Дисертації з теми "Optical benches"
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Lo, Chi Chuen. "Integrated silicon optical bench with passive alignment features for three-dimensional optical interconnect /." View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?MECH%202004%20LO.
Повний текст джерелаIncludes bibliographical references (leaves 118-122). Also available in electronic version. Access restricted to campus users.
Wintr, Aleš. "Měření parametrů optických čoček." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2011. http://www.nusl.cz/ntk/nusl-219103.
Повний текст джерелаDiekmann, Christian [Verfasser]. "Development of core elements for the LISA optical bench : electro-optical measurement systems and test devices / Christian Diekmann." Hannover : Technische Informationsbibliothek und Universitätsbibliothek Hannover (TIB), 2013. http://d-nb.info/103651188X/34.
Повний текст джерелаChen, Shih-Chi 1977. "A six-degree-of-freedom compliant micro-manipulator for silicon optical bench." Thesis, Massachusetts Institute of Technology, 2003. http://hdl.handle.net/1721.1/89396.
Повний текст джерелаSECCO, GIOEL GABRIO. "Optical Coherence Tomography, from bench to bedside: shining the light during percutaneous vascular intervention." Doctoral thesis, Università del Piemonte Orientale, 2015. http://hdl.handle.net/11579/81665.
Повний текст джерелаKreiß, Lucas [Verfasser], Oliver [Akademischer Betreuer] Friedrich, and Maximilian [Gutachter] Waldner. "Advanced Optical Technologies for Label-free Tissue Diagnostics - A complete workflow from the optical bench, over experimental studies to data analysis / Lucas Kreiß ; Gutachter: Maximilian Waldner ; Betreuer: Oliver Friedrich." Erlangen : Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), 2021. http://d-nb.info/1228627568/34.
Повний текст джерелаLieser, Maike Danielle [Verfasser]. "LISA optical bench development : experimental investigation of tilt-to-length coupling for a spaceborne gravitational wave detector / Maike Danielle Lieser." Hannover : Technische Informationsbibliothek (TIB), 2017. http://d-nb.info/1169964109/34.
Повний текст джерелаLieser, Maike [Verfasser]. "LISA optical bench development : experimental investigation of tilt-to-length coupling for a spaceborne gravitational wave detector / Maike Danielle Lieser." Hannover : Technische Informationsbibliothek (TIB), 2017. http://d-nb.info/1169964109/34.
Повний текст джерелаCiubotariu, Dragos. "Design, Modeling, Fabrication and Control of PMN-PT Piezoelectric Systems." Thesis, Besançon, 2016. http://www.theses.fr/2016BESA2048/document.
Повний текст джерелаThis work proposes the use of a novel material, called PMN-PT, that futher aids the miniaturizationof complex systems used in different technologies. The work is presented within the collaborativeframework of two projects, MIOP and ADMAN. The end-needs account for actuators capable ofdelivering high displacement, while maintaining system simplicity and reliability. The focus is onthe versatility of the PMN-PT piezoelectric material, due to its electro-mechanical properties. Thework includes an overview on what influences the electro-mechanical properties focusing on twodifferent, though very potent cuts: anisotropic [011] and longitudinal [001]. They were chosen forgenerating large displacement and high dynamics with small volume. For PMN-PT[001] a cantileverstructure was studied, for which the model was improved taking into account the material specificities.Displacements and forces were found to be superior to a similarly dimensioned PZT actuator, whilsthaving reduced non-linearities. This is exemplified with a 6 DoF capable microgripper. The PMNPT[001] longitudinal cut based actuator study follows. This is done by using PMN-PT as a simple,easy to integrate, bulk actuator. The findings demonstrate the improvements PMN-PT can bringto micro-spectrometry and image correction with micro-mirror displacement. A bulk PMN-PT microactuator was integrated into a MOEMS compatible structure and presented
Baldwin, Dan, Andrew Szentgyorgyi, Stuart Barnes, Jacob Bean, Sagi Ben-Ami, Patricia Brennan, Jamie Budynkiewicz, et al. "Advanced structural design for precision radial velocity instruments." SPIE-INT SOC OPTICAL ENGINEERING, 2016. http://hdl.handle.net/10150/622418.
Повний текст джерелаVu, Ngoc Tuan. "Dynamique régénérative du véhicule : Transfert de puissance optimal par la maîtrise des comportements du véhicule de distribution." Thesis, Lyon, INSA, 2014. http://www.theses.fr/2014ISAL0104/document.
Повний текст джерелаIn this work, we have studied the energy optimal transfer by controlling the delivery vehicle behaviors. We studied, in particular, the energy consumed by a hybrid vehicle in the urban area. This context led us to investigate the use of a regenerative dynamics by taking into account the vehicle lateral dynamics on a variety of architectures associated with a method for controlling an over-actuated system. To do this, we have developed: (i) a modular virtual test bench to study the energy terms of delivery hybrid vehicle, (ii) an optimal control to determine the actuator inputs of over-actuated system, (iii) and regenerative dynamics to manage energy by taking into account the vehicle lateral dynamics. The virtual test bench constructed in this work allow for studies of the energy consumed for all architectures without changing of each module. This bench is composed the models of vehicle dynamics, steering, traction, braking, and electrical components systems. All models of this bench have been validated by experiments. It provides us the ability to validate and justify the control inputs of actuators and to evaluate the energy consumed terms. The optimal control module by using the allocation controller was also built in this work. It allows us to determine the optimal inputs of the actuators and to simulate the behaviors of all vehicle architectures under the constraints related with different architectures. The results show that the allocation controller is sufficient to determine the actuator inputs and to ensure the vehicle stability without the integration of additional criteria in the optimization problem. The energy gains in comparison with conventional architecture, which have been determined, ensure that the proposed approach effectively reduce the energy consumed by the vehicle. The parametric studies show that the regenerative dynamics can be used to recover energy in the case where the actuators have a very good performance and fast dynamics. In this case, the principle of regenerative dynamics is being improved for delivery vehicles (heavy load and in urban areas)
Le, Breton Rémy. "Large synoptic survey telescope : distorsions électrostatiques dans les ccd." Thesis, Paris 6, 2017. http://www.theses.fr/2017PA066298/document.
