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Статті в журналах з теми "Microfluidic thermal management solution"
Yan, Zhibin, Mingliang Jin, Zhengguang Li, Guofu Zhou, and Lingling Shui. "Droplet-Based Microfluidic Thermal Management Methods for High Performance Electronic Devices." Micromachines 10, no. 2 (January 25, 2019): 89. http://dx.doi.org/10.3390/mi10020089.
Повний текст джерелаMouskeftaras, Alexandros, Stephan Beurthey, Julien Cogan, Gregory Hallewell, Olivier Leroy, David Grojo, and Mathieu Perrin-Terrin. "Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device." Micromachines 12, no. 9 (August 30, 2021): 1054. http://dx.doi.org/10.3390/mi12091054.
Повний текст джерелаNovikov, A., J. Maxa, M. Nowottnick, M. Heimann, and K. Jarchoff. "Investigation of phase change materials for efficient thermal management of electronic modules." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000045–51. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000045.
Повний текст джерелаFlemming, Jeb, Roger Cook, Kevin Dunn, and James Gouker. "Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000791–810. http://dx.doi.org/10.4071/2012dpc-tp12.
Повний текст джерелаN.S., Shashikumar, Gireesha B.J., B. Mahanthesh, and Prasannakumara B.C. "Brinkman-Forchheimer flow of SWCNT and MWCNT magneto-nanoliquids in a microchannel with multiple slips and Joule heating aspects." Multidiscipline Modeling in Materials and Structures 14, no. 4 (December 3, 2018): 769–86. http://dx.doi.org/10.1108/mmms-01-2018-0005.
Повний текст джерелаBatishcheva, KSENIA A., and ATLANT E. Nurpeiis. "WATER DROPLET EVAPORATION IN A CHAMBER ISOLATED FROM THE EXTERNAL ENVIRONMENT." Tyumen State University Herald. Physical and Mathematical Modeling. Oil, Gas, Energy 6, no. 3 (2020): 8–22. http://dx.doi.org/10.21684/2411-7978-2020-6-3-8-22.
Повний текст джерелаKroehnert, Steffen, André Cardoso, Steffen Kroehnert, Raquel Pinto, Elisabete Fernandes, and Isabel Barros. "Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (January 1, 2017): 1–23. http://dx.doi.org/10.4071/2017dpc-tp2_presentation6.
Повний текст джерелаNieto, C., H. Power, and M. Giraldo. "Boundary element solution of thermal creep flow in microfluidic devices." Engineering Analysis with Boundary Elements 36, no. 7 (July 2012): 1062–73. http://dx.doi.org/10.1016/j.enganabound.2012.01.001.
Повний текст джерелаGuo, Gang, Xuanye Wu, Demeng Liu, Lingni Liao, Di Zhang, Yi Zhang, Tianjiao Mao, et al. "A Self-Regulated Microfluidic Device with Thermal Bubble Micropumps." Micromachines 13, no. 10 (September 28, 2022): 1620. http://dx.doi.org/10.3390/mi13101620.
Повний текст джерелаSisó, Gonzalo, Joana Rosell-Mirmi, Álvaro Fernández, Gerard Laguna, Montse Vilarrubi, Jérôme Barrau, Manuel Ibañez, and Joan Rosell-Urrutia. "Thermal Analysis of a MEMS-Based Self-Adaptive Microfluidic Cooling Device." Micromachines 12, no. 5 (April 30, 2021): 505. http://dx.doi.org/10.3390/mi12050505.
Повний текст джерелаДисертації з теми "Microfluidic thermal management solution"
Wang, Yong. "Microfluidic technology for integrated thermal management: micromachined synthetic jet." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/5438.
Повний текст джерелаZhu, Yangying. "Magnetic tunable microstructured surfaces for thermal management and microfluidic applications." Thesis, Massachusetts Institute of Technology, 2013. http://hdl.handle.net/1721.1/82355.
Повний текст джерелаCataloged from PDF version of thesis.
Includes bibliographical references (p. 46-47).
