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Автор: Grafiati

Опубліковано: 10 грудня 2022

Оновлено: 28 січня 2023

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1

Liepmann, Dorian, Albert P. Pisano, and Burton Sage. "Microelectromechanical Systems Technology to Deliver Insulin." Diabetes Technology & Therapeutics 1, no. 4 (December 1999): 469–76. http://dx.doi.org/10.1089/152091599317026.

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2

Lucyszyn, S. "Review of radio frequency microelectromechanical systems technology." IEE Proceedings - Science, Measurement and Technology 151, no. 2 (March 1, 2004): 93–103. http://dx.doi.org/10.1049/ip-smt:20040405.

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3

Liu, A. Q., X. M. Zhang, H. Cai, D. Y. Tang, and C. Lu. "Miniaturized injection-locked laser using microelectromechanical systems technology." Applied Physics Letters 87, no. 10 (September 5, 2005): 101101. http://dx.doi.org/10.1063/1.2035321.

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4

Zhang, X. M., A. Q. Liu, D. Y. Tang, and C. Lu. "Discrete wavelength tunable laser using microelectromechanical systems technology." Applied Physics Letters 84, no. 3 (January 19, 2004): 329–31. http://dx.doi.org/10.1063/1.1639130.

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5

Yokoyama, Yoshisato, Takashi Fukushige, Seiichi Hata, Kazuya Masu, and Akira Shimokohbe. "On-Chip Variable Inductor Using Microelectromechanical Systems Technology." Japanese Journal of Applied Physics 42, Part 1, No. 4B (April 30, 2003): 2190–92. http://dx.doi.org/10.1143/jjap.42.2190.

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6

Bishop, David, Arthur Heuer, and David Williams. "Microelectro-mechanical Systems: Technology and Applications." MRS Bulletin 26, no. 4 (April 2001): 282–88. http://dx.doi.org/10.1557/mrs2001.60.

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Анотація:

Microelectromechanical systems, or MEMS, constitute a group of microdevices that are just beginning to affect many areas of science and technology. In diverse fields including the automotive industry, aeronautics, cellular communications, chemistry, acoustics, and display technologies and other photonic systems, these highly functional devices are making a big name for themselves, despite their diminutive size.

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7

Korikov, A. M., and Y. E. Meshcheryakov. "Orientation of mining technology machines based on microelectromechanical systems." Proceedings of Tomsk State University of Control Systems and Radioelectronics 21, no. 4 (2018): 92–97. http://dx.doi.org/10.21293/1818-0442-2018-21-4-92-97.

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8

Chircov, Cristina, and Alexandru Mihai Grumezescu. "Microelectromechanical Systems (MEMS) for Biomedical Applications." Micromachines 13, no. 2 (January 22, 2022): 164. http://dx.doi.org/10.3390/mi13020164.

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Анотація:

The significant advancements within the electronics miniaturization field have shifted the scientific interest towards a new class of precision devices, namely microelectromechanical systems (MEMS). Specifically, MEMS refers to microscaled precision devices generally produced through micromachining techniques that combine mechanical and electrical components for fulfilling tasks normally carried out by macroscopic systems. Although their presence is found throughout all the aspects of daily life, recent years have witnessed countless research works involving the application of MEMS within the biomedical field, especially in drug synthesis and delivery, microsurgery, microtherapy, diagnostics and prevention, artificial organs, genome synthesis and sequencing, and cell manipulation and characterization. Their tremendous potential resides in the advantages offered by their reduced size, including ease of integration, lightweight, low power consumption, high resonance frequency, the possibility of integration with electrical or electronic circuits, reduced fabrication costs due to high mass production, and high accuracy, sensitivity, and throughput. In this context, this paper aims to provide an overview of MEMS technology by describing the main materials and fabrication techniques for manufacturing purposes and their most common biomedical applications, which have evolved in the past years.

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9

Choe, Howard C., and Emel S. Bulat. "Systems and methods for sensing an acoustic signal using microelectromechanical systems technology." Journal of the Acoustical Society of America 118, no. 1 (2005): 25. http://dx.doi.org/10.1121/1.1999410.

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10

Kota, S., G. K. Ananthasuresh, S. B. Crary, and K. D. Wise. "Design and Fabrication of Microelectromechanical Systems." Journal of Mechanical Design 116, no. 4 (December 1, 1994): 1081–88. http://dx.doi.org/10.1115/1.2919490.