Повний текст джерелаThe removal of the sensor signature in the science images has been identified by the LSST Dark Energy Science Collaboration as a mandatory path to fullfill its scientific goals. The SAWG working group has been put together to perform this task for the collaboration. It has access to optical benches in some of the laboratories of the collaboration (UC Davis, SLAC, BNL and LPNHE) for this purpose. LSST belongs to a new category of telescopes equiped with large focal planes. For the decade that they have been equipped with thick, high resistivity Charge Coupled Devices (CCD), new effects have been identified. A particular attention is given to the understanding of the electrostatic distortions that are inherent to the CCD properties. These electrostatic distortions have an impact on science measurements. My PhD work is centered on the study of the brighter-fatter effect and the tree-rings. It has been shown that with different kind of illuminations, it was possible to accurately characterize these effects. A fringe projector has been developed on the optical bench of the LPNHE in order to produce these particular illuminations. In this document, we present : a new method, tested on simulations, to characterize the tree-rings; a new method to measure the brighter-fatter effect based on the projection of Ronchi profiles; a complete study of the different properties of the brighter-fatter effect, where we developped a simplified electrostatic model. Finally, the efficiency of a correction method, called descrambling, is evaluated
Sabry, Gad Aboelmagd Yasser Mohammed. "Miroirs acylindriques et asphériques à échelle microscopique : principes, technologie et applications aux bancs optiques miniatures." Thesis, Paris Est, 2013. http://www.theses.fr/2013PEST1096/document.
Повний текст джерелаThe ultimate objective of this thesis is to improve our understanding of light reflection on micro-curved surfaces, especially when the physical dimensions of the surfaces (radii of curvature in the order of 50-300 microns) are comparable to typical dimensional parameters of a Gaussian optical beam, such as those coming from an optical fiber or from a micro-laser. To this end, a theoretical study and numerical simulations were conducted; they were confronted with an experimental study. To do this, the realization of micro-mirrors controlled concavity being not easy, a first step of this thesis was to achieve the technological advances necessary for the realization of such micro-mirrors (by plasma etching method of DRIE type) for their subsequent experimental characterization. An important motivation for choosing this topic is its potential application in the production of micro-optical benches on a silicon chip, so as to increase the coupling efficiencies and capabilities of manipulation of light, in an integrated way and in an ultra compact space. As an illustration of the new micro-optical instrumentation which is attainable, we have designed and implemented a micro-device able of wide-angle (110 °) spatial scanning of a laser beam, the optical spot being not deformed during the scanning operation, which makes this device, the centerpiece of portable medical imaging systems by optical coherence tomography, among others
Rodriguez-Ferreira, Julian. "Étalonnage au sol de l’instrument SIMBIO-SYS à bord de la mission ESA/BEPICOLOMBO." Thesis, Paris 11, 2015. http://www.theses.fr/2015PA112011/document.
Повний текст джерелаBepiColombo is one of the cornerstones of the scientific program of ESA. It will study the planet Mercury with two spacecrafts in orbit around the planet. One of the two spacecrafts, the Mercury Planetary Orbiter (MPO), will be dedicated to the study of the surface and interior of the planet. The mission is scheduled for launch in 2016 and arrival at Mercury in January 2024. IAS is responsible for the calibration of the imaging system SIMBIO-SYS (Spectrometers and Imagers for MPO BepiColombo Integrated Observatory-SYStem) which consists of a high-resolution camera (HRIC), a stereoscopic camera (STC) and a visible and near-infrared hyperspectral imager (VIHI). These instruments should deeply change our understanding of the composition and geomorphology of Mercury surface. My research subject allowed me to participate in all the activities concerning the definition, implementation and validation of the calibration facilities at the IAS. These facilities are divided into different sub-systems: a thermal vacuum chamber containing the instrument during all the calibration campaign that shall simulate the environmental conditions (temperature and pressure), an optical bench with optical components and radiometrically calibrated sources reproducing the observational conditions as it will be seen by the instrument once placed in Mercury’s orbit, mechanical interfaces allowing the positioning and guidance of the instrument when placed inside the vacuum chamber with the required precision and accuracy, thermal interfaces facilitating the thermal excursion of the detectors, software interfaces so as to automatize and control the entire system. I developed a radiometric model of the calibration system and instrument to refine the calibration sources. In parallel, I performed several measurements of some subsystems so as to validate the optical assembly and to improve its control. Finally as a result of a close collaboration with the three Italian scientific teams of the instrument, I elaborate the fully package of the calibration sequences and the detailed instrument configuration that will be used during the calibration campaign
Komati, Bilal. "Automated microassembly using an active microgripper with sensorized end-effectors and hybrid force / position control." Thesis, Besançon, 2014. http://www.theses.fr/2014BESA2066/document.
Повний текст джерелаThis work proposes the use of an active microgripper with sensorized end-effectors for the automationof the microassembly of 3D hybrid MOEMS. Each of the two fingers of the microgripper is composedof a piezoelectric actuator with an integrated piezoresistive force sensor. The integrated force sensorpresents innovative performances compared to the existing force sensors in literature. The forcesensors provide the ability to measure the gripping forces applied by the microgripper to grasp a microcomponentand estimated the contact forces between the microcomponent and the substrate ofmicroassembly. A dynamic nonlinear model of the microgripper is developed. A hybrid force/positioncontrol is used for the automation of the microassembly. In the hybrid force/position control formulation,some axes are controlled in position and others are controlled in force. For the force controlledaxes, a new nonlinear force control scheme based on force tracking sliding mode impedance controlis proposed with parameter estimation. Using the proposed hybrid force/position control scheme, fullautomation of the microassembly is performed, notably for the guiding of a flexible component in arail
Li, Jen-yu, and 李振宇. "Polymer Waveguides Based on Silicon Optical Benches." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/39525267335883126321.
