. This paper will discuss, at largely a level based on acquired and compiled lessons learned, some of the aforementioned challenges including the susceptibility to both electrically and mechanically induced failure modes in power devices encountered in aircraft. The paper will also discuss the notion that while Wide Band Gap (WBG) technology may be the right answer in some/many applications, it may not be the answer in achieving high reliability given a specific combination of application and operating conditions. Reliability issues can be focused around: a) packaging optimization, b) manufacturing tolerances and c) selecting the right vendor to do the job. Further, the ability to receive adequate forms of cooling from the aircraft (if not otherwise constrained and if cooling margins permit) to power electronics will also be discussed as an obvious and significant driver in maintaining high reliability and integrity in more demanding (and higher power) applications. Trade assessments that can occur with specific generator electronics will be discussed at a non-specific, and generalized, level. The main body of the paper will be concluded with a discussion on the potential application of WBG technology in a variety of applications mentioned for aircraft while pointing out unique aspects that may be relevant in the future adoption of this technology. Finally, a conclusion will be provided reiterating various points throughout the paper and areas of potential follow-on activity.

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13

Calleja, Hugo, and Freddy Chan. "Reliability: A Neglected Topic in the Power Electronics Curricula." Journal of Power Electronics 10, no. 6 (November 20, 2010): 660–66. http://dx.doi.org/10.6113/jpe.2010.10.6.660.

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14

Dababneh, Amer B., Ben Goerdt, Timothy Marler, and Ibrahim T. Ozbolat. "A Virtual Prognostic Tool for Nuclear Power Electronics Reliability." Computer-Aided Design and Applications 11, no. 2 (October 30, 2013): 228–38. http://dx.doi.org/10.1080/16864360.2014.846097.

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15

Persons, Ryan, and Paul Gundel. "Print Copper on Ceramic for High Reliability Electronics." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000330–35. http://dx.doi.org/10.4071/isom-2015-wp12.

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In the power electronics world, Direct Bonded Copper (DBC) is the primary substrate technology. In this paper, we will discuss an alternative technology utilizing screen printable copper pastes (Thick Printed Copper - TPC) on a variety of substrate technologies including Alumina (Al2O3) and Aluminum Nitride (AlN). These materials when processed, look and perform similar to DBC, but exhibit superior reliability and excellent design flexibility. DBC has drawbacks when it comes to thermal mechanical reliability and lacks the flexibility to have multiple copper thicknesses for power and signal circuits within the same design, which is easily achieved via screen printing. The benefits of this TPC system will be demonstrated through data generated on passive thermal shock tests in comparison to high end DBC. Furthermore, this Thick Print Copper technology has the excellent potential for replacing high end Metal Core Printed Circuit Board (MCPCB) technology due to utilization of higher thermal conductive dielectric materials like Al2O3 and AlN. This will allow for designers to drive their LED's harder and effectively producing LED modules with higher power densities.

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16

Blaabjerg, Frede, and Michael M. Pecht. "Special Issue on Robust Design and Reliability of Power Electronics, IEEE Transactions on Power Electronics, May 2015." IEEE Transactions on Power Electronics 30, no. 5 (May 2015): 2373–74. http://dx.doi.org/10.1109/tpel.2014.2376271.

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17

OKABE, Nagatoshi, Mitsuyoshi TSUTSUMI, and Xia ZHU. "Testing Method and Reliability Design of Reliability Estimation in Mounting Power Electronics Semiconductor." Proceedings of the 1992 Annual Meeting of JSME/MMD 2002 (2002): 253–54. http://dx.doi.org/10.1299/jsmezairiki.2002.0_253.

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18

Drobnik, Joe, and Praveen Jain. "Electric and Hybrid Vehicle Power Electronics Efficiency, Testing and Reliability." World Electric Vehicle Journal 6, no. 3 (September 27, 2013): 719–30. http://dx.doi.org/10.3390/wevj6030719.

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19

Khazaka, R., L. Mendizabal, D. Henry, and R. Hanna. "Survey of High-Temperature Reliability of Power Electronics Packaging Components." IEEE Transactions on Power Electronics 30, no. 5 (May 2015): 2456–64. http://dx.doi.org/10.1109/tpel.2014.2357836.

