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1
Chan, Ching-Yuen. "Cell controller for printed circuit board assembly rework." Thesis, University of Salford, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.386432.
Повний текст джерела
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Wang, Lei. "Printed Circuit Board Design for Frequency Disturbance Recorder." Thesis, Virginia Tech, 2005. http://hdl.handle.net/10919/30917.
Повний текст джерелаАнотація:
The FDR (Frequency Disturbance Recorder) is a data acquisition device for the power system. The device is portable and can be used with any residential wall outlet for frequency data collection. Furthermore, the FDR transmits calculated frequency data to the web for access by authorized users via Ethernet connection. As a result, Virginia Tech implemented Frequency Monitoring Network (FNET) with these FDR devices. FNET is a collection of identical FDRs placed in different measurement sites to allow for data integration and comparison. Frequency is an important factor for power system control and stabilization. With funding and support provided by ABB, TVA and NSF the FDRs are placed strategically all over the United States for frequency analysis, power system protection and monitoring.
The purpose of this study is to refine the current FDR hardware design and establish a new design that will physically fit all the components on one Printed Circuit Board (PCB). At the same time, the software that is to be implemented on the new board is to be kept similar if not the same as that of the current design. The current FDR uses the Axiom CME555 development board and it is interfaced to the external devices through its communication ports. Even through the CME555 board is able to meet the demands of the basic FDR operations, there are still several problems associated with this design. This paper will address some of those hardware problems, as well as propose a new board design that is specifically aimed for operations of FDR.
Master of Science
3
Sandron, Marco. "Mils - Stampante per la creazione di PCB (printed circuit board) con polimero." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2019. http://amslaurea.unibo.it/19757/.
Повний текст джерелаАнотація:
Nella mia carriera universitaria mi sono imbattuto in progetti che necessitavano di un circuito elettronico che in alcuni casi costituiva una parte fondamentale e che veniva valutata. Per la realizzazione di questi circuiti è stata utilizzata l’elettronica open source, di conseguenza è stato necessario collegare tra di loro varie schede e anche alcuni componenti. Questi collegamenti non potevano essere eseguiti solo con semplici cavi elettrici ma necessitavano si supporti fisici anche per posizionare in modo ordinato i componenti e sono state utilizzate perciò basette millefori.
I collegamenti eseguiti con cavi elettrici occupano spazio e rendono difficoltose le riparazioni in caso di guasto o mal funzionamento inoltre la qualità finale del circuito creato con le basette millefori sono una problematica nel realizzare circuiti per una piccola serie. Ho voluto quindi trovare una soluzione per questo, pensando a qualcosa di economico, rapido e facile da utilizzare, con una certa qualità del prodotto finale.
Nella fase di ricerca ho notato che questa problematica è presente anche all’interno dei FabLab, dove la prototipazione, la personalizzazione e la piccola serie sono questioni fondamentali. Qui le tecnologie non sono poche (pantografo CNC, la stampante 3D e taglio laser) e quindi ho cercato di capire se la soluzione per risolvere il problema potesse essere già presente o derivare da quelle presenti, ponendomi in un’ottica di riciclo e riutilizzo a fine vita del circuito e dei sui componenti. La soluzione finale ne riprende la tecnologia base, le forme e i componenti fisici ed elettronici e utilizza una tipologia di materiale per la costruzione dei collegamenti tra i vari componenti elettronici, che è presente e utilizzato ampiamente all’interno dei FabLab, in varie tipologie e con varie caratteristiche. Questa può condurre corrente solo se opportunamente trattato, perché naturalmente ha l’effetto opposto cioè quello di isolare, si tratta del filamento di polimero.
4
maamoun, Adam. "A SURROGATE MEASURE OF CUSTOMER SATISFACTION IN THE MANUFACTURE OF PRINTED WIRING BOARDS." Doctoral diss., University of Central Florida, 2008. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/2428.
Повний текст джерелаАнотація:
The objective of this research is to determine and develop a model that is capable of accurately measuring customer satisfaction for different industries and in particularly for the Printed Wiring Boards (PWB) Manufacturers. The new model will incorporate data not being collected or utilized by the survey method of determining customer satisfaction. The method used is a weighted average of satisfaction among several researched categories with percentages that accurately represent the relative importance of multiple facets of the PWB manufacturers customer satisfaction. A very common term in quality assurance is that "What is not measured accurately can not be evaluated or managed correctly," thus customer satisfaction is a very important aspect of any business, industry, or government. A satisfied customer will do more business and recommend it to other potential customers. Thus the business will grow and more revenues result. On the other hand, an unsatisfied customer will abandon the business and encourage more customers not to get involved with the same business so the business may decline and lose its market share and profitability. The categories that contribute to PWB customer satisfaction will be determined by conducting surveys among the leaders and best in the business of the PWB industry in addition to discovery of related articles that define the categories of the customer satisfaction for the PWB manufacturers. Once the categories are determined, the research concentrates on the weighting of the categories that most contribute to the PWB customer's satisfaction and a measure of satisfaction is derived. The model is easily applied to any other kind of PWB business or service industry. The model is based on empirical methods that will give an accurate measurement for the PWB customer's satisfaction. This in turn allows organizations the opportunity for improving customer satisfaction and increasing market share. The algorithm is based on characteristics deemed important by customers. Thus the customer satisfaction index can be computed and monitored on a regular basis without costly surveys. The major difference between this new model and the standard methods of determining customer satisfaction using the surveys is that this model will utilize data available with the proposals, sales, shipping, receiving, quality, engineering, manufacturing, and purchasing departments. The developed method to measure customer satisfaction utilizing internal data can be more cost effective, more accurate, can provide individual customer satisfaction scores, can measure whether or not these individual scores are statistically lower than the majority, and can provide satisfaction measures in real time none of which can be supplied by the survey method.Ph.D.
Department of Industrial Engineering and Management Systems
Engineering and Computer Science
Industrial Engineering PhD
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Rajagopal, Abhilash. "Printed circuit board (PCB) loss characterization up-to 20 GHz and modeling, analysis and validation." Diss., Rolla, Mo. : University of Missouri-Rolla, 2007. http://scholarsmine.umr.edu/thesis/pdf/Rajagopal_09007dcc803bf920.pdf.
Повний текст джерелаАнотація:
Thesis (M.S.)--University of Missouri--Rolla, 2007.Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed November 26, 2007) Includes bibliographical references (p. 112-113).
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Subbarayan, Guhan. "A systematic approach for selection of best PB-free printed circuit board (PCB) surface finish." Diss., Online access via UMI:, 2007.
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7
Ahmed, Ahmed Sabry Eltaher. "High-performance cooling of power semiconductor devices embedded in a printed circuit board." Electronic Thesis or Diss., Lyon, INSA, 2024. http://www.theses.fr/2024ISAL0100.