Повний текст джерела國立中央大學
光電科學研究所
99
In recent years, the optical interconnect is an important issue for communication technology. Because these are limitations of increasing transmission speed and bandwidth for traditional copper, the optical interconnect is the other approach to apply to the high-speed transmission. In this paper, the polymer waveguide with a 45°reflector is introduced on the silicon optical bench. This technique can be applied to the optical interconnects of inter- or intra-chip applications. In the framework, the 1550 nm light source was coupled to polymer waveguide and bend to the power meter by 45°reflector. The proposed polymer waveguide fabricated on a silicon optical bench includes a Si-based 45° reflector and a straight rectangular waveguide with a cross-section of about 40 μm × 20 μm. The insertion loss of straight rectangular waveguide is -2.49 dB, and its propagation loss is -2.085 dB/cm. At output multi-mode fiber, the 1-dB degradation tolerance in the vertical direction and the horizontal direction are about 44 μm. In the bending waveguide with a 45°reflector, the insertion loss is -5.62 dB, and the 1-dB degradation tolerance of input single-mode fiber is about 24 μm in the vertical direction, and is 8 μm in the horizontal direction.
Hsiao, Wen-chia, and 蕭文佳. "A Study of Manufacture of Micro Molds and Injection Molding Technology for Producing Precision Micro Optical Benches." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/01409977131239744994.
Повний текст джерела國立雲林科技大學
機械工程系碩士班
93
In this work, the technology to manufacture a polymeric optical bench will be developed. There are three micro features: ball lens holder, v-grooves (for holding optical fibers) and 45゚reflection mirror on this optical bench. Due to different levels of micro structures, the manufacture of the micro mold becomes more difficult and complicated. Several processes which involve UV-LIGA, wet etching, dry etching on the silicone wafer and electro-forming are needed to fabricate the micro mold. The final products were then duplicated by the thermoplastic micro injection molding. Three different processes, conventional injection molding (CIM), vario-thermal injection molding (VTIM) and injection compression molding (ICM) to mold the optical benches were examined and compared through Taguchi’s experimental studies. Shrinkage of v-grooves, holder width and the whole width of molded parts were selected as the quantities to be minimized. The experimental results reveal that for CIM, the mold temperature is the most significant factor (72.27%) on the shrinkage of holder width, followed by the injection pressure (12.12%). For ICM, the compression speed has the strongest effect on holder width’s shrinkage (40.45%), and the second one is the injection pressure (29.58%). For VTIM, the initial mold temperature is the most important parameter (72.64%). If we look at the shrinkage of whole width of the optical bench, the results are quite similar to the above except for CIM, the second important factor changes to the holding pressure. For duplicating the micro features, it depends on the parameters at the early stage of molding. This is different from the shrinkage of the whole width, which depends on the post filling. The shrinkage of holder widths of three different processes were also compared, the VTIM one has the smallest shrinkage (0.87%) i.e. highest degree of replication (99.13%); but for the shrinkage of whole widths, the ICM has the smallest shrinkage (1.88%) i.e. highest degree of replication (98.12%). The vario-thermal molding process can help increase the replication degree, especially for the micro features such as ball lens holder, V-groove and 45゚reflection mirror, but its cycle time is longer. The ICM provides more even and flat residual stresses distributions of the molded parts than the other two.
POLYCARPOU, CONSTANTINA. "Adaptive Detection of Arbitrarily Shaped Ultrashort Quantum Light States." Doctoral thesis, 2013. http://hdl.handle.net/2158/807677.
Повний текст джерелаHsiao, Hsu-liang, and 蕭旭良. "Silicon Optical Bench For Optical Interconnect Modules." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/85531474809111675570.
Повний текст джерела國立中央大學
光電科學研究所
96
With the computing speed of computers up to several GHz and above, the telecommunications bandwidth through the traditional copper wire will be inadequate. Thus, incorporating optical light as a transmitting media will substantially improve most current interconnect technology due to its high transmission speed. Silicon optical bench technology for optical interconnect applications provides specific characteristics of miniaturized sizes, a good heat spreading, and so on. In addition, the fabrication process can be achieved by employing a standard semiconductor process technology. Therefore, it provides assembly with highly precise alignment, and mass-production possibilities. In this paper, a free-space optical interconnect technology, which can serve as a board on board and/or USB 3.0 applications, is realized by using a silicon-optical bench. The transceiver module on the silicon micro-optical bench includes of a monolithic 45∘micro-reflector, V-groove fiber array, high frequency transmission line for 2.5 GHz and bonding pads. The designed silicon optical bench is possessed of a 45∘micro-reflector with 110 ?m. And the process tolerance can be controlled within 6%. Through the ray-tracing simulation methods, the coupling efficiency of transceiver and receiver part reaches up to -6 dB and -2 dB, respectively.
Chen, Hung-hsun, and 陳弘勳. "HDMI Optical Transceiver on Si Optical Bench." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/ze84n5.
Повний текст джерела國立中山大學
光電工程研究所
97
The primary target of this thesis is to fabricate an optical transceiver base on Si-bench technology for High Definition Multimedia Interface (HDMI). The HDMI transceivers were formed by hybrid integration of the semiconductor laser, photo detectors, multi-mode fibers (MMF) on Si optical bench using V-groove and U-groove structures. Using V-groove structures, we were able to passively align semiconductor lasers to MMFs and MMFs to photo detectors with accurate precision. The measured optical losses between transmitting module and receiving module were less than 6dB with a speed of 4 × 1 Gb/sec.
Shen, Po-Cheng, and 沈柏蒼. "Optical HDMI Module Based on Silicon Optical Bench Technology." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/33688310739822430912.
