Дисертації: "PECVD silicon carbide and silicon nitride"

1

Razzell, Anthony Gordon. "Silicon carbide fibre silicon nitride matrix composites." Thesis, University of Warwick, 1992. http://wrap.warwick.ac.uk/110559/.

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Silicon carbide fibre/silicon nitride matrix composites have been fabricated using the reaction bonded silicon nitride (RBSN) and sintered reaction bonded silicon nitride (SRBSN) processing routes. A filament winding and tape casting system was developed to produce sheets of parallel aligned fibres within a layer of green matrix ('prepreg') which were cut, stacked and hot pressed to form a plate. This was nitrided and (in the case of SRBSN matrix composites) hot pressed at 1700°C to density the matrix. The magnesia (MgO) and the yttria/alumina (Y2O3/AI2O3) additive SRBSN systems were investigated as matrices for ease of processing and compatibility with the matrix. The MgO additive Si3N4 matrix reacted with the outer carbon rich layer on the surface of the fibres, framing a reaction layer approx. 2pm in thickness. A reaction layer was also observed with the Y2O3/AI2O3 additive matrix, but was thinner (< 0.5um), and was identified as silicon carbide from the electron diffraction pattern. X-ray mapping in the SEM was used to investigate the spatial distribution of elements within the interface region to a resolution < lum, including light elements such as carbon. The 6wt%Y203/ 2wt%Al203 additive SRBSN system was chosen for more detailed investigation, and the majority of characterisation was performed using this composition. Oxidation of composite samples was carried out at temperatures between 1000°C and 1400°C for up to 1000 hours. Little damage was visible after 100 hours for all temperatures, corresponding to a relatively small drop in post oxidation bend strength. After 1000 hours at 1000°C both carbon rich outer layers and the central carbon core of the fibre were removed. Samples were severely oxidised after 1000 hours at 1400°C, having a glass layer on the outer surface and replacement of near surface fibre/matrix interfaces with glass. The post oxidation bend strengths for both conditions were approx.2/3 of the as fabricated strength. Less damage was observed after 1000 hours at 1200°C, and the post oxidation bend strength was higher than the 1000°C and 1400°C samples. Mechanical properties of the SRBSN matrix composite were investigated at room temperature and elevated temperatures (up to 1400°C). The average room temperature values for matrix cracking stress and ultimate strength (in bend) were 651.1 and 713.2 MPa respectively, with corresponding Weibull moduli of 5.7 and 8.7. The stresses are comparable to similar monolithic silicon nitrides. Room temperature tensile matrix cracking and ultimate strength were 232MPa and 413MPa, lower than the bend test results, which were attributed to bending stresses in the sample, lowering the apparent failure stresses. The samples failed in a composite like manner (i.e. controlled rather than catastrophic failure), with a substantially higher woric of fracture than monolithic materials. The average matrix cracking and ultimate bend strength at 1200°C were 516MPa and 554MPa, dropping to 178MPa and 486MPa at 1400°C (the matrix cracking stress was indistinct at 1400°C due to plasticity). The creep and stress rupture properties at 1300°C were investigated in four point bend, using dead-weight loading. The creep rate was KH/s at a stress of 200MPa, lower than a hot pressed silicon nitride with MgO additive, and higher than a hot isostatically pressed Y2O2/SÍO2 additive silicon nitride. A cavitation creep mechanism was deduced from the stress exponent, which was >1. Failure by stress rupture did not have a lower limit, which is also associated with cavitation of the amorphous grain boundary phase.

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2

Chen, Wan Lam Florence Photovoltaics &amp Renewable Energy Engineering Faculty of Engineering UNSW. "PECVD silicon nitride for n-type silicon solar cells." Publisher:University of New South Wales. Photovoltaics & Renewable Energy Engineering, 2008. http://handle.unsw.edu.au/1959.4/41277.

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The cost of crystalline silicon solar cells must be reduced in order for photovoltaics to be widely accepted as an economically viable means of electricity generation and be used on a larger scale across the world. There are several ways to achieve cost reduction, such as using thinner silicon substrates, lowering the thermal budget of the processes, and improving the efficiency of solar cells. This thesis examines the use of plasma enhanced chemical vapour deposited silicon nitride to address the criteria of cost reduction for n-type crystalline silicon solar cells. It focuses on the surface passivation quality of silicon nitride on n-type silicon, and injection-level dependent lifetime data is used extensively in this thesis to evaluate the surface passivation quality of the silicon nitride films. The thesis covers several aspects, spanning from characterisation and modelling, to process development, to device integration. The thesis begins with a review on the advantages of using n-type silicon for solar cells applications, with some recent efficiency results on n-type silicon solar cells and a review on various interdigitated backside contact structures, and key results of surface passivation for n-type silicon solar cells. It then presents an analysis of the influence of various parasitic effects on lifetime data, highlighting how these parasitic effects could affect the results of experiments that use lifetime data extensively. A plasma enhanced chemical vapour deposition process for depositing silicon nitride films is developed to passivate both diffused and non-diffused surfaces for n-type silicon solar cells application. Photoluminescence imaging, lifetime measurements, and optical microscopy are used to assess the quality of the silicon nitride films. An open circuit voltage of 719 mV is measured on an n-type, 1 Ω.cm, FZ, voltage test structure that has direct passivation by silicon nitride. Dark saturation current densities of 5 to 15 fA/cm2 are achieved on SiN-passivated boron emitters that have sheet resistances ranging from 60 to 240 Ω/□ after thermal annealing. Using the process developed, a more profound study on surface passivation by silicon nitride is conducted, where the relationship between the surface passivation quality and the film composition is investigated. It is demonstrated that the silicon-nitrogen bond density is an important parameter to achieve good surface pas-sivation and thermal stability. With the developed process and deeper understanding on the surface passivation of silicon nitride, attempts of integrating the process into the fab-rication of all-SiN passivated n-type IBC solar cells and laser doped n-type IBC solar cells are presented. Some of the limitations, inter-relationships, requirements, and challenges of novel integration of SiN into these solar cell devices are identified. Finally, a novel metallisation scheme that takes advantages of the different etching and electroless plating properties of different PECVD SiN films is described, and a preliminary evalua-tion is presented. This metallisation scheme increases the metal finger width without increasing the metal contact area with the underlying silicon, and also enables optimal distance between point contacts for point contact solar cells. It is concluded in this thesis that plasma enhanced chemical vapour deposited silicon nitride is well-suited for n-type silicon solar cells.

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3

Tatli, Zafer. "Silicon nitride and silicon carbide fabrication using coated powders." Thesis, University of Newcastle Upon Tyne, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.394640.

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4

Turan, Servet. "Microstructural characterisation of silicon nitride-silicon carbide particulate composites." Thesis, University of Cambridge, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.627653.

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5

Kim, Hyoun-Ee. "Gaseous corrosion of silicon carbide and silicon nitride in hydrogen /." The Ohio State University, 1987. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487327695622538.

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6

Gao, Wei. "Oxidation of nitride-bonded silicon carbide (NBSC) and hot rod silicon carbide with coatings." Thesis, University of Strathclyde, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.366751.

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7

Dominguez, Bucio Thalia. "NH3-free PECVD silicon nitride for photonic applications." Thesis, University of Southampton, 2018. https://eprints.soton.ac.uk/422874/.

