Статті в журналах з теми "MICRO-BONDING"
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Kim, Joo-Han, and Chul-Ku Lee. "Laser Micro Bonding Technology." Journal of the Korean Welding and Joining Society 25, no. 2 (April 30, 2007): 1–2. http://dx.doi.org/10.5781/kwjs.2007.25.2.001.
Повний текст джерелаGu, Yao Xin, and Hong Chao Qiao. "Study on the Manufacturing Process of Polymer Microfluidic Chip with Integrated Cu Micro Array Electrode." Applied Mechanics and Materials 723 (January 2015): 884–87. http://dx.doi.org/10.4028/www.scientific.net/amm.723.884.
Повний текст джерелаShoda, Koki, Minori Tanaka, Kensuke Mino, and Yutaka Kazoe. "A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices." Micromachines 11, no. 9 (August 25, 2020): 804. http://dx.doi.org/10.3390/mi11090804.
Повний текст джерелаOhashi, Osamu, Miho Narui, Kensaku Aihara, Kazutoshi Harada, Masaki Hosaka, Hajime Inagaki, and Osamu Tsuya. "Ancient Micro Bonding of Gold; Granulation." Materia Japan 55, no. 10 (2016): 468–74. http://dx.doi.org/10.2320/materia.55.468.
Повний текст джерелаYang Mengsheng, 杨蒙生, 邢丕峰 Xing Pifeng, 郑凤成 Zheng Fengcheng, 谢军 Xie Jun, 刘学 Liu Xue, 马小军 Ma Xiaojun, and 易泰民 Yi Taimin. "Precise bonding of Cu micro-sphere." High Power Laser and Particle Beams 26, no. 5 (2014): 52008. http://dx.doi.org/10.3788/hplpb20142605.52008.
Повний текст джерелаSHI Ya-li, 史亚莉, 张文生 ZHANG Wen-sheng, 徐德 XU De, 张正涛 ZHANG Zheng-tao, and 张娟 ZHANG Juan. "Time/pressure pL micro-bonding technology." Optics and Precision Engineering 19, no. 11 (2011): 2724–30. http://dx.doi.org/10.3788/ope.20111911.2724.
Повний текст джерелаMehlmann, Benjamin, Elmar Gehlen, Alexander Olowinsky, and Arnold Gillner. "Laser Micro Welding for Ribbon Bonding." Physics Procedia 56 (2014): 776–81. http://dx.doi.org/10.1016/j.phpro.2014.08.085.
Повний текст джерелаBöhm, S., K. Dilger, J. Hesselbach, J. Wrege, S. Rathmann, W. Ma, E. Stammen, and G. Hemken. "Micro bonding with non-viscous adhesives." Microsystem Technologies 12, no. 7 (February 7, 2006): 676–79. http://dx.doi.org/10.1007/s00542-006-0101-7.
Повний текст джерелаWang, Chun Yu, Qing Wang, Han Zhu Li, Xiao Zhi Ji, and Zhi Long Kang. "Optimized Wire Bonding Process on Micro-Connection Pad with Ni/CeO2 Coatings." Applied Mechanics and Materials 275-277 (January 2013): 1925–28. http://dx.doi.org/10.4028/www.scientific.net/amm.275-277.1925.
Повний текст джерелаYang, Jun Ru, Kun Guo, Yu Rong Chi, Xue Cheng Chen, and Hai Tao Feng. "Molecular Dynamics Simulation of the Propagation Property of the Interface Micro Crack in Ternary Boride Hard Cladding Material." Materials Science Forum 861 (July 2016): 264–69. http://dx.doi.org/10.4028/www.scientific.net/msf.861.264.
Повний текст джерелаKim, Joo Han, Hyang Tae Kim, and Chul Ku Lee. "UV Laser Bonding of Optical Devices on Polymers." Materials Science Forum 580-582 (June 2008): 459–62. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.459.
Повний текст джерелаZhang, Zong Bo, Qing Qiang He, and Cao Qing Yan. "Non-Melt Ultrasonic Bonding Method for Polymer MEMS Devices." Applied Mechanics and Materials 607 (July 2014): 133–38. http://dx.doi.org/10.4028/www.scientific.net/amm.607.133.