Повний текст джерела國立中央大學
光電科學研究所碩士在職專班
101
In this thesis, the core technology of silicon optical bench (SiOB) is utilized to develop an active hybrid high definition multimedia interface cable (Hybrid HDMI cable). The transmission capability of hybrid HDMI cable can achieve 150 meters with low power consumption as low as 250 mW. The results compared with normal HDMI cable that use copper wires, hybrid HDMI cable has a lot of advantages as larger bandwidth of 10.2 Gbps, less high-speed signal loss of 0.03dB/m, and long distance transmission. The active hybrid HDMI cable includes optical transmitter and receiver module with four optical channels for unidirectional high-speed signal transmission and six copper wires for low-speed signal transmission. The video bandwidth of this hybrid cable can achieve as 10.2 Gbps, and support and satisfy the commercial specification, HDMI version 1.4a, like three-dimension display (3-D display), 4K2K high-precision display, etc.
Chang, Chia-Chi, and 張家齊. "Research on Guide-Wave Silicon Optical Bench for Optical Interconnect." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/84118142558150803147.
Повний текст джерела國立中央大學
光電科學研究所
100
In this dissertation, the concept of guided-wave silicon optical bench (GW-SiOB) is proposed for optical interconnects. The research focuses on developing optical waveguides with 45° micro-reflectors for out-of-plane coupling as the active devices being assembled on silicon optical bench. The GW-SiOB can be classified into two groups, optical waveguides of (i) silicon trapezoidal waveguides based on silicon-on-insulator (SOI) substrate, and (ii) polymer waveguides based on silicon substrates. In the silicon trapezoidal waveguide case, the three-dimensional (3-D) optical paths interconnect the front and rear facets of SOI substrate using the 1310-nm light wave is demonstrated the first time. In the polymer waveguide case, the 850-nm light wave can be applied to optical interconnects on silicon substrates for the first time. The polymer waveguides embedded in the SiOB with 45° micro-reflector using the laser beam of 850-nm wavelength is demonstrated. The coupling efficiency of the proposed structure is -2.5 dB and the propagation loss of polymer waveguide is 0.35 dB/cm. For multi-channels application, the channel pitch for the waveguide array is 250 μm. The cross talk of channel-to-channel could be suppressed down to -40 dB. The polymer waveguides combined with silicon-based 45° micro-reflectors are also realized on a silicon substrate to demonstrate a vertical splitter with out-of-plane output ports. Its transmission efficiencies are -6.8 and -5.6 dB, respectively, for two output ports. The split ratio of proposed splitter is around 3:2. The total insertion loss of proposed splitter is estimated as 3.19 dB. The first output port can be placed a photodiode to monitor the power of input port. On the other hand, the SOI-based trapezoidal waveguide with a 45° micro-reflector is realized to demonstrate a 3-D bending for non-coplanar optical interconnects. The proposed SOI-based SiOB can apply to wavelength over 1100 nm. The transmission efficiency of proposed structure with wavelength of 1550 nm can be controlled at the level of -4.51 dB, and the propagation loss of SOI waveguide is 0.404 dB/cm. The wider alignment tolerance of ±20 μm is achieved to facilitate the system assembly. The multi-channel trapezoidal waveguides are also demonstrated to verify the cross talk of channel-to-channel as low as -53 dB. The vertical power splitter based on guide-wave SiOB with 45˚ micro-reflector is also realized to demonstrate a 3-D silicon photonics. This guide-wave power splitter has two Si-based 45˚ micro-reflectors, one is utilized to bend the light beam into SOI waveguide, and the other separates partial power to monitor the power of laser or be a variable optical path. The total insertion loss of proposed splitter is around 3.5 to 3.9 dB. The power split ratio can be controlled by modulating the width of waveguide and the split ratio with around 4:1, 2:1, and 1:1 have demonstrated in this research. The wider alignment tolerance of proposed splitter is more than the present assembly technology (±5 um) and achieved to facilitate the system assembly. Finally, a SOI-based optical interconnect transmitter with trapezoidal waveguides and 45° micro-reflectors is demonstrated. The trapezoidal waveguides monolithically integrated with 45° micro-reflectors facilitate a 3-D bending for non-coplanar optical interconnects. It would simplify and shrink the intra-chip optical interconnect located on a silicon substrate. The clearly open eye patterns at 5-Gbps data rate verify the proposed guide-wave SiOB is suitable for intra-chip optical interconnects.
Hsiao, Hsu-Liang, and 蕭旭良. "Research on On-Board Optical Interconnect Based on Silicon Optical Bench." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/67493198041303429585.