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Silicon Photonics has open the possibility of developing multilayer platforms based on complementary metal-oxide semiconductors compatible materials that have the potential to provide the density of integration required to fabricate complex photonic circuits. Amongst these materials, silicon nitride (SiN) has drawn attention due to its fabrication flexibility and advantageous intrinsic properties that can be tailored to fulfil the requirements of different linear and non-linear photonic applications covering the ultra-violet to mid-infrared wavelengths. Yet, the fabrication techniques typically used to grow SiN layers rely on processing temperatures > 400 C to obtain low propagation losses, which deem them inappropriate for multilayer integration. This thesis presents a systematic investigation that provided a comprehensive knowledge of a deposition method based on an NH3-free plasma enhanced chemical vapour deposition recipe that allows the fabrication of low-loss silicon nitride layers at temperatures < 400 C. The results of this study showed that the properties of the studied SiN layers depend mostly on their N/Si ratio, which is in fact one of the only properties that can be directly tuned with the deposition parameters. These observations provided a framework to optimise the propagation losses and optical properties of the layers in order to develop three platforms intended for specific photonic applications. The first one comprises 300nm stoichiometric SiN layers with refractive index (n) of 2 that enable the fabrication of photonic devices with propagation losses < 1 dB=cm at l = 1310nm and < 1:5 dB=cm at l = 1550 nm, which are good for applications that require efficient routing of optical signals. The second one consists on 600nm N-rich layers (n = 1.92) that allow fabricating both devices with propagation losses < 1 dB=cm at l = 1310 nm, apt for polarisation independent operation and coarse wavelength division multiplexing devices with cross-talk < 20 dB and low insertion losses. Finally, the last platform consisted of suspended Si-rich layers (n = 2.54) that permits the demonstration of photonic crystal cavities with Q factors as high as 122 000 and photonic crystal waveguides capable of operating in the slow-light regime. Hopefully, the demonstration of these platforms will stimulate the development of more complex SiN devices for multilayer routing, wavelength division multiplexing applications and non-linear integrated photonics in the future.

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8

Unal, Ozer. "Interface studies in silicon nitride/silicon carbide and gallium indium arsenide/gallium arsenide systems." Case Western Reserve University School of Graduate Studies / OhioLINK, 1991. http://rave.ohiolink.edu/etdc/view?acc_num=case1059501714.

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9

Demir, Adem. "Silicon carbide fibre reinforced #beta#-sialon ceramics." Thesis, University of Newcastle Upon Tyne, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.391291.

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10

Gasch, Matthew J. "Processing and mechanical properties of silicon nitride/silicon carbide ceramic nanocomposites derived from polymer precursors /." For electronic version search Digital dissertations database. Restricted to UC campuses. Access is free to UC campus dissertations, 2003. http://uclibs.org/PID/11984.

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11

Martinelli, Antonio Eduardo. "Diffusion bonding of silicon carbide and silicone nitride to molybdenum." Thesis, McGill University, 1995. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=40191.

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This study focuses on various aspects of solid-state diffusion bonding of two ceramic-metal combinations, namely: silicon carbide-molybdenum (SiC-Mo), and silicon nitride-molybdenum (Si$ rm sb3N sb4$-Mo). Single SiC-Mo and $ rm Si sb3N sb4$-Mo joints were produced using hot-uniaxial pressing. The microstructure of the resulting interfaces were characterized by image analysis, scanning electron microscopy (SEM), electron probe micro-analysis (EPMA), and X-ray diffraction (XRD). The mechanical properties of the joints were investigated using shear strength testing, depth sensing nanoindentation, and neutron diffraction for residual stress measurement.
SiC was solid-state bonded to Mo at temperatures ranging from 1000$ sp circ$C to 1700$ sp circ$C. Diffusion of Si and C into Mo resulted in a reaction layer containing two main phases: $ rm Mo sb5Si sb3$ and Mo$ sb2$C. At temperatures higher than 1400$ sp circ$C diffusion of C into $ rm Mo sb5Si sb3$ stabilized a ternary phase of composition $ rm Mo sb5Si sb3$C. At 1700$ sp circ$C, the formation of MoC$ rm sb{1-x}$ was observed as a consequence of bulk diffusion of C into Mo$ sb2$C. A maximum average shear strength of 50 MPa was obtained for samples hot-pressed at 1400$ sp circ$C for 1 hour. Higher temperatures and longer times contributed to a reduction in the shear strength of the joints, due to the excessive growth of the interfacial reaction layer. $ rm Si sb3N sb4$ was joined to Mo in vacuum and nitrogen, at temperatures between 1000$ sp circ$C and 1800$ sp circ$C, for times varying from 15 minutes to 4 hours. Dissociation of $ rm Si sb3N sb4$ and diffusion of Si into Mo resulted in the formation of a reaction layer consisting, initially, of $ rm Mo sb3$Si. At 1600$ sp circ$C (in vacuum) Mo$ sb3$Si was partially transformed into $ rm Mo sb5Si sb3$ by diffusion of Si into the original silicide, and at higher temperatures, this transformation progressed extensively within the reaction zone. Residual N$ sb2$ gas, which originated from the decomposition of $ rm Si sb3N sb4,$ dissolved in the Mo, however, most of the gas escaped during bonding or remained trapped at the original $ rm Si sb3N sb4$-Mo interface, resulting in the formation of a porous layer. Joining in N$ sb2$ increased the stability of $ rm Si sb3N sb4,$ affecting the kinetics of the diffusion bonding process. The bonding environment did not affect the composition and morphology of the interfaces for the partial pressures of N$ sb2$ used. A maximum average shear strength of 57 MPa was obtained for samples hot-pressed in vacuum at 1400$ sp circ$C for 1 hour.

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12

Kerkar, Awdhoot Vasant. "Investigation of steric stabilization as a route for colloidal processing of silicon carbide/silicon nitride composites." Case Western Reserve University School of Graduate Studies / OhioLINK, 1990. http://rave.ohiolink.edu/etdc/view?acc_num=case1059055054.

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13

Zetterling, Carl-Mikael. "Silicon dioxide and aluminium nitride as gate dielectric for high temperature and high power silicon carbide MOSFETs." Doctoral thesis, KTH, Electronic Systems Design, 1997. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-2514.

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Silicon carbide (SIC) is a wide bandgap semiconductor thathas been suggested as a replacement for silicon in applicationsusing high voltages, high frequencies, high temperatures orcombinations thereof. Several basic process steps need to bedeveloped for reliable manufacturing of long-term stableelectronic devices. One important process step is the formationof an insulator on the silicon carbide surface that may be usedas a) a gate dielectric, b) for device isolation or c) forpassivation of the surface. Silicon dioxide and aluminumnitride have been suggested for these purposes. This thesiscovers the investigation of some formation methods for boththese materials on 4H and 6H silicon carbide, and theelectrical characterisation of the resulting films.

Commercially available n-type and p-type 4H and 6H SICwafers have been used, and both the silicon face and the carbonface have been investigated. Silicon dioxide has been formed byseveral methods: a) dry thermal oxidation with or without theaddition of TCA (trichloroethane), b) wet oxidation inpyrogenic steam or with awater bubbler, c) oxide deposition byPECVD (plasma enhanced chemical vapor deposition) or LPCVD (lowpressure chemical vapor deposition) and d) oxidation of aevaporated or LPCVD deposited sacrificial layer of silicon. Theinfluence of various cleaning methods prior to oxidation hasbeen studied, as well as post-oxidation and post-metallisationannealing. The aluminum nitride films were grown by MOCVD(metal organic chemical vapor deposition) under various processconditions.