Повний текст джерелаАнотація:
L'intégration de dispositifs semi-conducteurs de puissance dans un circuit imprimé (PCB) est une solution prometteuse pour réduire les éléments parasites des circuits, simplifier le packaging des dispositifs et réduire les coûts. Cependant, la réduction continue de la taille des puces semi-conductrices, combinée à la faible conductivité thermique des couches diélectriques des PCB nécessitent des solutions de gestion thermique plus efficaces. Les solutions de gestion thermique et de refroidissement doivent offrir une faible résistance thermique entre la jonction de la puce et son environnement, et être capables de gérer une densité de puissance élevée au niveau de la puce sans dépasser la limite supérieure de la température de jonction de la puce. La plupart des dispositifs en silicium sont limités à 175°C. L'objectif de cette thèse est d'atteindre une densité de puissance de 1000 W/cm² sans dépasser la limite de température de jonction de 175°C. Cet objectif est contraint par d'autres considérations telles que la faible consommation d'énergie, la taille et le poids, la haute fiabilité, le faible coût et un entretien minimal. Enfin, les solutions de refroidissement étudiées ici doivent être compatibles avec les processus de fabrication des PCB et la technologie d'intégration, car nous visons à les appliquer aux puces intégrées dans les PCB. Dans ce projet de recherche, deux solutions de gestion thermique sont étudiées. Tout d'abord, un dissipateur de chaleur en graphite avec une haute conductivité thermique (1300 W/(m.K) dans le plan, et 15 W/(m.K) hors plan) est intégré dans le PCB. Deuxièmement, une solution d'extraction de chaleur basée sur la technique de refroidissement par jet d'eau impactant est mise en œuvre pour collecter la chaleur à la surface du PCB. Pour la solution de dissipation de chaleur, les valeurs des résistances thermiques jonction-environnement et jonction-boîtier (RthJA et RthJC, respectivement), des variantes de PCB avec des diodes et des puces MOSFET intégrées, sont réduites jusqu'à 38 % pour RthJA et 30 % pour RthJC, d'après les mesures. Pour la solution d'extraction de chaleur, le refroidisseur à jet d'eau (JIC) présenté réduit expérimentalement RthJA de 33 % par rapport à une plaque froide conventionnelle. Le coefficient de transfert de chaleur effectif (HTC) du JIC est calculé par simulations et s'élève à environ 43 kW/(m².K) avec une chute de pression de 9,7 kPa. Cette performance permet d'atteindre une densité de puissance de 865 W/cm² sans dépasser la limite de température de jonction de 175°C. Augmenter la conductivité thermique de la couche isolante par un facteur de 10 permettra d'atteindre 993 W/cm² (très proche de l'objectif de 1000 W/cm²)The integration of power semiconductor devices within a printed circuit board (PCB) stack is a promising solution to reduce circuit parasitics, simplifying device packaging, and lowering costs. However, the continuous reduction in the chip size of the semiconductors, combined with the low thermal conductivity of the dielectric layers of PCBs, present more thermal challenges, and require more efficient thermal management solutions. The thermal management and cooling solutions must offer low thermal resistance between the chip junction and its environment and be capable of handling a high-power loss density at the chip level without exceeding the upper limit of the chip junction temperature. Most silicon devices are limited to 175°C to account for the temperature limits of packaging materials. The ultimate goal of this thesis is to achieve a power-loss density of 1000 W/cm² without exceeding the junction temperature limit of 175°C. This goal is constrained by other considerations such as low power consumption, compact size and weight, high reliability, low cost, and minimal maintenance. Finally, the cooling solutions studied here must be compatible with PCB manufacturing processes and embedding technology, as we aim to apply them to chips integrated into PCBs. In this research project, two thermal management solutions are studied. First, a graphite heat spreader with high thermal conductivity (1300 W/(m.K) in-plane, and 15 W/(m.K) cross-plane) is integrated into the PCB stack. Second, a heat extraction solution based on water jet impingement cooling technique is implemented to collect heat at the PCB surface. For the heat spreading solution, the junction-to-ambient and junction-to-case thermal resistances values (RthJA and RthJC, respectively) of the PCB variants with embedded diodes and MOSFET chips, are reduced by up to 38 % in RthJA and 30 % in RthJC. For the heat extraction solution, the presented water jet cooler (JIC) experimentally reduces RthJA by 33% compared to a conventional cold plate. The effective heat transfer coefficient (HTC) of the JIC is calculated through simulations and found to be about 43 kW/(m².K) with a pressure drop of 9.7 kPa. This performance allows achieving a power loss density of 865 W/cm² without exceeding the junction temperature limit of 175°C. Increasing the thermal conductivity of the isolation layer by 10 times will allow to reach 993 W/cm² (very close to the target of 1000 W/cm²)
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Caillaud, Rémy. "Integration of a 3.3 kW, AC/DC bidirectional converter using printed circuit board embedding technology." Thesis, Lyon, 2019. http://www.theses.fr/2019LYSEI001/document.
Повний текст джерелаАнотація:
Les énergies fossiles (Pétrole, Charbon, …) représentent 80 % des énergies consommés. Malheureusement pour l’environnement, elles sont les plus polluantes. Le remplacement actuel des énergies fossiles permet au marché de l’électronique de puissance de grandir d’année en année. L’électronique de puissance permet d’adapter l’énergie électrique à son utilisation finale. Dans la pratique, l’adaptation de l’énergie électrique utilise des convertisseurs. En plus de respecter le volume, l’efficacité et la fiabilité imposés par le cahier des charges pour chaque application, l’électronique de puissance doit aussi permettre de réduire sensiblement les coûts. Le convertisseur doit assurer le fonctionnement électrique du circuit, le support mécanique des composants et la gestion thermique. Le package utilisé par les nouveaux composants à grand gap limite leurs performances. L’intégration des convertisseurs doit développer des méthodes d’interconnexion permettant d’éliminer ce package. L’objectif de la recherche sur l’intégration des convertisseurs est de repousser les limites imposées par un cahier des charges standard tout en assurant ces 3 fonctions principales. Parmi les nombreuses techniques d’intégration, le circuit imprimé (PCB) est mature industriellement, permet la fabrication collective et un assemblage automatisé. L’intégration utilisant le PCB a développé la technique d’enfouissement de puce avec laquelle la puce est directement enfouie dans le PCB sans son package. Cette thèse va étudier la méthode d’enfouissement pour les autres composants nécessaires à la réalisation d’un convertisseur (Condensateurs, Composants Magnétiques). Une optimisation du convertisseur qui doit être réalisé permet de prendre en compte les avantages de cette nouvelle technologie. Un prototype de convertisseur intégré a été réalisé avec des composants utilisant cette technologieWith the endangering of the environment due to the use of fossil fuels, the power electronics market is growing through the years. The number of applications is increasing in numerous field as, for example, transport (electric car, "more electric" aircraft) or energy (photovoltaic, smart grid). Beyond meeting the volume, efficiency and reliability specifications for each application, power electronics should also reduce substantially costs. Today, the managing of the electric energy uses power electronic converters. The conception of a converter is a multiphysic problem. The converter has to ensure electrical functionality, mechanical support and proper thermal management.The new wide-band gap components are limited in performance by their package. The integration of a converter should use new interconnection methods to avoid the use of packaged components. The trend is to integrate the maximum of components into a single system. This integration can offer benefits such as size and weight reduction, cost saving and reliability improvement by managing the complexity and the high density of interconnection. Among many integration technologies available, Printed Circuit Board (PCB) is well known in the industry, allowing mass production with automated manufacturing and assembly. The PCB integration was developed with the “Die Embedding” technology in which a bare die in embedded directly in the PCB to not use package. This thesis studied the embedding technology on others components necessary to the realization of a converter (Capacitors, Magnetics, …). An optimization of the converter is done taking into account the advantages of this new technology. A prototype of an AC/DC bidirectional converter fully integrated using this technology was realized
9
Zhang, Jingbing. "On flexibly integrating machine vision inspection systems in PCB manufacture." Thesis, Loughborough University, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.314613.
Повний текст джерела
10
Machuca, Julían, and Thomas Tuvesson. "PCB design of Power Distributor Unit (PDU)." Thesis, Uppsala universitet, Institutionen för elektroteknik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-415474.
Повний текст джерелаАнотація:
The project idea was created from the demand of a renewal for a Power Distributor Unit also known as a PDU. The current product had successively turned in to a cable mess because of short term solutions. This made the product non user friendly, inconvenient and non-agile to handle troubleshooting. To develop this project, a PCB design was created by simplifying and improving circuit diagrams until satisfied. Once the final circuit diagram was obtained, a PCB layout design was created. The result of the project, due to limited time, was only theoretical. The finished product was not tested as there was no time allowing this.
11
Saiganesh, Subramaniam. "SUSTAINABLE RESOURCE UTILIZATION IN MANUFACTURING OF PRINTED CIRCUIT BOARD ASSEMBLY: EXERGY ANALYSIS OF THE PROCESS." UKnowledge, 2010. http://uknowledge.uky.edu/gradschool_theses/34.
Повний текст джерелаАнотація:
Engineering for sustainable development requires prudent utilization of resources under economic, environmental and societal constraints. Resource utilization must follow a holistic approach. This brings in a need for comprehensive metrics which are simple, standard and universal. Thermodynamics may offer a metric that focuses on both quality and quantity of energy resources which may carry information to be combined with other metrics. This metric may be a thermodynamic property called exergy or available energy, which provides a better insight into resource use in both energy and non-energy producing systems. This thesis is devoted to a study of the exergy concept in manufacturing.
A high volume PCB assembly, manufactured in a state of the art soldering facility is chosen for the study. Various mass and energy resources flowing through the production line were quantified in terms of exergy. On the basis of exergy content and exergy utilization in the production process, the sustainability in terms of resources use is discussed. An early version of this approach was presented at the International Symposium on Sustainable Systems and Technologies, IEEE, Washington DC, in May 2010.
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Foster, Andrew Wallace. "Predicting solder defects in printed circuit board assembly (PCBA) process." Thesis, Massachusetts Institute of Technology, 2019. https://hdl.handle.net/1721.1/122584.
Повний текст джерелаАнотація:
Thesis: M.B.A., Massachusetts Institute of Technology, Sloan School of Management, 2019, In conjunction with the Leaders for Global Operations Program at MITThesis: S.M., Massachusetts Institute of Technology, Department of Civil and Environmental Engineering, 2019, In conjunction with the Leaders for Global Operations Program at MIT
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 72-76).