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Анотація:

An attempt has been made to summarize some of the important developments in the emerging technology of microelectromechanical systems (MEMS) from the mechanical engineering perspective. In the micro domain, design and fabrication issues are very much different from those of the macro world. The reason for this is twofold. First, the limitations of the micromachining techniques give way to new exigencies that are nonexistent in the macromachinery. One such difficulty is the virtual loss of the third dimension, since most of the microstructures are fabricated by integrated circuit based micromachining techniques that are predominantly planar. Second, the batch-produced micro structures that require no further assembly, offer significant economical advantage over their macro counterparts. Furthermore, electronic circuits and sensors can be integrated with micromechanical structures. In order to best utilize these features, it becomes necessary to establish new concepts for the design of MEMS. Alternate physical forms of the conventional joints are considered to improve the manufacturability of micromechanisms and the idea of using compliant mechanisms for micromechanical applications is put forth. The paper also reviews some of the fabrication techniques and the micromechanical devices that have already been made. In particular, it discusses the fabrication of a motor-driven four-bar linkage using the “boron-doped bulk-silicon dissolved-wafer process” developed at The University of Michigan’s Center for Integrated Sensors and Circuits.

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11

Latif, Rhonira, Enrico Mastropaolo, Andy Bunting, Rebecca Cheung, Thomas Koickal, Alister Hamilton, Michael Newton, and Leslie Smith. "Microelectromechanical systems for biomimetical applications." Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 28, no. 6 (November 2010): C6N1—C6N6. http://dx.doi.org/10.1116/1.3504892.

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12

Baghelani, Masoud, Ahmad Hosseini-Sianaki, Zeinab Behzadi, and Arash Mirabdolah Lavasani. "Simulation of capacitive pressure sensor based on microelectromechanical systems technology." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 232, no. 9 (April 27, 2017): 1538–46. http://dx.doi.org/10.1177/0954406217706095.

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Анотація:

This paper proposes a very high sensitivity pressure sensor with a novel technique for temperature compensation. The proposed technique employs a geometrical method for self-compensation of Young’s modulus reduction due to temperature increase, where a stronger spring with much larger length and width is anchored. According to the connection of the suspension spring to the larger spring, in higher temperatures, the large spring experiences more length increase, which in turn increases the stiffness of the suspension spring and, consequently, could compensates the Young’s modulus reduction. Simulation results verify that the temperature variation related error in the compensated sensor is less than 0.66% of full-scale under 260 ℃ of temperature range, which shows considerable improvement in comparison with literature. The total consumed area is about 0.033 mm2 with the sensitivity of 290 × 10−6 K−1.

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13

Elders, Job, Vincent Spiering, and Steve Walsh. "Microsystems Technology (MST) and MEMS Applications: An Overview." MRS Bulletin 26, no. 4 (April 2001): 312–15. http://dx.doi.org/10.1557/mrs2001.69.

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Анотація:

Microelectromechanical systems (MEMS), microsystems technology (MST), and micromachines are roughly synonymous terms applied in the United States, Europe, and Japan, respectively, for manufacturing technologies that are enabling miniaturization and the development of useful products.

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14

SHAKHER, SARDER SHAMIR, and KWADWO OSEI BONSU. "OPTIMIZATION OF THE MICROELECTROMECHANICAL PROPERTIES OF HEAT EXCHANGE SYSTEMS THROUGH MICROCHANNEL TECHNOLOGY." Journal of Engineering Studies and Research 27, no. 1 (June 8, 2021): 120–31. http://dx.doi.org/10.29081/jesr.v27i1.261.

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Abstract: Performance of microchannel heat exchangers is highly dependent on their geometry and shape. Hence, the structural design is as equally important as the material components. This paper expounds the development and applications of microchannel technology thereby proposing an optimal applicability on the microelectromechanical properties of heat exchange systems.

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15

Zhenhai Chen and R. C. Luo. "Design and implementation of capacitive proximity sensor using microelectromechanical systems technology." IEEE Transactions on Industrial Electronics 45, no. 6 (1998): 886–94. http://dx.doi.org/10.1109/41.735332.

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16

Kim, Steven, and Shuvo Roy. "Microelectromechanical Systems and Nephrology: The Next Frontier in Renal Replacement Technology." Advances in Chronic Kidney Disease 20, no. 6 (November 2013): 516–35. http://dx.doi.org/10.1053/j.ackd.2013.08.006.