Oxidation kinetics have been studied for dry thermaloxidation at 1200 0C. The redistribution of aluminum (p-typedopant in SiC) during dry thermal oxidation has beeninvestigated using SIMS (secondary ion mass spectrometry). Themorphology of the aluminum nitride was determined using x-raydiffraction rocking curves, RHEED (reflection high energyelectron diffraction) and AFM (atomic force microscopy). Thequality of the silicon dioxide used as gate dielectric has beendetermined using breakdown field measurements. High frequencycapacitance-voltage measurements have been used on bothinsulators to a) verify thickness measurements made with othermethods, b) to determine fixed oxide charges by measuring theflatband voltage shifts and c) to quantitatively compare theamount of interface states.

For electrical characterisation either aluminum, titanium ordoped polysilicon circular gate contacts of various sizes wereformed on the insulator surface. Flat MOS capacitors weremainly used for the electrical characterisation. U-grooved MOScapacitors, manufactured by RIE (reactive ion etching), wereused to test the quality of oxides grown on vertical surfaces.Two types of MOSFETs (metal oxide semiconductor field effecttransistors) have been fabricated: vertical U-grooved andlateral devices.

Keywords:silicon carbide, thermal oxidation, silicondioxide, metal organic chemical vapor deposition (MOCVD),aluminum nitride, capacitance-voltage measurements, MOSFET.

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14

Sundaresan, Siddarth G. "Ultra-fast high temperature microwave processing of silicon carbide and gallium nitride." Fairfax, VA : George Mason University, 2007. http://hdl.handle.net/1920/2851.

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Thesis (Ph.D.)--George Mason University, 2007.
Title from PDF t.p. (viewed Oct. 29, 2007). Thesis director: Mulpuri V. Rao. Submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy in Electrical and Computer Engineering. Vita: p. 170. Includes bibliographical references (p. 160-169). Also available in print.

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15

Okayama, Taizo. "Performance of devices made of large band-gap semiconductors, SiC and GaN." Fairfax, VA : George Mason University, 2007. http://hdl.handle.net/1920/2935.

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Thesis (Ph. D.)--George Mason University, 2007.
Title from PDF t.p. (viewed Jan. 21, 2008). Thesis director: Mulpuri V. Rao. Submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy in Electrical and Computer Engineering. Vita: p. 128. Includes bibliographical references (p. 122-127). Also available in print.

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16

Cai, Li. "Improved understanding and control of the properties of PECVD silicon nitride and its applications in multicrystalline silicon solar cells." Diss., Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/15468.

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17

Bazilchuk, Molly Strimbeck. "Improved Induced Diode Photodetectors by Increased Fixed Charge in PECVD Amorphous Silicon Nitride." Thesis, Norges teknisk-naturvitenskapelige universitet, Institutt for materialteknologi, 2014. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-25278.

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The predictable quantum efficient detector (PQED) is a cheaper, more practical alternative to the current radiometric primary standard, the cryogenic radiometer. The PQED is made of an induced diode, a rectifying junction based on a positively charged dielectric film which induces an n-type inversion layer on a p-type silicon substrate. Increasing the fixed charge Qf in the dielectric has been theoretically predicted to improve the quantum efficiency of the diode by decreasing the surface recombination velocity (SRV) at the dielectric-silicon interface, as well as improving the performance of the diode at high intensities. In this work, we purpose the replacement of silicon oxide (SiOx) with silicon nitride (SiNx) as the inversion-inducing dielectric layer as a means of increasing Qf.Amorphous PECVD SiNx has been shown to have a significantly higher Qf than thermally grown SiOx. A sixfold increase of Qf in SiNx by means of charge injection via bias soaking has also been demonstrated. The dielectric ideality of the nitride increases with the atomic nitrogen concentration x, and a high-x film has shown superior charge retention properties. The absorption in the high-x film is far less than 1% in the applicable wavelength ranges, but is larger in the low-x film. The impact of Qf on the SRV has been experimentally demonstrated, and may be fit to the extended SRH theory with the inclusion of a sub-surface damage term. Finally, it has been demonstrated that the aluminium contacts deposited for the purpose of charging the SiNx may be chemically removed while the injected charge remains. SiNx has thus been shown to be an interesting candidate for the PQED application.

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18

Lee, Jaeseob. "Direct bonding of gallium nitride to silicon carbide physical, and electrical characterization /." NCSU, 2003. http://www.lib.ncsu.edu/theses/available/etd-08072003-125025/.

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The direct bonding method is applied to the GaN/SiC system, and the processing conditions for successful direct bonding are clarified. Direct bonding of GaN/SiC is achieved at 900¡ÆC. The direct bonding of GaN to Si-face SiC is very dependent on the choice of chemical treatments, but the bonding of GaN to C-face SiC is less dependent on surface preparation. If a native oxide is present when the bonded interface is prepared, the current through the interface is decreased, which is attributed to an energy barrier due to the presence of charged interface states. TEM images indicate 10nm spaced dislocations at the interface for the GaN/SiC (Si-face), and ~6nm for the GaN/SiC (C-face), which form to accommodate the lattice mismatch (3.4%) and twist (1~2¡Æ) and tilt misfit (0.2¡Æ for Si-face SiC and 3¡Æ for C-face SiC). In some regions (~30%) an amorphous oxide layer forms at the interface, which is attributed to inadequate surface preparation prior to bonding. The strain of the GaN film with a Ga/C interface was ~0.1%, tensile strain, and that of GaN with a Ga/Si interface was ~0.2%, tensile strain. Our analysis indicates that the GaN/SiC thermal misfit dominates the strain of the GaN after bonding. The electrical characteristics of n-p GaN/SiC heterojunctions display diode ideality factors, saturation currents, energy barrier heights, and band offsets of 1.5 ¡¾ 0.1, 10^-13 A/cm² , 0.75 ¡¾ 0.10 eV, and ¥ÄE_c= 0.87 ¡¾ 0.10 eV for the Ga/Si interface and 1.2 ¡¾ 0.1, 10^-16 A/cm² , 0.56 ¡¾ 0.10 eV, and ¥ÄE_c= 0.46 ¡¾ 0.10 eV for the Ga/C interface.

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19

Romero, Amy Marie. "Static and Dynamic Characterization of Silicon Carbide and Gallium Nitride Power Semiconductors." Thesis, Virginia Tech, 2018. http://hdl.handle.net/10919/93744.