Printed circuit boards (PCBs) are core components of virtually every modern electronic device, from smartphones to servers. Accordingly, printed circuit board assembly (PCBA) has become core to Flex, a leading electronics manufacturing services (EMS) company. As the EMS industry continues to automate the PCBA process, it captures more data and creates opportunities to leverage this data and to generate value through analytics. One such promising opportunity is using defect prediction to improve downstream yields. For instance, x-ray inspection, which mostly detects solder defects, has a yield of about 97% for one of Flex's automated PCBA lines, and an improvement even to just 98% would create significant cost savings. Given this opportunity, this project aims to use the new data captured by the first steps in the automated PCBA process to predict solder defects that are usually identified during inspection, several days after the board begins the PCBA process. Specifically, the proposed boosted trees model uses data on 20,000 solder pads to predict whether an entire board will fail a downstream x-ray test. Other, more granular models are also studied, as well as other predictive models such as logistic regression and convolutional neural network models. The model is able to identify defective PCBs with an AUC of 0.74 and improve x-ray inspection yields from 97% to 98%, using one PCBA line at Flex as a case study. A second additional use case would reduce the number of x-ray inspection machines needed. Furthermore, a pilot implementation demonstrated that the model works well enough to enable these savings to be realized in practice. At the site where this study was conducted, these two use cases are estimated to produce significant savings over the seven-year useful life of the PCBA machinery. Since Flex has over 1,500 PCBA sites, the results of this case study suggest that there is potential to scale these analytics and related savings across the company.
by Andrew Wallace Foster.
M.B.A.
S.M.
M.B.A. Massachusetts Institute of Technology, Sloan School of Management
S.M. Massachusetts Institute of Technology, Department of Civil and Environmental Engineering
13
Ambatipudi, Radhika. "Multilayered Coreless Printed Circuit Board (PCB) Step-down Transformers for High Frequency Switch Mode Power Supplies (SMPS)." Licentiate thesis, Mittuniversitetet, Institutionen för informationsteknologi och medier, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-13967.
Повний текст джерелаАнотація:
The Power Supply Unit (PSU) plays a vital role in almost all electronic equipment. The continuous efforts applied to the improvement of semiconductor devices such as MOSFETS, diodes, controllers and MOSFET drivers have led to the increased switching speeds of power supplies. By increasing the switching frequency of the converter, the size of passive elements such as inductors, transformers and capacitors can be reduced. Hence, the high frequency transformer has become the backbone in isolated AC/DC and DC/DC converters. The main features of transformers are to provide isolation for safety purpose, multiple outputs such as in telecom applications, to build step down/step up converters and so on. The core based transformers, when operated at higher frequencies, do have limitations such as core losses which are proportional to the operating frequency. Even though the core materials are available in a few MHz frequency regions, because of the copper losses in the windings of the transformers those which are commercially available were limited from a few hundred kHz to 1MHz. The skin and proximity effects because of induced eddy currents act as major drawbacks while operating these transformers at higher frequencies. Therefore, it is necessary to mitigate these core losses, skin and proximity effects while operating the transformers at very high frequencies. This can be achieved by eliminating the magnetic cores of transformers and by introducing a proper winding structure. A new multi-layered coreless printed circuit board (PCB) step down transformer for power transfer applications has been designed and this maintains the advantages offered by existing core based transformers such as, high voltage gain, high coupling coefficient, sufficient input impedance and high energy efficiency with the assistance of a resonant technique. In addition, different winding structures have been studied and analysed for higher step down ratios in order to reduce copper losses in the windings and to achieve a higher coupling coefficient. The advantage of increasing the layer for the given power transfer application in terms of the coupling coefficient, resistance and energy efficiency has been reported. The maximum energy efficiency of the designed three layered transformers was found to be within the range of 90%-97% for power transfer applications operated in a few MHz frequency regions. The designed multi-layered coreless PCB transformers for given power applications of 8, 15 and 30W show that the volume reduction of approximately 40-90% is possible when compared to its existing core based counterparts. The estimation of EMI emissions from the designed transformers proves that the amount of radiated EMI from a three layered transformer is less than that of the two layered transformer because of the decreased radius for the same amount of inductance. Multi-layered coreless PCB gate drive transformers were designed for signal transfer applications and have successfully driven the double ended topologies such as the half bridge, the two switch flyback converter and resonant converters with low gate drive power consumption of about half a watt. The performance characteristics of these transformers have also been evaluated using the high frequency magnetic material made up of NiZn and operated in the 2-4MHz frequency region. These multi-layered coreless PCB power and signal transformers together with the latest semiconductor switching devices such as SiC and GaN MOSFETs and the SiC schottky diode are an excellent choice for the next generation compact SMPS.
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Camilo, Edson 1959. "Propostas de design de layout da PCI para redução de curto circuito de solda a onda, para processo de montagem de placa eletrônica = PCB layout design techniques for shortcircuit (bridging) reduction due to wave soldering in electronic board assembly." [s.n.], 2015. http://repositorio.unicamp.br/jspui/handle/REPOSIP/260044.
Повний текст джерелаАнотація:
Orientador: Yuzo IanoDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
Made available in DSpace on 2018-08-27T18:51:43Z (GMT). No. of bitstreams: 1 Camilo_Edson_M.pdf: 3518346 bytes, checksum: 0264cd60aaed512cef0dacda58a43540 (MD5) Previous issue date: 2015
Resumo: Este trabalho de Mestrado tem como objetivo contribuir para a área de placa de circuito impresso no que se refere ao projeto de layout focado não só em satisfazer as conexões das trilhas, mas nas regras de projeto com foco na redução de curto circuito de solda para o processo de solda por onda. Projetos de PCB (Printed Circuit Board) ou PCI (Placa de Circuito Impresso) envolvem uma série de conhecimentos no que se refere ao entendimento das funcionalidades dos circuitos e para tanto é importante que se faça o correto posicionamento dos componentes em grupos de circuitos pela funcionalidade; além disso, é importante que se conheça as regras de capacidade de corrente, de distâncias de isolação em função das tensões aplicadas, características de impedância, áreas de restrição mecânica entre outras. O que será visto neste trabalho está focado na aplicação de conceitos e considerações ligadas ao processo de montagem da placa eletrônica por solda a onda. Muitos dos defeitos que ocorrem num processo de montagem da PCB são atribuídos ao processo de montagem da PCB como, por exemplo, a temperatura da solda, o tempo de solda, quantidade de fluxo aplicado na placa, altura da onda de solda, etc. Recomendações sobre posicionamento de componentes PTH (Pin Through Hole) e SMD (Surface Mounting Devise) em relação ao sentido em que a PCB entra em direção à solda a onda, recursos de aplicação de serigrafia, tipos de laminados, de formato das ilhas de solda, adição de técnica de ladrão de solda e as recomendações da IPC (Association Connecting Electronics Industries) serão descritos neste trabalho. O correto entendimento dos defeitos que ocorrem durante o processo de montagem da PCB reflete na constante melhoria e aperfeiçoamento do projeto do layout da placa, que por sua vez resulta num processo de montagem de placa com menos ocorrência de defeitos de fabricação e consequentemente melhor qualidade do produto. Menos retrabalho nas PCBs significa menos custo de produção que reflete em maior lucro para as empresas. As propostas apresentadas neste trabalho são fruto de resultados práticos vivenciados na indústria e de pesquisa em literatura dos assuntos relacionados a defeitos em PCB e processos de solda por onda. O conjunto destas recomendações e seus resultados estão aqui descritos e ilustrados para servirem de referência aos futuros pesquisadores e leitores
Abstract: This work aims to contribute to the area of the printed circuit board in regard to layout design focused not only on satisfying the connections of the tracks but the design rules focused on reducing short- circuit solder for wave solder process . Projects PCB (Printed Circuit Board) involve a lot of knowledge when it comes to understanding the features of both circuit and is important to make the correct positioning of components into groups of circuits for feature addition is important to know the rules of current capacity, isolation distances depending on the applied voltage, impedance characteristics, areas of mechanical restrictions among others. What will be seen in this work is focused on application of concepts and considerations involved in the process of mounting the electronic board by solder wave. Many of the defects which occur in the process of assembling the PCB are assigned to the PCB assembly process such as the temperature of the solder, weld time , amount of flux applied to the board, solder wave height, etc. Recommendations on positioning components PTH( Pin Through Hole) and SMD( Surface Mounting Devise) relative to the direction in which the PCB goes toward the wave solder , screen printing application features , format type of solder lands , techniques of solder thief and the IPC ( Association Connecting Electronics Industries) recommendations will be described on this work . The correct understanding of the defects that occur during the assembly process of the PCB reflects on constant improvement and refinement of the board layout design, which in turn results in a process of mounting plate with fewer occurrences of defects in workmanship and consequently better quality product. Less rework means less PCBs in production cost which reflects in higher profits for companies. The proposals presented in this paper are the result of practical results experienced in industry and research literature on the subjects related to defects in PCB and wave solder processes. All these recommendations and their results are described and illustrated to better serve as reference for future researchers and readers
Mestrado
Telecomunicações e Telemática
Mestre em Engenharia Elétrica
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Castle, Joshua. "Design of a Printed Circuit Board for a Sensorless Three-Phase Brushless DC Motor Control System." DigitalCommons@CalPoly, 2020. https://digitalcommons.calpoly.edu/theses/2159.
