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Готові списки джерел за темами / Multimetal Deposition

Добірка наукової літератури з теми "Multimetal Deposition"

Автор: Grafiati

Опубліковано: 10 грудня 2022

Оновлено: 28 січня 2023

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Статті в журналах з теми "Multimetal Deposition"

1

He, Yayun, Linru Xu, Yu Zhu, Qianhui Wei, Meiqin Zhang, and Bin Su. "Immunological Multimetal Deposition for Rapid Visualization of Sweat Fingerprints." Angewandte Chemie 126, no. 46 (July 30, 2014): 12817–20. http://dx.doi.org/10.1002/ange.201404416.

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2

Schnetz, Bertrand, and P. Margot. "Technical note: latent fingermarks, colloidal gold and multimetal deposition (MMD)." Forensic Science International 118, no. 1 (April 2001): 21–28. http://dx.doi.org/10.1016/s0379-0738(00)00361-3.

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3

Neirinck, Bram, Xiaoshuang Li, and Matthias Hick. "Powder Deposition Systems Used in Powder Bed-Based Multimetal Additive Manufacturing." Accounts of Materials Research 2, no. 6 (May 14, 2021): 387–93. http://dx.doi.org/10.1021/accountsmr.1c00030.

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4

Stauffer, Eric, Andy Becue, Kanwar Vikas Singh, K. Ravindranathan Thampi, Christophe Champod, and Pierre Margot. "Single-metal deposition (SMD) as a latent fingermark enhancement technique: An alternative to multimetal deposition (MMD)." Forensic Science International 168, no. 1 (May 2007): e5-e9. http://dx.doi.org/10.1016/j.forsciint.2006.12.009.

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5

Charlton, Deborah T., Stephen M. Bleay, and Vaughn G. Sears. "Evaluation of the multimetal deposition process for fingermark enhancement in simulated operational environments." Analytical Methods 5, no. 20 (2013): 5411. http://dx.doi.org/10.1039/c3ay40533h.

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6

Masuda, Atsushi, Kazuko Matsuda, Yasuto Yonezawa, Akiharu Morimoto, and Tatsuo Shimizu. "Mechanism of Stoichiometric Deposition of Volatile Elements in Multimetal-Oxide Films Prepared by Pulsed Laser Ablation." Japanese Journal of Applied Physics 35, Part 2, No. 2B (February 15, 1996): L237—L240. http://dx.doi.org/10.1143/jjap.35.l237.

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7

Becue, Andy, Aurèle Scoundrianos, Christophe Champod, and Pierre Margot. "Fingermark detection based on the in situ growth of luminescent nanoparticles—Towards a new generation of multimetal deposition." Forensic Science International 179, no. 1 (July 2008): 39–43. http://dx.doi.org/10.1016/j.forsciint.2008.04.008.

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8

Gelatos, A. V., A. Jain, R. Marsh, and C. J. Mogab. "Chemical Vapor Deposition of Copper for Advanced On-Chip Interconnects." MRS Bulletin 19, no. 8 (August 1994): 49–54. http://dx.doi.org/10.1557/s0883769400047734.

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Анотація:

Continued dimensional scaling of the elements of integrated circuits places significant restrictions on the width, density, and current carrying capability of metallic interconnects. It is expected that, by the year 2000, the transistor channel length will be at 0.18 μm, while microprocessors will pack more than 15 million transistors over an area ~700 mm. To conserve area, interconnects will continue to be stacked at an increasing number of levels (six by the year 2000, versus four in today's leading microprocessors), and the minimum spacing and width within an interconnect layer will shrink to 0.3 μm. In addition, it is expected that future interconnects will need to sustain increasingly higher current densities without electromigration failures.Aluminum alloys are the conductors of choice in present-day interconnects, and much effort is focused on means to extend the usefulness of aluminum through improvements in reliability, either by new alloy formulations or by the development of complicated multimetal stacks. A more radical approach, which is gaining increased attention, is the replacement of aluminum altogether by copper. The bulk resistivity of copper is significantly lower than that of aluminum (1.7 μΩ cm for Cu versus 3.0 μΩ cm for Al-Cu), which is expected to translate to interconnects of higher performance because of reduction in signal propagation delay. In addition, the significantly higher melting temperature of copper (~1100°C versus ~600°C for Al-Cu alloys) and its higher atomic weight are expected to translate to improved resistance to electromigration.

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9

Ambati, Ramesh Babu. "Difference between conventional and modern methods for examination of fingerprints." Journal of Forensic Science and Research 5, no. 1 (August 10, 2021): 037–40. http://dx.doi.org/10.29328/journal.jfsr.1001025.

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Анотація:

The impression of frictional ridges of the finger is known as fingerprints. Owing to this uniqueness, the fingerprints have long been used to identify a person since Ancient times. In any crime scene the presence of fingerprint makes the identification of the Culprit very easy. The fingerprints can also easily be embedded on any item such as paper, Clothing and body of the victim. To utilize this uniqueness of fingerprints forensic experts devised many techniques to obtain a clear fingerprint. These come under two categories i.e. Conventional and modern methods. The conventional methods are although important but there are limitations of them. Just take the example of powder method. Powder method require different powders for different Surfaces and colors, but modern method like quantum dots method can easily detect Fingerprints on all surfaces regardless of their color giving great resolution in seconds. Other methods like physical developer method is very time consuming and expensive, carbon Black method creates mess and does not work on porous surface, iodine fuming and Naphthaloflavin does have an advantage that it can bring up prints on skin also but it does not Work on metallic surfaces. VMD also fails on heavy plastic polymers and body oils. But some modern methods like nanotechnology can obtain high resolution prints old and dried prints also within 3 minutes. Laser technology is very fast, accurate and can be used for Fingerprints up toten years old also on any surface without any mess. Multimetal deposition Method can even be used to identify smokers and drug addicts and can be used Porous, non-porous and wet surfaces.

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10

Kim, Mee Rahn, Dong Ki Lee, and Du-Jeon Jang. "Template-Based Electrochemically Controlled Growth of Segmented Multimetal Nanorods." Journal of Nanomaterials 2010 (2010): 1–7. http://dx.doi.org/10.1155/2010/203756.

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Анотація:

Multisegmented one-dimensional nanostructures composed of gold, copper, and nickel have been fabricated by depositing metals electrochemically in the pores of anodic aluminum oxide (AAO) templates. The electrodeposition process has been carried out using a direct current in a two-electrode electrochemical cell, where a silver-evaporated AAO membrane and a platinum plate have served as a working electrode and a counter electrode, respectively. The striped multimetal rods with an average diameter of about 300 nm have tunable lengths ranging from a few hundred nanometers to a few micrometers. The lengths and the sequence of metal segments in a striped rod can be tailored readily by controlling the durations of electrodeposition and the order of electroplating solutions, respectively.

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Більше джерел

Дисертації з теми "Multimetal Deposition"

1

Endle, James Patrick. "MOCVD of multimetal and noble metal films /." Digital version accessible at:, 2000. http://wwwlib.umi.com/cr/utexas/main.

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