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20

Teixeira, Tiago M. L., and Juan Bevan. "Product Development of High Power Electronics for High Reliability Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (July 1, 2017): 000213–17. http://dx.doi.org/10.4071/2380-4491.2017.hiten.213.

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Abstract: The goal of this study was to achieve an improvement on power conversion based on SiC High Power Electronic devices at high temperature (+220°C). Two different devices (a SiC Schottky Diode & a Schottky Diode Bridge Rectifier) were studied using different substrates, die attach materials and die. Positive results were achieved; it was found a strong relationship between wire bond strength and die attach material; it was evident the two different die chosen for the study resulted in different electrical performance on the devices; and that, from the arrays of tests, there was no evident data to prefer one of the two substrates chosen for the study.

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21

Bayerer, Reinhold. "Advanced packaging yields higher performance and reliability in power electronics." Microelectronics Reliability 50, no. 9-11 (September 2010): 1715–19. http://dx.doi.org/10.1016/j.microrel.2010.07.016.

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22

Ishizaki, T., A. Kuno, A. Tane, M. Yanase, F. Osawa, T. Satoh, and Y. Yamada. "Reliability of Cu nanoparticle joint for high temperature power electronics." Microelectronics Reliability 54, no. 9-10 (September 2014): 1867–71. http://dx.doi.org/10.1016/j.microrel.2014.07.113.

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23

Arifujjaman, Md, M. T. Iqbal, and J. E. Quaicoe. "Reliability analysis of grid connected small wind turbine power electronics." Applied Energy 86, no. 9 (September 2009): 1617–23. http://dx.doi.org/10.1016/j.apenergy.2009.01.009.

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24

Pang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (April 16, 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.

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The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal conductivity materials as well as structural modifications to the current module structure while not adding complexity to the fabrication process to reduce the cost.

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25

Novak, M., A. Sangwongwanich, and F. Blaabjerg. "Monte Carlo-Based Reliability Estimation Methods for Power Devices in Power Electronics Systems." IEEE Open Journal of Power Electronics 2 (2021): 523–34. http://dx.doi.org/10.1109/ojpel.2021.3116070.

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26

Wassick, Thomas A. "Electromigration in Lead – Free Solder: A Power IC Perspective." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000753–57. http://dx.doi.org/10.4071/isom-2013-wp61.

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Over the past few years, lead - free solder interconnects have been significantly incorporated into electronic products, and are increasingly found in high performance computing systems and in their associated power electronics. As power and current levels increase within these products, the overall reliability of a lead-free solder based system can be impacted by an increasing risk of finding electromigration (EM) degradation during the product lifetime, especially if the product is operating at higher temperatures and with very high current densities. This paper provides a high-level technical overview of lead-free electromigration and describes the key factors and issues that can influence the EM performance of lead-free interconnects, especially in the environments in which power electronics are typically found.

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27

Paul, Arun Kumar. "Experimental exploration of functional integrity, functional reliability and reliability of modern power electronics equipments." International Journal of Power Electronics 3, no. 4 (2011): 374. http://dx.doi.org/10.1504/ijpelec.2011.040803.

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28

Tan, Yangyang, Jun Liu, Sichang Xu, Peng Zhong, Qi Zhang, and Lin Hu. "Operational reliability evaluation of PV inverter considering relative humidity and its application on power system." E3S Web of Conferences 185 (2020): 01050. http://dx.doi.org/10.1051/e3sconf/202018501050.

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With the penetration of renewable energy in the power system gradually increases, the importance of power electronics is growing up. The reliability of the power electronics should be taken seriously. This paper focuses on the operational reliability of photovoltaic (PV) inverters which is the most vulnerable in grid-connected PV systems and its application on the reliability evaluation of power systems. According to the field data, the effect of relative humidity is nonnegligible to the reliability of PV inverters. First, the real-time failure rate of components in PV inverters calculation method considering relative humidity is presented. Then the operational reliability evaluation of PV inverters is proposed. Finally, the reliability of power system including grid-connected PV systems is evaluated. It is aimed to explore a bottom-up approach to "effect factors-components-devices-system" reliability evaluation to establish a link between the components/devices and system. In this paper, the numerical examples verify the necessary of considering relative humidity in reliability evaluation. The evaluation results of PV inverters are used to the Roy Billinton Test System (RBTS). The analysis shows the results may affect the overall system performance.