Повний текст джерелаАнотація:
The use of brushless motors has increased in recent years due to superior performance characteristics compared with alternatives. The operation of a brushless motor is dependent upon a separate controller which is often in the form of a printed circuit board. As such, the size and performance capability of the controller can restrict the performance of the overall motor control system so advancements of these controllers further the potential use of BLDC motors. This project outlines the design of a PCB based, sensorless motor controller for operation of a three-phase BLDC motor powered by a 24 V, high current external supply. Components used were selected to withstand an ambient temperature environment of 125 degrees C.
The design for this PCB based motor control system was completed but fabrication and testing of the system was prevented by COVID-19 related restrictions that prohibited the use of necessary facilities and equipment. The detailed design including component selection, board layout, and software development is included in addition to a plan for fabrication and fundamental functional testing. Although no results are available for analysis to bring about any conclusions, a variety of design strategies and corresponding learnings hold the potential to be a source of valuable reference to the further study and development of future designs.
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Nsoumbi, Michèle. "Etude des mécanismes d'inflammation d'un matériau isolant en présence d'un point chaud d'origine électrique." Paris 11, 2010. http://www.theses.fr/2010PA112346.
Повний текст джерелаАнотація:
Dans un objectif de prévention de défaillances sévères susceptibles de conduire à un amorçage de feu sur circuits imprimés, l'évolution rapide d'un défaut d'origine thermique sur un circuit de type FR-4 a été étudiée. Une étude préliminaire des caractéristiques électrique et chimique du matériau a été effectuée en fonction de la température. La défaillance a été modélisée par une surintensité contrôlée localisée au niveau d'un défaut de géométrie imposée. Les expériences ont été conduites jusqu'à rupture de la piste aboutissant ou non à un départ de feu. Le courant de fuite circulant dans le substrat s'est révélé être un paramètre pertinent pour évaluer la dégradation du circuit imprimé. Des cartographies thermiques de la surface et de l'épaisseur du substrat sous le défaut ont également été réalisées. Parallèlement à cette étude expérimentale, un modèle numérique électrothermique 3D développé sur cette structure a permis de décrire et valider la dominance d'un processus thermique jusqu'à la rupture de la piste. Un enregistrement détaillé des paramètres électriques synchronisé à une cinématographie rapide au moment de la rupture a permis d'identifier un mécanisme impliquant un décollement de piste au niveau du défaut lié à un emballement de la température et du courant de fuite localisés. Ce mécanisme a été associé à la présence d'un canal chaud au travers du substrat conduisant à : (i) un échauffement important et localisé du matériau par effet Joule susceptible de conduire l'inflammation, (ii) un entretien de chauffage du substrat après rupture de la piste contribuant à entretenir et à propager Ie feu, notamment par émission de composés inflammablesIn the objective of prevention of severe failures leading to fire in onboard printed circuit board, the aggravation of hot spots due to an electronic component defect was experimentally modelled by creating a controlled overload on a FR4 Printed Circuit Board (PCB) track. A two-sided PCB was considered for these experiments, in which the leakage current intensity flowing through the PCB was measured. The experiments were lead until the track rupture with or without fire ignition. Leakage current was found to be a reliable parameter for monitoring the PCB temperature and state of degradation. Concurrently, thermal space and time resolved measurements were made on the PCB surfaces and on the PCB cross section surface. In addition to experiments, a 3-D finite element model was also created to simulate the trace heating; good agreement was found with experiments within the model's assumptions, up to the point of the track rupture. A detailed record of the electrical parameters synchronized to a fast camera when the track rupture identified a mechanism involving a detachment of the track near the defect according to the current/temperature runaway phenomenon. Leakage current appeared as a contributor to fire ignition by Joule effect (intensity in the A range) and was also seen to sustain the heating of the PCB despite of the track rupture, and to support fire propagation through promoting the release of flammable compounds (e. G. Hydrogen, acetylene, ethylene measured at 300°C) via substrate heating
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BIGELLI, FRANCESCO. "Technologies for the Integration of Waveguide Components and Antennas on Printed Circuit Boards." Doctoral thesis, Università Politecnica delle Marche, 2017. http://hdl.handle.net/11566/245384.
Повний текст джерелаАнотація:
In questo lavoro presento lo studio di fattibilità riguardo la realizzazione di una classe di dispositivi in tecnologia SIW (Substrate Integrated Waveguide) per applicazioni ICT alle frequenze delle microonde. Con questa tecnologia è possibile ottenere, attraverso i processi tradizionali per la realizzazione di circuiti stampati, componenti integrati nel substrato con fattori di qualità più alti rispetto alla microstriscia e la stripline.
La tecnologia SIW è molto promettente in quanto permette di ottenere strutture guidanti, e quindi componenti, compatti, a basso costo e auto-schermanti. Sebbene siano presenti in letteratura molti articoli che esaltino queste qualità, questa tecnologia non è sfociata al momento in una produzione industriale, nemmeno su bassi volumi.
Questo lavoro è parte del progetto di formazione annesso al progetto di ricerca, intitolato “Sviluppo di tecnologie in guida d’onda integrata (SIW) per applicazioni ICT a microonde” in collaborazione con il Politecnico di Bari, Università Politecnica delle Marche e SOMACIS SpA, un produttore internazionale di circuiti stampati con quarant’anni di esperienza in settori altamente tecnologici.
Questa promettente tecnologia permette una drastica riduzione di costi e dimensioni, qualità che si adattano bene alle crescenti esigenze del mercato; il progetto prevede lo sviluppo e la realizzazione di una classe di dispositivi come filtri, ibridi, accoppiatori e antenne.
La tecnologia SIW potrebbe permettere di produrre in larga scala prodotti complicati e costosi così come i radar per la difesa e l’automotive. Inoltre, nel mercato delle telecomunicazioni, potrebbe essere possibile sostituire le tradizionali e ingombranti parabole con schiere di antenne planari che sono più competitive e potrebbero avere una grande diffusione. Tali schiere potrebbero essere addirittura integrate al di sopra dei tetti come avviene per i pannelli solari, questo vantaggio potrebbe portare le persone ad optare per questo nuovo concetto di antenne satellitari. Quindi, sembra realistico prevedere un mercato di migliaia di componenti che forniscano le giuste motivazioni al successo del progetto.
La tecnologia SIW permette di riprodurre in forma planare, attraverso file di fori metallizzati su di un substrato dielettrico, una guida d’onda tradizionale. Ovviamente in queste strutture, il campo elettromagnetico viaggia all’interno del dielettrico e non in aria. È chiaro che questo comporta un sensibile aumento delle perdite. Anche se le perdite dielettriche rappresentano la parte dominante, queste sono aumentate dalle perdite ohmiche dovute all’alta densità di corrente localizzata nei fori metallizzati che costituiscono le pareti laterali.
Negli ultimi anni molti dispositivi in guida SIW sono stati riportati in letteratura, come antenne [1-2], filtri, and accoppiatori [3-4, 5-6]. La tecnologia SIW rappresenta una buona scelta di progettazione di circuiti e dispositivi a microonde e onde millimetriche [7-21]. Comunque, un uso industriale dei componenti SIW richiede ancora una fase essenziale di studio sistematico.
Perciò il primo obiettivo di questo studio consiste nell’ottimizzazione di tecnologie appropriate per la realizzazione di questi componenti.In this research work I present the feasibility study on the realization of a class of devices in SIW (Substrate Integrated Waveguide) technology for ICT application at microwave frequencies. With this technology it is possible to obtain, by the traditional processes for the printed circuits manufacturing, integrated components with quality factors greater than the microstrip and the stripline. SIW technology is very promising because it permits to obtain compact, low cost and self-shielding guiding structures and hence, guides components. Although many papers, presented in literature, strengthen these qualities, this technology did not lead to an industrial production today, even at low volumes. This work is part of the formation project annexed to its research project, entitled “Integrated Waveguide (SIW) technologies development for microwave ICT applications” in collaboration with the Politecnico of Bari, Università Politecnica delle Marche and SOMACIS SpA, a worldwide PCB (Printed Circuit Board) industry with forty years of experience in the highly technological sector of high-mix and low-volume. As this hopeful technology allows a drastic reduction in size and costs, qualities that are well suited to the increasing market needs, the project aims to design and realize a class of product ranging from filter, hybrids, “frequency-shaping” components and antenna. SIW technology could also permit to produce in a large scale expensive and complicated products like the automotive and defense radars. Moreover, in the market of civil telecommunication, it could be possible to replace the standard and bulky TV dishes with planar array of antenna that are more competitive and could have a wide spread. Such array could also be fully integrated in the roof like it happens for the solar panels, this advantage could drive people to opt for these new concept of satellite antennas. Indeed, it seems to be realistic to foresee a market of thousands of components overlooking the proper motivation to the success of the project. The SIW technology permits to reproduce in a planar form, through rows of metallic holes, a traditional waveguide. Obviously, in these structures, the electromagnetic field travels into the dielectric and not in air. It is clear that this involves a sensible increase of the losses. Even if the dielectric losses are the dominant part, these are still enhanced from a high density of current localized in the metallic holes that constitute the lateral sidewalls. In recent years several Substrate Integrated Waveguide devices such as antennas [1-2], filters, and couplers [3-4, 5-6] have been reported in literature. SIW technology is a good technique for designing and fabricating microwave and millimeter-wave devices and circuits [7-21]. However, an industrial use of SIW components still requires an essential phase of systematic study. Therefore the first objective of this study consists in optimization of technologies most suitable for the realization of this components.