Повний текст джерела國立中央大學
光電科學研究所
100
In this dissertation, the researches focus on the high-speed multi-channel short-reach (SR) optical engine platform development based on the silicon optical bench (SiOB) technologies. As the rapid development of cloud computing and upcoming high-speed link expectation for portable devices, how to drive the optical interconnect technology to higher speed, multi-channels, miniaturization, and even low costs in mass production has become the research hot zone, where the SiOB technology has been received with great attentions on completing the OE/EO converter. SiOB-based optical engine can be conducted via silicon Micro Electro Mechanical Systems (MEMS) process, leading to high structural accuracy up to few micron-meters, precisely packaging among micro-optical elements, such as VCSEL/PD and MMFs, and cost competitive advantages in mass batch production. In first research topic, a 4-channel x 10-Gbps optical interconnect module based on a SiOB with a 45 degree reflector as well as monolithic V-groove array for fiber alignment is developed. The 4-channel VCSEL and PD arrays are flip-chip assembled onto the pedestal of SiOB using Au/Sn eutectic solder bumps to form a SiOB-based bi-directional optical sub-assembly (BOSA) configuration. In a 4 mm × 3.75 mm × 0.6 mm small size, 4-Tx and 4-Rx channels can be completed, bringing into physical size advantage for portable cables with optical link. The optical coupling of VCSEL-to-MMF and MMF-to-PD without adding coupled optics is -5.2 and -2 dB, respectively. The widely alignment tolerances of 1-dB power variation for the transmitting and receiver parts are 15-?m are achieved. The clearly open 10-Gbps eye patterns of Tx part as well as BER of 10-12 . The Rx sensitivity can reach to as low as -12 dBm as input optical power with channel cross-talk enabled. The research study starts from wafer process, chip-level packaging, PCB circuit and chip-on-board assembly, fiber mounting, to highs-speed testing, and also industrial reliability testing applied. The results indicate this SiOB optical engine can be a fundamental platform for versatile optical interconnect applications with high-speed and compact OE/EO module. In the last part of this dissertation, a polymer waveguide technology has been to apply into this SiOB platform. To providing more optical layout flexibility and also, the upcoming 25-Gbps optical link with tougher optical coupling requirement due to the smaller sensing area of PD or larger NA of VCSEL, polymer waveguide can play an important role to overcome these issues. A multi-channels OE/EO module with polymer waveguide on SiOB has been successfully realized with optical link by fiber coupled. The polymer waveguide can be fabricated onto the SiOB with standard lithography process, whose core size is approx. up to 40-?m scale with compatible size of MMF’s core. We believe this configuration can be a basis for future more compact size OE module or higher speed optical interconnects applications.
Lin, Chi-Hsiang, and 林期祥. "Optical Performance of Guided-Wave Silicon Optical Bench with Inertial Sensing Element." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/f32r75.
Повний текст джерела國立中央大學
光電科學與工程學系
102
The guided-wave silicon optical bench (GW-SiOB) with inertial sensing element is proposed in this thesis. The working principle of the module as below: the external inertial force causes the membrane of inertial sensing element with vibration, and this vibration let the mass element, which is on the membrane, with relative vibration displacement. The relative vibration displacement of mass element lets optical waveguide with variation optical flux, and the optical flux of waveguide is monitored by silicon optical bench to analyze the external inertial force. The polymer material is utilized to fabricate the waveguide with air trench on GW-SiOB, and the mass element of silicon based inertial sensing element is inserted into the air trench. The silicon based inertial sensing element and GW-SiOB are fabricated by semiconductor process, and the flip-chip assembly is used to assemble the silicon based inertial sensing element, vertical-cavity surface-emitting Laser (VCSEL), and photodiode (PD) on the GW-SiOB. An optical inertial sensing module achieved is through above process. The PD of optical inertial sensing module without inertial sensing element received the optical current of 0.12 mA and the optical coupling efficiency of the module with -9.49 dB. The assembly insertion loss of inertial sensing element is -2.18 dB, and compared to simulation result of -1.99 dB with error value in 9%.
Hung, Chen-Yi, and 洪真一. "Three-dimensional Optical Path on Silicon Optical Bench with Cantilever Waveguide Sensing Element." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/mp5e93.
Повний текст джерела國立中央大學
光電科學與工程學系
103
In research area of cantilever sensing element, most of approaches are based on the methodology of fiber-to-fiber coupling, which is unsuitable for the integration of laser source and photodetector (PD) into the platform of cantilever structure. In this thesis, a three-dimensional optical path on silicon optical bench (SiOB) with cantilever waveguide sensing element is proposed for the first time to overcome the bottleneck of laser and PD integration. In the proposed approach, the three-dimensional optical path consists of input 45-degree micro reflector, cantilever waveguide, and output 45-degree micro reflector. A vertical-cavity-surface-emitted-laser (VCSEL) and a PD could be easily integrated into the SiOB by three-dimensional optical path. The proposed SiOB is realized on a silicon-on-insulator (SOI) wafer. The three-dimensional optical waveguide is fabricated on the photonic layer of SOI wafer by wet etching process, and the cantilever waveguide is defined by three kind of different deep etching processes. The measurement result divides into optics part and vibration part. In the optics part, under the substrate thickness of 300 μm, the optical transmission efficiency is -12.168 dB, and the alignment tolerance of x-axis and z-axis at input port ranges from -4 μm to +5 μm and -4 μm to +4 μm, respectively. At output port, the alignment tolerance of x-axis ranges from -14 μm to +19 μm, and it ranges from -14 μm to +20 μm for z-axis. In the vibration part, considering that the exterior sound source levels at 1 kHz frequency are 94, 100, 105 and 108 dB, the displacement amplitude of cantilever waveguide sensing element are ±2 nm, ±4 nm, ±5.5 nm and ±10 nm, respectively. Based on the unique optical bench design, it provides a platform to integrate optical waveguide and cantilever waveguide sensing element, and further possible to integrate laser source and PD.
Chen, Chin-Ta, and 陳進達. "4-Channel×10-Gbps Optical Interconnect Receiving Module Based on Silicon Optical Bench." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/36054594097218295485.
Повний текст джерела國立中央大學
光電科學研究所
98
In this thesis, the compact and passive-alignment optical interconnect receiving module based on silicon optical bench (SiOB) is realized. The transmission speed of receiving modules are 4-channel × 5-Gbps and 4-channel × 10-Gbps, the former is corresponded to photo-detector (PD) which wavelength is 1310 nm, the later is corresponded to PD which wavelength is 850 nm. The size of module is 5 × 5 mm2. The receiving module can apply optical interconnect of board to board or chip to chip. The silicon-based optical interconnect receiving module includes a monolithic integration of 45° micro-reflector, V-groove arrays, high-frequency transmission lines of 10 GHz, bonding pads with Au/Sn eutectic solder and metal layer with high reflection coating (HR coating),using hybrid integration of PD and fibber array of 8 channels with passive alignment process. The 45° micro-reflector provides non-coplanar transmission, which surface roughness is less than 10 nm, etching depth is 110 um, V-groove arrays provide bench of setting fiber, the tolerance accuracy of fabrication process for SiOB is less than 6 %. The optical characteristic with receiving module, 1-dB tolerance of optical level of 850-nm and 1310-nm module are ±16 and ±20 um, respectively, responsivity are 0.5 and 0.7 A/W, respectively, the cross-talk between neighboring channels can be less than -25 dB. The frequency characteristic with receiving module, The eye pattern of 850-nm module and 1310-nm module can pass OC-192 and OC-96 eye mask, respectively. The bit error rate (BER) of them can achieve 10-11 order.