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29

Chow, T. Paul. "SiC Bipolar Power Devices." MRS Bulletin 30, no. 4 (April 2005): 299–304. http://dx.doi.org/10.1557/mrs2005.77.

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AbstractThe successful commercialization of unipolar Schottky rectifiers in the 4H polytype of silicon carbide has resulted in a market demand for SiC high-power switching devices. This article reviews recent progress in the development of high-voltage 4H-SiC bipolar power electronics devices.We also present the outstanding material and processing challenges, reliability concerns, and future trends in device commercialization.

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30

Fan, Guangyu, Christine Labarbera, Ning-Cheng Lee, and Colin Clark. "Shear Strength and Thermomechanical Reliability of Sintered Ag Joints Containing low CTE Non-metal Additives for Die Attach." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000167–72. http://dx.doi.org/10.4071/2380-4505-2018.1.000167.

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Abstract Ag sintering has been paid attention as an alternative to soldering in die attach for decades, especially for high temperature power electronics packages because of its high melting temperature, highly thermal and electrical conductivity of the sintered silver joints, and low process temperature less than 275°C. The coefficient of thermal expansion (CTE) of silver (19.1ppm/°C), however, is much higher than the silicon die (2.6ppm/°C) and the commonly used alumina substrate (7.2ppm/°C). CTE mismatch of the different materials in the various components in a power electronics package lead to the delamination at the interface between interconnection layer and chips or substrate, and/or cracking of the interconnection layer is one of the mostly common causes of failure of power electronics device during thermal cycling or high temperature operation. In recent years we have been developing a series of silver sinter pastes containing low CTE non-metal particles to reduce or adjust CTE of the sintered joints so as to extend the lifetime and reliability of power electronics device in high temperature applications. In the present paper, we will report a new set of silver sinter pastes containing micro scale non-metal particles, a sintering process, microstructural morphologies, thermo-mechanical reliability of the sintered joint and effect of the contents of non-metal particles on shear strength of the sintered silver joints bonding an Ag silicon die on Ni/Au DBC substrates. Shear tests on the sintered joints with and/or without the low CTE non-metal additives have been conducted at room temperature, 200, 250, and 300°C. Thermo-mechanical reliability of the sintered joints was evaluated by thermal cycling, thermal shock, high temperature storage tests (HTS), respectively. X-ray inspection and scanning electronic microscopy (SEM) were used to characterize void, crack and microstructure morphologies of the sintered joints with and/or without the additives.

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31

Kaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." Journal of Microelectronics and Electronic Packaging 15, no. 3 (July 1, 2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved because of common degradation effects above 175°C. Ceramic (nonpolymeric) materials with thermal conductivities above 5 W/(m·K) already illustrated promising results for the encapsulation of power electronics. The present work illustrates recent developments and improvements on novel ceramic encapsulation materials, which finally avoid critical interactions with the chip surface. Furthermore, advances in reliability will be discussed in terms of passed high-temperature reverse bias and humidity tests correlated with relevant material properties.

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32

Kaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge, and K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved because of common degradation effects above 175°C. Ceramic (nonpolymeric) materials with thermal conductivities above 5 W/(m·K) already illustrated promising results for the encapsulation of power electronics. The present work illustrates recent developments and improvements on novel ceramic encapsulation materials, which finally avoid critical interactions with the chip surface. Furthermore, advances in reliability will be discussed in terms of passed high-temperature reverse bias and humidity tests correlated with relevant material properties.

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33

Yang, Yongheng, Ariya Sangwongwanich, and Frede Blaabjerg. "Design for Reliability of Power Electronics for Grid-Connected Photovoltaic Systems." CPSS Transactions on Power Electronics and Applications 1, no. 1 (December 28, 2016): 92–103. http://dx.doi.org/10.24295/cpsstpea.2016.00009.

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34

Hansen, Sandra, Frederik Hahn, Helge Krueger, Felix Hoffmann, Markus Andresen, Rainer Rainer Adelung, and Marco Liserre. "Reliability of Silicon Battery Technology and Power Electronics Based Energy Conversion." IEEE Power Electronics Magazine 8, no. 2 (June 2021): 60–69. http://dx.doi.org/10.1109/mpel.2021.3075756.