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17

Marom, Dan M. "Enabling Devices Using MicroElectroMechanical System (MEMS) Technology for Optical Networking." Advances in Science and Technology 55 (September 2008): 145–49. http://dx.doi.org/10.4028/www.scientific.net/ast.55.145.

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Abstract: Optical communication systems are the premier conduit for providing broadband data across continents, nations, cities, neighborhoods, and are now starting to penetrate into private homes. This spectacular achievement is the culmination of years of research and development efforts in diverse fields. Recently we are witnessing the evolution of these communication systems towards optical networking. The advent of optical networking has been enabled by a suite of complementary optical subsystems that are pivotal to the operation and management of these networks. These optical microsystems directly interact with the optical signal and-through functionality afforded by design-are able to filter, switch, attenuate, and adapt the optical communication channels carried by the network. In this talk I will review a sampling of these enabling devices and focus on the MEMS technology required for its implementation.

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18

Baltiysky, S., I. Gurov, S. De Nicola, P. Ferraro, A. Finizio, and G. Coppola. "Characterization of microelectromechanical systems by digital holography method." Imaging Science Journal 54, no. 2 (June 2006): 103–10. http://dx.doi.org/10.1179/174313106x98746.

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19

Lysenko, Igor, Alexey Tkachenko, Elena Sherova, and Alexander Nikitin. "Analytical Approach in the Development of RF MEMS Switches." Electronics 7, no. 12 (December 10, 2018): 415. http://dx.doi.org/10.3390/electronics7120415.

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Анотація:

Currently, the technology of microelectromechanical systems is widely used in the development of high-frequency and ultrahigh-frequency devices. The most important requirements for modern and advanced devices of the ultra-high-frequency range are the reduction of weight and size characteristics, power consumption with an increase in their functionality, operating frequency and level of integration. Radio frequency microelectromechanical switches are developed using the technology of the manufacture of CMOS-integrated circuits. Integrated radio frequency control circuits require low control voltages, the high ratio of losses to the isolation in the open and closed condition, high performance and reliability. This review is devoted to the analytical approach based on the knowledge of materials, basic performance indices and mechanisms of failure, which can be used in the development of radio-frequency microelectromechanical switches.

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20

Komvopoulos, K., and W. Yan. "A Fractal Analysis of Stiction in Microelectromechanical Systems." Journal of Tribology 119, no. 3 (July 1, 1997): 391–400. http://dx.doi.org/10.1115/1.2833500.

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The strong adherence (stiction) of adjacent surfaces is a major design concern in microelectromechanical systems (MEMS). Advances in micromachine technology greatly depend on basic understanding of microscale stiction phenomena. An analysis of the different stiction micromechanisms and the elastic deformation of asperities at MEMS interfaces is developed using a two-dimensional fractal description of the surface topography. The fractal contact model is scale independent since it is based on parameters invariant of the sample area size and resolution of measuring instrument. The influence of surface roughness, relative humidity, applied voltage, and material properties on the contributions of the van der Waals, electrostatic, and capillary forces to the total stiction force is analyzed in light of simulation results. It is shown that the effects of surface roughness and applied voltage on the maximum stiction force are significantly more pronounced than that of material properties. Results for the critical pull-off stiffness versus surface roughness are presented for different material properties and microstructure stand-free surface spacings. The present analysis can be used to determine the minimum stiffness of microdevices required to prevent stiction in terms of surface roughness, apparent contact area, relative humidity, applied voltage, and material properties.

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21

Zou, Ting, and Jorge Angeles. "Structural and instrumentation design of a microelectromechanical systems biaxial accelerometer." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 228, no. 13 (January 7, 2014): 2440–55. http://dx.doi.org/10.1177/0954406213518745.