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Geren, Necdet. "Design and development of the hardware for an automated PCBA inspection and rework cell." Thesis, University of Salford, 1993. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.386584.
Повний текст джерела
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Arkeholt, Simon. "Induction in Printed Circuit Boards using Magnetic Near-Field Transmissions." Thesis, Linköpings universitet, Teoretisk Fysik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-148788.
Повний текст джерелаАнотація:
In 1865 Maxwell outlined the theoretical framework for electromagnetic field propagation. Since then many important developments have been made in the field, with an emphasis on systems using high frequencies for long-range interactions. It was not until recent years that applications based on short-range inductive coupling demonstrated the advantages of using low frequency transmissions with magnetic fields to transfer power and information. This thesis investigates magnetic transmissions in the near-field and the possibility of producing induced voltages in printed circuit boards. A near-field magnetic induction system is designed to generate a magnetic flux in the very low frequency region, and used experimentally to evaluate circuit board induction in several interesting environments. The resulting voltages are measured with digital signal processing techniques, using Welch’s method to estimate the spectrum of the received voltage signal. The results show that the amount of induced voltage is proportional to the inverse cube of the transmission distance, and that the system is able to achieve a maximum induced voltage of 65 \micro V at a distance of 2.5 m and under line-of-sight conditions. It is also concluded that conductive obstructions, electromagnetic shielding and background noise all have a large impact on the obtained voltage, either cancelling the signal or causing it to fluctuate.
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Aalto, Alve, and Ali Jafari. "Automatic Probing System for PCB : Analysis of an automatic probing system for design verification of printed circuit boards." Thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-174865.
Повний текст джерелаАнотація:
The purpose of this thesis is to conduct an analysis of whether the printed circuit boards from Ericsson can be tested using an automatic probing system or what changes in the design are required, to be a viable solution. The main instrument used for analyzing the printed circuit board was an oscilloscope. The oscilloscope was used to get the raw data for plotting the difference between the theoretical and actual signals. Connected to the oscilloscope was a 600A-AT probe from LeCroy. The programs used for interpreting the raw data extracted from the oscilloscope included Python, Matlab and Excel. For simulations on how an extra via in the signal path would affect the end results we used HFSS and ADS. The results were extracted into different Excel sheets to get an easier overview of the results. The results showed that the design of a board must almost become completely rebuilt for the changes, and it is therefore better to implement in a new circuit board rather than in an already existing one. Some of the components have to either be smaller or placed on one side of the board, where they cannot be in the way of the probe. The size of the board will become larger since the rules of via placements will be limited compared to before. The most time demanding part was the simulations of the extra via in the signal path, and the results showed that if a single-ended signal is below two gigahertz the placing of the via does not make a big difference, but if the signal has a higher frequency the placement is mostly dependent on the type of the signal. The optimal placement is generally around four millimeters away from the receiving end.Målet med detta examensarbete är att göra en analys av huruvida Ericssons kretskort kan testas med hjälp av ett automatiskt probe system eller om det kräver stora förändringar i designdelen av kretskorten och om, vad för förändringar det i sådant fall kan vara. Till hjälp att analysera kretskorten har vi haft oscilloskop för att få ut rådata om skillnaderna mellan de teoretiska och verkliga signalerna. För att kunna tyda oscilloskopets samplade signaler har olika programmeringsspråk som Python, Matlab samt Excel använts. En extra via i signalens väg har även simulerats i HFSS och ADS med olika sorts probar för att se hur signalens beteende påverkas. Resultaten extraherades sedan in i olika Excel ark för att få en lätt överskådlig bild av resultaten. Resultatet vi fick visade att utformningen av ett kretskort med ändringarna skulle vara lättare att göra med en ny design istället för en redan existerande då större delar av kortet skulle behöva göras om. Vissa stora komponenter behöver antingen göras om, hitta mindre men likvärdiga eller sättas på ena sidan av kortet där de inte är i vägen för proben. Kretskorten som kommer använda flygande probesystem kommer antagligen bli lite större då viornas placering är mer begränsade än tidigare. Det mest tidskrävande arbetet var att simulera olika placeringar av en extra via i signalens väg. Detta visade att på en single ended signal under två gigahertz så gör det ingen större skillnad vart i signalens väg som den extra vian placeras. Då en högre frekvens används så är själva signalens karaktär det viktigaste än placeringen av en via, men om man inte vet den exakta karaktären så är fyra millimeter bort från mottagarens sida att rekommendera då närmare placering av viorna gör att signalerna börjar störa varandra.
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Korczyk, Jakub. "Reliable On Board Data Processing System for the ICEYE- 1 satellite." Thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-204920.
Повний текст джерелаАнотація:
Recent development in electronics for mobile devices has led to the decrease in sizes and cost of autonomous complex embedded systems such as satellites. It is now possible to build a satellite quicker and only for a fraction of previous costs by using Commercial Off The Shelf (COTS) components. Yet, there are some obstacles that need to be overcome before a successful small satellite can be designed. Among these are the radiation environment, thermal issues, the overall system complexity and tight schedules. This thesis addresses these issues and proposes an overall approach for designing small satellites’ electronics. This approach can be summarised in 6 recommendations: Keep it simple Use fast hardware iterations Do not use space grade components Use a single string design on the system level (no redundancy) Design with limited trust in the software Use simple, accessible and easy updatable documentation With respect to those recommendations an on board data processing system, the Processing Board, has been designed for the ICEYE-1 satellite. The ICEYE-1 satellite is a fully commercial Synthetic Aperture Radar (SAR) satellite that will be launched in December 2017. The designed board has been manufactured and verified during airborne test campaigns.Nya elektronikutvecklingar för mobiltelefoner har lett till en minskning av storlek och kostnader för andra autonoma komplexa inbyggda system som t.ex. satelliter. Så kallade småsatelliter kan numera byggas snabbare och för endast en bråkdel av tidigare kostnader med hjälp av Commercial Off The Shelf (COTS) komponenter. Det finns dock vissa hinder som måste övervinnas om man vill designa en pålitligt fungerande småsatellit. Till dessa kan räknas strålningsmiljön, väl fungerande värmeledning, det totala systemets komplexitet samt snäva tidtabeller. Detta examensarbete behandlar dessa frågor och föreslår en övergripande strategi för att designa elektronik för småsatelliter. Detta tillvägagångssätt kan sammanfattas i 6 rekommendationer: Håll det enkelt Implementera snabba hårdvaruiterationer Använd inte rymdklassade komponenter Använd ingen redundans på systemnivå Designa med en begränsad tilltro på mjukvaran Dokumentera på ett enkelt, tillgängligt och lätt uppdateringsbart sätt Dessa rekommendationer har använts till att utveckla ett databehandlingssystem, kallat "Processing Board", till småsatelliten ICEYE-1. ICEYE-1 är en kommersiell Synthetic Aperture Radar (SAR) satellit som kommer att skjutas i omloppsbana i december 2017. Databehandlingssystemet i fråga har utvecklats och verifierats i samband med flygplansburna testkampanjer.
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Pascal, Yoann. "Étude multicritère pour l'enfouissement partiel ou total de convertisseurs d'électronique de puissance dans un circuit imprimé." Thesis, Université Paris-Saclay (ComUE), 2019. http://www.theses.fr/2019SACLN038/document.