Yang, Ling-Gang, and 楊凌岡. "4-Channel x 10 Gbps Optical Interconnect Transmitter Module Based on Silicon Optical Bench." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/18857701992152438675.
Повний текст джерела國立中央大學
光電科學研究所
98
In this thesis, two types of transmitter modules (Tx) for optical interconnect based on silicon-optical-bench (SiOB) had been developed. Two types are 850 nm with 4-channel × 10 Gbps (850nm-4x10G-Tx) and 1310 nm with 4-channel × 5 Gbps (1310nm-4x5G-Tx), respectively. The chip size of Tx is only 5 × 5 mm2. Tx includes a monolithic integration of silicon-based 45° micro-reflector, V-groove array, high-frequency transmission line of 10 GHz, and bonding pads with Au/Sn eutectic solder. All of Components are assembling through hybrid integration, vertical-cavity surface-emitting laser (VCSEL) is assembled by flip-chip bonding and fiber ribbon is inserted to V-groove array at specific position with highly precise-passive alignment. The depth of 45° micro-reflector can be reached to 110 μm by anisotropic wet etching process. Such this micro-reflector has good optical properties for infrared light. The light emanating from VCSEL can be deflected into multi-mode fiber (MMF) and the coupling efficiency of 850nm-4x10G-Tx and 1310nm-4x5G-Tx can be up to -3.5 dB and -1.1 dB, respectively. The cross-talk of inter-channel is less than 30 dB in these modules. Utilizing micro lithography, the process tolerances of 10 GHz transmission line are within 10%, and the optical 1 dB alignment tolerances are within 20 μm and 15 μm for 850nm-4x10G-Tx and 1310nm-4x5G-Tx, respectively. Eye patterns of the Tx are measured as the 15-bit PRBS with a data rate of 10 Gbps for 850nm-4x10G-Tx and 5Gbps for for 1310nm-4x5G-Tx.
Lu, Guan-Fu, and 盧冠甫. "4 Channels x 10-Gbps Optical Interconnect Transceiver Based on Silicon Optical Bench Technology." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/65445798348158310174.
Повний текст джерела國立中央大學
光電科學研究所
99
In this thesis, a bi-directional 4-channels×10-Gbps optoelectronic transceiver base on this Silicon Optical Bench technology is proposed. This transceiver including a Bi-Directional Optical Sub-Assembly (BOSA), transmitter driver IC, receiver TIA, Fiber ribbon assembly and PCB with high frequency trace design. BOSA and PCB have some specific design for conventional Chip-on-Board (COB) process. In eye diagram measurement, the transmitter can pass 10-G Ethernet eye mask with 25% margin at room temperature; Bit error rate (BER) of Receiver can achieve 10-12 order, which confirm the transceiver’s ability of 10-Gbps data transmission.
Lin, Hung-Yi, and 林弘毅. "The Hybrid Micromachined Silicon-Optical-Bench and Its Applications." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/24061556033111631322.
Повний текст джерела國立清華大學
動力機械工程學系
90
Optical MEMS utilized by microstructure and micromachine to construct various optical functions, the applications from simple barcode reader to sophisticated optical network, the development of micromachining open up the new applications and opportunities. From 1970, the development of Bulk micromachining shows the characteristic of the precision etching in single crystal silicon could be used for optical alignment. And silicon also as a wonderful mechanical material, therefore the actuated silicon machine could function as light manipulator. The Surface micromachining developed from 1990, could implement real 3D structure by folded-up assembly. The refining micromachine utilized by surface micromachining demonstrate various applications, however the static and dynamic deformation of those thinness structure limits the optical performance. Therefore, the DRIE machining is developed for high aspect ratio structure, but those uni-thickness structures also have the limitation from the perspective of motion. This thesis proposed a novel micromachining process, based on existing thin film technology and integrate DRIE and Bulk wet release to realize a multi-depth micromachining process. The proposed hybrid process provides three level machining depths monolithically; therefore the thin film structure has the flexure property intrinsically, and also could be a high stiffness/weight ratio structure utilized by proposed rib-reinforced technology for better dynamic characteristic. This thin film micromaching also could inherit the assembly technology of surface micromachining. This thesis expounds the precision is the essential of micromachining when apply to optical application, both the position accuracy of static structure and motion accuracy of dynamic structure. Therefore the assembly technology and its accuracy were discussed, and conclude this technology is suitable for quasi-static precision optical bench. Further, for dynamic optical bench, the essential elements include actuator, transmitting mechanism and passive component were fabricated by proposed hybrid process, and a novel high frequency scanning mirror as a vehicle to demonstrate the proposed dynamic optical bench. In concludes, an optical bench utilized by proposed hybrid process could potentially meet the requirement both static and dynamic applications.
Lee, Meng-Ju, and 李孟儒. "DFB Laser on Si Optical Bench for Si Photonics." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/b67yaa.
Повний текст джерела國立中山大學
光電工程學系研究所
107
A DFB laser for Si photonics was aligned to single mode fiber (SMF) using Si V-groove structure. Good vertical alignment was obtained by adjusting the width of the V-groove fabricated on Si substrate. In addition, the optical output of the DFB laser was coupled to a photonic integrated circuit via lateral optical coupling technique. ×12 angled fiber array with MT ferrule was used to couple the optical output to the photonic integrated circuit through a waveguide grating coupler. The coupling losses of the DFB laser to SMF and the angled SMF to grating coupler are -2.96dB and -4.76dB respectively.