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Microscale biaxial accelerometers are required to be sensitive to applied accelerations and manufacturable by means of microelectromechanical systems technology. In order to meet these requirements, a compliant realization of biaxial accelerometers, dubbed simplicial biaxial accelerometers, has been proposed, as reported in this paper. Notched joints, to realize what is termed Π-joints in the parallel-robots literature, are employed and then improved by the introduction of Lamé-shaped hinges serving as flexible joints. The sensitivity of the simplicial biaxial accelerometers in estimating accelerations is investigated and validated by means of finite element analysis. The sensing system is embedded in the simplicial biaxial accelerometers, with piezoresistive sensing technology adopted in the instrumentation design. Using the principles of piezoresistive sensing, the electronic layout is developed for the accelerometer. Through the piezoresistive analysis implemented on the finite element model of the simplicial biaxial accelerometers, the matrix that maps voltage signals into acceleration signals is derived. By virtue of both the structural and electronic designs, the accelerometer is observed to be sensitive to accelerations in its plane, but fairly insensitive to accelerations in any of the other four directions of the rigid-body motion. Finally, prototypes were fabricated with microelectromechanical systems technology to test the microfabrication feasibility of the structure and measurement system of the accelerometer. Test results are the subject of a forthcoming paper.

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22

Huang, Hai Qing, Wei Min Li, and Wen Yi Ren. "Next-Generation ROADM Architecture and Technologies." Advanced Materials Research 760-762 (September 2013): 50–53. http://dx.doi.org/10.4028/www.scientific.net/amr.760-762.50.

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The main architecture of the next generation ROADM has its "colorless"," Directionless" and "Contentionless" characteristics. The Wavelength Selective Switch (WSS) module technology includes the microelectromechanical-systems (MEMs), Planar lightwave circuit (PLC) and liquid crystal on silicon (LCOS) based technology.

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23

Lysenko, Igor, Alexey Tkachenko, Olga Ezhova, Boris Konoplev, Eugeny Ryndin, and Elena Sherova. "The Mechanical Effects Influencing on the Design of RF MEMS Switches." Electronics 9, no. 2 (January 22, 2020): 207. http://dx.doi.org/10.3390/electronics9020207.

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Анотація:

Radio-frequency switches manufactured by microelectromechanical systems technology are now widely used in aerospace systems and other mobile installations for various purposes. In these operating conditions, these devices are often exposed to intense mechanical environmental influences that have a strong impact on their operation. These negative effects can lead to unwanted short-circuit or open-circuit in the radio-frequency transmission line or to irreversible damage to structural elements. Such a violation in the operation of radio-frequency microelectromechanical switches leads to errors and improper functioning of the electronic equipment in which they are integrated. Thus, this review is devoted to the analysis of the origin of these negative intense mechanical effects of the environment, their classification, and analysis, as well as a review of methods to reduce or prevent their negative impact on the design of radio-frequency microelectromechanical switches.

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24

Allerdissen, Merle, Rinaldo Greiner, and Andreas Richter. "Microfluidic Microchemomechanical Systems." Advances in Science and Technology 81 (September 2012): 84–89. http://dx.doi.org/10.4028/www.scientific.net/ast.81.84.

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Анотація:

The lab-on-a-chip (LOC) technology was expected to influence our every day live in a similarly fundamental way as integrated circuits have. Unfortunately, this demand has not been met yet. The cause therefore lies in the complexity of microelectromechanical systems (MEMS), which form the base of the current LOC technology. We present a new concept of LOC which are based on fluidic microchemomechanical systems (μCMS). During the fabrication process, these μCMS are preprogrammed by monolithic integration of special active components. These active components are holding chemical energy that can be transformed at least once into mechanical energy and thus provide a timed and quantitative exactly defined fluidic function. With our simple and inexpensive fabrication method combined with the above mentioned advantages of the invented μCMS, new and better LOC technology can be developed.

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25

Woods, R. C., and A. L. Powell. "The impact of III-V semiconductors on microelectromechanical systems." Engineering Science & Education Journal 3, no. 6 (December 1, 1994): 271–75. http://dx.doi.org/10.1049/esej:19940607.

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26

Li, J.-B., K. Jiang, and G. J. Davies. "Novel die-sinking micro-electro discharge machining process using microelectromechanical systems technology." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 220, no. 9 (September 1, 2006): 1481–87. http://dx.doi.org/10.1243/09544062jmes323ft.

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Анотація:

A novel die-sinking micro-electro discharge machining (EDM) process is presented for volume fabrication of metallic microcomponents. In the process, a high-precision silicon electrode is fabricated using deep reactive ion etching (DRIE) process of microelectromechanical systems (MEMS) technology and then coated with a thin layer of copper to increase the conductivity. The metalized Si electrode is used in the EDM process to manufacture metallic microcomponents by imprinting the electrode onto a flat metallic surface. The two main advantages of this process are that it enables the fabrication of metallic microdevices and reduces manufacturing cost and time. The development of the new EDM process is described. A silicon component was produced using the Surface Technology Systems plasma etcher and the DRIE process. Such components can be manufactured with a precision in nanometres. The minimum feature of the component is 50 μm. In the experiments, the Si component was coated with copper and then used as the electrode on an EDM machine of 1 μm resolution. In the manufacturing process, 130 V and 0.2 A currents were used for a period of 5 min. The SEM images of the resulting device show clear etched areas, and the electric discharge wave chart indicates a good fabrication condition. The experimental results have been analysed and the new micro-EDM process is found to be able to fabricate 25 μm features.