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Wide-bandgap semiconductors have made and are continuing to make a major impact on the power electronics world. The most common commercially available wide-bandgap semiconductors for power electronics applications are SiC and GaN devices. This paper focuses on the newest devices emerging that are made with these wide-bandgap materials. The static and dynamic characterization of six different SiC MOSFETs from different manufacturers are presented. The static characterization consists of the output characteristics, transfer characteristics and device capacitances. High temperature (up to 150 °C) static characterization provides an insight into the dependence of threshold voltage and on-state resistance on temperature. The dynamic characterizations of the devices are conducted by performing the double-pulse test. The switching characteristics are also tested at high temperature, with the presented results putting an emphasis on one of the devices. A comparison of the key characterization results summarizes the performance of the different devices. The characterization of one of the SiC MOSFETs is then continued with a short-circuit failure mode operation test. The device is subjected to non-destructive and destructive pulses to see how the device behaves. The non-destructive tests include a look at the performance under different external gate resistances and drain-source voltages. It is found that as the external gate resistance is increased, the waveforms get noisier. Also, as the drain-source voltage is increased, the maximum short-circuit current level rises. The destructive tests find the amount of time that the device is able to withstand short-circuit operation. At room temperature the device is able to withstand 4.5 μs whereas at 100 °C, the device is able to withstand 4.2 μs. It is found that despite the different conditions that the device is tested at for destructive tests, the energy that they can withstand is similar. This paper also presents the static and dynamic characterization of a 600 V, 2A, normallyoff, vertical gallium-nitride (GaN) transistor. A description of the fabrication process and the setup used to test the device are presented. The fabricated vertical GaN transistor has a threshold voltage of 3.3 V, a breakdown voltage of 600 V, an on-resistance of 880 mΩ, switching speeds up to 97 V/ns, and turn-on and turn-off switching losses of 8.12 µJ and 3.04 µJ, respectively, demonstrating the great potential of this device
MS

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20

Stodilka, Danielle O. "Silicon carbide MIS and MOS development using alternative nitride and oxide dielectrics." [Gainesville, Fla.] : University of Florida, 2005. http://purl.fcla.edu/fcla/etd/UFE0013116.

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21

Gulses, Alkan Ali. "Ellipsometric And Uv-vis Transmittance Analysis Of Amorphous Silicon Carbide Thin Films." Master's thesis, METU, 2004. http://etd.lib.metu.edu.tr/upload/12605589/index.pdf.

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The fundamentals of the ellipsometry are reviewed in order to point out the strengths and weaknesses of the ellipsometric measurements. The effects of the surface conditions (such as degree of cleanliness, contaminated thin layer, roughness etc&hellip
) on the ellipsometric variables are experimentally studied
the optimum procedures have been determined. Hydrogenated amorphous silicon carbide (a-Si1-xCx:H) thin films are produced by plasma enhanced chemical vapor deposition (PECVD) technique with a circular reactor, in a way that RF power and carbon contents are taken as variables. These samples are analyzed using multiple angle of incidence ellipsometer and uv-vis spectrometer. These measurements have inhomogeneities in optical constants, such as thicknesses, refractive indices and optical energy gaps along the radial direction of the reactor electrode for different power and carbon contents.

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22

Graham, David W. "Corrosion resistant chemical vapor deposited coatings for SiC and Si₃N₄ /." This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-09292009-020327/.

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23

Im, Hsung Jai. "Metal contacts to silcon carbide and galliumnitride studied with ballistic electron emission microscopy." Connect to this title online, 2001. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1000844302.

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Thesis (Ph. D.)--Ohio State University, 2001.
Title from first page of PDF file. Document formatted into pages; contains xiii, 165 p.; also contains graphics (some col.). Includes abstract and vita. Advisor: Jonathan P. Pelz, Dept. of Physics. Includes bibliographical references (p. 160-165).

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24

Im, Hsung J. "Metal Contacts to Silicon Carbide and Gallium Nitride Studied with Ballistic Electron Emission Microscopy." The Ohio State University, 2001. http://rave.ohiolink.edu/etdc/view?acc_num=osu1000844302.

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25

Im, Hsung Jai. "Metal contacts to silicon carbide and gallium nitride studied with ballistic electron emission microscopy /." The Ohio State University, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=osu1486402957194756.

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26

Zaman, Farhana. "Characterization of selective epitaxial graphene growth on silicon carbide: limitations and opportunities." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/43624.

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The need for post-CMOS nanoelectronics has led to the investigation of innovative device structures and materials. Graphene, a zero bandgap semiconductor with ballistic transport properties, has great potential to extend diversification and miniaturization beyond the limits of CMOS. The goal of this work is to study the growth of graphene on SiC using the novel method of selective graphitization. The major contributions of this research are as follows - First, epitaxial graphene is successfully grown on selected regions of SiC not capped by AlN deposited by molecular beam epitaxy. This contribution enables the formation of electronic-grade graphene in desired patterns without having to etch the graphene or expose it to any detrimental contact with external chemicals. Etching of AlN opens up windows to the SiC in desirable patterns for subsequent graphitization without leaving etch-residues (determined by XPS). Second, the impact of process parameters on the growth of graphene is investigated. Temperature, time, and argon pressure are the primary growth-conditions altered. A temperature of 1400oC in 1 mbar argon for 20 min produced the most optimal graphene growth without significant damage to the AlN capping-layer. Third, first-ever electronic transport measurements are achieved on the selective epitaxial graphene. Hall mobility of about 1550 cm2/Vs has been obtained to date. Finally, the critical limitations of the selective epitaxial graphene growth are enumerated. The advent of enhanced processing techniques that will overcome these limitations will create a multitude of opportunities for applications for graphene grown in this manner. It is envisaged to be a viable approach to fabrication of radio-frequency field-effect transistors.

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27

Iqbal, Abid. "The Sputtering and Characterization of C-Axis Oriented Aluminium Nitride Thin Films On Top Of Cubic Silicon Carbide-On-Silicon Substrates for Piezoelectric Applications." Thesis, Griffith University, 2017. http://hdl.handle.net/10072/365840.

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The growth of micro-scale wireless electronics is increasing significantly because of their miniaturisation and low power consumption. These devices currently draw power from batteries or chemical fuel cells. Their limited life-spans prompt active research to find an alternative solution by harvesting ambient energy from the environment. Numerous sources are available such as solar, thermoelectric, acoustic, and mechanical vibrations. Among them, mechanical vibration is perhaps the most practical to power these wireless electronic devices via piezoelectric transduction. Three most common piezoelectric materials are Lead zirconate titanate (PZT), zinc oxide (ZnO) and aluminum nitride (AlN). AlN is preferred over ZnO and PZT for several reasons. Chiefly among them is because it has the highest electromechanical coupling along the c-axis of wurzite AlN for longitudinal deformation. This thesis investigates the sputtering of c-axis oriented AlN on top of cubic-silicon carbide-on-silicon (3C-SiC-on-Si) substrates for piezoelectric applications. The 3C-SiC buffer layer was used to reduce the lattice mismatch and thermal expansion coefficient between AlN and Si. In the first part of the research, RF sputtering was utilised for depositing AlN. The low growth rate of RF sputtering prompted the switch to DC sputtering. The DC sputtering suffered from electrical arching problems, which were addressed by gradually decreasing the sputtering pressure. However, the system had the limitation of 1200 W of maximum power.
Thesis (PhD Doctorate)
Doctor of Philosophy (PhD)
Griffith School of Engineering
Science, Environment, Engineering and Technology
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Komarovy, F. F., L. A. Vlasukova, I. N. Parkhomenko, O. V. Milchanin, A. V. Mudryi, A. K. Togambayeva, and N. S. Kovalchuk. "Strong Room-Temperature Photoluminescence of Si-rich and N-rich Silicon-Nitride Films." Thesis, Sumy State University, 2013. http://essuir.sumdu.edu.ua/handle/123456789/35162.