Micro and nanostructured surfaces have broad applications including heat transfer enhancement in phase-change systems and liquid manipulation in microfluidic devices. While significant efforts have focused on fabricating static micro/nanostructured arrays, uniform arrays that can be dynamically tuned have not yet been demonstrated. In this work, we present a novel fabrication process for magnetically tunable microstructured surfaces, where the tilt angle can be controlled upon application of an external magnetic field. We also demonstrated this platform for droplet manipulation in heat transfer applications. The tunable surfaces consist of ferromagnetic nickel (Ni) pillars on a soft PDMS substrate. The pillars have diameters of 23-35 [mu]m, pitches of 60-70 [mu]m, and heights of 70-80 [mi]m. We used vibrating sample magnetometry to obtain hysteresis loops of the Ni pillar arrays which match well the properties of bulk Ni. With a field strength of 0.5 tesla and a field angle of 600, a uniform 10.5± 1 tilt angle of the pillar arrays was observed. Furthermore, we developed a model to capture the tilt angle as a function of the magnetic field, and showed that by replacing nickel to cobalt, the tilt angle could be increased to 30' with the same field. Meanwhile, simulations show good agreement with the experiments. Future work will focus on using these surfaces to actively transport water droplets and spread the liquid film via pillar movement. This work promises tunable surface designs for important device platforms in microfluidics, biological and optical applications.
by Yangying Zhu.
S.M.
Yalcin, Fidan Seza. "Cfd Analysis Of A Notebook Computer Thermal Management Solution." Master's thesis, METU, 2008. http://etd.lib.metu.edu.tr/upload/12609483/index.pdf.
Повний текст джерелаs specifications. The different heat dissipation paths that are utilized in the design are investigated. Two active fans and aluminum heat dissipation plates as well as the heat pipe system are modeled according to their specifications. The first and second order discretization schemes as well as two different mesh densities are investigated as modeling choices. Under different operating powers, adequacy of the existing thermal management system is observed. Average and maximum temperatures of the internal components are reported in the form of tables. Thermal resistance networks for five different operating conditions are obtained from the analysis of the CFD simulation results. Temperature distributions on the top surface of the chassis where the keyboard and touchpad are located are investigated considering the user comfort.
Redmond, Matthew J. "Thermal management of 3-D stacked chips using thermoelectric and microfluidic devices." Thesis, Georgia Institute of Technology, 2013. http://hdl.handle.net/1853/50240.
Повний текст джерелаCruz, Ethan E. "Coupled inviscid-viscous solution methodology for bounded domains: Application to data center thermal management." Diss., Georgia Institute of Technology, 2015. http://hdl.handle.net/1853/54316.
Повний текст джерелаWang, Qian. "Analysing and evaluating a thermal management solution via heat pipes for lithium-ion batteries in electric vehicles." Thesis, University of Nottingham, 2015. http://eprints.nottingham.ac.uk/29358/.
Повний текст джерелаWilson, Scott E. "Investigation of Copper Foam Coldplates as a High Heat Flux Electronics Cooling Solution." Thesis, Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/6944.
Повний текст джерелаSinha, Ashish. "An adsorption based cooling solution for electronics used in thermally harsh environments." Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/37077.
Повний текст джерелаPrieto, herrera Rafael. "Développement d'une solution de répartition de la chaleur émise par les points chauds en co-intégration avec les technologies CMOS." Thesis, Université Grenoble Alpes (ComUE), 2018. http://www.theses.fr/2018GREAT113/document.