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35

Flicker, Jack, Govindasamy Tamizhmani, Mathan Kumar Moorthy, Ramanathan Thiagarajan, and Raja Ayyanar. "Accelerated Testing of Module-Level Power Electronics for Long-Term Reliability." IEEE Journal of Photovoltaics 7, no. 1 (January 2017): 259–67. http://dx.doi.org/10.1109/jphotov.2016.2621339.

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36

Bahman, A. S., F. Iannuzzo, T. Holmgaard, R. Ø. Nielsen, and F. Blaabjerg. "Reliability-oriented environmental thermal stress analysis of fuses in power electronics." Microelectronics Reliability 76-77 (September 2017): 25–30. http://dx.doi.org/10.1016/j.microrel.2017.06.089.

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37

Sawan, Mohamad, B. Gosselin, J. Coulombe, A. E. Ayoub, A. Chaudhuri, and F. Leporé. "Implantable Electronics for the Recovery of Neuromuscular Functions." Advances in Science and Technology 57 (September 2008): 204–9. http://dx.doi.org/10.4028/www.scientific.net/ast.57.204.

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This paper covers circuits and systems techniques for the construction of high reliability biosensing and stimulation medical devices. Such microsystems are dedicated for interconnections through either the central or the peripheral nervous systems. Low-power high-reliability wireless links are used to power up the implanted devices while data are exchanged bidirectionaly between these implants and external controllers. A global view of main devices is given, case studies related to applications such as bladder control, intracortical monitoring and microstimulation are discussed, altogether with modeling, characterization, as well as microsystems assembly and packaging. Also, dedicated electrode arrays and their interfaces to tissues interfaces are summarized.

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38

Shohji, Ikuo. "Large area bonding for power devices by pillar-like IMC effective dispersion control." Impact 2020, no. 1 (February 27, 2020): 76–78. http://dx.doi.org/10.21820/23987073.2020.1.76.

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Electronic packaging is extremely important, not least to protect the precious electronic devices inside. And these precious devices, in turn, are used to build important industrial products such as automobiles and smart grid systems, for example. It makes sense, then, that high-quality electronic packaging and the technologies used to produce it is paramount. In Japan, electronic packaging technology is known as 'Jisso' and can be defined as a key technology supporting the development of electronic devices. A team of Japanese researchers is investigating bonding methodologies, structures and materials for electronics packaging, as well as shedding light on the effect of microstructures on the mechanical properties and reliability of joints.

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39

Yuan, Cadmus, René Kregting, Willem van Driel, Sander Gielen, An Xiao, and G. Q. (Kouchi) Zhang. "Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000418–29. http://dx.doi.org/10.4071/isom-2011-tp6-paper4.

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High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital-analog mixed circuit design, high power IC manufacturing technologies, and high power packaging design/process, in order to guarantee their performance and lifetime. In this paper, we overviewed our works on the packaging/assembly development of high power packages, including three parts: (1) Thermal simulation and die bond defect control (2) Mechanical integrity model for soft package heatsink implementation (3) Al wire multiphysics modeling and reliability of plastic power package.

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Palmer, David W. "Test Structures as a Way to Evaluate Packaging Reliability." MRS Bulletin 18, no. 12 (December 1993): 55–58. http://dx.doi.org/10.1557/s0883769400039105.

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Electronics packaging has always accounted for about 50% of reliability shortcomings in electronics systems. Materials, processes, and geometries used in microelectronics packaging are quickly evolving to meet the commercial challenge for more reliable, lighter, smaller, cheaper devices, and lower power consumption. Amid the rapid evolution, methodology and metrology to measure package reliability and materials aging properties must be standardized to allow quantitative technology comparisons.What Is Packaging?For most purposes packaging can be thought of as everything involved in making an electronics system except the wafer fabrication. For example, all the design, fabrication, assembly, and finishing that goes into interconnecting the integrated circuits, discrete devices, resistors, and capacitors and then interfacing the system to the user is traditionally called “packaging.”

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SHENAI, KRISHNA. "THE PERFECT POWER SEMICONDUCTOR SWITCH FOR 21st CENTURY GLOBAL ENERGY ECONOMY." Journal of Circuits, Systems and Computers 22, no. 10 (December 2013): 1340020. http://dx.doi.org/10.1142/s0218126613400203.