Повний текст джерелаWang, Xuelei, Mao Ye, Fei Lu, Yunkai Mao, Hao Tian, and Jianli Li. "Recent Progress on Micro-Fabricated Alkali Metal Vapor Cells." Biosensors 12, no. 3 (March 6, 2022): 165. http://dx.doi.org/10.3390/bios12030165.
Повний текст джерелаBi, Gui Jun, Sum Huan Ng, Khin Thet May, and Cong Zhi Chan. "Micro-Laser Welding of Plastics for the Applications in Micro-Fluidic Devices." Key Engineering Materials 447-448 (September 2010): 745–49. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.745.
Повний текст джерелаLiu, Hang, Yan Xu, Kai Leung Yung, and Chun Lei Kang. "The Interface Behavior of Micro Overmolding." Advanced Materials Research 591-593 (November 2012): 896–99. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.896.
Повний текст джерелаMIURA, Kazuma, and Koii SERIZAWA. "Micro-Metal Bonding Technology for LSI Package." Journal of the Society of Materials Science, Japan 50, no. 6Appendix (2001): 127–31. http://dx.doi.org/10.2472/jsms.50.6appendix_127.
Повний текст джерелаYasuda, Kiyokazu. "Ultrasonic Bonding Technology for Micro System Integration." Journal of The Japan Institute of Electronics Packaging 22, no. 5 (August 1, 2019): 395–99. http://dx.doi.org/10.5104/jiep.22.395.
Повний текст джерелаThomas, S., and H. Berg. "Micro-Corrosion of Al-Cu Bonding Pads." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10, no. 2 (June 1987): 252–57. http://dx.doi.org/10.1109/tchmt.1987.1134741.
Повний текст джерелаMIZUNO, Jun, Katsuyuki SAKUMA, Masatsugu NIMURA, Fumihiro WAKAI, and Shuichi SHOJI. "Thermo-compression Micro Bonding Technology Using Au." Journal of the Japan Society for Precision Engineering 79, no. 8 (2013): 714–18. http://dx.doi.org/10.2493/jjspe.79.714.
Повний текст джерелаHofmann, Christian, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Maik Wiemer, Karla Hiller, and Harald Kuhn. "Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils." Micromachines 13, no. 8 (August 12, 2022): 1307. http://dx.doi.org/10.3390/mi13081307.
Повний текст джерелаNaito, Makio, Hiroya Abe, and Kazuyoshi Sato. "Nanoparticle Bonding Technology for Composite Materials." Advances in Science and Technology 45 (October 2006): 1704–10. http://dx.doi.org/10.4028/www.scientific.net/ast.45.1704.
Повний текст джерелаYoshida, Yoshinori, Takashi Ishikawa, and Tomoaki Suganuma. "Mechanism of Forming Joining on Backward Extrusion Forged Bonding Process." Advanced Materials Research 966-967 (June 2014): 461–70. http://dx.doi.org/10.4028/www.scientific.net/amr.966-967.461.
Повний текст джерелаKim, Uk-Su, Seung-Sik Shin, Ki-Gwon Kim, Ba-Wi Jeong, and Jeong-Woo Park. "Bonding properties on diffusion bonding layer for micro PCD-WC tool fabrication." Journal of Mechanical Science and Technology 33, no. 8 (August 2019): 3749–54. http://dx.doi.org/10.1007/s12206-019-0717-z.
Повний текст джерелаYe, Yiyun, Qi Zou, Yinan Xiao, Junke Jiao, Beining Du, Yuezhan Liu, and Liyuan Sheng. "Effect of Interface Pretreatment of Al Alloy on Bonding Strength of the Laser Joined Al/CFRTP Butt Joint." Micromachines 12, no. 2 (February 11, 2021): 179. http://dx.doi.org/10.3390/mi12020179.
Повний текст джерелаLong, Zhi Li, Lu Fan Zhang, and Jian Guo Zhang. "FEM Design and Experiment of a Micro-Gripper Based on Piezoelectric Material." Advanced Materials Research 479-481 (February 2012): 434–38. http://dx.doi.org/10.4028/www.scientific.net/amr.479-481.434.