Crane, Jeffrey David. "Exploring galactic structure with the fan obervatory bench optical spectrograph /." 2004. http://wwwlib.umi.com/dissertations/fullcit/3144647.
Повний текст джерелаLin, Ching-Chang, and 林慶彰. "An Optimal Scheduling in Semiconductor Wet Bench Process." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/11535137217996911328.
Повний текст джерела長庚大學
管理學院碩士學位學程在職專班經營管理組
100
This study focuses on semiconductor wet bench scheduling process optimization problems, mainly based on the production target, process constraints and characteristics of the equipment to develop the mathematical programming model and seek the optimal solution by optimization software CPLEX. The wet bench scheduling problem is divided into two parts (1) within the chemical tank machine scheduling, which is essentially a " Jumping No-Wait Flowshop with a Starting Common Machine " (JNWF-SCM). (2) need to consider the multi-target of production line, to meet production targets demand, and distribute the process recipes. In order to the individual machine to reach production capacity assignment and distribution, thereby enhance production efficiency needs, this study provides new combination structure for machine capacity allocation and scheduling of JNWF. The best method through mathematical models written by IBM iLOG CPLEX solution from this study, then apply the results to automatic systems. The results shown by this study method can effectively reduce the gap between actual production and the target by 23.6%, increase the utilization rate of chemical tank by 0.7% and increase wafer per hour by 5.7%. Thereby, improve the balance of production line to avoid bottlenecks machine idle and eventually reach production delivery goal.
Fontes, Alexandre Rui Reis. "Test techniques of photonic integrated circuits for PON networks." Master's thesis, 2018. http://hdl.handle.net/10773/25596.
Повний текст джерелаAs comunicações óticas fazem parte do nosso dia a dia, pois atualmente são a base das infraestruturas de telecomunicações, destacando-se pela qualidade e eficiência na transmissão de dados. Devido ao desenvolvimento tecnologico que caracteriza o nosso quotidiano, torna-se necessário a evolução destas infraestruturas de comunicação para satisfazer as necessidades e exigências do consumidor final. A Rede Ótica Passiva (PON) é uma das várias arquiteturas de distribuição de fibra otica ate ao consumidor final e caracteriza-se pelo baixo custo de implementação e de manutenção e pela divisão de banda larga disponível aos clientes. No entanto, e tendo em consideração o incremento do acesso à informação através dos canais digitais, impõe-se otimizar os custos dessa rede, aumentar a sua rapidez, ampliar a quantidade de informação e melhorar cada vez mais a qualidade da transmissão dos dados. O recurso, no futuro, à utilização dos Circuitos Oticos Integrados (PIC) permitir a melhorar as redes PON, pois estes circuitos consistem em chips que integram vários componentes óticos capazes de ter variadissimas funcionalidades. A caracterização e teste destes chips encontram-se ainda numa fase inicial e pouco otimizada nos nossos laboratórios. Neste contexto, este trabalho consistiu na realização de testes que permitissem definir um protocolo de teste e apresentar uma proposta de um setup de teste genérico, sendo o principal objetivo desta dissertação que a mesma possa ser utilizada como ferramenta com todos os passos necessários à realização destes testes. Inicialmente é feito um enquadramento teórico acerca de redes óticas passivas (PON) e de circuitos oticos integrados (PIC). De seguida, é apresentado um capítulo sobre teoria de medidas e o tratamento correto dos dados obtidos numa experiência. Depois são apresentados alguns testes de PICs realizados em laboratório, constatando-se as dificuldades dos mesmos. No fim, é proposto um setup de teste genérico, acompanhado de um protocolo de teste, tendo como objetivo a otimização do tempo gasto na experiência, e da qualidade da receção e tratamento dos dados recebidos.
COMPRESS - PTDC/EEI-TEL/7163/2014; HEATIT 017942 (CENTRO-01-0247-FEDER-017942)
Mestrado em Engenharia Eletrónica e Telecomunicações
Shiu, Jr-I., and 許智奕. "Passively-aligned Optical Transceiver on Si Bench for Light Peak Application." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/76986029936568816120.
Повний текст джерела國立中山大學
光電工程學系研究所
99
ABSTRACT The aim of this dissertation is to fabricate an optical transceiver based on Si-bench technology for light peak application. The transceivers are composed of hybrid integration of the vertical cavity surface-emitting lasers (VCSEL), photo diodes and multi-mode fibers (MMF) on the Si optical bench using V-groove and U-groove structures. We are able to passively align VCSEL to MMF and photo diode to MMF because of the accurately-aligned characteristic of V-groove. The 45-degree-angled fibers with mirror coating are used to bend the directions of both the incoming and outgoing lights to the photodiode and the MMF. The simulations showed that the optical losses of the transceiver are less than 10 dB when the distance between VCSEL and MMF is 250μm.The measured optical losses between transmitting module and receiving module are less than 12 dB. Key words: Light Peak、optical transceiver、Si-bench、accurately-aligned
Sun, Pei-Fen, and 孫培峰. "Designs and fabrication of the CWDM4 filter on Si optical bench." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/7n29t7.
Повний текст джерела國立中山大學
光電工程學系研究所
106
In this thesis, we realized coarse wavelength division multiplexing(CWDM) on silicon optical bench based on thin film filter(TFF) technology. Three-port structure was used to perform the demultiplexing function. Incident lights of 1271nm, 1291nm, 1311nm, and 1331nm wavelengths from the input fiber were demultiplexed and transferred to the four output fibers using GRIN lenses and TFFs. The positions of the fibers, GRIN lens, and TFFs were defined by V-groove on the Si optical bench. Lights with wavelengths matching to the center wavelengths of the TFFs can then pass through the TFFs, which are located between the two GRIN lenses, and reach the output ports. The rest of the wavelengths will be reflected by the TFF and refocused by the GRIN lens to the next input fibers. The optical loss of the reflection of lights from the TFF is less than 5dB. However, maximum loss of 7dB was measured due to poor position control of the fixtures. The insertion losses of the ports of 1271nm, 1291nm, 1311nm, and 1331nm are 6.3dB, 9.9dB, 14.7dB, and 21.7dB, respectively.
