Книги з теми "Microelectronic devices"

Yang, Edward S. Microelectronic devices. New York: McGraw-Hill, 1988.

Yang, Edward S. Microelectronic devices. New York: McGraw-Hill, 1988.

Microelectronic devices. 2nd ed. London: Imperial College Press, 1997.

Leaver, K. D. Microelectronic devices. Harlow, Essex, England: Longman Scientific & Technical, 1989.

Fonstad, Clifton G. Microelectronic devices and circuits. New York: McGraw-Hill, 1994.

Microelectronic circuits and devices. 2nd ed. London: Prentice Hall International, 1996.

Fonstad, Clifton. Microelectronic devices and circuits. Maidenhead: McGraw-Hill, 1994.

Microelectronic circuits and devices. 2nd ed. Englewood Cliffs, N.J: Prentice Hall, 1996.

1956-, Tarr N. Garry, ed. Introduction to microelectronic devices. Englewood Cliffs, N.J: Prentice Hall, 1989.

Pulfrey, David L. Introduction to microelectronic devices. Englewood Cliffs, N.J: Prentice-Hall International, 1989.

Horenstein, Mark N. Microelectronic circuits and devices. Englewood Cliffs, N.J: Prentice Hall, 1990.

Arunachalam, V., and K. Sivasankaran, eds. Microelectronic Devices, Circuits and Systems. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-5048-2.

Manzione, Louis T. Plastic packaging of microelectronic devices. New York: Van Nostrand Reinhold, 1990.

Arunachalam, V., and K. Sivasankaran, eds. Microelectronic Devices, Circuits and Systems. Cham: Springer Nature Switzerland, 2022. http://dx.doi.org/10.1007/978-3-031-23973-1.

Burrows, Susan Elizabeth. Silicone encapsulants for microelectronic devices. [s.l.]: typescript, 1995.

M, Grasserbauer, and Werner H. W, eds. Analysis of Microelectronic Materials and Devices. Chichester: Wiley, 1994.

1945-, Grasserbauer M., and Werner H. W, eds. Analysis of microelectronic materials and devices. Chichester: Wiley, 1991.

Fleetwood, Daniel. Defects in microelectronic materials and devices. Boca Raton, FL: CRC Press, 2008.

C, Ling Hung, Niwa Koichi, Shukla Vishwa N, International Symposium on Materials for Optoelectronic and Microelectronic Packaging (1992 : San Francisco, Calif.), and International Ceramic Science and Technology Congress (3rd : 1992 : San Francisco, Calif.), eds. Materials in microelectronic and optoelectronic packaging. Westerville, Ohio: American Ceramic Society, 1993.

Reliability of electronic packages and semiconductor devices. New York: McGraw-Hill, 1997.

B, Courtois, and Centre national de la recherche scientifique (France), eds. Design, test, integration, and packaging of MEMS/MOEMS 2002: 6-8 May, 2002, Cannes, France. Bellingham, Wash: SPIE, 2002.

Qin-Yi, Tong, Goesele Ulrich M, Society of Photo-optical Instrumentation Engineers., Dong nan da xue, China Optics & Optoelectronic Manufacturers Association., Zhongguo dian zi xue hui (Jiangsu Sheng, China), and Laser and Optical Engineering Society (Jiangsu Sheng, China), eds. Advances in microelectronic device technology: 7-9 November 2001, Nanjing, China. Bellingham, Wash: SPIE, 2001.

1939-, Lee S. H., ed. Selected papers on optical interconnects and packaging. Bellingham, Wash: SPIE Optical Engineering Press, 1997.

K, Das Nirod, Bertoni Henry L, and International Symposium on Directions for the Next Generation of MMIC Devices and Systems (1996 : Brooklyn, New York, N.Y.), eds. Directions for the next generation of MMIC devices and systems. New York: Plenum Press, 1997.

G, Sabnis Anant, and Society of Photo-optical Instrumentation Engineers., eds. Manufacturing process control for microelectronic devices and circuits: 20-21 October 1994, Austin, Texas. Bellingham, Wash: SPIE, 1994.

Fachtagung Schichtsysteme für Zukünftige Bauelemente der Mikro-, Opto-, Bioelektronik und Optik (2nd 1989? Technische Universität Karl-Marx-Stadt). 2. Fachtagung Schichtsysteme für Zukünftige Bauelemente der Mikro-, Opto-, Bioelektronik und Optik. Karl-Marx-Stadt: Technische Universität Karl-Marx-Stadt, 1989.

Wolfram, Scharff, and Technische Universität Karl-Marx-Stadt, eds. Schichtsysteme für zukünftige Bauelemente der Mikro-, Opto- und Molekularelektronik: 1. Fachtagung, November 1986. Karl-Marx-Stadt: Technische Universität Karl-Marx-Stadt, 1987.

R, Feldman Michael, and Society of Photo-optical Instrumentation Engineers., eds. Optoelectronic interconnects VII ; Photonics packaging and integration II: 24-26 January, 2000, San Jose, California. Bellingham, Washington: SPIE, 2000.

Conference on Optoelectronic and Microelectronic Materials and Devices (2000 Melbourne, Australia). COMMAD 2000: Conference on Optoelectronic and Microelectronic Materials and Devices : proceedings : Melbourne, Australia, 6-8 December, 2000. Edited by Broekman Leonard D, Usher Brian F, Riley John D, and Institute of Electrical and Electronics Engineers. Piscataway, N.J: IEEE, 2000.