Повний текст джерелаLecarpentier, Gilbert, and Joeri De Vos. "Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 002251–84. http://dx.doi.org/10.4071/2012dpc-tha15.
Повний текст джерелаSun, Yibo, Yi Luo, and Xiaodong Wang. "Micro energy director array in ultrasonic precise bonding for thermoplastic micro assembly." Journal of Materials Processing Technology 212, no. 6 (June 2012): 1331–37. http://dx.doi.org/10.1016/j.jmatprotec.2012.01.013.
Повний текст джерелаZhang, Wei Xiang, and Shuang Min Du. "Investigation into Cu-Interlayered Diffusion Bonding Trial of AZ31B Alloy." Advanced Materials Research 631-632 (January 2013): 167–71. http://dx.doi.org/10.4028/www.scientific.net/amr.631-632.167.
Повний текст джерелаBai, S. L., C. M. L. Wu, Y. W. Mai, H. M. Zeng, and R. K. Y. Li. "Failure Mechanisms of Sisal Fibres in Composites." Advanced Composites Letters 8, no. 1 (January 1999): 096369359900800. http://dx.doi.org/10.1177/096369359900800102.
Повний текст джерелаMurayama, Kei, Mitsuhiro Aizawa, and Mitsutoshi Higashi. "TLP Bonding Technologies for Micro Joining and 3D Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 001221–52. http://dx.doi.org/10.4071/2010dpc-wa12.
Повний текст джерелаLuo, Yi, Sheng Qiang He, Liang Jiang Wang, and Zong Bo Zhang. "Study on Ultrasonic Fusion Bonding for Polymer Microfluidic Chips." Key Engineering Materials 483 (June 2011): 311–15. http://dx.doi.org/10.4028/www.scientific.net/kem.483.311.
Повний текст джерелаSun, Yibo, Yuqi Feng, Pengfei Hu, Xing Zhao, Xinhua Yang, and Guoxiong Wu. "Online visual monitoring and ultrasonic feedback detection in the ultrasonic precision bonding of polymers." Advanced Composites Letters 29 (January 1, 2020): 2633366X2093258. http://dx.doi.org/10.1177/2633366x20932584.
Повний текст джерелаWang, Ying Hao, Xian Sheng Qi, Xian Lin Meng, Wen Bin Li, Chuan Yun Wang, Hong Chao Kou, and Jin Shan Li. "The Influence of Initial Microstructures on the Diffusion Bonding Interface of High Nb Containing TiAl Alloy." Advanced Materials Research 753-755 (August 2013): 396–401. http://dx.doi.org/10.4028/www.scientific.net/amr.753-755.396.
Повний текст джерелаJang, Woong Ki, Yoo Su Kang, Young Ho Seo, and Byeong Hee Kim. "The manufacturing of a surface anchor structure for the electroless plating of a three-dimensional antenna integrated with a mobile device case." Advances in Mechanical Engineering 12, no. 9 (September 2020): 168781402095857. http://dx.doi.org/10.1177/1687814020958576.
Повний текст джерелаSHI Ya-li, 史亚莉, 李福东 LI Fu-dong, 杨鑫 YANG Xin, 张正涛 ZHANG Zheng-tao, and 徐德 XU De. "pL class adhesive dispensing approach for micro bonding." Optics and Precision Engineering 20, no. 12 (2012): 2744–50. http://dx.doi.org/10.3788/ope.20122012.2744.
Повний текст джерелаIto, Takeshi, Kazuharu Sobue, and Seishiro Ohya. "Water glass bonding for micro-total analysis system." Sensors and Actuators B: Chemical 81, no. 2-3 (January 2002): 187–95. http://dx.doi.org/10.1016/s0925-4005(01)00951-0.
Повний текст джерелаIshii, Takao, and Shinji Aoyama. "Novel micro-bump fabrication for flip-chip bonding." Journal of Electronic Materials 33, no. 11 (November 2004): L21—L23. http://dx.doi.org/10.1007/s11664-004-0172-0.