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A critical evaluation of high-power electronics switching in semiconductor materials is made from the standpoint of performance, reliability, and commercial viability. This study takes into account recent experimental results obtained from the field-reliability study of silicon power MOSFETs in high-density power supplies where residual material defects present in the space charge region of the device were found to generate local micro plasma that eventually caused power MOSFETs to fail. Based on these results and commercial progress made to date in wide bandgap semiconductor technologies, it is suggested that silicon carbide (SiC) promises to be the preferred material for high-power electronics switching from cost, performance and reliability considerations — this assessment is further strengthened by the near-term potential for developing large-area, low-cost, and defect-free SiC bulk substrates and epitaxial layers. This conclusion is also supported by the feasibility and the need for vertical, MOS-controlled, bipolar power switches in compact and efficient megaWatt-level power converters in order to make transformational changes in the 21st century electrical transmission and distribution infrastructure.

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Flicker, Jack, Jay Johnson, Peter Hacke, and Ramanathan Thiagarajan. "Automating Component-Level Stress Measurements for Inverter Reliability Estimation." Energies 15, no. 13 (July 1, 2022): 4828. http://dx.doi.org/10.3390/en15134828.

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In the near future, grid operators are expected to regularly use advanced distributed energy resource (DER) functions, defined in IEEE 1547-2018, to perform a range of grid-support operations. Many of these functions adjust the active and reactive power of the device through commanded or autonomous operating modes which induce new stresses on the power electronics components. In this work, an experimental and theoretical framework is introduced which couples laboratory-measured component stress with advanced inverter functionality and derives a reduction in useful lifetime based on an applicable reliability model. Multiple DER devices were instrumented to calculate the additional component stress under multiple reactive power setpoints to estimate associated DER lifetime reductions. A clear increase in switch loss was demonstrated as a function of irradiance level and power factor. This is replicated in the system-level efficiency measurements, although magnitudes were different—suggesting other loss mechanisms exist. Using an approximate Arrhenius thermal model for the switches, the experimental data indicate a lifetime reduction of 1.5% when operating the inverter at 0.85 PF—compared to unity PF—assuming the DER failure mechanism thermally driven within the H-bridge. If other failure mechanisms are discovered for a set of power electronics devices, this testing and calculation framework can easily be tailored to those failure mechanisms.

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Tripathi, Rajesh, Sejin Im, Douglas Devoto, Joshua Major, Sreekant Narumanchi, Paul Paret, and Xuhui Feng. "Power electronics thermal solutions using thermally conductive polyimide films." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (January 1, 2019): 000616–46. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tp3_042.