吳忠衛. "MEMS Based Micro Optical Bench with Integration of SOI and SU-8." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/51576722452727602964.
Повний текст джерелаHuang, Ching-lin, and 黃靖麟. "Monolithic Integration of Photo-detector on Silicon Optical Bench with Acoustic Sensing Membrane." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/38d32g.
Повний текст джерела國立中央大學
光電科學與工程學系
103
In this research, we proposed a guided-wave silicon optical bench, which successfully integrates VCESL, sensing membrane and photo-detector for photo-acoustic sensor application. Such a optical bench has advantages including: high assembly tolerance, low optical loss, and monolithic photo-detector. The guided wave silicon optical bench has a 45° reflector to efficiently couple the 850 nm light emitted by VCSEL in to polymer waveguide. The sensing membrane is inserted into the air trench on optical bench and the vibration is caused by external inertial force. The vibration of sensing membrane results a variation of optical flux monitored by monolithic photo-detector fabricated by ion implantation. The monolithic photo-detector has a high responsivity of 0.3 A/W. When the light source emit into waveguide via SMF in this system, the .optical current is 125 mA. After optimization, the optical bench obtains optical current of 96.9 mA and efficiency of -3.3 dB after integrated VCSEL and sensing membrane by flip-chip bonding. The SNR of photo and dark current is 20 dB. Such a guided wave silicon optical bench provides a solution for photo-acoustic sensor development.
Wallace, Brian Peter. "Design, implementation, and testing of an adaptive optics test-bench." 2005. http://hdl.handle.net/1828/836.
Повний текст джерелаHung, Sheng-Feng, and 洪聖峰. "Passive Alignment of Buried Optical Waveguide and Single Mode Fiber on the Silicon Bench." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/58316595127526408618.
Повний текст джерела國立中山大學
光電工程研究所
93
The objective of this thesis is to integrate the optical waveguide and single mode fiber in a passive alignment way on a silicon bench. This technique can reduce the complexity of packaging the individual components and increase yield of the module in order to achieve the goal of the mass production. In this module, buried waveguide structure was used for light guidance. A 1.31µm semiconductor laser was used as the input light source. Light signal launched by semiconductor laser is transferred through the buried waveguide into the single mode fiber. This module structure is consisted of two major parts, namely, the buried waveguide and the silicon bench. Buried optical Waveguide uses SO2 as the bottom cladding. Conventional photolithography procedures and etching technique were used to form a trench on the SiO2 cladding. The waveguide core was fabricated by coating the organic-inorganic hybrid materials into the trench. Finally, an organic-inorganic hybrid materials with a refractive index smaller than that of the core is used as the top cladding. The silicon benches were obtained by etching V-groove and saw-cutting U-groove on the silicon substrates for fixing the fiber. The patterning of buried waveguide and silicon V-groove were fabricated by a single optical mask procedure. Therefore accurate alignment between the waveguide and the single mode fiber can be obtained.
Yang, Chia-chin, and 楊家欽. "Bidirectional Transceiver Modules on the Silicon Bench using Ultra-thin Thin-film Filter and Optical Fibers." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/35071613174541606572.
Повний текст джерела國立中山大學
光電工程研究所
93
The primary target of this paper is to fabricate bidirectional transceiver modules based on single mode fiber (SMF) and ultra-thin thin-film filter (TFF). Two major components, namely, SMF and ultra-thin TFF are hybrid integrated on the silicon bench using V-groove and U-groove techniques. A 1310 nm wavelength light was launched into the input SMF of the module. After passing through the filter, the light was received by the output SMF of the module. On the other hand, a 1550 nm wavelength light input to the SMF is reflected by the filter and collected by the output multimode fiber (MMF). Transceiver modules using two different fiber structures were fabricated. The first kind of the module uses standard SMF for 1310 nm light transmission. The insertion loss of the module for the 1310 nm wavelength light was 5.66 dB. In the second kind of the module lens fibers were used to replace the standard SMF. The insertion loss for the 1310 nm wavelength light was reduced to 0.98 dB. A reduction of 4.6 dB was achieved. For both modules, the insertion loss for the 1550 nm wavelength light reflected from the filter was around 0.5 dB.
Chen, Yi-ting, and 陳怡廷. "Triplexer Transceiver Modules on the Silicon Bench using Ultra-thin Thin-film Filter and Optical Fibers." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/59016379462805917838.
Повний текст джерела國立中山大學
光電工程研究所
94
The primary target of this paper is to fabricate triplexer modules based on Si-bench technology. The triplexer modules were formed by hybrid integration of single mode lensed fibers and ultra-thin thin-film filters (TFF) on silicon bench as using V-groove and U-groove techniques. The output light at 1.31 µm was launched into the input lensed fiber of the module. After passing through two filters, the light was received by the output lensed fiber of the module. The insertion loss of the module at the 1.31 µm light was 1.25 dB. On the other hand, incoming lights at 1.49µm and 1.55µm were received from the output lensed fiber. Lights at 1.49µm will pass through the first filter, and be reflected by the second filter, and eventually be collected into the second multimode fiber. The insertion loss of the module at the 1.49 µm light was 1.14 dB. The 1.55µm wavelength lights received at the lensed fiber are reflected by the first filter and collected by the first multimode fiber. The insertion loss of the module at the 1.55 µm light was 0.68 dB.
Meyerhöfer, Dietrich. "Johann Friedrich von Uffenbach. Sammler – Stifter – Wissenschaftler." Doctoral thesis, 2020. http://hdl.handle.net/21.11130/00-1735-0000-0005-13B0-E.
Повний текст джерела