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Si-rich and N-rich silicon nitride films were deposited at low temperature 300 °C by using plasmaenhanced chemical vapor deposition (PECVD). The optical and structural properties of these films have been investigated by ellipsometry, Rutherford backscattering (RBS), transmission electron microscopy (TEM), Raman spectroscopy (RS) and photoluminescence (PL). The formation of silicon clusters in both Sirich and N-rich silicon nitride films after annealing at 900 °C and 1000 °C for hour in N2 ambient has been shown by TEM. Dependency of PL spectra on stoichiometry and post-annealing temperature was analyzed. The contribution of Si and N-related defects in emitting properties of Si-rich and N-rich SiNx has been discussed. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/35162

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Kaminski, Piotr M. "Remote plasma sputtering for silicon solar cells." Thesis, Loughborough University, 2013. https://dspace.lboro.ac.uk/2134/13058.

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The global energy market is continuously changing due to changes in demand and fuel availability. Amongst the technologies considered as capable of fulfilling these future energy requirements, Photovoltaics (PV) are one of the most promising. Currently the majority of the PV market is fulfilled by crystalline Silicon (c-Si) solar cell technology, the so called 1st generation PV. Although c-Si technology is well established there is still a lot to be done to fully exploit its potential. The cost of the devices, and their efficiencies, must be improved to allow PV to become the energy source of the future. The surface of the c-Si device is one of the most important parts of the solar cell as the surface defines the electrical and the optical properties of the device. The surface is responsible for light reflection and charge carrier recombination. The standard surface finish is a thin film layer of silicon nitride deposited by Plasma Enhanced Chemical Vapour Deposition (PECVD). In this thesis an alternative technique of coating preparation is presented. The HiTUS sputtering tool, utilising a remote plasma source, was used to deposit the surface coating. The remote plasma source is unique for solar cells application. Sputtering is a versatile process allowing growth of different films by simply changing the target and/or the deposition atmosphere. Apart from silicon nitride, alternative materials to it were also investigated including: aluminium nitride (this was the first use of the material in solar cells) silicon carbide, and silicon carbonitride. All the materials were successfully used to prepare solar cells apart from the silicon carbide, which was not used due to too high a refractive index. Screen printed solar cells with a silicon nitride coating deposited in HiTUS were prepared with an efficiency of 15.14%. The coating was deposited without the use of silane, a hazardous precursor used in the PECVD process, and without substrate heating. The elimination of both offers potential processing advantages. By applying substrate heating it was found possible to improve the surface passivation and thus improve the spectral response of the solar cell for short wavelengths. These results show that HiTUS can deposit good quality ARC for silicon solar cells. It offers optical improvement of the ARC s properties, compared to an industrial standard, by using the DL-ARC high/low refractive index coating. This coating, unlike the silicon nitride silica stack, is applicable to encapsulated cells. The surface passivation levels obtained allowed a good blue current response.

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Jordan, Jennifer Lynn. "Shock-activated reaction synthesis and high pressure response of Ti-based ternary carbide and nitride ceramics." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/19674.

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張秀霞 and Sau-ha Cheung. "Growing of GaN on vicinal SiC surface by molecular beam epitaxy." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2002. http://hub.hku.hk/bib/B31243009.

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Cheung, Sau-ha. "Growing of GaN on vicinal SiC surface by molecular beam epitaxy /." Hong Kong : University of Hong Kong, 2002. http://sunzi.lib.hku.hk/hkuto/record.jsp?B25212163.

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Jehanathan, Neerushana. "Thermal stability of plasma enhanced chemical vapor deposited silicon nitride thin films." University of Western Australia. School of Mechanical Engineering, 2007. http://theses.library.uwa.edu.au/adt-WU2007.0069.

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[Truncated abstract] This study investigates the thermal stability of Plasma Enhanced Chemical Vapor Deposited (PECVD) silicon nitride thin films. Effects of heat-treatment in air on the chemical composition, atomic bonding structure, crystallinity, mechanical properties, morphological and physical integrity are investigated. The chemical composition, bonding structures and crystallinity are studied by means of X-ray Photoelectron Spectroscopy (XPS), Fourier Transform Infrared (FTIR) Spectroscopy and Transmission Electron Microscopy (TEM). The mechanical properties, such as hardness and Young’s modulus, are determined by means of nanoindentation. The morphological and physical integrity are analyzed using Scanning Electron Microscopy (SEM) . . . The Young’s modulus (E) and hardness (H) of the film deposited at 448 K were measured to have E=121±1.8 GPa and H=11.7±0.25 GPa. The film deposited at 573 K has E=150±3.6 GPa and H=14.7±0.6 GPa. For the film deposited at 573 K, the Young’s modulus is not affected by heating up to 1148 K. Heating at 1373 K caused significant increase in Young’s modulus to 180∼199 GPa. This is attributed to the crystallization of the film. For the film deposited at 448 K, the Young’s modulus showed a moderate increase, by ∼10%, after heating to above 673 K. This is consistent with the much lower level of crystallization in this film as compared to the film deposited at 573 K. In summary, low temperature deposited PECVD SiNx films are chemically and structurally unstable when heated in air to above 673 K. The main changes include oxidation to SiO2, crystallization of Si3N4 and physical cracking. The film deposited at 573 K is more stable and damage and oxidation resistant than the film deposited at 448 K.

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Souza, Denise Criado Pereira de. "Estudo da morfologia e estrutura de filmes de oxinitreto de silício (SiOxNy) obtidos pela técnica de PECVD." Universidade de São Paulo, 2007. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09012008-145807/.

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Neste trabalho são apresentados resultados da caracterização estrutural e morfológica de filmes de oxinitreto de silício (SiOxNy) depositados pela técnica de deposição química a vapor assistida por plasma (PECVD) a baixa temperatura (320°C). O objetivo deste trabalho é relacionar a composição química de ligas amorfas de SiOxNy com suas propriedades ópticas, estruturais, morfológicas e mecânicas visando sua aplicação em dispositivos elétricos, optoeletrônica e microestruturas. A proposta é dar continuidade a trabalhos prévios desenvolvidos no grupo, que demonstraram a viabilidade de controlar a composição química e, como conseqüência, controlar as propriedades como o índice de refração, constante dielétrica e fotoluminescência de filmes de SiOxNy. As condições de deposição foram ajustadas de forma a obter dois tipos de material: filmes de SiOxNy de composição química controlável entre a do SiO2 e a do de Si3N4 e filmes de SiOxNy com composição rica em Si. O material foi caracterizado pelas técnicas de elipsometria, índice de refração por prisma acoplado, RBS (Rutherford Backscattering Spectroscopy), FTIR (Fourier Transform Infrared Spectroscopy), XANES (X-Ray Absorption Near Edge Spectroscopy) na borda K do Si, O e N, medida de stress residual e microscopia eletrônica de varredura (Scanning Electron Microscopy) e de transmissão (Transmission Electron Microscopy). Os resultados mostraram que os filmes com composição química intermediária entre a do SiO2 e a do Si3N4 apresentam arranjo estrutural estável com a temperatura, mantendo as ligações e a estrutura amorfa mesmo após tratamentos térmicos a 1000°C. Também fora demonstrada a possibilidade de obter um material com baixo stress residual e índice de refração ajustável entre 1,46 e 2, resultados ótimos para aplicações em MOEMS (micro-opto-electro- mechanical systems). Já nas amostras ricas em Si foi observada a formação de diferentes fases, sendo uma delas formada por aglomerados de Si e a outra por material constituído por uma mistura de ligações Si-O e Si-N. Este material apresenta a formação de nanocristais de Si, dependendo do conteúdo de Si e das condições do tratamento térmico, permitindo assim, sua aplicação em dispositivos emissores de luz.
In this work results on the morphological and structural characterization of silicon oxynitride (SiOxNy) films deposited by plasma enhanced chemical vapor deposition technique (PECVD) at low temperature (320°C) are presented. The main goal is to correlate the chemical composition of amorphous SiOxNy alloys to their optical, structural, morphological and mechanical properties intending applications on electrical, optoelectronic and micromechanical devices. The proposal is to continue previous research developed in this group, which demonstrated the possibility of tuning the chemical composition and, consequently, the SiOxNy films properties such as refractive index, dielectric constant and photoluminescence by the precise control of the deposition parameters. The deposition conditions were adjusted in order to obtain to material types, SiOxNy films with tunable chemical composition between SiO2 and Si3N4 and silicon-rich SiOxNy. The characterization was performed by elipsometry, refractive index by coupled prism, RBS (Rutherford Backscattering Spectroscopy), FTIR (Fourier Transform Infrared Spectroscopy), XANES (X-Ray Absorption Near Edge Spectroscopy) on K edge of Si, O and N, residual stress measurement and Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM). The films with chemical composition between SiO2 and Si3N4 presented stable structural arrangement with temperature, maintaining the chemical bonds and the amorphous structure after high temperature annealing. Also the results demonstrated the possibility of producing a low residual stress material and an adjustable refractive index since in the 1.46 to 2 range, excellent result for MOEMS devices (micro-opto-electro- mechanical systems applications. For silicon rich-samples the formation of different phases was observed, one formed by Si clusters and other one by a mixture of Si-O and Si-N bonds. Depending on the Si content and on the annealing conditions this material can present nanocristals, results which allowed us to understand and to optimize this material for light emitting devices applications.