Повний текст джерелаWe witness today an explosion of nomadic technologies. Portable devices have become the main tool that people use to connect with the rest of the world. The microelectronics embedded in these devices is the technology that drives this process. The pace of development of these technologies is such that the versatility of portable devices today were science fiction only 10 years ago.The functionalities that will be integrated in the coming years cannot be imagined yet. These features will imply an increase of the computing demands, and consequently, of the heat dissipated inside them. The trend leads to complex stacks with heterogeneous modules of heat dissipating layers.These technologies will be integrated in everyday life. Internet of Things, as we call it, will demand an increasing amount of independent low footprint devices that will be connected. Heat dissipation strategies must therefore be compatible with increasingly smaller dimensions. Compact packages demand is growing rapidly, not only because of telephones and tablets, but also because of the massive introduction of electronics into in everyday life devices.The objective of the thesis is to study the integration of heat-spreaders in compact packages to enhance its thermal performance. This work goes deeply in the characterization of the thermal performance of carbon-base heat spreaders. Heat-spreaders are able to extract the heat produced in hot spots and transport it along its surface.In order to study the heat spreading phenomenon, a methodology that takes into account the multi-level nature of heat dissipation has been implemented. The objective is to be able to focus on the interaction between the heat-spreader and each one of the elements of the package stack. Two test vehicles have been re-used from previous works. A specific test vehicle was also design in order to emulate the thermal behavior of imaging sensors.The thesis is based on two main axes: Integration studies and thermal studies. The integration studies take into account the constraints derived from the implementation of heat spreaders in compact packages. Firstly, we focus on the implementation processes within an industrial process. Latelly, we study the thermomechanical effects of heat spreaders and the impact on the integrity of high frequency signals.Thermal studies are aimed to characterize the performance gain derived from this heat spreader integration. The thermal phenomena are analyzed with measurements and simulations. First at silicon and interface level, then at package level, finally we focus on the effects in image sensor die and package.In the light of the results it can be said that carbon based materials are the most interesting alternative for large-scale implementation of heat spreaders in compact packages. This implementation will be driven by the research of new functionalities and performances in compact packages. The heat spreader will have to perform while maintaining a minimal footprint. The combination of carbon layers at all package levels, along with reduced thermal interface thickness will be the trend in the coming years for this type of device.This thesis is part of a tripartite collaboration between the CEA-LETI of Grenoble, the G2Elab laboratory of the INP Grenoble and STMicroelectronics in Crolles
Narayanan, Shankar. "Gas assisted thin-film evaporation from confined spaces." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/42780.
Повний текст джерелаЧастини книг з теми "Microfluidic thermal management solution"
Zamora, William Rolando Miranda, Susana Soledad Chinchay Villarreyes, Nelly Luz Leyva Povis, Leandro Alonso Vallejos More, Manuel Jesús Sánchez Chero, Cynthia Milagros Apaza Panca, and María Verónica Seminario Morales. "A New Mathematical Solution for Packaged Food Thermal Processing." In Advances in Manufacturing, Production Management and Process Control, 383–87. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-51981-0_49.
Повний текст джерелаBanerjee, Sayan, and Koushik Ghosh. "Mixed Convection Condensation of Vapor with Non-condensable Gas Over a Vertical Plate: ODE-Based Integral Solution." In Advances in Thermal Engineering, Manufacturing, and Production Management, 101–15. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-2347-9_9.
Повний текст джерелаPradhan, Tenzing Dorjee, B. B. Pradhan, and A. P. Tiwary. "Shifting the Focus from Macro- to Micro-waste to Energy (WTE) Plants as a Solution to the Solid Waste Management." In Advances in Thermal Engineering, Manufacturing, and Production Management, 171–79. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-2347-9_14.
Повний текст джерелаBrück, Rolf, Manuel Presti+, Mathias Keck, Johannes Dengler, and Manuel Faiß. "Thermal Management on Demand; the Exhaust Aftertreatment Solution for Future Heavy Duty Application." In Proceedings, 387–99. Wiesbaden: Springer Fachmedien Wiesbaden, 2021. http://dx.doi.org/10.1007/978-3-658-35588-3_22.
Повний текст джерелаvan Erp, Remco, and Elison Matioli. "Microfluidic cooling for GaN electronic devices." In Thermal Management of Gallium Nitride Electronics, 407–39. Elsevier, 2022. http://dx.doi.org/10.1016/b978-0-12-821084-0.00013-5.
Повний текст джерелаHilgers, T. "Thermally conductive plastics: a mineral solution – Thermal management in thermoplastics and thermosets." In Plastics in Automotive Engineering 2016, 193–204. VDI Verlag, 2016. http://dx.doi.org/10.51202/9783182443438-193.
Повний текст джерелаSatapathy, Suchismita, and Jitendra Narayan Biswal. "Thermal Power Sector Sustainability." In Handbook of Research on Ergonomics and Product Design, 381–401. IGI Global, 2018. http://dx.doi.org/10.4018/978-1-5225-5234-5.ch021.
Повний текст джерелаAkgün, Mustafa. "Magnetic Nanoparticles for Environmental Management." In Green Chemistry for the Development of Eco-Friendly Products, 174–89. IGI Global, 2022. http://dx.doi.org/10.4018/978-1-7998-9851-1.ch008.