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27

Darrow, Margaret M., and David D. Jensen. "Cold Region Applications for In-Place Inclinometers Based on Microelectromechanical Systems Technology." Transportation Research Record: Journal of the Transportation Research Board 2433, no. 1 (January 2014): 1–9. http://dx.doi.org/10.3141/2433-01.

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28

Kwon, Hyouk, Sun-Ho Kim, Youngjoo Yee, Jong-Min Ha, Sang-Cheon Kim, Ki-Chang Song, Ki-Young Um, Hyo-Jin Nam, Young-Chang Joo, and Jong-Uk Bu. "Micro-Optical Fiber Coupler on Silicon Bench Based on Microelectromechanical Systems Technology." Japanese Journal of Applied Physics 46, no. 8B (August 23, 2007): 5473–77. http://dx.doi.org/10.1143/jjap.46.5473.

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29

Kumar, Sanjay, Pulak Bhushan, Mohit Pandey, and Shantanu Bhattacharya. "Additive manufacturing as an emerging technology for fabrication of microelectromechanical systems (MEMS)." Journal of Micromanufacturing 2, no. 2 (June 17, 2019): 175–97. http://dx.doi.org/10.1177/2516598419843688.

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Анотація:

The recent success of additive manufacturing processes (also called, 3D printing) in the manufacturing sector has led to a shift in the focus from simple prototyping to real production-grade technology. The enhanced capabilities of 3D printing processes to build intricate geometric shapes with high precision and resolution have led to their increased use in fabrication of microelectromechanical systems (MEMS). The 3D printing technology has offered tremendous flexibility to users for fabricating custom-built components. Over the past few decades, different types of 3D printing technologies have been developed. This article provides a comprehensive review of the recent developments and significant achievements in most widely used 3D printing technologies for MEMS fabrication, their working methodology, advantages, limitations, and potential applications. Furthermore, some of the emerging hybrid 3D printing technologies are discussed, and the current challenges associated with the 3D printing processes are addressed. Finally, future directions for process improvements in 3D printing techniques are presented.

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30

Shen, Bin, Hongquan Zhang, Xinlei Liu, Shengwu Cao, and Peiqing Yang. "Fabrication and Characterizations of Catalytic Methane Sensor Based on Microelectromechanical Systems Technology." Journal of Nanoelectronics and Optoelectronics 13, no. 12 (December 12, 2018): 1816–22. http://dx.doi.org/10.1166/jno.2018.2435.

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31

Schirosi, V., G. Del Re, L. Ferrari, P. Caliandro, L. Rizzi, and G. Melone. "A Novel Manufacturing Technology for RF MEMS Devices on Ceramic Substrates." Journal of Sensors 2010 (2010): 1–6. http://dx.doi.org/10.1155/2010/625325.

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Анотація:

Microelectromechanical systems are often used for their enormous capability and good qualities in T/R modules especially for space modular applications. High isolation and very low insertion loss are guaranteed by their intrinsic working principle. This is a very robust, flexible, and low-cost technology, and it provides high reliability, good reproducibility, and complete fulfillment of technical requirements.

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32

Kahn, H., A. H. Heuer, and R. Ballarini. "On-Chip Testing of Mechanical Properties of MEMS Devices." MRS Bulletin 26, no. 4 (April 2001): 300–301. http://dx.doi.org/10.1557/mrs2001.64.

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Анотація:

The field of microelectromechanical systems (MEMS) involves the interaction of the physical environment with electrical signals through the use of microbatchfabricated devices. MEMS is a growing technology, and commercial MEMS products are becoming commonplace.

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33

Haghighi, F., Z. Talebpour, and A. Sanati-Nezhad. "Through the years with on-a-chip gas chromatography: a review." Lab on a Chip 15, no. 12 (2015): 2559–75. http://dx.doi.org/10.1039/c5lc00283d.