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Sel, Kivanc. "The Effects Of Carbon Content On The Properties Of Plasma Deposited Amorphous Silicon Carbide Thin Films." Phd thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/2/12608292/index.pdf.

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The structure and the energy band gap of hydrogenated amorphous silicon carbide are theoretically revised. In the light of defect pool model, density of states distribution is investigated for various regions of mobility gap. The films are deposited by plasma enhanced chemical vapor deposition system with various gas concentrations at two different, lower (30 mW/cm2) and higher (90 mW/cm2), radio frequency power densities. The elemental composition of hydrogenated amorphous silicon carbide films and relative composition of existing bond types are analyzed by x-ray photoelectron spectroscopy measurements. The thicknesses, deposition rates, refractive indices and optical band gaps of the films are determined by ultraviolet visible transmittance measurements. Uniformity of the deposited films is analyzed along the radial direction of the bottom electrode of the plasma enhanced chemical vapor deposition reactor. The molecular vibration characteristics of the films are reviewed and analyzed by Fourier transform infrared spectroscopy measurements. Electrical characteristics of the films are analyzed by dc conductivity measurements. Conduction mechanisms, such as extended state, nearest neighbor and variable range hopping in tail states are revised. The hopping conductivities are analyzed by considering the density of states distribution in various regions of mobility gap. The experimentally measured activation energies for the films of high carbon content are too low to be interpreted as the difference between Fermi level and relevant band edge. This anomaly has been successfully removed by introducing hopping conduction across localized tail states of the relevant band. In other words, the second contribution lowers the mobility edge towards the Fermi level.

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Parro, Rocco John III. "THE MECHANICAL PROPERTIES OF AMORPHOUS SILICON CARBIDE FILMS DEPOSITED BY PECVD AND RF SPUTTERING FOR APPLICATION AS A STRUCTURAL LAYER IN MICROBRIDGE-BASED RF MEMS." Case Western Reserve University School of Graduate Studies / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=case1270241057.

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Rajgadkar, Ajay. "Characterization of Dielectric Films for Electrowetting on Dielectric Systems." Scholar Commons, 2010. http://scholarcommons.usf.edu/etd/3607.

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Electrowetting is a phenomenon that controls the wettability of liquids on solid surfaces by the application of electric potential. It is an interesting method to handle tiny amounts of liquid on solid surfaces. In recent times, researchers have been investigating this phenomenon and have reported some unexplained behavior and degradation in the Electrowetting system performance. Electrowetting systems include the presence of electric field and different materials from metals to dielectrics and electrolytes that create an environment in which corrosion processes play a very important role. With the small dimensions of the electrodes, corrosion can cause failure quickly when the dielectric fails. In this work, commonly used dielectric films such as silicon dioxide and silicon nitride were deposited using Plasma Enhanced Chemical Vapor Deposition and characterized on the basis of thickness uniformity, etch rate measurements, Dry current – voltage measurements and Wet current – voltage measurements. Sputtered silicon dioxide films were also characterized using the same methods. The correlation between Dry I – V and Wet I – V measurements was studied and a comparison of dielectric quality of films based on these measurements is presented. Also, impact of different liquids on the dielectric quality of films was studied.

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LaBarbera, Michael Anthony. "Long-Term, High Temperature Mechanical Stability of PECVD Amorphous Silicon Carbide for Use as Structural Material in Harsh Environment MEMS." Case Western Reserve University School of Graduate Studies / OhioLINK, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=case1396456649.

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Graham, David W. "Corrosion resistant chemical vapor deposited coatings for SiC and Si3N4." Thesis, Virginia Tech, 1993. http://hdl.handle.net/10919/44944.

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Silicon carbide and silicon nitride turbine engine components are susceptible to hot corrosion by molten sodium sulfate salts which are formed from impurities in the engine's fuel and air intake. Several oxide materials were identified which may be able to protect these components from corrosion and preserve their structural properties. Ta20, coatings were identified as one of the most promising candidates. Thermochemical calculations showed that the chemical vapor deposition(CVD) of tantalum oxide from O2 and TaCI5 precursors is thermodynamically feasible over a range of pressures, temperatures, and reactant concentrations. The deposition of Ta205, as a single phase is predicted in regions of excess oxygen, where the reaction is predicted to yield nearly 100% efficiency.

CVD experiments were carried out to deposit tantalum oxide films onto SiC substrates. Depending on the deposition conditions, a variety of coating morphologies have been produced, and conditions have been identified which produce dense, continuous Ta205 deposits. Preliminary corrosion tests on these coatings showed no apparent degradation of the CVD deposited tantalum oxide coatings.

The feasibility of depositing ZrTi04 as a coating material was also investigated based on thermochemical considerations. Since no data were available for this material, thermodynamic values were estimated. Thermochemical calculations indicated the chemical vapor deposition of zirconium titanate from O2, ZrCl4, and TiCl4 occurs over a range of temperatures in a very narrow region of the phase diagram. Deviations from the single phase region predicted the codeposition of either Zr02 or Ti02 with ZrTi04.

These results suggested that the chemical vapor deposition of ZrTi04 may be difficult from a process handling perspective. Additionally, the process is predicted to be very inefficient, leaving substantial amounts of unreacted chlorides in the reactor exhaust.

Master of Science

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Bosco, Giácomo Bizinoto Ferreira 1987. "Photoluminescence of Tb3+ in a-Si3N4:H prepared by reactive RF-Sputtering and ECR PECVD = Fotoluminescência de Tb3+ em a-Si3N4:H preparado por RF-Sputtering reativo e ECR PECVD." [s.n.], 2017. http://repositorio.unicamp.br/jspui/handle/REPOSIP/322722.