Повний текст джерелаde la Luz Mora, María, Jorge Medina, Patricia Poblete-Grant, Rolando Demanet, Paola Durán, Patricio Barra, and Cecilia Paredes. "Innovative agriculture management to foster soil organic carbon sequestration." In Understanding and fostering soil carbon sequestration, 271–302. Burleigh Dodds Science Publishing, 2022. http://dx.doi.org/10.19103/as.2022.0106.30.
Повний текст джерелаPais, Silvana, João Campos, Judit Lecina, and Adrián Regos. "Fire-smart management as nature-based solution to extreme wildfires in abandoned rural landscapes of Southern Europe." In Advances in Forest Fire Research 2022, 1634–39. Imprensa da Universidade de Coimbra, 2022. http://dx.doi.org/10.14195/978-989-26-2298-9_250.
Повний текст джерелаТези доповідей конференцій з теми "Microfluidic thermal management solution"
Tang, G. Y., C. Yang, C. J. Chai, and H. Q. Gong. "Joule Heating Induced Thermal and Hydrodynamic Development in Microfluidic Electroosmotic Flow." In ASME 2004 2nd International Conference on Microchannels and Minichannels. ASMEDC, 2004. http://dx.doi.org/10.1115/icmm2004-2442.
Повний текст джерелаPaik, Phil, Vamsee K. Pamula, and Krishnendu Chakrabarty. "Adaptive Hot-Spot Cooling of Integrated Circuits Using Digital Microfluidics." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-81081.
Повний текст джерелаWang, Tao, Lu Lv, JieJun Wang, Jian He, Qiuyan Li, Chuangui Wu, Wenbo Luo, Yao Shuai, and Wanli Zhang. "Applications of Microfluidic Devices for Electronics Thermal Management." In 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). IEEE, 2018. http://dx.doi.org/10.1109/nems.2018.8557010.
Повний текст джерелаWang, Evelyn N., Rong Xiao, and Kuang-Han Chu. "Nanoengineered surfaces for microfluidic-based thermal management devices." In MOEMS-MEMS, edited by Richard C. Kullberg and Rajeshuni Ramesham. SPIE, 2010. http://dx.doi.org/10.1117/12.842950.
Повний текст джерелаLaguna, Gerard, Manel Ibanez, Joan Rosell, Montse Vilarrubi, Amrid Amnache, Etienne Leveille, Rajesh Pandiyan, Luc G. Frechette, and Jerome Barrau. "Experimental Validation of a Smart Microfluidic Cell Cooling Solution." In 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2020. http://dx.doi.org/10.1109/itherm45881.2020.9190618.
Повний текст джерелаTigner, Julaunica, and Tamara Floyd-Smith. "Feasibility Assessment of the Integration of Microfluidics and NEPCM for Cooling Microelectronics Systems." In ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/mnhmt2012-75107.
Повний текст джерелаPanepinto, D., and G. Genon. "Wastewater sewage sludge: the thermal treatment solution." In WASTE MANAGEMENT 2014. Southampton, UK: WIT Press, 2014. http://dx.doi.org/10.2495/wm140171.
Повний текст джерелаBar-Cohen, Avram, Joseph J. Maurer, and Abirami Sivananthan. "Near-junction microfluidic thermal management of RF power amplifiers." In 2015 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS). IEEE, 2015. http://dx.doi.org/10.1109/comcas.2015.7360498.
Повний текст джерелаDong Liu and Suresh V. Garimella. "Microfluidic pumping based on dielectrophoresis for thermal management of microelectronics." In 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM). IEEE, 2008. http://dx.doi.org/10.1109/itherm.2008.4544315.
Повний текст джерелаLohani, Bhushan, and Robert C. Roberts. "Metal Additive Microfabricated Microfluidic Packages for Integrated Thermal Management In Power Application." In 2022 21st International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS). IEEE, 2022. http://dx.doi.org/10.1109/powermems56853.2022.10007076.
Повний текст джерелаЗвіти організацій з теми "Microfluidic thermal management solution"
Ng, K. K. Airborne Sensor Thermal Management Solution. Office of Scientific and Technical Information (OSTI), June 2015. http://dx.doi.org/10.2172/1251091.
Повний текст джерела