Повний текст джерелаАнотація:
Les travaux présentés dans ce manuscrit traitent de l’enfouissement dans un circuit imprimé de convertisseurs de puissance, paradigme visant l’insertion de composants électroniques au sein du circuit imprimé.Une structure simple et économique de composant inductif enfoui, pouvant être employé comme inductance, coupleur, ou résonateur monolithique, est tout d’abord décrite. Un modèle analytique complet est développé. Des prototypes sont réalisés, validant le modèle et démontrant l’intérêt de la topologie.L’agencement des composants de puissance constituant une cellule de commutation est ensuite étudié. En particulier, un modèle analytique permettant une compréhension intuitive des mécanismes oscillatoires dans le cadre de l’emploi de transistors rapides est décrit.Une technique de reprise de contact de face avant pour puce enfouie, basée sur un morceau de mousse pressée, est proposée. Une étude préliminaire, à forte composante expérimentale, est présentée. Elle démontre que certains prototypes enfouis présentent des caractéristiques électriques et une fiabilité similaires à celles obtenus avec des fils de bonding.Enfin, les résultats de l’étude sur l’agencement des composants d’une cellule de commutation sont appliqués pour concevoir et réaliser un hacheur basé sur des transistors SiC connectés par mousse pressée. La structure délivre 3 kW sous 600 V en continu, démontrant la viabilité du procédé de reprise de contact proposéThis thesis deals with Printed-Circuit Board (PCB) embedding of power converters, paradigm according to which electronic components are placed within the substrate itself.First, a simple and economical structure of inductive component, which can be used either as an inductor, a coupler, or a monolithic resonator, is described. A comprehensive analytical model is developed. Prototypes are manufactured, validating the analytical model and highlighting the value of the topology.The arrangement of the power components of a switching cell is then studied. In particular, an analytical model offering an intuitive understanding of the oscillation mechanisms in cells using fast transistors is proposed.A simple and economical top-side connection technic for PCB-embedded power dies using a pressed piece of metal foam is described. A preliminary study, with strong experimental component, is proposed. It shows that the embedded prototypes have electrical performances and a reliability close to that of wire-bonded dies.Finally, the results from the study on the arrangement of the components of a switching cell are used to design and manufacture a chopper based on SiC transistors connected using a piece of pressed metal foam. This chopper proved to be able to continuously deliver 3 kW under 600 V to a load, thereby validating the proposed top-side connection technic
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Good, Mattias. "Structural analysis of thermal interface materials and printed circuit boards in telecom units - a methodology." Thesis, Luleå tekniska universitet, Institutionen för teknikvetenskap och matematik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-59746.
Повний текст джерелаАнотація:
En struktur analys på Ericssons MINILINK-6352 har utförts för att undersöka spänningar och deformationer på enheten, främst med fokus på de termiska gränskiktsmaterialen och buktningar av kretskortet. Dessa är viktiga aspekter när man överväger om enheten är termiska lämpad ur en mekanisk synvinkel, där god ytkontakt mellan de olika kropparna är avgörande för ordentlig kylning genom värmeledning. Analysen kräver tillräcklig materialdata till gränskiktsmaterialen och kretskortet för att kunna skapa lämpliga matematiska modeller. Enaxliga kompressionstester har genomförts för att karakterisera de hyperelastiska och viskoelastiska lagar för fyllda silikongummimaterial som används som termiska gränskiktsmaterial, som ibland kallas för gappad. Böjning av ett kretskort simulerades och jämfördes med ett tre--punkts böjtest för att verifiera om befintlig materialdata i beräkningsprogrammen var tillräcklig, jämförelsen visade god överensstämmelse. Kretskortet med dess komponenter, som modellerades som styva block, med gappads ovanpå som komprimeras av en platta simulerades och ett svagt område hittades. Detta område var sedan tidigare känt och har i ett senare skede eliminerats genom att tillsätta ytterligare en stödpelare. Därav visar denna studie en metod för att hitta intressanta regioner tidigt i konstruktionsfasen som lätt kan ändras för att uppfylla nödvändiga krav och undvika brister i konstruktionen. Arbetet har visat sig användbart genom att hitta detta svaga område i exempel produkten, arbetet ger även tillräckligt med information och exempeldata för att ytterligare utreda liknande produkter. Kombinationen av erfarenhet och simulering möjliggör smartare designval.A structural analysis on Ericssons MINILINK-6352 has been performed in order to investigate stresses and deformations of the unit, mainly focusing on the thermal interface materials and warpage of the printed circuit boards. These are important aspects when considering if the unit is thermally adequate from a mechanical point of view, where good surface contact between various bodies are critical for proper cooling through heat conductivity. The analysis requires sufficient materal data for the interface material and the circuit board in order to create suitable mathematical models. Uniaxial compression tests have been conducted to characterise the hyperelastic and viscoelastic constitutive laws of a filled silicone rubber material used as a thermal interface material, commonly referred to as a thermal pad. Bending of a printed circuit board was simulated and compared to a three-point bend test on the circuit board in order to verify material data already available in the computational software, which showed good agreement. The entire radio unit was mechanically analysed during its sealing process. The circuit board with attached components modelled as stiff blocks with thermal pads on top compressed by plates was simulated and a weak area was found. This area in question was already known and has in a later stage been eliminated by adding an additional supporting pillar. Hence this study shows a methodology to find regions of interest at an early design phase which can easily be altered to fulfil necessary requirements and eliminate design flaws. This work has proven useful in finding weak regions in the example product, it also provides enough information and example data to further investigate similar products. The combination of experience and simulation allows for smarter design choices.
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Johnson, Bruce, and John Smith. "CAN BUS USED FOR DATA ACQUISITION SYSTEM CONTROLS (AUTOMOTIVE SOLUTION FOR AIRCRAFT PROBLEM)." International Foundation for Telemetering, 2005. http://hdl.handle.net/10150/604882.
Повний текст джерелаАнотація:
ITC/USA 2005 Conference Proceedings / The Forty-First Annual International Telemetering Conference and Technical Exhibition / October 24-27, 2005 / Riviera Hotel & Convention Center, Las Vegas, NevadaThis paper discusses using the CAN (Control Area Network) Bus protocol for control and status of flight test data acquisition systems. The application of the CAN (Control Area Network) on an F/A-18 aircraft will be discussed in detail.
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Davis, Daniel Jacob. "Achieving Six Sigma printed circuit board yields by improving incoming component quality and using a PCBA prioritization algorithm." Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/43831.
Повний текст джерелаАнотація:
Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2008.Includes bibliographical references (p. 139-143).
Printed circuit board assemblies (PCBAs) are the backbone of the electronics industry. PCBA technologies are keeping pace with Moore's Law and will soon enable the convergence of video, voice, data, and mobility onto a single device. With the rapid advancements in product and component technologies, manufacturing tests are being pushed to the limits as consumers are demanding higher quality and more reliable electronics than ever before. Cisco Systems, Inc. (Cisco) currently manufactures over one thousand different types of printed circuit board assemblies (PCBAs) per quarter all over the world. Each PCBA in Cisco's portfolio has an associated complexity to its design determined by the number of interconnects, components, and other variables. PCBA manufacturing yields have historically been quite variable. In order to remain competitive, there is an imminent need to attain Six Sigma PCBA yields while controlling capital expenditures and innovating manufacturing test development and execution. Recently, Cisco kicked off the Test Excellence initiative to improve overall PCBA manufacturing yields and provided the backdrop to this work study. This thesis provides a first step on the journey to attaining Six Sigma PCBA manufacturing yields. Using Six Sigma techniques, two hypotheses are developed that will enable yield improvements: (1) PCBA yields can be improved by optimizing component selection across the product portfolio by analyzing component cost and quality levels, and (2) Using the Six Sigma DMAIC (define-measure-analyze-improve-control) method and the TOPSIS (Technique for Order Preferences by Similarity to Ideal Solutions) algorithm, PCBA yields will improve by optimally prioritizing manufacturing resources on the most important PCBAs first.
(cont.) The two analytical tools derived in this thesis will provide insights into how PCBA manufacturing yields can be improved today while enabling future yield improvements to occur.
by Daniel Jacob Davis.
S.M.
M.B.A.
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Offeh, Gyimah Kwabena. "An investigation on the chemical and microwave-assisted approaches for the reclamation of metallic values from computer printed circuit boards (PCB) wastes." Thesis, University of Leeds, 2018. http://etheses.whiterose.ac.uk/22418/.
Повний текст джерела
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Uyanik, Basar. "Cell Formation: A Real Life Application." Master's thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/12606635/index.pdf.
Повний текст джерелаАнотація:
In this study, the plant layout problem of a worldwide Printed Circuit Board (PCB) producer company is analyzed. Machines are grouped into cells using grouping methodologies of Tabular Algorithm, K-means clustering algorithm, and Hierarchical grouping with Levenshtein distances. Production plant layouts, which are formed by using different techniques, are evaluated using technical and economical indicators.
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Hajjar, Gabriel. "Design and construction of a photoplotter : Building a device for rapid prototyping of PCBs." Thesis, Uppsala universitet, Fasta tillståndets fysik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-354717.
Повний текст джерелаАнотація:
The goal was to build a machine that could rapidly prototype PCBs using a moving light source and photoresist. The project failed, as the UV light did not make it through the lenses used to concentrate it. Better lenses and a laser would allow it to function better.
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Aytekin, Banu. "Vibration Analysis Of Pcbs And Electronic Components." Master's thesis, METU, 2008. http://etd.lib.metu.edu.tr/upload/3/12609444/index.pdf.