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Increased adoption of hybrid and electrical vehicles as well as renewable energy systems are driving the innovation in power module packaging. Thermal substrate, one of the major components of power modules, is not an exception, and technological advancements are necessary to meet increased reliability requirements. DuPont has developed a thermally conductive polymer film that provides very low thermal resistance and very high insulation. The film can be bonded to conductive and thick metallic layers and this polymer equivalent of DBC shows very high reliability in addition to high performance characteristics. Electrically insulating layers within a power electronics module are critical for separating circuitry from thermal management layers. Electrical insulating substrates typically used in power electronics modules utilize a ceramic layer, comprised most commonly of either Al2O3, AlN, or Si3N4. Thin Cu layers are bonded to either side of the substrate using a direct bond Cu (DBC) or active metal brazing (AMB) process. These processes involve bonding metallization layers to both sides of the ceramic at a high temperature as bonding to only one side would cause deformation during the cooling phase. Typical metal thickness bonded to either side of the ceramic is about 0.3–0.6 mm as the high temperature manufacturing process does not allow very thick metals to be bonded and this limits the heat spreading capability of the thermal substrate. DuPont's new Temprion™ Organic Direct Bond Copper (ODBC) address aforementioned problems, increasing thermal durability and reliability as well as enabling system layer suppression. Temprion™ ODBC's dielectric layer will absorb thermo-mechanical stress from the metals due to CTE mismatch, dramatically improving durability of the system. In addition, various kinds of metals including Cu and Al can be easily bonded to Temprion™ DB films through simple process. There are no thickness limitations on bonding metal sheets and metal attached at the bottom can be used as an integrated heat sink/baseplate. Al2O3 and Si3N4-based substrates were utilized as a baseline for reliability comparison with the DuPont substrates. The industry-standard substrates in used in this study have a thickness of 0.3 and 0.8 mm for the Cu metallization layers and 0.38 and 0.32 mm for the insulating layer respectively for Al2O3 an Si3N4 insulators. DuPont ODBC substrates were fabricated by attaching a polyimide layer to a layer of 0.8-mm-thick Cu. The polyimide and bottom Cu layer cross-sectional footprints are both 50.8 mm × 50.8 mm. The corners of both layers were filleted with various radii (0.5, 1.0, 2.0, and reversed 2.0 mm) to explore the impact of different stress concentrations between the metallization and insulating layers. The top Cu metallization was inset 2.0 mm from the perimeter of the electrically-insulating substrate and bottom Cu metallization.10 samples each of the DuPont ODBC and industry Al2O3 substrates were placed in a thermal shock chamber and cycled between temperature extremes of −40°C and 200°C. Substrates were inspected every 1000 cycles. After 5000 cycles, the ODBC substrates experienced no hipot failures, but preliminary edge delamination was visually observed. Al2O3 substrates all failed after 50 thermal cycles.Five DuPont ODBC samples were placed in a thermal chamber and subjected to an elevated temperature of 175°C. After 2000 hours, no hipot failures were observed, but edge delamination was again observed.Five DuPont ODBC samples were attached to a cold plate with Kapton tape. Heater cartridges were attached to the top of the substrates with Kapton tape and thermocouples were placed in several locations through the package. The heater cartridges were alternated between on and off states to allow for the substrates to cycle between −40°C and +200°C. While the change between the maximum and minimum temperatures is smaller for the power cycling test compared to the thermal cycling test, the heater cartridge and cold plate create a thermal gradient within the samples that is not possible with passive thermal cycling. After 2000 hrs cycles of testing, no hipot failures or edge delamination have been observed. Herein we show that the DuPont ODBC substrate design is a promising alternative to traditional industry substrates based on ceramic insulators. The reliability of the substrate design has been demonstrated under several thermomechanical accelerated tests and the electrical and thermal performance has been measured. Future work will include reliability comparisons to other industry substrates, including thermal shock testing of substrates with HPS, AlN, and Si3N4 ceramic layers. Thermal models will correlate thermal resistance values measured by the transient thermal tester and compare the ODBC substrate performance to industry substrates within a commercialized power electronics module. The modeling will also optimize the thickness of the metallization layers within the ODBC substrates to minimize the junction temperature of the switching devices.

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Du, Xiao, Xiong Du, Jun Zhang, and Gaoxian Li. "Numerical junction temperature calculation method for reliability evaluation of power semiconductors in power electronics converters." Journal of Power Electronics 21, no. 1 (September 23, 2020): 184–94. http://dx.doi.org/10.1007/s43236-020-00154-z.

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Shashidhar, Nagaraja, and Abhijit Rao. "Low thermal resistance packaging for high power electronics." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000131–38. http://dx.doi.org/10.4071/2380-4505-2019.1.000131.

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Abstract Alumina and aluminum nitride substrates are routinely used in micro-electronic packaging where large quantity of heat needs to be dissipated, such as in LED packaging, high power electronics and laser packaging. Heat management in high power electronics or LED's is crucial for their lifespan and reliability. The ever-increasing need for higher power keeps challenging the packaging engineers to become more sophisticated in their packaging. With the availability of a 40 μm thick, high thermal conductivity ribbon alumina from Corning, the options available for packaging engineers has widened. This product has very high dielectric breakdown (~10kV at 40 μm thick), high thermal conductivity (>36 W/mK) and is rugged enough to be handled (with components attached) during packaging. These characteristics make ribbon alumina a cost-effective alternative to incumbent materials such as thick aluminum nitride, for use in high power microelectronics packaging. In this paper, high power LED and IGBT modules are modeled using commercially available code from ANSYS®. A geometry representative of typical LED packaging and IGBT packaging is constructed with Ansys Design Modeler platform and the allied meshing is done employing in-built Meshing tool in ANSYS Workbench®. We show that packaging with ~40 μm ribbon alumina delivers performance on par with or better than packaging with thicker aluminum nitride substrates.

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Wiewiora, Lee. "Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other Factors." International Symposium on Microelectronics 2015, S1 (October 1, 2015): S1—S11. http://dx.doi.org/10.4071/isom-2015-slide-1.