Повний текст джерелаYin, Zhifu, and Helin Zou. "Experimental and Numerical Study on PDMS Collapse for Fabrication of Micro/Nanochannels." Journal of Electrical Engineering 67, no. 6 (December 1, 2016): 414–20. http://dx.doi.org/10.1515/jee-2016-0060.
Повний текст джерелаHwang, Yeong-Maw, Cheng-Tang Pan, Bo-Syun Chen, and Sheng-Rui Jian. "Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps." Metals 11, no. 3 (March 11, 2021): 460. http://dx.doi.org/10.3390/met11030460.
Повний текст джерелаZhang, Lu, Wendong Zhang, Shougang Zhang, and Shubin Yan. "Micro-fabrication and hermeticity measurement of alkali-atom vapor cells based on anodic bonding." Chinese Optics Letters 17, no. 10 (2019): 100201. http://dx.doi.org/10.3788/col201917.100201.
Повний текст джерелаZhu, Fu Dong, and Bi Yun Zhu. "Research on Laser-Hybrid Cladding of Ni-Cr Alloy on Copper." Key Engineering Materials 744 (July 2017): 270–74. http://dx.doi.org/10.4028/www.scientific.net/kem.744.270.
Повний текст джерелаSun, Yi Bo, Yi Luo, Xiao Dong Wang, and Yu Qi Feng. "Molecular Dynamics Simulation of Diffusion Behavior for Thermalplastic Fusion Bonding." Advanced Materials Research 217-218 (March 2011): 45–50. http://dx.doi.org/10.4028/www.scientific.net/amr.217-218.45.
Повний текст джерелаZhang, Chen, Dongbin Zhang, Can Luo, Weiping Peng, and Xusheng Zang. "Nanosecond-Pulse Laser Assisted Cold Spraying of Al–Cu Aluminum Alloy." Coatings 11, no. 3 (February 25, 2021): 267. http://dx.doi.org/10.3390/coatings11030267.
Повний текст джерелаKUMAGAI, Koichi, Akira KABESHITA, and Osamu YAMAZAKI. "Micro-Interconnection Technology. Production Engineering of Micro Connections in Stud-Bump-Bonding Packaging." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, no. 6 (1995): 368–72. http://dx.doi.org/10.5104/jiep1995.10.368.
Повний текст джерелаKageyama, Syotaro, Yuichi Nakazato, and Sugiya satou. "317 Study on Manipulation in Micro Region and Micro-bonding Under Vacuum Enviroment." Proceedings of the JSME annual meeting 2008.8 (2008): 33–34. http://dx.doi.org/10.1299/jsmemecjo.2008.8.0_33.
Повний текст джерелаChandrappa, Kasigavi, and Joel Hemanth. "Optimization of Process Parameters of Diffusing Bonding of Titanium with Titanium and Titanium with Copper." Advanced Materials Research 856 (December 2013): 153–58. http://dx.doi.org/10.4028/www.scientific.net/amr.856.153.
Повний текст джерелаJiang, Zheng Yi, Mahadi Hasam, Hamidreza Kamali, Fang Hui Jia, and Hai Bo Xie. "Micromanufacturing Technology and its Practice." Solid State Phenomena 311 (October 2020): 12–20. http://dx.doi.org/10.4028/www.scientific.net/ssp.311.12.
Повний текст джерелаWANG, Tao, Jian CAI, Qian WANG, Hao ZHANG, and Zheyao WANG. "Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000033–43. http://dx.doi.org/10.4071/isom-2011-ta1-paper5.
Повний текст джерелаZhang, Qingdong, Shuo Li, Rui Li, and Boyang Zhang. "Multiscale Comparison Study of Void Closure Law and Mechanism in the Bimetal Roll-Bonding Process." Metals 9, no. 3 (March 18, 2019): 343. http://dx.doi.org/10.3390/met9030343.
Повний текст джерелаStoleriu, Simona, Sorin Andrian, Irina Nica, Andrei Victor Sandu, Galina Pancu, Alice Murariu, and Gianina Iovan. "Evaluation of Adhesive Capacity of Universal Bonding Agents Used in Direct Composite Resins Repair." Materiale Plastice 54, no. 3 (September 30, 2017): 574–77. http://dx.doi.org/10.37358/mp.17.3.4899.
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