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Orientador: Leandro Russovski Tessler
Tese (doutorado) - Universidade Estadual de Campinas, Instituto de Física Gleb Wataghin
Made available in DSpace on 2018-09-01T20:54:28Z (GMT). No. of bitstreams: 1 Bosco_GiacomoBizinotoFerreira_D.pdf: 9507140 bytes, checksum: 4980b29f48f98f8ff97e8a0a37b7577e (MD5) Previous issue date: 2017
Resumo: Este trabalho fornece caracterização ótica e estrutural de filmes finos compostos por nitreto de silício amorfo hidrogenado dopado com térbio (a-SiNx:H) ¿ crescidos por deposição química a vapor assistida por plasma gerado através de ressonância ciclotrônica de elétrons (ECR PECVD) e por pulverização catódica reativa em radiofrequência (reactive RF-Sputtering) ¿ com o propósito de avançar a investigação em fabricação de novos materiais e dos mecanismos da emissão de luz de íons de Tb quando diluídos em materiais baseados em silício. A fotoluminescência (PL) atribuída aos filmes de a-SiNx:H foi investigada em termos das condições de deposição e correlacionadas com suas propriedades estruturais e de recozimento pós-deposição. Entre as propriedades caracterizadas estão: estequiometria, taxa de deposição, índice de refração, coeficiente de extinção, bandgap ótico E04, concentração de térbio e vizinhança química presente ao redor de íons Tb3+. Concentrações de Tb da ordem de 1.8 at.% ou 1.4×?10?^21 at/cm^3 foram obtidas em amostras crescidas por Sputtering enquanto que concentrações de 14.0 at.%, ou da ordem ?10?^22 at/cm^3, puderam ser obtidas em amostras crescidas por ECR PECVD. Em Sputtering, a incorporação de Tb varia linearmente com a área recoberta por pastilhas de Tb4O7 em pó, enquanto que em PECVD, a incorporação de Tb é inversamente proporcional e pode ser ajustada sensivelmente pelo fluxo de gás SiH4. Forte emissão de luz, atribuída às transições eletrônicas em Tb3+ (PL do Tb), foi obtida em filmes não-recozidos que possuíam bandgap estequiométrico (E04 = 4.7 ± 0.4 eV and x = 1.5 ± 0.2). Espectros de PL do Tb não mostraram mudanças significativas no formato e na posição dos picos de emissão devido a alterações na temperatura de recozimento, nas condições de deposição ou entre amostras crescidas por diferentes técnicas de deposição. Entretanto, esses parâmetros influenciaram fortemente a intensidade da PL do Tb. Estudos da estrutura fina de absorção de raios-X (XAFS) em filmes crescidos por sputtering mostraram a estabilidade da vizinhança química ao redor dos íons Tb3+ mesmo em altas temperaturas (1100ºC). Investigações por sonda atômica tomográfica (APT) não encontraram formação de nanoclusters envolvendo ou não Tb, mesmo após recozimentos em altas temperaturas. Isso sugere que a excitação de Tb3+ deve ocorrer através da própria matriz hospedeira amorfa e não por mudanças no campo cristalino e, portanto, na força de oscilador das transições eletrônicas do Tb3+. Caracterização da densidade de ligações Si-H por espectroscopia infravermelha a transformada de Fourier (FTIR) em filmes recozidos em diferentes temperaturas foi relacionada com a intensidade da PL do Tb. Ela mostra que um decréscimo na densidade das ligações Si-H, que está relacionada a um aumento na concentração de ligações pendentes de Si (Si-dbs), resulta em filmes com maior intensidade na PL do Tb. Portanto, isso sugere que a excitação de Tb3+ parece acontecer através de transições envolvendo Si-dbs e estados estendidos, o que é consistente com o modelo de excitação Auger por defeitos (DRAE)
Abstract: This work offers optical and structural characterization of terbium (Tb) doped hydrogenated amorphous silicon nitrides thin films (a-SiNx:H) grown by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECR PECVD) and reactive RF-Sputtering with the purpose of advancing the investigation in fabrication of novel materials and the mechanisms of light emission of Tb ions when embedded in Si-based materials. Photoluminescence (PL) of a-SiNx:H films were investigated and correlated with the deposition conditions, structural properties, and post-deposition thermal treatments (isochronal annealing under flow of N2). Among the characterized properties are: film stoichiometry, deposition rate, refractive index, extinction coefficient, optical bandgap, terbium concentration, and the chemical neighborhood around Tb ions. Tb concentrations of about 1.8 at.% or 1.4×?10?^21 at/cm^3 have been achieved in Sputtering system while concentrations of 14.0 at.%, or about ?10?^22 at/cm^3, could be achieved in ECR PECVD samples. In Sputtering, Tb incorporation varies linearly with the covered area of the Si target by Tb4O7 powder pellets, while in PECVD, Tb incorporation is inversely proportional to and can be sensitively adjusted through SiH4 gas flow. Bright PL attributed to Tb3+ electronic transitions (Tb PL) were obtained in as-deposited films with stoichiometric bandgaps (E04 = 4.7 ± 0.4 eV and x = 1.5 ± 0.2). The Tb PL spectra did not show any significant change in shape and in PL peak positions due to alterations in annealing temperature, deposition conditions or due to the used deposition method. However, these parameters strongly affected Tb PL intensity. Studies of X-ray absorption fine structure (XAFS) in Sputtering grown films show the stability of the chemical neighborhood around Tb3+ under annealing conditions even after thermal treatments at temperatures as high as 1100ºC. Atom probe tomography (APT) investigation also found no formation of nanoclusters of any type (involving Tb ions or not) after high temperature annealing treatments suggesting that Tb3+ excitation should come from the amorphous host matrix itself and not by changes in crystal field and thus in oscillator strength of Tb3+ electronic transitions. Fourier transform infrared spectroscopy (FTIR) characterization of Si-H bond density in films treated atin different annealing temperatures were crossed correlated with Tb PL intensity. It shows that a decrease in Si-H bond density, related to increase in Si dangling bonds (Si-dbs) concentration, results in greater Tb PL intensity. Thus, it suggests that excitation of Tb3+ happens through transitions involving silicon dangling bonds and extended states, consistent with the defect related Auger excitation model (DRAE)
Doutorado
Física
Doutor em Ciências
142174/2012-2
010308/2014-08
CNPQ
CAPES

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Chan, King-lung, and 陳勁龍. "A study of geometrical properties of SiC and GaN surfaces by auger electron spectroscopy." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2002. http://hub.hku.hk/bib/B2664387X.

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Devarapally, Rahul Reddy. "Survey of applications of WBG devices in power electronics." Kansas State University, 2016. http://hdl.handle.net/2097/32665.

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Master of Science
Department of Electrical and Computer Engineering
Behrooz Mirafzal
Wide bandgap devices have gained increasing attention in the market of power electronics for their ability to perform even in harsh environments. The high voltage blocking and high temperature withstanding capabilities make them outperform existing Silicon devices. They are expected to find places in future traction systems, electric vehicles, LED lightning and renewable energy engineering systems. In spite of several other advantages later mentioned in this paper, WBG devices also face a few challenges which need to be addressed before they can be applied in large scale in industries. Electromagnetic interference and new requirements in packaging methods are some of the challenges being faced by WBG devices. After the commercialization of these devices, many experiments are being carried out to understand and validate their abilities and drawbacks. This paper summarizes the experimental results of various applications of mainly Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices and also includes a section explaining the current challenges for their employment and improvements being made to overcome them.