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The modern battlefield demands that soldiers endure rough terrain and weather while carrying all necessary items for their mission. These necessities include their food, water, ammunition and mission essentials, typically electronics. In order to give the troops the most capability while in the field, the efficiency and dependability of electronics is paramount. Key to the requirements definition for mission electronics is Size, Weight and Power - Cost, commonly known as the acronym SWAP-C. In addition to satisfying the SWAP-C requirements, all mission electronics need proven reliability since lives are at stake. Major defense systems in the past have lasted 30+ years. With this in mind, systems for tomorrow are being designed to support the defense industry's need for reliability, longevity and upgrade compatibility. This talk will focus on SWAP-C and high reliability in electronics and packaging to support the defense industry for years to come.

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Faqir, M., J. W. Pomeroy, T. Batten, T. Mrotzek, S. Knippscheer, O. Vendier, S. Rochette, et al. "Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite." Journal of Microelectronics and Electronic Packaging 10, no. 2 (April 1, 2013): 54–58. http://dx.doi.org/10.4071/imaps.371.

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A reliability analysis of silver diamond composites in terms of both thermal and mechanical properties is presented. This new material is an attractive solution for power electronics packaging, because an improvement of 50% in terms of thermal management and channel temperature can be obtained when using silver diamond composites as a base plate in packages compared with the more traditionally used materials such as CuW. However, to date, little is known about the reliability of this new material, such as changes induced in its properties by thermal cycling. Assessment of the reliability of silver diamond composites is the aim of this work. Samples were submitted to 10 thermal cycles from room temperature to 350°C, and subsequently, a further 500 cycles of thermal shock as well as thermal cycling from −55°C to 125°C following typical standards used in space and military applications. In the worst-case scenario, thermal conductivity only decreased from 830 W/m·K to ∼700 W/m·K. An increase in the coefficient of thermal expansion and a change in diamond stress, were also observed after thermal cycling. Some structural modifications at the silver-diamond interface were found to be the underlying reason for the observed material properties change. These structural changes take place after the initial thermal cycling, and are constant thereafter. Changes found in thermal properties are satisfactory for enabling a significant improvement to standard CuW packaging materials.

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Wang, Huai, Marco Liserre, Frede Blaabjerg, Peter de Place Rimmen, John B. Jacobsen, Thorkild Kvisgaard, and Jorn Landkildehus. "Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics." IEEE Journal of Emerging and Selected Topics in Power Electronics 2, no. 1 (March 2014): 97–114. http://dx.doi.org/10.1109/jestpe.2013.2290282.

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Arifujjaman, Md, M. T. Iqbal, and J. E. Quaicoe. "Power Electronics Reliability Comparison of Grid Connected Small Wind Energy Conversion Systems." Wind Engineering 35, no. 1 (February 2011): 93–110. http://dx.doi.org/10.1260/0309-524x.35.1.93.

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Szcześniak, Paweł, Iwona Grobelna, Mateja Novak, and Ulrik Nyman. "Overview of Control Algorithm Verification Methods in Power Electronics Systems." Energies 14, no. 14 (July 19, 2021): 4360. http://dx.doi.org/10.3390/en14144360.

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The paper presents the existing verification methods for control algorithms in power electronics systems, including the application of model checking techniques. In the industry, the most frequently used verification methods are simulations and experiments; however, they have to be performed manually and do not give a 100% confidence that the system will operate correctly in all situations. Here we show the recent advancements in verification and performance assessment of power electronics systems with the usage of formal methods. Symbolic model checking can be used to achieve a guarantee that the system satisfies user-defined requirements, while statistical model checking combines simulation and statistical methods to gain statistically valid results that predict the behavior with high confidence. Both methods can be applied automatically before physical realization of the power electronics systems, so that any errors, incorrect assumptions or unforeseen situations are detected as early as possible. An additional functionality of verification with the use of formal methods is to check the converter operation in terms of reliability in various system operating conditions. It is possible to verify the distribution and uniformity of occurrence in time of the number of transistor switching, transistor conduction times for various current levels, etc. The information obtained in this way can be used to optimize control algorithms in terms of reliability in power electronics. The article provides an overview of various verification methods with an emphasis on statistical model checking. The basic functionalities of the methods, their construction, and their properties are indicated.

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