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Анотація:

In recent years, the need for measurement and detection of samples in situ or with very small volume and low concentration (low and sub-parts per billion) is a cause for miniaturizing systems via microelectromechanical system (MEMS) technology.

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34

Droogendijk, H., R. A. Brookhuis, M. J. de Boer, R. G. P. Sanders, and G. J. M. Krijnen. "Towards a biomimetic gyroscope inspired by the fly's haltere using microelectromechanical systems technology." Journal of The Royal Society Interface 11, no. 99 (October 6, 2014): 20140573. http://dx.doi.org/10.1098/rsif.2014.0573.

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Анотація:

Flies use so-called halteres to sense body rotation based on Coriolis forces for supporting equilibrium reflexes. Inspired by these halteres, a biomimetic gimbal-suspended gyroscope has been developed using microelectromechanical systems (MEMS) technology. Design rules for this type of gyroscope are derived, in which the haltere-inspired MEMS gyroscope is geared towards a large measurement bandwidth and a fast response, rather than towards a high responsivity. Measurements for the biomimetic gyroscope indicate a (drive mode) resonance frequency of about 550 Hz and a damping ratio of 0.9. Further, the theoretical performance of the fly's gyroscopic system and the developed MEMS haltere-based gyroscope is assessed and the potential of this MEMS gyroscope is discussed.

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35

Hornbeck, Larry J. "The DMDTM Projection Display Chip: A MEMS-Based Technology." MRS Bulletin 26, no. 4 (April 2001): 325–27. http://dx.doi.org/10.1557/mrs2001.72.

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The possibility of an all-digital (sourceto-eye) projection display was realized in 1987 with the invention of the Digital Micromirror Device™ projection display chip at Texas Instruments (TI). The DMD™ chip is a microelectromechanical systems (MEMS) array of fast digital micromirrors, monolithically integrated onto and controlled by an underlying silicon memory chip. Digital Light Processing™ projection displays are based on the DMD chip. DLP™ projection displays present bright, seamless images to the eye that have high image fidelity, and stability.

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36

Lee, Changho, Jin Kim, and Chulhong Kim. "Recent Progress on Photoacoustic Imaging Enhanced with Microelectromechanical Systems (MEMS) Technologies." Micromachines 9, no. 11 (November 8, 2018): 584. http://dx.doi.org/10.3390/mi9110584.

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Photoacoustic imaging (PAI) is a new biomedical imaging technology currently in the spotlight providing a hybrid contrast mechanism and excellent spatial resolution in the biological tissues. It has been extensively studied for preclinical and clinical applications taking advantage of its ability to provide anatomical and functional information of live bodies noninvasively. Recently, microelectromechanical systems (MEMS) technologies, particularly actuators and sensors, have contributed to improving the PAI system performance, further expanding the research fields. This review introduces cutting-edge MEMS technologies for PAI and summarizes the recent advances of scanning mirrors and detectors in MEMS.

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37

Tu, Wei-Hsiang, Wen-Chang Chu, Chih-Kung Lee, Pei-Zen Chang, and Yuh-Chung Hu. "Effects of etching holes on complementary metal oxide semiconductor–microelectromechanical systems capacitive structure." Journal of Intelligent Material Systems and Structures 24, no. 3 (June 11, 2012): 310–17. http://dx.doi.org/10.1177/1045389x12449917.

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Etching the large area of sacrificial layer under the microstructure to be released is a common method used in microelectromechanical systems technology. In order to completely release the microstructures, many etching holes are often required on the microstructure to enable the etchant to completely etch the sacrificial layer. However, the etching holes often alter the electromechanical properties of the micro devices, especially capacitive devices, because the fringe fields induced by the etching holes can significantly alter the electrical properties. This article is aimed at evaluating the fringe field capacitance caused by etching holes on microstructures. The authors aim to find a general capacitance compensation formula for the fringe capacitance of etching holes by the use of ANSYS simulation. According to the simulation results, the design of a capacitive structure with small etching holes is recommended to prevent an extreme capacitance decrease. In conclusion, this article provides a fringing field capacitance estimation method that shows the capacitance compensation tendency of the design of etching holes; this method is expected to be applicable to the design in capacitive devices of complementary metal oxide semiconductor–microelectromechanical systems technology.