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Prado, Rogério Junqueira. "Propriedades químicas e morfológicas de filmes hidrogenados de carbeto de silício amorfo." Universidade de São Paulo, 1997. http://www.teses.usp.br/teses/disponiveis/43/43133/tde-07032002-142147/.

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Nesta dissertação discorremos acerca do crescimento e caracterização de filmes finos de carbeto de silício amorfo hidrogenado (a-Si1-xCx:H), crescidos pelo método de deposição química de vapor assistida por plasma (PECVD) no regime de baixa densidade de potência a partir de misturas de silano e metano. Foram analisadas e correlacionadas as propriedades ópticas, morfológicas e composicionais de filmes depositados em diferentes condições de fluxo de silano e concentração de metano. Os resultados não apenas confirmaram dados anteriores obtidos em filmes de a-Si1-xCx:H similares, mas possibilitaram uma melhor compreensão das características deste material. Para a obtenção de um composto de alto gap, alto conteúdo de carbono, química e morfologicamente homogêneo é necessário utilizar baixos fluxos de silano e alta concentração de metano, condições de deposição conhecidas como regime de \"plasma faminto por silano\". Neste regime são crescidos filmes com Eg > 3 eV, x > 0,5, maior concentração de ligações Si-C, concentração de hidrogênio de 50 at.%, menor proporção de radicais CH3 e menor densidade de poros.
In this work we describe the growth and characterization of hydrogenated amorphous silicon carbide (a-Si1-xCx:H) thin films deposited by plasma enhanced chemical vapor deposition (PECVD) in the low power density regime from mixtures of silane and methane. The optical, morphological and compositional properties of films deposited under different silane flow and methane concentration were analyzed and correlated. The results not only confirmed previous data obtained on similar a-Si1-xCx:H films, but improved the comprehension of their characteristics. In order to obtain a compound with high optical gap, high carbon content, chemically and morphologically homogeneous, it is necessary to work with low silane flow and high methane concentration; deposition conditions known as \"silane starving plasma\" regime. In this regime, films with Eg > 3 eV, x > 0.5, higher concentration of Si-C bonds, hydrogen concentration of 50 at.%, smaller proportion of CH3 radicals and smaller density of pores are produced.

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Parikh, Rinku Pankaj. "Simulation-based design, optimization, and control of silicon carbide and gallium nitride thin film chemical vapor deposition reactor systems." College Park, Md. : University of Maryland, 2006. http://hdl.handle.net/1903/3976.

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Thesis (Ph. D.) -- University of Maryland, College Park, 2006.
Thesis research directed by: Chemical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.

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Oliveira, Alessandro Ricardo de. "Estudo da viabilidade de fabricação de dispositivos semicondutores baseados em filmes de carbeto de silício crescidos por PECVD." Universidade de São Paulo, 2006. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-08122006-142624/.

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Анотація:

Neste trabalho é estudada a viabilidade de produção de dispositivos eletrônicos baseados em filmes semicondutores de carbeto de silício estequiométrico (a-Si0,5C0,5:H) obtidos por deposição química por vapor assistida por plasma, PECVD. A proposta do projeto envolve a realização de uma série de trabalhos que permitam avaliar as potencialidades do a-SiC:H para a fabricação de dispositivos semicondutores simples. Deste modo, desenvolvemos as principais etapas para a construção de dispositivos, as quais envolveram a dopagem elétrica por diferentes técnicas com a utilização de diferentes elementos dopantes, a corrosão seletiva por plasma e a obtenção um dielétrico apropriado e compatível com a tecnologia do SiC, bem como o desenvolvimento de processos de cristalização, que podem se mostrar fundamentais para melhorar as propriedades dos filmes de a-SiC:H. Com tais processos aprimorados, fabricamos estruturas MOSiC (metal-óxidocarbeto de silício) a partir do SiC cristalizado, utilizando como dielétrico de porta o SiO2 crescido por oxidação térmica (seca e úmida) dos próprios filmes de carbeto de silício cristalizados. Essas estruturas apresentaram o comportamento típico de um capacitor MOS, com regiões de acumulação, depleção e inversão bem definidas em todos os casos. Também fabricamos heterojunções de filmes de SiC tipo-p (como depositado e tratado termicamente) sobre substratos de Si tipo-n, os quais mostraram boas caracterísitcas retificadoras para as heteroestruturas formadas pelo a-SiC:H como-depositado e tratado termicamente a 550ºC. Além do mais, também projetamos, fabricamos, modelamos e caracterizamos transistores de filme fino de a-SiC:H. De acordo com as caracterizações elétricas observamos que podemos controlar a condutividade do canal, embora os dispositivos ainda precisem ser aprimorados para se obter melhores níveis de corrente. Vemos, portanto que, embora ainda tenham que ser aperfeiçoados, foram construídos com sucesso dispositivos eletrônicos semicondutores baseados em filmes de a-Si0,5C0,5:H obtidos por PECVD.
In this work we studied the viability to build devices based on stoichiometric amorphous silicon carbide semiconductor films (a-Si0.5C0.5:H), obtained by plasma enhanced chemical vapor deposition technique. The project proposal involves the realization of a series of studies that evaluate the potentialities of the a-SiC:H for the fabrication of simple semiconductor devices. In this way, we developed the main steps for the devices\' fabrication, which involved electric doping, by different doping techniques using different doping sources, selective plasma etching and the obtention of an appropriate and compatible dielectric for SiC technology. Besides, we performed crystallization processes that were essential to improve the properties of the amorphous films. By establishing the processes steps, we manufactured MOSiC (metal-oxidesilicon carbide) structures starting from crystallized SiC and using SiO2 as the gate dielectric, which was obtained by thermal oxidation (wet and dry) of the crystallized silicon carbide films. All the structures presented a typical MOS capacitor behavior, with accumulation, depletion and inversion regions well-defined in all the cases. We also fabricated heterojunctions formed by p-type SiC films (as-deposited and annealed) on n-type silicon substrates that showed good rectifying characteristics for as-deposited and annealed at 550ºC a-SiC:H films. Moreover, we designed, manufactured, modeled and characterized a-SiC:H thin film transistors. The electric characterization demonstrated that it is possible to control the channel conductivity; however, the devices still need to be improved to obtain better current levels. Although some improvement still need to be made, we built successfully electronic semiconductor devices based on a-Si0.5C0.5:H films obtained at low temperatures by PECVD technique.

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Carbaugh, Daniel J. "Growth and Characterization of Silicon-Based Dielectrics using Plasma Enhanced Chemical Vapor Deposition." Ohio University / OhioLINK, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1406644891.

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Kaneko, Mitsuaki. "Strain-Controlled AlN Growth on SiC Substrates." 京都大学 (Kyoto University), 2016. http://hdl.handle.net/2433/217172.

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Lin, Limin. "A study of gate dielectrics for wide-bandgap semiconductors GaN & SiC /." Click to view the E-thesis via HKUTO, 2007. http://sunzi.lib.hku.hk/hkuto/record/B3932252X.

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Dai, Xianqi, and 戴憲起. "A study of the structural properties of SiC and GaN surfaces and theirinterfaces by first principle total energy calculation." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2003. http://hub.hku.hk/bib/B31244130.

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Lin, Limin, and 林立旻. "A study of gate dielectrics for wide-bandgap semiconductors: GaN & SiC." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2007. http://hub.hku.hk/bib/B3932252X.

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Дисертації з теми "PECVD silicon carbide and silicon nitride"

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