Повний текст джерелаАнотація:
In this thesis, vibration analyses of electronic assemblies that consist of an electronic box, printed circuit board and electronic components are presented. A detailed vibration analysis of a real electronic assembly is performed by finite element methods and vibration tests. Effects of component addition and component modeling are investigated by finite element analysis in detail. Results are compared in order to identify the most efficient, reliable and suitable method depending on the type of problem. Experimental results for the vibration of an electronic box, PCB and components are presented and discussed. Furthermore, an analytical model that represents a printed circuit board and electronic component is suggested for fixed and simply supported boundary conditions of the PCB. Different types of electronic
components are modeled analytically to observe different dynamic characteristics. The validity of the analytical model is computationally checked by comparing results with those of finite element solution.
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Hedin, Alexander. "Testing and evaluation of the integratability of the Senior processor." Thesis, Linköpings universitet, Datorteknik, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-71043.
Повний текст джерелаАнотація:
The first version of the Senior processor was created as part of a thesis projectin 2007. This processor was completed and used for educational purposes atLinköpings University. In 2008 several parts of the processor were optimized andthe processor expanded with additional functionality as part of another thesisproject. In 2009 an EU funded project called MULTI-BASE started, in which theComputer Division at the Department of Electrical Engineering participated in.For their part of the MULTI-BASE project, the Senior processor was selected tobe used. After continuous revision and development, this processor was sent formanufacturing. The assignment of this thesis project was to test and verify the different func-tions implemted in the Senior processor. To do this a PCB was developed fortesting the Senior processor together with a Virtex-4 FPGA. Extensive testingwas done on the most important functions of the Senior processor. These testsshowed that the manufactured Senior processor works as designed and that it alonecan perform larger calculations and use external hardware accelerators with thehelp of its various interfaces.Den första versionen av Senior processorn skapades som en del i ett examensarbe-te under 2007, denna processor färdigställdes och användes i utbildningssyfte påLinköping Universitet. 2008 optimerades flera delar av processorn och utökadesmed extra funktionalitet som del av ytterligare ett examensarbete. 2009 startadeett EU finansierat projekt vid namn MULTI-BASE, som ISYs Datortekniks avdel-ning deltar i. Till deras del av MULTI-BASE projektet valdes Senior processorn attanvändas, efter ytterligare utveckling skickades denna processor för tillverkning. Detta examensarbete hade i uppgift att testa och verifiera de olika funktionernasom Senior processorn har implementerats med. För att göra detta tillverkades ettkretskort som ska användas för att testa Senior processorn tillsammans med enVirtex-4 FPGA. Utförliga tester gjordes på de viktigaste funktionerna hos Seniorprocessorn, dessa tester visade att den tillverkade Senior processorn fungerar somplanerat. Den kan på egen hand utföra större beräkningar och använda sig avexterna hårdvare acceleratorer med hjälp av sina olika gränssnitt.
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Novak, Markus. "Low Cost Ultra-Wideband Millimeter-Wave Phased Arrays." The Ohio State University, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=osu1500574802418502.
Повний текст джерела
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Mantena, Keerthi Varma. "Electrical and mechanical properties of MWCNT filled conductive adhesives on lead free surface finished PCB's." Lexington, Ky. : [University of Kentucky Libraries], 2009. http://hdl.handle.net/10225/1084.
Повний текст джерелаАнотація:
Thesis (M.S.)--University of Kentucky, 2009.Title from document title page (viewed on October 28, 2009). Document formatted into pages; contains: viii, 44 p. : ill. Includes abstract and vita. Includes bibliographical references (p. 42-43).
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Almustafa, Mohamad. "Modélisation des micro-plasmas, conception des circuits micro-ondes, Coupleur Directionnel Hybride pour Mesures et des applications en Télécommunication." Phd thesis, Toulouse, INPT, 2013. http://oatao.univ-toulouse.fr/14170/1/almustafa.pdf.
Повний текст джерелаАнотація:
L'intégration des nouveaux éléments basés sur la physique des plasmas dans le domaine des circuits et des systèmes micro-ondes est l'objectif de ce travail. En profitant des caractéristiques électromagnétiques des plasmas et en jouant sur leur architecture, on développe des micro-commutateurs micro-ondes et d'autres circuits radio et hyperfréquences en technologies microrubans ou en guide d'onde… La simulation de la propagation des ondes électromagnétiques dans un plasma et les études de l'interaction entre un plasma et les ondes électromagnétiques nécessite la connaissance des paramètres fondamentaux du plasma comme la permittivité. C'est pour cela qu'on étudie aussi les mesures plasmas par différents techniques comme la transmission/réflexion des ondes électromagnétiques, la perturbation des cavités résonnantes, ... Un schéma électrique équivalent modélisant un micro-commutateur hyperfréquence en plasma, est obtenu grâce aux mesures des courants de décharge électrique, à la rétro-simulation et aux techniques de modélisation numérique. Un coupleur directif hybride compact est utilisé pour les mesures plasmas en assurant la protection du matériel et de l'équipement de mesure des signaux d'un plasma.
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Oplt, Tomáš. "Porovnání výsledků modální analýzy desky plošných spojů dosažených výpočtovým a experimentálním modelováním." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2015. http://www.nusl.cz/ntk/nusl-232000.
Повний текст джерелаАнотація:
Modal analysis of printed circuit board results, gained from computional and experimental modeling, have been compared. Anylyses have been performed on dummy boards (models without electronic components), created as one-layered at first, then as three-layered PCB. Board is usually clamped by its longer edges with wedgelock. In order to enable the realization of boundary conditions in computional and experimental modeling, real clamping has been simplified to simply supported. Computional models have used FEM elements, which are comomnly used in this type of problem. Determined results have been evaluated by comparing the experimental modeling results. Models‘ sensitivity on modification of element length and number of elements through thickness have been performed.
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Ha, Tuan. "Detektor pozice laserového svazku." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2020. http://www.nusl.cz/ntk/nusl-413007.
Повний текст джерелаАнотація:
This thesis deals with design of a laser position detector. Different types of sensor are mentioned and compared at the beginning. Special attention is paid to quadrant sensor. Its pros and cons are discussed with designing methods. The sensor is simulated in Matlab to test its output response. Then the laboratory tests follow to meassure real response of the chip. Then follows the design of the detector based on measured and simulated data. In the conclusion of this thesis parameters of created device are evaluated.
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Kubik, Jan [Verfasser]. "Printed Circuit Board Fluxgate Sensors / Jan Kubik." Aachen : Shaker, 2009. http://d-nb.info/1161308342/34.
Повний текст джерела
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Moorhouse, Colin. "Laser processing of printed circuit board materials." Thesis, Heriot-Watt University, 2006. http://hdl.handle.net/10399/195.
Повний текст джерела
38
Lim, Geok H. "Vibration analysis of a printed circuit board." Thesis, Aston University, 2000. http://publications.aston.ac.uk/15341/.
Повний текст джерелаАнотація:
The reliability of the printed circuit board assembly under dynamic environments, such as those found onboard airplanes, ships and land vehicles is receiving more attention. This research analyses the dynamic characteristics of the printed circuit board (PCB) supported by edge retainers and plug-in connectors. By modelling the wedge retainer and connector as providing simply supported boundary condition with appropriate rotational spring stiffnesses along their respective edges with the aid of finite element codes, accurate natural frequencies for the board against experimental natural frequencies are obtained. For a PCB supported by two opposite wedge retainers and a plug-in connector and with its remaining edge free of any restraint, it is found that these real supports behave somewhere between the simply supported and clamped boundary conditions and provide a percentage fixity of 39.5% more than the classical simply supported case. By using an eigensensitivity method, the rotational stiffnesses representing the boundary supports of the PCB can be updated effectively and is capable of representing the dynamics of the PCB accurately. The result shows that the percentage error in the fundamental frequency of the PCB finite element model is substantially reduced from 22.3% to 1.3%. The procedure demonstrated the effectiveness of using only the vibration test frequencies as reference data when the mode shapes of the original untuned model are almost identical to the referenced modes/experimental data. When using only modal frequencies in model improvement, the analysis is very much simplified. Furthermore, the time taken to obtain the experimental data will be substantially reduced as the experimental mode shapes are not required.In addition, this thesis advocates a relatively simple method in determining the support locations for maximising the fundamental frequency of vibrating structures. The technique is simple and does not require any optimisation or sequential search algorithm in the analysis. The key to the procedure is to position the necessary supports at positions so as to eliminate the lower modes from the original configuration. This is accomplished by introducing point supports along the nodal lines of the highest possible mode from the original configuration, so that all the other lower modes are eliminated by the introduction of the new or extra supports to the structure. It also proposes inspecting the average driving point residues along the nodal lines of vibrating plates to find the optimal locations of the supports. Numerical examples are provided to demonstrate its validity. By applying to the PCB supported on its three sides by two wedge retainers and a connector, it is found that a single point constraint that would yield maximum fundamental frequency is located at the mid-point of the nodal line, namely, node 39. This point support has the effect of increasing the structure's fundamental frequency from 68.4 Hz to 146.9 Hz, or 115% higher.