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Giles, C. Randy, David Bishop, and Vladimir Aksyuk. "MEMS for Light-Wave Networks." MRS Bulletin 26, no. 4 (April 2001): 328–29. http://dx.doi.org/10.1557/mrs2001.73.

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As demonstrated in this issue, the emerging field of microelectromechanical systems (MEMS) is beginning to impact almost every area of science and technology. MEMS have the potential to revolutionize light-wave systems. Microdevices such as optical switches, variable attenuators, active equalizers, add/drop multiplexers (ADMs), optical cross-connects (OXCs), gain tilt equalizers, data transmitters, and many others are beginning to find ubiquitous application in advanced light-wave systems.

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Burcham, Kevin E., та Joseph T. Boyd. "Freestanding, micromachined, multimode silicon optical waveguides at λ = 13 μm for microelectromechanical systems technology". Applied Optics 37, № 36 (20 грудня 1998): 8397. http://dx.doi.org/10.1364/ao.37.008397.

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40

Cao, Li, Susan Mantell, and Dennis Polla. "Design and simulation of an implantable medical drug delivery system using microelectromechanical systems technology." Sensors and Actuators A: Physical 94, no. 1-2 (October 2001): 117–25. http://dx.doi.org/10.1016/s0924-4247(01)00680-x.

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41

Samotaev, Nikolay, Konstantin Oblov, Maya Etrekova, Denis Veselov, and Anastasiya Gorshkova. "Parameter Studies of Ceramic MEMS Microhotplates Fabricated by Laser Micromilling Technology." Materials Science Forum 977 (February 2020): 238–43. http://dx.doi.org/10.4028/www.scientific.net/msf.977.238.

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This paper presents a modeling of technology aspects for fabrication ceramic microelectromechanical systems (MEMS) microhotplate and surface mounting device (SMD) packaging for (MOX) gas sensors applications. Innovative claims include: demonstration of flexible opportunities for new fabrication process flows based on laser micromilling tech; modeling of power consumption MEMS microhotplate depending on the thickness and topology; demonstration of necessity changing thick film technology of metallization to vacuum sputtering by reducing of power consumption. The results show possibility to fast fabrication of different topologies for ceramic MEMS microhotplate in form-factor of SOT-23 type SMD package.

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42

Murashev, V. N., S. A. Legotin, S. I. Didenko, Oleg Rabinovich, A. A. Krasnov, and S. U. Urchuk. "Improvement of Si-Betavoltaic Batteries Technology." Advanced Materials Research 1070-1072 (December 2014): 585–88. http://dx.doi.org/10.4028/www.scientific.net/amr.1070-1072.585.

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One of the valuable problems of modern science and technology is to create a low-power (less than 1 mW), long-life (10-100 years) miniature sources of electric power based on the conversion of radioactive isotopes of energy into electricity. Such batteries can be used directly, for example, in cardiology, microelectromechanical systems (MEMS), in military equipment and power sharing systems for many applications. Among isotopes to create energy sources particular interest is nickel Ni63, as it is safe for human health and thus in the development of electric batteries based on it devoted a lot of work. This article discusses the main types of structures betavoltaic battery (BVB) with the prospects for industrial application using - isotope of nickel Ni63. It is shown that the efficiency of beta radiation conversion of into electricity and the dimensions of the existing batteries are far from the theoretically possible. It is shown that the prospects for improving the effective efficiency are planar multijunction betavoltaic batteries.

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43

Esashi, Masayoshi. "Introduction to the special issue: microrobots and distributed microactuators in Japan." Robotica 14, no. 5 (September 1996): 467. http://dx.doi.org/10.1017/s0263574700019925.

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This special issue in Robotica contains papers from Japanese authors on microrobots and distributed microactuators. Advances in technology made possible progress in the realm of small but complicated microsystems that include different elements, such as sensors, circuits and actuators. Microsystems are also called micromachines or microelectromechanical systems (MEMS); microsystems which move like insects are termed microrobots.

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44

Morrison, Richard, Livia Racz, and David Carter. "Case Study: Design and Construction of the Draper Laboratory Microfabrication Center." Journal of the IEST 56, no. 1 (March 1, 2013): 3–16. http://dx.doi.org/10.17764/jiet.56.1.t755m81670245652.

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For 25 years, Draper Laboratory has been active in the areas of microelectromechanical systems (MEMS) and multichip modules (MCM), using two separate laboratories. When these laboratories were constructed, cleanroom technology was in its mid-life cycle. To meet evolving R&D needs, the cleanroom facilities recently underwent a major renovation as described in this article.