Conference on Optoelectronic and Microelectronic Materials and Devices (1998 Perth, Australia). 1998 Conference on Optoelectronic and Microelectronic Materials and Devices: Proceedings, 14-16 December 1998, Microelectronics Research Group, Department of Electrical and Electronic Engineering, The University of Western Australia, Perth, Western Australia. Edited by Faraone Lorenzo and Institute of Electrical and Electronics Engineers. [New York]: Institute of Electrical and Electronic Engineers, 1999.

Conference on Optoelectronic and Microelectronic Materials and Devices (1996 Canberra, Australia). 1996 Conference on Optoelectronic and Microelectronic Materials and Devices: Proceedings, 8-11 December 1996, Australian National University, Canberra, Australia. Edited by Jagadish C and Institute of Electrical and Electronics Engineers. New York: Institute of Electrical and Electronic Engineers, 1996.

MEMS/MOEMS packaging: Concepts, designs, metarials, and processes. New York: McGraw-Hill, 2005.

Keren, Bergman, Centre national de la recherche scientifique (France), and Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (5th : 2003 : Cannes, France), eds. Design, test, integration and packaging of MEMS/MOEMS 2003: DTIP 2003 : 5-7 May, 2003, Cannes, France. Piscataway, N.J: IEEE, 2003.

B, Courtois, and Centre national de la recherche scientifique (France), eds. Design, test, integration and packaging of MEMS/MOEMS 2001: 25-27 April 2001, Cannes, France. Bellingham, Washington: SPIE, 2001.

E, Bailey Wayne, Motamedi M. Edward, Luo Fang-Chen, Semiconductor Equipment and Materials International., National Institute of Standards and Technology (U.S.), and Society of Photo-optical Instrumentation Engineers., eds. Microelectronic structures and microelectromechanical devices for optical processing and multimedia applications: 24 October, 1995, Austin, Texas. Bellingham, Wash: SPIE, 1995.

I, Baturone, ed. Microelectronic design of fuzzy logic-based systems. Boca Raton: CRC, 2000.

1950-, Mickelson Alan Rolf, Basavanhally N. R, and Lee Yung-Cheng, eds. Optoelectronic packaging. New York: Wiley, 1997.

Wei mi na mi qi jian feng zhuang ji shu: Micro-Nanometer Devices Packaging Technology. Beijing: Guo fang gong ye chu ban she, 2012.

S, Mathad G., Nguyen Du B, Electrochemical Society. Dielectric Science and Technology Division., and Electrochemical Society Electronics Division, eds. Proceedings of the symposia on reliability of semiconductor devices/interconnections and dielectric breakdown, and laser process for microelectronic applications. Pennington, NJ: Electrochemical Society, 1992.

Xuping, Zhang, Zhongguo yi qi yi biao xue hui, and SPIE (Society), eds. Microelectronic and optoelectronic devices and integration: 2008 International Conference on Optical Instruments and Technology : 16-19 November 2008, Beijing, China. Bellingham, Wash: SPIE, 2009.

R, Feldman Michael, Grote James Gerard 1955-, Hibbs-Brenner Mary K, Society of Photo-optical Instrumentation Engineers., and United States. Defense Advanced Research Projects Agency., eds. Optoelectronic integrated circuits and packaging III: 28-29 January, 1999, San Jose, California. Bellingham, Washington: SPIE, 1999.

T, Chen Ray, Hinton H. Scott, and Society of Photo-optical Instrumentation Engineers., eds. Optoelectronic interconnects III: 8-9 February 1995, San Jose, California. Bellingham, Wash., USA: SPIE, 1995.

T, Chen Ray, Guilfoyle Peter S, Society of Photo-optical Instrumentation Engineers., and United States. Defense Advanced Research Projects Agency., eds. Optoelectronic interconnects and packaging IV: 12-14 February, 1997, San Jose, California. Bellingham, Washington: SPIE, 1997.

J, Dubowski J., and Society of Photo-optical Instrumentation Engineers., eds. Laser applications in microelectronic and optoelectronic manufacturing II: 10-12 February, 1997, San Jose, California. Bellingham, Washington: SPIE, 1997.

Pham, Anh-Vu H., Morgan J. Chen, and Kunia Aihara. LCP for microwave packages and modules. Cambridge: Cambridge University Press, 2012.

Glebov, A. L. Photonics packaging, integration, and interconnects IX: 26-28 January 2009, San Jose, California, United States. Edited by SPIE (Society). Bellingham, Wash: SPIE, 2009.

Glebov, Alexei L. Photonics packaging, integration, and interconnects VIII: 22-24 January 2008, San Jose, California, USA. Edited by Society of Photo-optical Instrumentation Engineers. Bellingham, Wash: SPIE, 2008.

Leaver, Keith. Microelectronic Devices. PUBLISHED BY IMPERIAL COLLEGE PRESS AND DISTRIBUTED BY WORLD SCIENTIFIC PUBLISHING CO., 1997. http://dx.doi.org/10.1142/p011.

Nagchoudhuri, D. Microelectronic Devices. Prentice-Hall, 2002.

Leaver, Keith. Microelectronic Devices. Allied Publishers Pvt. Ltd., 2003.