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Hickam, James William III 1956. "Paperless planning in printed circuit board manufacturing." Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/277250.
Повний текст джерелаАнотація:
One of the aspects of Computer Integrated Manufacturing is the ability to provide current work instructions to the operator at their workstation on a terminal or graphic monitor. The problem is, today, paperless planning is displayed to the operator one page at a time, making the operator report the completion or not completion of that task before showing the next page. This allows the operator no freedom of choice in how to do the job, which leads to reduced productivity and quality. A possible solution is presented by structuring the planning instructions and enhancing the workstation. The operator can be allowed to do the work the way he or she feels the most comfortable and yet, ensure the work is done according to design requirements.
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Yoshitomi, Satoshi. "Application of surface analytical techniques to the characterisation of 60Pb/40Sn solder alloy on PCBs." Thesis, University of Bristol, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.294393.
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Lehmann, Peter W. "Printed circuit board manufacturing process improvement drill optimization." Menomonie, WI : University of Wisconsin--Stout, 2005. http://www.uwstout.edu/lib/thesis/2005/2005lehmannp.pdf.
Повний текст джерела
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Lofgren, Christopher Bradley. "Machine configuration of flexible printed circuit board assembly systems." Diss., Georgia Institute of Technology, 1986. http://hdl.handle.net/1853/24293.
Повний текст джерела
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Altman, Elizabeth Jane. "Cost and quality drivers in printed circuit board assembly." Thesis, Massachusetts Institute of Technology, 1992. http://hdl.handle.net/1721.1/12783.
Повний текст джерелаАнотація:
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1992 and (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1992.Includes bibliographical references (leaves 55-56).
by Elizabeth Jane Altman.
M.S.
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Alvi, Mohammed Imtiaz. "Dynamic job quoting system for printed circuit board fabrication." FIU Digital Commons, 2000. http://digitalcommons.fiu.edu/etd/1274.
Повний текст джерелаАнотація:
This research deals with the development of a dynamic job quotation system for printed circuit board (PCB) fabrication, which can estimate the price and completion time of a job based on customer preference and current capacity of the shop floor. The primary purpose of building a dynamic quotation system is to maximize the company's profit by quoting optimum lead-time and competitive price for the day-to-day orders received from different customers and original equipment manufacturers.
The system was developed using MS-Access relational database. Evaluating the output of the system it was observed that the dynamic system provided more reliable estimation of the lead-time needed for fabricating new jobs. The overall price quoted by the system was competitive with higher profit margin when compared to traditional static systems.
This system would therefore provide a vital link between the job quoting and scheduling system of the firm enabling better utilization of the available resources.
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Tucker, Joseph C. "Ultrasonic welding of copper to laminate circuit board." Link to electronic thesis, 2002. http://www.wpi.edu/Pubs/ETD/Available/etd-0429102-124154.
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Rakkarn, Sakchai. "OPERATION ASSIGNMENT WITH BOARD SPLITTING AND MULTIPLE MACHINES IN PRINTED CIRCUIT BOARD ASSEMBLY." Case Western Reserve University School of Graduate Studies / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=case1201021027.
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Cohn, Amy Mainville, Michael J. Magazine, and George G. Polak. "An Optimal Algorithm for Integrating Printed Circuit Board Manufacturing Problems." Massachusetts Institute of Technology, Operations Research Center, 2000. http://hdl.handle.net/1721.1/5209.
Повний текст джерелаАнотація:
Printed circuit boards appear in a wide array of products and thus their production is crucial to the contemporary electronics industry. A global approach to planning the complex and multi-stage production process is currently intractable. Nonetheless,significant improvements can be made by integrating closely related elements within the planning process. We focus here on the integration of two key problems -- product clustering and machine setup. In the product clustering problem, board types with similar component requirements are clustered together for assembly under a common configuration of the pick-and-place machine. In the machine setup problem, an optimal configuration of the pick-and-place machine is found for each of these clusters. In practice and in the literature, the product clustering and machine setup problems are typically solved sequentially. By instead solving the two problems simultaneously, we are able to find an optimal tradeoff between processing and setup times. We present the Integrated Clustering and Machine Setup model as a set partitioning problem. We describe a branch-and-price algorithm for solving this exponentially large problem. We introduce a rank-cluster-and-prune, a method for solving the imbedded pricing problems by combinatorial search, and conclude with computational results.
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Hsu, Huang-Hsuan, and 許煌漩. "Customization of PCB printed circuit board measurement platform developed." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/09917434431708399699.
Повний текст джерелаАнотація:
碩士淡江大學
電機工程學系碩士在職專班
102
The impedance matching mainly applies in the transmission line, let high frequency signal that is not attenuation to deliver load side, but any signal have not reflection to source side. That can increase the energy efficiency and benefit. Briefly, the characteristic impedance must equal the impedance of load. The relation of output impedance and impedance of load that have to fit power efficiency totally, that avoid occurring affect after connect the impedance of load. Therefore the impedance analyzer could be analyzer on the impedance of transmission line whether that meet request for impedance. Some kinds of the measurement instrument, for example: TDR, LNA, they are precise and complicated in the application. The research will be able to reduce the functional, simplification so far but measure value for impedance that is not precise, however that can express and simple on the usefulness.
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CHEN, CHI-LUNG, and 陳祈龍. "Reliability Prediction and Experimental Analysis-Based on PCB(Printed Circuit Board)of Wireless Router." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/7a9rtf.
Повний текст джерелаАнотація:
碩士明新科技大學
工業工程與管理系碩士班
106
PCB (Printed Circuit Board) or PWB (Printed wire board) is the mother of electronic products, is an important electronic components, is the support of electronic components, is the electronic components of the circuit connection provider. PCB has been developed for decades. In recent years, due to increasingly thin and light end products, the electronic products have changed from the standardized specifications of the past to the form of flexible custom-made specifications. In the face of the "few and varied" trend of scientific and technological products in the future, the reliability of PCB (or trust, Reliability) test is highly valued. PCB products for environmental reliability testing, based on the PCB's temperature cycling test (Temperature Cycling Test, hereinafter referred to as TCT) as the most common and important test methods. Using the phenomenon of CTE mismatch with different thermal expansion coefficients among different materials, we can generate breakthroughs in holes and delaminated products (Delamination) during long-term high temperature and low temperature cycling, so as to help find the quality risk of products. This test method is highly effective for multilayer products and high-density interconnect (HDI) products. It can also be used to verify and improve the strength of Lamination Bond, the quality of electroplating and the stability of process. Expect to perform product reliability verification through this TCT test, repay R & D departments to improve the reliability of Wireless Router and win orders through customer verification. Keywords：Printed Circuit Board,Wireless Router, Reliability test, Temperature cycle test
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Hung, Charles Kater, and 洪嘉澤. "Using electrolytic system for removal of wastewater containing copper from printed circuit board (PCB)." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/kqfgpk.
Повний текст джерелаАнотація:
碩士國立中央大學
環境工程研究所在職專班
107
This study aims to use electrolytic system for the removal of wastewater containing copper for printed circuit board (PCB) industry. The wastewater used in this study came from copper wire foundry of PCB in Taiwan. Wastewater mainly includes solution of micro-etching copper, solution of chemical copper and solution of nitrate copper, respectively. For characteristics of three wastewaters, chemical copper presented strong alkaline, while micro-etching copper and nitrate copper were strong acid. In addition, analytical results indicated that wastewater of chemical copper had the highest chemical oxygen demand (COD). With various applied current (8 A - 16 A), Cu2+ removal efficiency of three wastewater achieved with electrolysis were 94.7% - 99.2% (chemical copper), 16.0% - 42.9% (micro-etching copper) and 14.3% - 39.0% (nitrate copper), respectively, indicating that electrolysis had the highest performance as applied for the treatment of chemical copper wastewater. Conversely, electrolysis performance was unsatisfactory for the treatment of micro-etching copper and nitrate copper. It may be ascribed to low pH value (micro-etching copper and nitrate copper were strong acid solution) to cause copper recovered in electrode was dissolved, resulting in lower Cu2+ removal efficiency. For effect of pH on electrolytic system, results indicated that electrolysis performance increased with increasing pH value. Also, effect of ratio of different wastewater on electrolytic system was explored, indicating that it was beneficial to Cu2+ removal efficiency with increasing ratio of chemical copper. In addition, results indicated that a higher Cu2+ removal efficiency could be obtained as electrolytic system was operated at a higher temperature due to high reaction rate. For durability test, electrolysis could be maintained at ≥ 72 hr stably. On the other hand, results of XRF and ICP, purity of copper recovered by electrolysis could almost achieve at ≥ 98%, indicating that high purity copper can be obtained as electrolysis was applied for the treatment of wastewater. Overall, high Cu2+ removal efficiency could be reached if electrolysis was operated at appropriate conditions, demonstrating that electrolysis has potential to be applied for the treatment of real field wastewater.