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45

Hang, Bui Thu, Tran Duc Tan, and Chu Duc Trinh. "Three-axis piezoresistive accelerometer with adjustable axial resolutions." Vietnam Journal of Mechanics 34, no. 1 (March 1, 2012): 45–54. http://dx.doi.org/10.15625/0866-7136/34/1/427.

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A three-axis piezoresistive accelerometer which has adjustable resolutions to three axes was developed using MicroElectroMechanical Systems (MEMS) technology. This sensor made of a heavy proof mass and four long beams is to obtain high resolutions by reducing resonance frequencies. Adjustable resolution with small cross axis sensitivity could be obtained by a three-dimensional sensor structure.

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46

Knapkiewicz, Pawel. "Technological Assessment of MEMS Alkali Vapor Cells for Atomic References." Micromachines 10, no. 1 (December 31, 2018): 25. http://dx.doi.org/10.3390/mi10010025.

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This paper is a review that surveys work on the fabrication of miniature alkali vapor cells for miniature and chip-scale atomic clocks. Technology on microelectromechanical systems (MEMS) cells from the literature is described in detail. Special attention is paid to alkali atom introduction methods and sealing of the MEMS structure. Characteristics of each technology are collated and compared. The article’s rhetoric is guided by the proposed classification of MEMS cell fabrication methods and contains a historical outline of MEMS cell technology development.

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47

Baik, S., J. P. Blanchard, and M. L. Corradini. "Development of Micro-Diesel Injector Nozzles via Microelectromechanical Systems Technology and Effects on Spray Characteristics." Journal of Engineering for Gas Turbines and Power 125, no. 2 (April 1, 2003): 427–34. http://dx.doi.org/10.1115/1.1559901.

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Micromachined planar orifice nozzles have been developed using MEMS (micro-electro-mechanical systems) technology and tested with commercially produced diesel injection systems. Such a system, properly designed, may have the capability to improve the spray characteristics in DI diesel engines due to improved atomization and fuel-air mixing. To demonstrate this process, 14 microplanar orifice nozzles were fabricated with deep X-ray lithography and electroplating (LIGA) technology. The circular orifice diameters were varied from 40 to 260 microns and the number of orifices varied from one to 169. Three plates with noncircular orifices were also fabricated to examine the effect of orifice shape on spray characteristics. These nozzles were then attached to commercial diesel injectors and the associated injection systems were used in the study of drop sizes. The experiments were carried out at two different injection pressures (around 25 MPa and 80 MPa). Local drop sizes were measured by a laser diffraction technique, and the average drop sizes of the whole sprays were measured by a light extinction technique. The drop sizes were found to depend primarily on the total mass flow area. Coalescence droplet collisions among adjacent sprays were apparent for the multiple orifice nozzles. Nonplanar configurations are under development and may show improved performance.

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48

Zhu, Wei Ming, Wu Zhang, Hong Cai, Tarik Bourouina, and Ai Qun Liu. "A Photonic MEMS Polarization Switch." Advanced Materials Research 74 (June 2009): 63–66. http://dx.doi.org/10.4028/www.scientific.net/amr.74.63.

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This paper presents a photonic polarization switch based on microelectromechanical systems (MEMS) technology. The polarization switch can change the pathway of the different polarized light via optical tunneling effects. By controlling the incident angle of the input light, the output polarization state can be switched between two different polarization states. The polarization switch has promising applications on both photonic circuit and bio-detecting.

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49

Huang, Jung-Tang, Kuo-Yu Lee, Hou-Jun Hsu, Rung-Gen Wu, Ming-Zhe Lin, Ting-Chiang Tsai, and Ching-Kong Chen. "Fabrication Technology of Microelectromechanical Systems Probe Chip Compatible with Standard Complementary Metal–Oxide–Semiconductor Process." Japanese Journal of Applied Physics 49, no. 6 (June 21, 2010): 06GN02. http://dx.doi.org/10.1143/jjap.49.06gn02.

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50

Samiee, M., K. Garre, M. Cahay, P. B. Kosel, S. Fairchild, J. W. Fraser, and D. J. Lockwood. "Field emission characteristics of a lanthanum monosulfide cold cathode array fabricated using microelectromechanical systems technology." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 26, no. 2 (2008): 764. http://dx.doi.org/10.1116/1.2837893.

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